Taiwan Union Technology Corporation

Taïwan, Province de Chine


Commandez votre montre hebdomadaire Taiwan Union Technology Corporation
Quantité totale PI 62
Rang # Quantité totale PI 22 428
Note d'activité PI 2,4/5.0    27
Rang # Activité PI 28 757
Symbole boursier 6274 (tpex)
ISIN TW0006274004
Capitalisation 48.0B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

57 3
0 0
0 0
2
 
Dernier brevet 2025 - Metal-clad laminate
Premier brevet 2009 - Epoxy resin blend
Dernière marque 2019 - PegaClad
Première marque 2007 - tuc

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Metal-clad laminate. A metal-clad laminate is provided. The metal-clad laminate includes: a diel...
Invention Prepreg and uses of the same. A prepreg is provided. The prepreg includes a first dielectric laye...
Invention Resin composition and uses of the same. A resin composition is provided. The resin composition c...
Invention Copper clad laminate and uses of the same. A copper clad laminate is provided. The copper clad l...
2023 Invention Resin composition and uses thereof. A resin composition and uses thereof are provided. The resin...
2022 Invention Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the ...
Invention Resin composition and uses thereof. (B) a diene compound, represented by the following formula (I...
Invention Prepreg and uses thereof. A prepreg and uses thereof are provided. The prepreg includes an organ...
Invention Solvent-free resin composition and uses of the same. A solvent-free resin composition and uses t...
2021 Invention Resin composition and uses of the same. A resin composition and uses of the same are provided. T...
2020 Invention Fluororesin composition, and resin sheet, laminate and printed circuit board. wherein, the parti...
Invention Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using th...
Invention Metal-clad laminate, printed circuit board, and method for manufacturing the same. a metal foil d...
2019 Invention Metal-clad laminate and manufacturing method of the same. wherein the melting point of the second...
Invention Resin composition and uses of the same. A resin composition and uses of the same are provided. Th...
Invention Resin composition and uses of the same. wherein the first one-minute half-life temperature is 20°...
Invention Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same. (B) a...
Invention Flexible prepreg and uses thereof. (B-1) a repeating unit of formula (I), (B-2) a repeating un...
Invention High thermal conductivity prepreg and uses of the same. (e) oven-drying the impregnated reinforci...
Invention Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circ...
P/S Printed circuit boards; printed circuit board which has trace layers of laminates and copper; fle...
Invention Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board ma...
Invention Solvent-free resin composition and uses of the same. (C) inorganic fillers, including a hollow fi...
Invention Resin composition and uses of the same. (a) a thermal-curable resin system, which has a dielectri...
2018 P/S Printed circuit boards; printed circuit boards which have trace layers of laminates and copper; f...
Invention Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed cir...
Invention Dielectric composite and uses thereof. the dielectric composite has a dielectric constant (Dk) no...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same. (B...
Invention Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the...
Invention Adhesive composition and uses of the same. (B-1) a repeating unit of formula (I), (B...
Invention Resin composition and uses of the same. (a) a resin of formula (I); (c) a compound of formula ...
2017 Invention Solvent-free resin composition and uses of the same. (A) a benzoxazine resin of formula (I), ...
Invention Method of manufacturing metal-clad laminate and uses of the same. wherein the first fluoropolymer...
Invention Resin composition, prepreg, metal-clad laminate, and printed circuit board using the same. A res...
Invention Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same. (b...
2016 Invention Resin composition and uses of the same. wherein the amount of the component (b) is 1 wt % to 30 w...
Invention Resin composition and uses of the same. A resin composition, comprising the following components...
2015 Invention Resin composition and uses of the same. (a) a resin of formula (I): (c) a hardening ...
Invention Resin composition and uses of the same. (a) a resin of formula (I): wherein, X, Y, R1 to R4, A...
2014 Invention Prepreg and uses of the same. A prepreg is provided. The prepreg is prepared by immersing a rein...
Invention Resin composition and uses of the same. A resin composition is provided. The resin composition in...
Invention Resin composition and uses of the same. 50) of the filler ranges from about 2 μm to about 10 μm. ...
Invention Epoxy resin blend. An example method to prepare a prepreg is disclosed. In one embodiment, the me...
2013 Invention Resin composition and uses of the same. (a) a resin of formula (I): wherein, R1, R2,...
2012 Invention Resin composition and uses of the same. A resin composition is provided. The resin composition co...
Invention Resin compositions and uses of the same. A resin composition is provided. The resin composition ...
2007 P/S Carbon-fiber reinforced resin sheets for general industrial use; Carbon fiber laminates in the na...
P/S Printed circuit board; printed circuit board which has trace layers of laminates and copper; flex...
P/S Printed circuit board; printed circuit board laminate; copper clad laminate; flexible printed cir...