- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/58 - Mounting semiconductor devices on supports
Patent holdings for IPC class H01L 21/58
Total number of patents in this class: 307
10-year publication summary
19
|
18
|
13
|
5
|
7
|
14
|
7
|
5
|
4
|
4
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
STATS ChipPAC Pte. Lte. | 1551 |
13 |
Micron Technology, Inc. | 26279 |
11 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
11 |
Samsung Electronics Co., Ltd. | 148077 |
10 |
Intel Corporation | 46921 |
8 |
International Business Machines Corporation | 61616 |
6 |
Texas Instruments Incorporated | 19450 |
6 |
Infineon Technologies AG | 8265 |
5 |
Cheil Industries Inc. | 846 |
5 |
Commissariat à l'énergie atomique et aux energies alternatives | 10959 |
5 |
OSRAM Opto Semiconductors GmbH | 3288 |
5 |
Tessera, Inc. | 618 |
5 |
Apple Inc. | 55735 |
3 |
3m Innovative Properties Company | 17762 |
3 |
LG Chem, Ltd. | 17680 |
3 |
Texas Instruments Japan, Ltd. | 1656 |
3 |
Renesas Electronics Corporation | 5964 |
3 |
Mitsubishi Electric Corporation | 46618 |
3 |
Xilinx, Inc. | 3968 |
3 |
Agency for Science, Technology and Research | 3659 |
3 |
Other owners | 193 |