- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/02 - Positioning or observing the workpiece, e.g. with respect to the point of impactAligning, aiming or focusing the laser beam
Patent holdings for IPC class B23K 26/02
Total number of patents in this class: 510
10-year publication summary
27
|
36
|
51
|
34
|
32
|
25
|
15
|
15
|
17
|
5
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1869 |
25 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
12 |
Mitsubishi Electric Corporation | 46397 |
11 |
FANUC Corporation | 6758 |
11 |
IPG Photonics Corporation | 539 |
11 |
Samsung Display Co., Ltd. | 35171 |
9 |
Hamamatsu Photonics K.K. | 4446 |
9 |
Electro Scientific Industries, Inc. | 369 |
8 |
Amada Holdings Co., Ltd. | 277 |
7 |
Nikon Corporation | 7213 |
6 |
Precitec KG | 23 |
6 |
Scansonic MI GmbH | 37 |
6 |
General Electric Company | 13845 |
5 |
Robert Bosch GmbH | 42813 |
5 |
Applied Materials, Inc. | 18861 |
5 |
Panasonic Intellectual Property Management Co., Ltd. | 31806 |
5 |
Corning Incorporated | 10300 |
5 |
Toray Engineering Co., Ltd. | 491 |
5 |
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 4997 |
5 |
Amada Company, Limited | 567 |
5 |
Other owners | 349 |