Taiwan Union Technology Corporation

Taïwan, Province de Chine


 
Quantité totale PI 61
Rang # Quantité totale PI 22 507
Note d'activité PI 2,3/5.0    28
Rang # Activité PI 28 119
Symbole boursier 6274 (tpex)
ISIN TW0006274004
Capitalisation 48.0B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

56 3
0 0
0 0
2
 
Dernier brevet 2025 - Prepreg and uses of the same
Premier brevet 2009 - Epoxy resin blend
Dernière marque 2019 - PegaClad
Première marque 2007 - tuc

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Prepreg and uses of the same. A prepreg is provided. The prepreg includes a first dielectric lay...
Invention Resin composition and uses of the same. A resin composition is provided. The resin composition c...
Invention Copper clad laminate and uses of the same. A copper clad laminate is provided. The copper clad l...
2023 Invention Resin composition and uses thereof. A resin composition and uses thereof are provided. The resin...
2022 Invention Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the ...
Invention Resin composition and uses thereof. A resin composition and the uses of it are provided. The res...
Invention Prepreg and uses thereof. A prepreg and uses thereof are provided. The prepreg includes an organ...
Invention Solvent-free resin composition and uses of the same. A solvent-free resin composition and uses t...
2021 Invention Resin composition and uses of the same. A resin composition and uses of the same are provided. T...
2020 Invention Fluororesin composition, and resin sheet, laminate and printed circuit board. wherein, the parti...
Invention Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using th...
Invention Metal-clad laminate, printed circuit board, and method for manufacturing the same. a metal foil d...
2019 Invention Metal-clad laminate and manufacturing method of the same. wherein the melting point of the second...
Invention Resin composition and uses of the same. A resin composition and uses of the same are provided. Th...
Invention Resin composition and uses of the same. wherein the first one-minute half-life temperature is 20°...
Invention Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same. (B) a...
Invention Flexible prepreg and uses thereof. (B-1) a repeating unit of formula (I), (B-2) a repeating un...
Invention High thermal conductivity prepreg and uses of the same. (e) oven-drying the impregnated reinforci...
Invention Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circ...
P/S Printed circuit boards; printed circuit board which has trace layers of laminates and copper; fle...
Invention Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board ma...
Invention Solvent-free resin composition and uses of the same. (C) inorganic fillers, including a hollow fi...
Invention Resin composition and uses of the same. (a) a thermal-curable resin system, which has a dielectri...
2018 P/S Printed circuit boards; printed circuit boards which have trace layers of laminates and copper; f...
Invention Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed cir...
Invention Dielectric composite and uses thereof. the dielectric composite has a dielectric constant (Dk) no...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same. (B...
Invention Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the...
Invention Adhesive composition and uses of the same. (B-1) a repeating unit of formula (I), (B...
Invention Resin composition and uses of the same. (a) a resin of formula (I); (c) a compound of formula ...
2017 Invention Solvent-free resin composition and uses of the same. (A) a benzoxazine resin of formula (I), ...
Invention Method of manufacturing metal-clad laminate and uses of the same. wherein the first fluoropolymer...
Invention Resin composition, prepreg, metal-clad laminate, and printed circuit board using the same. A res...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same. (b...
2016 Invention Resin composition and uses of the same. wherein the amount of the component (b) is 1 wt % to 30 w...
Invention Resin composition and uses of the same. A resin composition, comprising the following components...
2015 Invention Resin composition and uses of the same. (a) a resin of formula (I): (c) a hardening ...
Invention Resin composition and uses of the same. (a) a resin of formula (I): wherein, X, Y, R1 to R4, A...
2014 Invention Prepreg and uses of the same. A prepreg is provided. The prepreg is prepared by immersing a rein...
Invention Resin composition and uses of the same. A resin composition is provided. The resin composition in...
Invention Resin composition and uses of the same. 50) of the filler ranges from about 2 μm to about 10 μm. ...
Invention Epoxy resin blend. An example method to prepare a prepreg is disclosed. In one embodiment, the me...
2013 Invention Epoxy resin composition, and prepreg and printed circuit board using the same. Disclosed is an e...
Invention Resin composition and uses of the same. (a) a resin of formula (I): wherein, R1, R2,...
2012 Invention Resin composition and uses of the same. A resin composition is provided. The resin composition co...
Invention Resin compositions and uses of the same. A resin composition is provided. The resin composition ...
2007 P/S Carbon-fiber reinforced resin sheets for general industrial use; Carbon fiber laminates in the na...
P/S Printed circuit board; printed circuit board which has trace layers of laminates and copper; flex...
P/S Printed circuit board; printed circuit board laminate; copper clad laminate; flexible printed cir...