- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
Patent holdings for IPC class B23K 26/402
Total number of patents in this class: 854
10-year publication summary
|
89
|
97
|
85
|
77
|
75
|
105
|
69
|
66
|
59
|
29
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1957 |
39 |
| Corning Incorporated | 10518 |
32 |
| Agc, Inc. | 5590 |
19 |
| Samsung Display Co., Ltd. | 38914 |
17 |
| AGC Glass Europe | 1183 |
15 |
| AGC Flat Glass North America, Inc. | 186 |
10 |
| LPKF Laser & Electronics AG | 89 |
10 |
| AGC Vidros do Brasil Ltda. | 142 |
10 |
| 4JET Microtech GmbH | 54 |
10 |
| Applied Materials, Inc. | 20514 |
9 |
| Apple Inc. | 59117 |
8 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
8 |
| Toyota Motor Corporation | 35992 |
7 |
| Hamamatsu Photonics K.K. | 4695 |
7 |
| IPG Photonics Corporation | 591 |
7 |
| Mitsubishi Heavy Industries, Ltd. | 9172 |
6 |
| Levi Strauss & Co. | 304 |
6 |
| SCHOTT AG | 1745 |
6 |
| io Tech Group Ltd. | 74 |
6 |
| Toppan Packaging Americas Holdings, Inc. | 220 |
6 |
| Other owners | 616 |