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2024
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P/S
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Machines for assembly of semiconductor components; bonding equipment, namely, die bonders for sem... |
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Invention
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Defect inspection method and apparatus for electronic devices.
Method for inspecting a semicondu... |
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Invention
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Bond head heater incorporating fluid chamber for cooling.
A cooling system provided for a bond h... |
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2023
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Invention
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Apparatus and method for handling carrier rings mounted with electronic devices.
Electronic devi... |
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Invention
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Method for manufacturing integrated device packages.
Preparation for fabricating an integrated d... |
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Invention
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Apparatus and method for vibration attenuation. An apparatus for attenuating vibration of a suppo... |
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Invention
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Bonding machine bond head having six degrees of freedom.
A bond head having a bonding tool for b... |
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Invention
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Bond head having individually-displaceable bond arms.
A method of transferring a plurality of el... |
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Invention
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Ultrasonic transducer operable at multiple resonant frequencies.
An ultrasonic transducer that i... |
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Invention
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Bonding tool incorporating decoupled motion axes.
A bonding tool with a decoupling mechanism inc... |
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Invention
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Die bonder having a rotary bond arm actuator.
A semiconductor die bonding device has a bond arm ... |
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Invention
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Dielectric barrier discharge plasma generator. A dielectric barrier discharge plasma generator in... |
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Invention
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Picking an electronic component from a reusable adhesive tape.
A method of picking an electronic... |
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Invention
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Method and apparatus for conducting shear tests on interconnect bonds.
A shear test is conducted... |
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Invention
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Wire path plate having enhanced durability for wire bonding.
A wire path plate for a wire bondin... |
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Invention
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System and method for fluxless thermocompression bonding.
A bonding system for bonding an electr... |
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Invention
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Syringe housing for enhancing fluid dispensing stability.
A syringe housing has a space that is ... |
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Invention
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Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bondin... |
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Invention
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Molding apparatus having wedge driver.
A molding apparatus includes a mold and a wedge structure... |
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Invention
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Camera module assembly. A camera unit assembly which improves efficiency and quality of the solde... |
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2022
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Invention
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Handling a fragile substrate for interconnect bonding.
A bonding apparatus has a bonding platfor... |
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Invention
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Hybrid bonding of a thin semiconductor die.
When locating a semiconductor die on a substrate, th... |
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Invention
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Apparatus and method for calibrating a shear test tool. An apparatus for calibrating a shear test... |
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Invention
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Ultrasonic transducer operable at multiple resonant frequencies.
An ultrasonic transducer includ... |
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Invention
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Apparatus for applying a sintering force via a compressible film.
A sintering apparatus for simu... |
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Invention
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Wire bonding system including a wire biasing tool. A wire bonding system has a bonding tool and a... |
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Invention
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Passive alignment of lens module relative to an image sensor for manufacturing a camera module.
... |
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P/S
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Manufacturing machines for electronics boards and
components; machinery for production of electr... |
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P/S
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Manufacturing machines for manufacturing electronics boards and components; machinery for manufac... |
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Invention
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Force sensor in an ultrasonic wire bonding device. A force sensor for determining a bonding force... |
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Invention
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Pick-up chuck with gas bearing structure.
A pick-up chuck for handling a substrate has a chuck b... |
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Invention
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Force measurement device and method for bonding or encapsulation process and apparatus incorporat... |
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Invention
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Apparatus and method for imaging lens alignment using a virtual test image. An alignment apparatu... |
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2021
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Invention
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Encapsulation process for double-sided cooled packages. One or more electronic devices that are m... |
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Invention
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Laser-cutting using selective polarization. A method of cutting a semiconductor wafer by selectiv... |
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Invention
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Flexural pick arm for a pick and place apparatus. A pick arm for a pick and place apparatus for e... |
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Invention
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Aligning optical components along a predetermined reference optical path. To align an optical mod... |
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Invention
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Flexible sinter tool for bonding semiconductor devices. An apparatus having a seal plate which in... |
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Invention
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Detaching a die from an adhesive tape by air ejection. When picking a die from an adhesive tape, ... |
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Invention
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Ejector unit for detaching an electronic element from an adhesive carrier. An ejector unit for de... |
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2020
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P/S
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machines for assembly of semiconductor components; bonding equipment, namely, die and flip chip b... |
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Invention
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Aligning lens elements in a lens module relative to an image sensor. Before fixing first and seco... |
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Invention
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Detape apparatus for an optical alignment machine. A detape apparatus has a support unit with a d... |
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Invention
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Volumetric measurement and regulation device incorporated in a time-pressure dispenser. A device ... |
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Invention
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Automated particle removal system having angular adjustability. A foreign particle removal system... |
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P/S
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Machines for laser processing of semiconductor wafers; Machines for assembly of semiconductor com... |
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Invention
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Testing of led devices during pick and place operations. A pick and place LED testing apparatus, ... |
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Invention
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Die ejector height adjustment. A die ejection apparatus operable to eject a die from a support ha... |
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Invention
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System and method for aligning multiple lens elements. A lens assembly is separated into a first ... |
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Invention
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Dual-sided molding for encapsulating electronic devices. A molding system for molding electronic ... |
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Invention
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Fluid-dispensing apparatus.
A dispensing apparatus for the dispensation of a fluid onto a surfac... |
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Invention
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High precision bonding apparatus comprising heater. A bonding apparatus includes a bond head stru... |
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Invention
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Apparatus and method for removing a film from a surface. After molding a substrate located betwee... |
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Invention
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Bonding apparatus incorporating variable force distribution. A bonding apparatus includes a holdi... |
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Invention
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Direct transfer apparatus for electronic components. Electronic components are transferred from a... |
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2018
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P/S
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Active alignment machine for camera module assemblies; Assembly machines; Automated assembly mach... |
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P/S
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Active alignment machine for camera module assemblies; assembly machines, namely, alignment machi... |
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P/S
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machines for bonding semiconductor chips; machines for bonding semiconductor chips to substrates;... |
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P/S
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Bonding apparatus; Machines for manufacturing semiconductors; Machines for the assembly of semico... |
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P/S
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Machines for manufacturing semiconductor components; Machines for the plasma processing of semico... |
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2017
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P/S
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Machines for packaging electronic components; machines for packaging semiconductor devices Inspec... |
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2016
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P/S
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Machines for manufacturing semiconductor devices; machines for packaging semiconductors devices. |
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2015
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P/S
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Encapsulation machines; machines for encapsulation of semiconductor devices; molding machines; ma... |
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2013
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P/S
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Apparatus for testing electronic packages, namely, electronic products that have been packaged in... |
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2009
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P/S
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Solar cell wafer inspection machine. |
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2008
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P/S
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Molding machines and molds thereof; machines for transfer-molding of semiconductor devices. |
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P/S
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MOLDING MACHINES AND MOLDS THEREOF FOR USE IN THE MANUFACTURE OF INTEGRATED CIRCUIT PACKAGES AND ... |
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P/S
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Molding machines and molds thereof for use in the manufacture of integrated circuit packages and ... |
