- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/04 - ContainersSeals characterised by the shape
Patent holdings for IPC class H01L 23/04
Total number of patents in this class: 1415
10-year publication summary
|
130
|
122
|
140
|
112
|
97
|
93
|
73
|
73
|
61
|
43
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42863 |
116 |
| Kyocera Corporation | 13846 |
107 |
| Mitsubishi Electric Corporation | 46160 |
67 |
| International Business Machines Corporation | 61287 |
43 |
| Fuji Electric Co., Ltd. | 5158 |
39 |
| Advanced Semiconductor Engineering, Inc. | 1656 |
35 |
| Intel Corporation | 47013 |
34 |
| Samsung Electronics Co., Ltd. | 146534 |
31 |
| Micron Technology, Inc. | 26256 |
30 |
| Infineon Technologies AG | 8221 |
24 |
| Invensas Corporation | 613 |
24 |
| Murata Manufacturing Co., Ltd. | 24575 |
22 |
| Daishinku Corporation | 242 |
22 |
| STATS ChipPAC Pte. Lte. | 1553 |
21 |
| Amkor Technology Singapore Holding Pte.ltd. | 508 |
15 |
| Renesas Electronics Corporation | 6006 |
13 |
| BroadPak Corporation | 18 |
13 |
| Infineon Technologies Americas Corp. | 671 |
12 |
| Toshiba Corporation | 12350 |
11 |
| Xilinx, Inc. | 3987 |
11 |
| Other owners | 725 |