- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Patent holdings for IPC class B23K 26/364
Total number of patents in this class: 950
10-year publication summary
|
69
|
93
|
122
|
88
|
101
|
97
|
90
|
79
|
64
|
56
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1957 |
110 |
| Nippon Steel Corporation | 6945 |
35 |
| POSCO Co., Ltd. | 2025 |
19 |
| Applied Materials, Inc. | 20514 |
15 |
| Tokyo Seimitsu Co., Ltd. | 417 |
15 |
| Hamamatsu Photonics K.K. | 4695 |
14 |
| Samsung Display Co., Ltd. | 38914 |
13 |
| Nitto Denko Corporation | 8565 |
13 |
| Corning Incorporated | 10518 |
12 |
| POSCO | 2142 |
12 |
| Nikon Corporation | 7229 |
10 |
| Panasonic Intellectual Property Management Co., Ltd. | 34335 |
10 |
| EO Technics Co., Ltd. | 116 |
10 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
10 |
| Baoshan Iron & Steel Co., Ltd. | 1115 |
9 |
| Samsung Electronics Co., Ltd. | 158605 |
8 |
| IPG Photonics Corporation | 591 |
8 |
| Asmpt Singapore Pte. Ltd. | 239 |
8 |
| Sumitomo Rubber Industries, Ltd. | 4736 |
7 |
| JENOPTIK Automatisierungstechnik GmbH | 49 |
7 |
| Other owners | 605 |