Ymt Co., Ltd.

République de Corée


Commandez votre montre hebdomadaire Ymt Co., Ltd.
Quantité totale PI 33
Rang # Quantité totale PI 44 024
Note d'activité PI 2,5/5.0    37
Rang # Activité PI 20 245
Parent Hicel Co., Ltd.
Symbole boursier 251370 (kosdaq)
Capitalisation 134.034B  (KRW)
Classe Nice dominante Produits chimiques destinés à l'...

Brevets

Marques

13 1
0 0
18 1
0
 
Dernier brevet 2025 - Methods for forming circuit patt...
Premier brevet 2002 - Cartridge for fixing collector
Dernière marque 2022 - NANOTUS
Première marque 2022 - NANOTUS

Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Methods for forming circuit pattern on substrate using metal foil with low surface roughness. Pr...
Invention Leveler and electroplating composition for filling via hole. The present invention relates to a ...
Invention Metal layer, carrier-attached metal foil comprising same, and printed circuit board comprising sa...
2022 Invention Method for forming circuit pattern on substrate by using metal foil with low surface roughness. T...
Invention Carrier material for forming perforated metal foil, and perforated metal foil having carrier mate...
Invention Leveling agent and electrolytic composition for filling via hole. The present invention relates ...
Invention Metal-based encapsulating material for organic light emitting diode, and method for producing sam...
Invention A leveling agent and an electroplating composition including the same. The present invention rela...
Invention Leveling agent, and electroplating composition comprising same for filling via hole. The present ...
Invention Leveling agent and electroplating composition comprising same for filling via hole. The present i...
Invention Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing met...
Invention Leveling agent and electroplating composition for forming circuit pattern including the same. Pr...
Invention Leveling agent, and electroplating composition for forming circuit patterns, comprising same. The...
Invention Composite release layer for carrier-attached metal foil and metal foil comprising same. The prese...
P/S Precious metal plating; gold plating; metal plating and laminating; exterior and interior metal p...
P/S Tempering chemicals for use in metalworking; solution additives for metal plating; pre-treatment...
2021 Invention Release layer for metal foil with carrier and metal foil comprising the same. The present inventi...
Invention Metal foil, metal foil with carrier comprising same, and printed circuit board comprising same. ...
Invention Metal foil, metal foil with carrier comprising same, and printed circuit board comprising same. T...
Invention Release layer for metal foil with carrier, and metal foil comprising same. The present invention ...
Invention High-density interconnection printed circuit board having plating layers, and method for manufact...
Invention Surface modifier for electrolytic nickel plating and nickel electroplating solution including the...
Invention Electrolytic nickel plating surface modifier and electrolytic nickel plating solution comprising ...
2020 Invention Method for filling via hole of circuit board and circuit board manufactured using same. The prese...
Invention Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the sa...
Invention Carrier foil-attached metal foil, manufacturing method therefor, and laminate comprising same. Th...
2019 Invention Plated laminate and printed circuit board. Provided is a plating lamination technology for provid...
Invention Plated laminate and printed circuit board. The present invention relates to a plating laminating ...
2018 Invention Method for producing porous copper foil and porous copper foil produced by the same. Provided is ...
2016 Invention Antimicrobial cosmetic container containing impregnating material. Provided is a cosmetic contain...
2014 Invention Method for producing substrate formed with copper thin layer, method for manufacturing printed ci...
2012 Invention Electroplating method for printed circuit board. Disclosed is an electroplating method for print...
2009 Invention Electroless nickel plating solution composition, flexible printed circuit board and manufacturing...
2008 Invention Composition for surface modification of a heat sink and method for surface treatment of the heat ...
2006 Invention Method for plating printed circuit board and printed circuit board manufactured therefrom. Discl...
Invention Method of forming triple palladium- palladium-gold plating layer on high-density printed circuit ...
2003 Invention Coupler having guard cap. The present invention relates to a coupler, in which a guard cap couple...
2002 Invention Cartridge for fixing collector. A cartridge for fixing a collector includes a main body 100, a ca...
Invention Device for locking cap nut for coupling. A device for locking a cap nut for a coupling includes a...