- All sections
- C - Chemistrymetallurgy
- C09G - Polishing compositionsski waxes
- C09G 1/02 - Polishing compositions containing abrasives or grinding agents
Patent holdings for IPC class C09G 1/02
Total number of patents in this class: 2141
10-year publication summary
|
154
|
157
|
160
|
187
|
210
|
199
|
192
|
189
|
194
|
121
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fujimi Incorporated | 743 |
306 |
| CMC Materials LLC | 247 |
123 |
| Anji Microelectronics (Shanghai) Co., Ltd. | 160 |
112 |
| Resonac Corporation | 2825 |
102 |
| Versum Materials US, LLC | 647 |
96 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 331 |
75 |
| BASF SE | 20945 |
71 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
55 |
| DuPont Electronic Materials Holding, Inc. | 210 |
49 |
| Cabot Microelectronics Corporation | 196 |
45 |
| Anji Microelectronics Technology (Shanghai) Co., Ltd. | 58 |
41 |
| Saint-Gobain Ceramics & Plastics, Inc. | 840 |
38 |
| JSR Corporation | 2529 |
34 |
| Entegris, Inc. | 1882 |
34 |
| K.C. Tech Co., Ltd. | 82 |
34 |
| BASF (China) Co., Ltd. | 844 |
27 |
| Samsung Electronics Co., Ltd. | 147003 |
25 |
| FUJIFILM Corporation | 29458 |
25 |
| Shin-Etsu Chemical Co., Ltd. | 5674 |
25 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 72 |
25 |
| Other owners | 799 |