- All sections
- C - Chemistrymetallurgy
- C09G - Polishing compositionsski waxes
- C09G 1/02 - Polishing compositions containing abrasives or grinding agents
Patent holdings for IPC class C09G 1/02
Total number of patents in this class: 2131
10-year publication summary
|
154
|
158
|
161
|
187
|
212
|
199
|
192
|
190
|
194
|
109
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fujimi Incorporated | 740 |
304 |
| CMC Materials LLC | 246 |
122 |
| Anji Microelectronics (Shanghai) Co., Ltd. | 163 |
114 |
| Resonac Corporation | 2766 |
100 |
| Versum Materials US, LLC | 640 |
95 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 329 |
75 |
| BASF SE | 20892 |
71 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42389 |
54 |
| DuPont Electronic Materials Holding, Inc. | 198 |
47 |
| Cabot Microelectronics Corporation | 198 |
45 |
| Anji Microelectronics Technology (Shanghai) Co., Ltd. | 58 |
41 |
| Saint-Gobain Ceramics & Plastics, Inc. | 840 |
38 |
| JSR Corporation | 2514 |
34 |
| Entegris, Inc. | 1863 |
34 |
| K.C. Tech Co., Ltd. | 81 |
34 |
| BASF (China) Co., Ltd. | 835 |
27 |
| FUJIFILM Corporation | 29295 |
25 |
| Shin-Etsu Chemical Co., Ltd. | 5632 |
25 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 79 |
25 |
| Samsung Electronics Co., Ltd. | 145025 |
24 |
| Other owners | 797 |