- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/073 - Shaping the laser spot
Patent holdings for IPC class B23K 26/073
Total number of patents in this class: 1119
10-year publication summary
|
75
|
104
|
97
|
107
|
117
|
109
|
97
|
76
|
73
|
24
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Laser- und Systemtechnik GmbH | 526 |
76 |
| Hamamatsu Photonics K.K. | 4613 |
38 |
| Corning Incorporated | 10421 |
31 |
| Disco Corporation | 1934 |
23 |
| nLIGHT, Inc. | 414 |
20 |
| Samsung Display Co., Ltd. | 37960 |
18 |
| Panasonic Intellectual Property Management Co., Ltd. | 33634 |
17 |
| 4JET Microtech GmbH | 53 |
17 |
| Robert Bosch GmbH | 43646 |
16 |
| Coherent, Inc. | 300 |
16 |
| Corelase Oy | 34 |
16 |
| The Furukawa Electric Co., Ltd. | 3701 |
15 |
| General Electric Company | 13808 |
14 |
| Mitsubishi Electric Corporation | 47655 |
14 |
| Amada Company, Limited | 614 |
14 |
| Gigaphoton Inc. | 1308 |
11 |
| IPG Photonics Corporation | 579 |
11 |
| SCHOTT AG | 1735 |
10 |
| VulcanForms Inc. | 117 |
10 |
| TRUMPF Laser GmbH | 158 |
8 |
| Other owners | 724 |