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2025
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P/S
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Integrated circuits; Semiconductors; Semiconductor chip sets; Computer chips; Electronic componen... |
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P/S
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Integrated circuits; semiconductors; semiconductor chipsets and computer chipsets; electronic com... |
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P/S
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Integrated circuits; semiconductors; semiconductor chipsets
and computer chipsets; electronic co... |
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P/S
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Computer networking hardware; computer network bridges; semiconductors; semiconductor wafers; sem... |
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P/S
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Computer networking hardware; computer network bridges;
semiconductors; semiconductor wafers; se... |
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P/S
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integrated circuits; semiconductors; semiconductor chipsets and computer chipsets; electronic com... |
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2024
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Invention
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Manufacturing optically accessible co-packaged optics.
The present disclosure relates to circuit... |
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Invention
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Optical memory module, cache manager for an optical memory module. Systems and methods that inclu... |
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Invention
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Systems and methods for switching. Systems and method for switching are disclosed. In an example,... |
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Invention
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Optical ring modulator.
An optical ring modulator for use as a PAM-N modulator, the optical ring... |
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Invention
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Optoelectronic device and array thereof.
A photonic chip. In some embodiments, the photonic chip... |
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Invention
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Manufacturing optically accessible co-packaged optics. The present disclosure relates to circuit ... |
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Invention
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Disaggregated memory architecture.
A computing device includes a first circuit package including... |
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Invention
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Optically bridged multicomponent package with extended temperature range. A package comprises a p... |
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Invention
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Electro-photonic network for machine learning.
Electro-photonic networks, including a plurality ... |
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Invention
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Multicomponent photonically bridged assembly. A package comprises a first die and a bridging elem... |
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Invention
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Multicomponent photonically intra-die bridged assembly. A package includes a first die with a com... |
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Invention
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Stacked-dies optically bridged multicomponent package. An implementation provides a package that ... |
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Invention
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Optical bridging element for separately stacked electrical ics. A package includes a first die wi... |
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Invention
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Electro-photonic network for machine learning.
Various embodiments provide for electro-photonic ... |
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Invention
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Clock signal distribution using photonic fabric. Various embodiments provide for clock signal dis... |
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Invention
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Load / store unit for a tensor engine and methods for loading or storing a tensor. A method for p... |
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Invention
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Load/store unit for a tensor engine and methods for loading or storing a tensor. A method for pro... |
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Invention
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Electrical bridge package with integrated off-bridge photonic channel interface. A method of manu... |
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Invention
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Electrical bridge package with integrated off-bridge photonic channel interface. A circuit packag... |
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2023
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Invention
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Hybrid electro-photonic network-on-chip.
Various embodiments provide for a circuit package inclu... |
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Invention
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Optical multi-die interconnect bridge with electrical and optical interfaces.
A package includes... |
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Invention
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Single ended eam with electrical combining.
Disclosed here are systems, methods, and apparatuses... |
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Invention
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Optical multi-die interconnect bridge with optical interface. A package includes a bridging eleme... |
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Invention
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Via formed in a wafer using a front-side and a back-side process.
One embodiment is a method inc... |
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P/S
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Semiconductors; silicon-photonic devices, namely, application-specific integrated circuits (ASICs... |
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P/S
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Semiconductors; silicon-photonic devices, namely, application-specific, integrated circuits (ASIC... |
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P/S
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Technical support services, namely, providing technical advice related to the manufacture of opti... |
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P/S
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Computer networking hardware Computer network design and computer software design for the silicon... |
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P/S
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Computer network bridges Licensing of intellectual property |
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P/S
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Semiconductor devices Design of integrated circuits |
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Invention
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Optoelectronic device and array thereof. 2. |
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Invention
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Circuit package for connecting to an electro-photonic memory fabric.
The present disclosure rela... |
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Invention
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Circuit package for connecting to an electro-photonic memory fabric. The present disclosure relat... |
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Invention
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Thermal control of an optical component.
The present disclosure relates to thermal control syste... |
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Invention
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Optical multi-die interconnect bridge (omib). A package includes a bridging element (an OMIB), an... |
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2022
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Invention
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Through-substrate via formed using a partial plug that stops before a substrate.
A method is des... |
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Invention
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Via formed using a partial plug that extends into a substrate.
A method is described including c... |
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Invention
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Fidelity-restorable photonic linear operator.
The present disclosure relates to implementations ... |
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Invention
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Photonic memory fabric for system memory interconnection. One embodiment is a method that include... |
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Invention
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Photonic fabric with optical interface for connection to memory. One embodiment is an apparatus c... |
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Invention
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Electro-photonic network for machine learning. Various embodiments provide for a circuit package ... |
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Invention
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Multi-chip electro-photonic network.
Various embodiments provide for computational systems inclu... |
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Invention
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Thermosonic bonding for securing photonic components. The present disclosure includes a method of... |
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P/S
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Semiconductors; computer chipsets; semiconductors, computer chipsets and computer software for co... |
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P/S
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Semiconductors; Computer chipsets; Semiconductors, computer chipsets and computer software for co... |
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2021
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Invention
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Balanced photonic architectures for matrix computations. Vector and matrix multiplications can be... |
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P/S
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Semiconductors; semiconductor chips; semiconductor chipsets; computer chipsets for use in transmi... |
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P/S
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Semiconductors; semiconductor chips; semiconductor chipsets; computer chipsets; microprocessors; ... |
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Invention
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Switch assembly.
An integrated switch assembly having a stacked configuration, the integrated sw... |
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2020
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Invention
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Optical ring modulator. a second electrode region having a second pn junction or second Moscap, t... |
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Invention
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Silicon photonic interposer with two metal redistribution layers. A silicon integrated circuit. I... |
