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2024
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Invention
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Reliable semiconductors packages.
A semiconductor package is disclosed. The package includes a p... |
|
|
Invention
|
Multi-chip image sensor semiconductor package.
Multi-chip image sensor semiconductor packages an... |
|
|
Invention
|
Reliable optical semiconductor packages.
A semiconductor package and method for forming thereof ... |
|
|
Invention
|
Semiconductor device and method of making a semiconductor package with a pre-installed glass cove... |
|
|
Invention
|
Semiconductor device and method of making a semiconductor package with a glass cover.
A semicond... |
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|
Invention
|
Reliable semiconductor packages.
A semiconductor package and method for forming thereof are disc... |
|
|
Invention
|
Semiconductor packages with thermal dissipation.
The present disclosure is directed to improving... |
|
|
Invention
|
Semiconductor device and method of making an optical semiconductor package.
A semiconductor devi... |
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2023
|
Invention
|
Wafer lamination systems and methods thereof for semiconductor wafers.
Lamination systems and me... |
|
|
Invention
|
Semiconductor packaging for image sensors.
A semiconductor package for a sensor is disclosed. Th... |
|
|
Invention
|
Semiconductor device and method of making a substrate with improved substrate mounting apparatus.... |
|
|
Invention
|
Semiconductor device carriers and methods of making and using.
A first carrier has a first plate... |
|
|
Invention
|
Semiconductor device and method for sensing external condition in harsh environment.
A semicondu... |
|
|
Invention
|
Semiconductor packages and methods of forming rdl and side and back protection for semiconductor ... |
|
|
Invention
|
Plasma diced wafers and methods thereof.
Reliable plasma dicing of a processed wafer with a die ... |
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2022
|
Invention
|
Plasma diced wafers and methods thereof.
Reliable plasma dicing of a wafer with a die attach fil... |
|
|
Invention
|
Semiconductor device and method of making a mems semiconductor package.
A semiconductor device i... |
|
|
Invention
|
Plasma diced wafers and methods thereof.
Reliable plasma dicing of wafers to singulate it into i... |
|
|
Invention
|
Frame mask for singulating wafers by plasma etching.
The present disclosure relates to plasma di... |
|
|
Invention
|
Semiconductor packages with reliable covers.
A semiconductor package is disclosed. The package i... |
|
|
Invention
|
Illuminator method and device for semiconductor package testing. An illuminator system for semico... |
|
|
Invention
|
Semiconductor device and method of forming an optical semiconductor package with a shield structu... |
|
|
Invention
|
Wafer adaptor for adapting different sized wafers. A wafer adaptor ring assembly for adapting an ... |
|
|
Invention
|
Wafer adaptors, including systems and methods, for adapting different sized wafers.
A wafer adap... |
|
|
Invention
|
Semiconductor device and method of disposing electrical components above and below substrate.
A ... |
|
|
Invention
|
Flip chip semiconductor package with a leadframe to enhance package mechanical stability and heat... |
|
2021
|
Invention
|
Semiconductor packages with vertical passive components. An embodiment related to a package is di... |
|
|
Invention
|
Semiconductor device and method of forming clip bond having multiple bond line thicknesses.
A se... |
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|
P/S
|
Electrical and electronic components, namely, computers, electrical circuit boards, electrical co... |
|
|
P/S
|
Electrical and electronic components, parts and fittings for all the aforesaid goods; semi-conduc... |
|
|
Invention
|
Semiconductor device and method of forming leadframe with clip bond for electrical interconnect. ... |
|
|
Invention
|
System and method of cleaning and inspecting semiconductor die carrier. A semiconductor manufactu... |
|
|
Invention
|
Semiconductor packages and methods of packaging semiconductor devices. An embodiment related to a... |
|
|
Invention
|
Reliable semiconductor packages. A semiconductor package and a method of manufacturing thereof is... |
|
|
Invention
|
Semiconductor package with dams. A semiconductor package and a method of manufacturing thereof is... |
|
|
Invention
|
Semiconductor device and method of forming protective layer around cavity of semiconductor die. A... |
|
|
Invention
|
Reliable semiconductor packages. A semiconductor package is disclosed. The package includes a pac... |
|
|
Invention
|
Hermetic semiconductor packages. A semiconductor package and method for forming thereof are discl... |
|
|
Invention
|
Semiconductor packages with integrated shielding. The present disclosure is directed to improving... |
|
|
Invention
|
Reliable semiconductor packages. A semiconductor package and method for forming thereof are discl... |
|
|
Invention
|
Reliable semiconductor packages. Semiconductor packages and methods for forming thereof are discl... |
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2020
|
Invention
|
Reliable semiconductor packages.
The present disclosure is directed to improving package adhesio... |
|
|
Invention
|
Semiconductor packages without debris. A semiconductor package which is free of metal debris from... |
|
|
Invention
|
Reliable semiconductor packages for sensor chips. A method for forming a semiconductor package is... |
|
|
Invention
|
Clip bond semiconductor packages and assembly tools. The present disclosure is directed to a high... |
|
|
Invention
|
Semiconductor packages and methods of packaging semiconductor devices. A semiconductor package is... |
|
|
Invention
|
Stacked dies electrically connected to a package substrate by lead terminals. An embodiment relat... |
|
|
Invention
|
Cavity wall structure for semiconductor packaging. A method for forming a semiconductor package i... |
|
2019
|
Invention
|
Reliable semiconductor packages. A method for forming a semiconductor package is disclosed. The m... |
|
|
Invention
|
Conductive bonding layer with spacers between a package substrate and chip. An embodiment related... |
|
2015
|
P/S
|
Custom fabricating, making and manufacturing of goods and materials for others, namely, electrica... |
|
|
P/S
|
Electrical and electronic components; semi-conductors;
integrated circuits; integrated circuit p... |
|
2004
|
P/S
|
Electrical and electronic components; semi-conductors,
semi-conductor chips; integrated circuits... |
|
2002
|
P/S
|
ELECTRONIC AND ELECTRIC COMPONENTS, NAMELY, SEMI-CONDUCTORS, SEMI-CONDUCTOR CHIPS, AND INTEGRATED... |
