- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/86 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
Patent holdings for IPC class H01L 21/86
Total number of patents in this class: 38
10-year publication summary
|
3
|
6
|
6
|
3
|
1
|
1
|
1
|
0
|
2
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tessera, Inc. | 610 |
3 |
| Murata Manufacturing Co., Ltd. | 25037 |
2 |
| Shin-Etsu Chemical Co., Ltd. | 5807 |
2 |
| Inoso, LLC | 8 |
2 |
| Saint-Gobain Ceramics & Plastics, Inc. | 822 |
2 |
| Psemi Corporation | 1051 |
2 |
| Innoscience (Suzhou) Technology Co., ltd. | 171 |
2 |
| Apple Inc. | 56547 |
1 |
| Qualcomm Incorporated | 87874 |
1 |
| International Business Machines Corporation | 61759 |
1 |
| Honeywell International Inc. | 13571 |
1 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46224 |
1 |
| Advanced Micro Devices, Inc. | 5819 |
1 |
| TDK Corporation | 6750 |
1 |
| Kyocera Corporation | 14102 |
1 |
| National Semiconductor Corporation | 974 |
1 |
| Microsoft Technology Licensing, LLC | 54366 |
1 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
1 |
| Korea Electronics Technology Institute | 1672 |
1 |
| OmniVision Technologies, Inc. | 1559 |
1 |
| Other owners | 10 |