- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/053 - ContainersSeals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
Patent holdings for IPC class H01L 23/053
Total number of patents in this class: 790
10-year publication summary
|
77
|
68
|
85
|
65
|
54
|
51
|
67
|
70
|
72
|
23
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 45860 |
84 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
63 |
| Fuji Electric Co., Ltd. | 5114 |
61 |
| Infineon Technologies AG | 8201 |
49 |
| Samsung Electronics Co., Ltd. | 144426 |
28 |
| Intel Corporation | 46751 |
17 |
| Micron Technology, Inc. | 26214 |
17 |
| Kyocera Corporation | 13706 |
17 |
| Advanced Semiconductor Engineering, Inc. | 1633 |
14 |
| International Business Machines Corporation | 61123 |
13 |
| Semiconductor Components Industries, L.L.C. | 5253 |
13 |
| Texas Instruments Incorporated | 19482 |
11 |
| Renesas Electronics Corporation | 6054 |
10 |
| Apple Inc. | 54527 |
9 |
| Siemens AG | 24547 |
9 |
| Shinko Electric Industries Co., Ltd. | 1207 |
8 |
| Amkor Technology Singapore Holding Pte. Ltd | 408 |
8 |
| Robert Bosch GmbH | 42505 |
7 |
| Analog Devices, Inc. | 3389 |
7 |
| Mediatek Inc. | 5058 |
6 |
| Other owners | 339 |