Hwatsing Technology Co., Ltd.

Chine

Commandez votre montre hebdomadaire Hwatsing Technology Co., Ltd.
Quantité totale PI 27
Rang # Quantité totale PI 55 068
Note d'activité PI 2/5.0    13
Rang # Activité PI 66 673
Symbole boursier 688120 (sse)
Classe Nice dominante Machines et machines-outils

Brevets

Marques

5 2
0 0
20 0
0
 
Dernier brevet 2024 - Monitoring method for chemical m...
Premier brevet 2011 - Device and method for measuring ...
Dernière marque 2021 - HWATSING
Première marque 2021 - HWATSING

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Monitoring method for chemical mechanical polishing and chemical mechanical polishing device. A m...
2022 Invention Wafer post-processing device. Disclosed in the present invention is a wafer post-processing devic...
Invention Rotary wafer exchange system. Disclosed is a rotary wafer exchange system; the rotary wafer excha...
Invention Wafer vertical rotation processing apparatus based on marangoni effect. Disclosed is a wafer vert...
Invention Flexible membrane, bearing head and planarization apparatus for chemical mechanical planarization...
Invention Chemical mechanical planarization control method and system. A chemical mechanical planarization ...
2021 P/S Components for machines and machine tools, grinding machines, material handling machines, food pr...
P/S Buffing and polishing; Burnishing, not by abrasion; Machinery installation, maintenance and repai...
Invention Vertical marangoni wafer processing device. A vertical marangoni wafer processing device, compris...
Invention Marangoni drying device with adjustable spray angle. A Marangoni drying device with an adjustable...
Invention Substrate thinning method, substrate thinning device, and operating method thereof. A substrate t...
2018 Invention Adaptive polishing head. An adaptive polishing head (100), comprising: a pivot component (10), a ...
Invention Polishing head capable of preventing water accumulation. The invention discloses a polishing head...
2017 Invention Wafer clamping device. A wafer clamping device (100) comprising: a first clamping member (10) hav...
Invention Wafer transport apparatus. A wafer transport apparatus (100), comprising: a wafer clamping assemb...
Invention Gas passage pressure response system. Disclosed is a gas passage pressure response system (100), ...
Invention Chemical mechanical polishing system. A chemical mechanical polishing system comprises: a front-e...
Invention Pressure loading film. Disclosed is a pressure loading film (100). The pressure loading film (100...
Invention Positioning assembly. Disclosed is a positioning assembly (100) comprising: a support (10); and a...
Invention Cmp equipment polishing head wafer falling detection method and system. A CMP equipment polishing...
Invention Polishing apparatus. Disclosed is a polishing apparatus (100), comprising a polishing device (10)...
Invention Apparatus for measuring friction force of lubricant. An apparatus for measuring a friction force ...
Invention Apparatus for chemical-mechanical polishing. An apparatus for chemical-mechanical polishing is pr...
Invention Chemical-mechanical polishing machine. A chemical-mechanical polishing machine (100) is provided,...
2011 Invention Measuring device for measuring film thickness of silicon wafer. A measuring device for measuring ...
Invention Method for measuring thickness of film on wafer edge. A method for measuring a film thickness of ...
Invention Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the ...
Invention Device and method for measuring thickness of slurry and chemical mechanical polishing apparatus c...