- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/765 - Making of isolation regions between components by field-effect
Patent holdings for IPC class H01L 21/765
Total number of patents in this class: 281
10-year publication summary
12
|
11
|
17
|
22
|
35
|
38
|
54
|
27
|
17
|
12
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
35 |
Infineon Technologies Austria AG | 2157 |
18 |
Infineon Technologies AG | 8244 |
12 |
Fuji Electric Co., Ltd. | 5168 |
11 |
Mitsubishi Electric Corporation | 46295 |
10 |
NXP USA, Inc. | 4306 |
10 |
Texas Instruments Incorporated | 19450 |
9 |
Intel Corporation | 47062 |
8 |
Toshiba Corporation | 12383 |
7 |
United Microelectronics Corp. | 4244 |
6 |
Rohm Co., Ltd. | 6464 |
6 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1765 |
6 |
TSMC China Company Limited | 225 |
6 |
Semiconductor Components Industries, L.L.C. | 5270 |
5 |
MACOM Technology Solutions Holdings, Inc. | 817 |
5 |
Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
5 |
Toshiba Electronic Devices & Storage Corporation | 1999 |
5 |
Micron Technology, Inc. | 26138 |
4 |
STMicroelectronics S.r.l. | 3605 |
4 |
HRL Laboratories, LLC | 1602 |
4 |
Other owners | 105 |