Quantité totale PI	238
Rang # Quantité totale PI	5 497
Note d'activité PI	2,7/5.0    74
Rang # Activité PI	9 602
Classe Nice dominante	Produits chimiques destinés à l'...

Brevets Marques 101 43 2 11 37 3 41
Dernier brevet	2025 - Method for improving adhesion be...
Premier brevet	1997 - Printed circuit board manufacture
Dernière marque	2017 - MICROFAB
Première marque	1944 - EBONOL

Industrie (Classification de Nice)

Derniers inventions, produits et services 2024 Invention Method for improving adhesion between metallization layers and ozone-etched plastics. A method of... Invention Suppression of manganese dioxide formation in manganese (iii)-based etching solutions. A.method i... Invention Bendable nickel plating on flexible substrates. A method of producing a flexible nickel phosphoru... Invention Boric acid-free satin nickel. A nickel electrolyte for depositing a satin nickel layer that inclu... Invention Gold plating bath and gold plated final finish. An autocatalytic gold bath capable of depositing... Invention Electrodeposition of thin copper films on conductive substrates. A copper electrolyte comprising ... 2023 Invention Method for improving adhesion between metallization layers and ozone-etched plastics. A method o... Invention Treatment and recycling of wastewater from trivalent chromium plating processes. A method of trea... Invention Suppression of manganese dioxide formation in manganese (iii)-based etching solutions. A method ... Invention Compositions and methods for the electrodeposition of nanotwinned copper. A copper electroplatin... Invention Boric acid-free satin nickel. A nickel electrolyte for depositing a satin nickel layer that incl... Invention Composition and method for nanotwinned copper formation. A copper electrolyte comprising a copper... Invention Bendable nickel plating on flexible substrates. A method of producing a flexible nickel phosphor... Invention Copper electrodeposition in microelectronics. An electrolytic plating composition for superfilli... Invention Method and wet chemical compositions for diffusion barrier formation. A method of forming a diffu... Invention Electrolyte comprising an accelerator agent for bottom-up copper electroplating. The present inv... Invention Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor device... Invention Method of metallization by a nickel or cobalt alloy for the manufacture of semiconductor devices.... 2022 Invention Compositions and methods for the eletrodeposition of nanotwinned copper. A copper electrolyte co... Invention Compositions and methods for the electrodeposition of nanotwinned copper. A copper electrolyte co... Invention Compositions and methods for the electrodeposition of nanotwinned copper. A copper electroplating... Invention Complex waveform for electrolytic plating. A method of copper electroplating in the manufacture o... Invention Single step electrolytic method of filling through-holes in printed circuit boards and other subs... Invention Single step electrolytic method of filling through holes in printed circuit boards and other subs... Invention Silver/tin electroplating bath and method of using the same. An electroplating bath for depositin... 2021 Invention Cobalt chemistry for smooth topology. An electroplated cobalt deposit and a method of electrodepo... Invention Process for fabricating a 3d-nand flash memory. The invention relates to a process for fabricati... Invention High elongation electroless copper process. An electroless copper deposition composition, compris... Invention Copper deposition in wafer level packaging of integrated circuits. An electrodeposition compositi... Invention Electrolyte and deposition of a copper barrier layer in a damascene process. The present inventi... Invention Leveler compositions for use in copper deposition in manufacture of microelectronics. An aqueous... Invention Gold plating bath and gold plated final finish. An autocatalytic gold bath capable of depositing ... Invention Cobalt filling of interconnects. Compositions and methods of using such compositions for electrop... Invention Cobalt filling of interconnects in microelectronics. Processes and compositions for electroplatin... Invention Carbon-based direct plating process. A method of preparing a non-conductive substrate to allow m... 2020 Invention High elongation electroless copper process. An electroless copper deposition composition, compri... Invention Composition and method for fabrication of nickel interconnects. A nickel electrodeposition compos... 2018 Invention Copper electrodeposition in microelectronics. An electrolytic plating method and composition for ... 2017 P/S Chemicals for use in the plating process. 2015 P/S Chemicals used in polymer fields of science and electrochemical industries for use in the manufac... P/S chemicals for use in metal plating processes and fabrication of semiconductor wafers 2014 P/S chemical compositions used to prepare plastic and metal substrates for subsequent base and precio... 2013 P/S Chemical additives for use with plating solutions. 2012 P/S Chemical compositions for activating, treating and sealing metallic products; Chemical compositio... 2011 P/S Downloadable software used by customers to manage and analyze the chemical composition of functio... P/S Chemicals for use in the plating of zinc and zinc alloys. 2010 P/S Electroforming chemicals used for manufacturing fine gold jewelry and watches, and other decorati... P/S Chromium plating compositions for electroplating, namely, chemical products, salts, brighteners a... 2009 P/S Chemical compositions. P/S [ chemical compositions for use in metal deposition processes and addition agents therefor, namel... P/S Purification equipment. 2008 P/S Metal plating chemical compositions, namely, electrolytic acid copper solution P/S Electrolytic acid copper plating chemicals. 2007 P/S Electrolytic plating chemicals that are plated over nickel that produces satin and matte finishes... P/S Electroplating chemicals used in the manufacture of electronic devices, namely, inductive phone c... P/S Chemicals used for plating magnesium. P/S Electroless plating chemicals used for semiconductor manufacturing. P/S Electroplating chemicals used for manufacturing solar cells and photovoltaic arrays. P/S Chemicals for use in metal plating processes and for manufacture of semiconductor plates/wafers. P/S chemicals used for electroplating during the manufacture of solar cells and photovoltaic arrays 2006 P/S Electroplating compositions and solutions. P/S Chemicals and chemical preparations for surface conditioning of metal substrates, including chemi... P/S Electroplating compositions. P/S Chemicals except chemicals for use in cosmetics and fragances. P/S Chemicals. P/S Chemical plating solutions and addition agents for use in the electrodeposition of metals. P/S Chemicals used in industry, science and photography; unprocessed artificial resins; unprocessed ... 2005 P/S Chemical compositions for use in metal deposition process and as addition agents therefore. P/S Chemicals used in industry, science and photography, as well as in agriculture, horticulture and ... P/S Chemical compositions for the protection of metal surfaces. Inhibitors against opacification and ... P/S Chemicals used in industry, science and photography; unprocessed artificial resins, unprocessed p... P/S Chemical products for galvanotechnic purposes, electrolyte for use in gold plating processes. P/S Chemicals and chemical additives for zinc plating processes. P/S Chemical compositions for use in the deposition of alloys consisting of copper and tin. P/S Silver process chemistry, namely silver plating compositions, used in the manufacture of printed ... 2004 P/S Electrolyte for use in gold plating process. P/S Salts and other reagents, used in the forming of electrolytes in the electrodeposition of preciou... P/S Chemicals for forming passivate coatings on metallic surfaces, particularly, zinc. P/S Chemical compositions to brighten and prevent tarnishing of metal surfaces. P/S Silver process chemistry, namely silver plating compositions used in the manufacture of printed c... P/S Chemical products, namely a chemical solution for the surface treatment of printed circuit boards... P/S chemicals for use in the plating of zinc and zinc alloys P/S Chemical compositions for cleaning and protecting metal surfaces in the field of printed circuit ... P/S electrolytic plating chemistries that are plated over nickel that produces satin and matte finish... P/S Chemicals for the electrolytic cutting of metals. P/S CHEMICALS FOR USE IN THE MANUFACTURE OF ELECTRICAL AND ELECTRONIC COMPONENTS; CHEMICAL PREPARATIO...