- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/073 - Shaping the laser spot
Patent holdings for IPC class B23K 26/073
Total number of patents in this class: 1132
10-year publication summary
|
75
|
105
|
97
|
108
|
117
|
109
|
96
|
76
|
74
|
38
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
76 |
| Hamamatsu Photonics K.K. | 4681 |
39 |
| Corning Incorporated | 10504 |
31 |
| Disco Corporation | 1956 |
23 |
| nLIGHT, Inc. | 417 |
20 |
| Samsung Display Co., Ltd. | 38627 |
18 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
18 |
| 4JET Microtech GmbH | 53 |
17 |
| Robert Bosch GmbH | 44160 |
16 |
| Corelase Oy | 37 |
16 |
| Mitsubishi Electric Corporation | 48018 |
15 |
| The Furukawa Electric Co., Ltd. | 3694 |
15 |
| General Electric Company | 13899 |
14 |
| Coherent, Inc. | 294 |
14 |
| Amada Company, Limited | 621 |
12 |
| Gigaphoton Inc. | 1326 |
12 |
| IPG Photonics Corporation | 585 |
12 |
| SCHOTT AG | 1738 |
10 |
| VulcanForms Inc. | 118 |
10 |
| Husky Injection Molding Systems Ltd. | 983 |
8 |
| Other owners | 736 |