HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

Chine

 
Quantité totale PI 136
Rang # Quantité totale PI 9 533
Note d'activité PI 2,9/5.0    118
Rang # Activité PI 5 830

Brevets

Marques

121 0
0 0
15 0
0
 
Dernier brevet 2025 - Circuit board with embedded resi...
Premier brevet 2013 - Chip package structure and metho...

Derniers inventions, produits et services

2024 Invention Circuit board, manufacturing method, and display module. A circuit board includes an inner wirin...
Invention Transparent circuit board. A transparent circuit board includes a conductive wiring, a transpare...
2023 Invention Chip packaging structure and method for packaging the chip. A method for packaging a chip, the c...
Invention Circuit board assembly and method of manufacturing the same, packaging structure having the same....
Invention Circuit board assembly. The disclosure provides a circuit board assembly, which includes a core ...
Invention Circuit board with embedded resistors and method for fabricating the same. A circuit board with ...
Invention Flexible circuit board and method for fabricating the same. A flexible circuit board and a metho...
Invention Circuit board and manufacturing method thereof. A circuit board includes a first circuit layer, ...
Invention Transducer wiring board and method for manufacturing the same. A transducer wiring board and a m...
Invention Circuit board connection structure and preparation method therefor. A preparation method for a c...
Invention Flexible circuit board and method of fabricating the same. A flexible circuit board and a method...
Invention Circuit board. A circuit board includes an inner circuit substrate and an outer circuit substrat...
Invention Circuit board and manufacturing method therefor, and display module. Disclosed in the present app...
2022 Invention Circuit board and method for manufacturing the same. A circuit board with improved heat dissipat...
Invention Packaging method for chip, and chip packaging structure. A packaging method for a chip (30), comp...
Invention Circuit board assembly and manufacturing method therefor, and packaging structure. Provided is a ...
Invention Circuit board connection structure and manufacturing method therefor. A manufacturing method for ...
Invention Buried thermistor and method of fabricating the same. A buried thermistor includes a lower substr...
Invention Packaging structure with embedded electronic components and method for manufacturing the same. A ...
Invention Packaging structure. A packaging structure, includes: a dielectric layer; at least one inner wir...
Invention Circuit board and method for manufacturing the same. A circuit board, with inbuilt protection aga...
Invention Camera module of reduced size and method for manufacturing the same. A camera module of reduced s...
Invention Method for manufacturing a circuit board. A method for manufacturing a circuit board comprises: a...
Invention Circuit board with embedded component and method of fabricating the same. A circuit board with e...
Invention Circuit board and method of manufacturing circuit board. A circuit board includes a substrate, a ...
2021 Invention Manufacturing method of circuit board assembly. The disclosure provides a circuit board assembly,...
Invention Circuit board and method of manufacturing thereof. A circuit board includes a dielectric substrat...
Invention Circuit board assembly and manufacturing method thereof. The disclosure provides a circuit board ...
Invention Method of manufacturing display module with light emitting diode free of a split-screen boundary ...
Invention Method for manufacturing multilayer printed circuit board. A method for manufacturing such multil...
Invention Wiring substrate and method of manufacturing the same. A wiring substrate includes a first insula...
Invention Circuit board and manufacturing method thereof. The present application provides a circuit board...
Invention Circuit board and manufacturing method therefor. The present application provides a circuit board...
Invention Method of manufacturing composite circuit board. A composite circuit board includes a composite c...
Invention Method for manufacturing flexible circuit board. A method for manufacturing a flexible circuit bo...
Invention Method for manufacturing a circuit board. A circuit board with improved heat dissipation function...
Invention Circuit board and method for manufacturing the same. A method for manufacturing a circuit board e...
Invention Method for manufacturing a circuit board. A circuit board includes a circuit substrate, a solder,...
Invention Circuit board, method for manufacturing the same. A circuit board includes a circuit substrate, a...
Invention Circuit board and manufacturing method therefor. Provided in the present application is a circuit...
2020 Invention Method for manufacturing a circuit board with embedded nickel resistor. A method for manufacturin...
Invention Lens module and manufacturing method therefor. A lens module (100), comprising: a substrate (10),...
Invention Multi-layer circuit board with embedded components and method for manufacturing same. A multi-la...
Invention Circuit board and preparation method thereof. A circuit board and a manufacturing method therefor...
Invention Board-to-board connection structure and method for manufacturing the same. The present disclosure...
Invention Circuit board with embedded electronic component and method for manufacturing the same. A method ...
2019 Invention Method for manufacturing a packaging structure. A packaging structure, includes: a dielectric lay...
Invention Method for manufacturing transparent circuit board. A method for manufacturing a transparent circ...