- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/50 - Working by transmitting the laser beam through or within the workpiece
Patent holdings for IPC class B23K 26/50
Total number of patents in this class: 123
10-year publication summary
|
6
|
7
|
13
|
19
|
10
|
20
|
18
|
13
|
11
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1842 |
17 |
| Samsung Display Co., Ltd. | 33900 |
6 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
4 |
| Jsw Aktina System, Co., Ltd. | 71 |
4 |
| Corning Incorporated | 10159 |
3 |
| Gigaphoton Inc. | 1206 |
3 |
| Apple Inc. | 54076 |
2 |
| Semiconductor Energy Laboratory Co., Ltd. | 11293 |
2 |
| Nikon Corporation | 7149 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 30670 |
2 |
| Lockheed Martin Corporation | 3284 |
2 |
| 3D-Micromac AG | 51 |
2 |
| Bobst Mex SA | 580 |
2 |
| IPG Photonics Corporation | 517 |
2 |
| Nippon Electric Glass Co., Ltd. | 2433 |
2 |
| Nippon Sheet Glass Company, Limited | 998 |
2 |
| Rofin-Sinar Technologies Inc. | 4 |
2 |
| Smarter Alloys Inc. | 29 |
2 |
| Agc, Inc. | 4663 |
2 |
| Mobile Advanced Technologies, LLC | 8 |
2 |
| Other owners | 58 |