• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 4044

10-year publication summary

528
487
491
417
316
216
144
174
143
42
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
42288
568
International Business Machines Corporation
61144
435
GLOBALFOUNDRIES U.S. Inc.
6427
337
Samsung Electronics Co., Ltd.
144675
179
Semiconductor Energy Laboratory Co., Ltd.
11381
137
Boe Technology Group Co., Ltd.
40728
127
Intel Corporation
46833
119
Qualcomm Incorporated
84760
85
Samsung Display Co., Ltd.
34349
78
Monolithic 3D Inc.
308
77
Renesas Electronics Corporation
6050
69
Commissariat à l'énergie atomique et aux energies alternatives
10925
68
United Microelectronics Corp.
4239
66
Semiconductor Manufacturing International (Shanghai) Corporation
1773
63
Micron Technology, Inc.
26221
56
Au Optronics Corporation
3512
50
Institute of Microelectronics, Chinese Academy of Sciences
1378
45
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8478
39
LG Display Co., Ltd.
13283
36
Skyworks Solutions, Inc.
3708
36
Other owners 1374