- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/02 - Positioning or observing the workpiece, e.g. with respect to the point of impactAligning, aiming or focusing the laser beam
Patent holdings for IPC class B23K 26/02
Total number of patents in this class: 516
10-year publication summary
|
36
|
51
|
34
|
32
|
25
|
15
|
15
|
17
|
15
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1919 |
25 |
| Hamamatsu Photonics K.K. | 4584 |
13 |
| FANUC Corporation | 6984 |
12 |
| Mitsubishi Electric Corporation | 47449 |
11 |
| IPG Photonics Corporation | 569 |
11 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 533 |
11 |
| Samsung Display Co., Ltd. | 37467 |
9 |
| Toray Engineering Co., Ltd. | 503 |
7 |
| Amada Holdings Co., Ltd. | 275 |
7 |
| Nikon Corporation | 7263 |
6 |
| Electro Scientific Industries, Inc. | 365 |
6 |
| Precitec KG | 23 |
6 |
| Scansonic MI GmbH | 37 |
6 |
| General Electric Company | 13804 |
5 |
| Robert Bosch GmbH | 43385 |
5 |
| Applied Materials, Inc. | 19849 |
5 |
| Panasonic Intellectual Property Management Co., Ltd. | 33168 |
5 |
| Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 5174 |
5 |
| Amada Company, Limited | 596 |
5 |
| EO Technics Co., Ltd. | 108 |
5 |
| Other owners | 351 |