• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/86 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS

Patent holdings for IPC class H01L 21/86

Total number of patents in this class: 38

10-year publication summary

3
6
6
3
1
1
1
0
2
0
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Tessera, Inc.
610
3
Murata Manufacturing Co., Ltd.
25037
2
Shin-Etsu Chemical Co., Ltd.
5807
2
Inoso, LLC
8
2
Saint-Gobain Ceramics & Plastics, Inc.
822
2
Psemi Corporation
1051
2
Innoscience (Suzhou) Technology Co., ltd.
171
2
Apple Inc.
56547
1
Qualcomm Incorporated
87874
1
International Business Machines Corporation
61759
1
Honeywell International Inc.
13571
1
Taiwan Semiconductor Manufacturing Company, Ltd.
46224
1
Advanced Micro Devices, Inc.
5819
1
TDK Corporation
6750
1
Kyocera Corporation
14102
1
National Semiconductor Corporation
974
1
Microsoft Technology Licensing, LLC
54366
1
GLOBALFOUNDRIES U.S. Inc.
6418
1
Korea Electronics Technology Institute
1672
1
OmniVision Technologies, Inc.
1559
1
Other owners 10