|
2025
|
Invention
|
Package with polymer pillars and raised portions.
The present disclosure is directed to semicond... |
|
|
Invention
|
Sensor die package.
The present disclosure is directed to a package that includes a transparent ... |
|
|
Invention
|
Wafer level chip scale package having varying thicknesses.
A wafer level chip scale package (WLC... |
|
|
Invention
|
Stacked die package including a multi-contact interconnect.
The present disclosure is directed t... |
|
|
Invention
|
Low profile sensor packages.
The present disclosure is directed to embodiments of optical sensor... |
|
|
Invention
|
Mems thin membrane with stress structure.
A blind opening is formed in a bottom surface of a sem... |
|
2024
|
Invention
|
Optical sensor package and method of making an optical sensor package.
A molded carrier is forme... |
|
|
Invention
|
Power mosfet with reduced current leakage and method of fabricating the power mosfet.
An integra... |
|
|
Invention
|
Embedded wafer level optical sensor packaging.
The present disclosure is directed to a sensor di... |
|
|
Invention
|
Slanted glass edge for image sensor package. Disclosed herein is a method of reducing noise captu... |
|
2023
|
Invention
|
Passivation layer for an integrated circuit device that provides a moisture and proton barrier.
... |
|
|
Invention
|
Panel level semiconductor package and method of manufacturing the same.
The present disclosure i... |
|
|
Invention
|
Optical sensor package with encapsulant is between and separates substrates and multiple assembli... |
|
|
Invention
|
Gas sensor device for detecting gases with large molecules. The present disclosure is directed to... |
|
|
Invention
|
Chip size package and system.
A method of manufacturing a chip-sized package includes providing ... |
|
|
Invention
|
Power package with copper plating and molding structure.
The present disclosure is directed to a... |
|
|
Invention
|
Wafer level chip scale package having varying thicknesses. A wafer level chip scale package (WLCS... |
|
|
Invention
|
Semiconductor package with gas release holes.
A semiconductor package includes a silicon substra... |
|
|
Invention
|
Method for auto-aligned manufacturing of a trench-gate mos transistor, and shielded-gate mos tran... |
|
|
Invention
|
Semiconductor device with a dielectric between portions. A semiconductor device having a channel ... |
|
|
Invention
|
Multi-chip package. A multi-chip package including a first integrated circuit and a second integr... |
|
|
Invention
|
Semiconductor package with exposed electrical contacts.
A semiconductor package includes a die a... |
|
2022
|
Invention
|
Semiconductor metal oxide based gas sensor activated at zero heater power.
A gas sensor is forme... |
|
|
Invention
|
Integrated circuit chip package that does not utilize a leadframe.
An integrated circuit die inc... |
|
|
Invention
|
Thick bonding pad structure for wire bond stress reduction.
A bonding pad for an integrated circ... |
|
|
Invention
|
Oxide field trench power mosfet with a multi epitaxial layer substrate configuration.
A semicond... |
|
|
Invention
|
Sensor package including a sensor die.
The present disclosure is directed to embodiments of sens... |
|
|
Invention
|
Sensor package with embedded integrated circuit.
Provided is a sensor package with an integrated... |
|
|
Invention
|
Low cost wafer level packages and silicon.
Described herein is a method of forming wafer-level p... |
|
|
Invention
|
Method of making a charge coupled field effect rectifier diode. A trench in a semiconductor subst... |
|
|
Invention
|
Method of manufacturing electronic devices and corresponding electronic device. A substrate inclu... |
|
|
Invention
|
Low profile sensor packages. The present disclosure is directed to embodiments of optical sensor ... |
|
|
Invention
|
Optical integrated circuit sensor package using a stacked configuration for the sensor die and th... |
|
|
Invention
|
Semiconductor device package with conductive vias and method of manufacturing.
The present discl... |
|
|
Invention
|
Gate contact structure for a trench power mosfet with a split gate configuration. An integrated c... |
|
|
Invention
|
Wafer level packaging having redistribution layer formed utilizing laser direct structuring.
A m... |
|
|
Invention
|
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an i... |
|
2021
|
Invention
|
Sensor die package. The present disclosure is directed to a package that includes a transparent l... |
|
|
Invention
|
Stacked die package including a multi-contact interconnect. The present disclosure is directed to... |
|
|
Invention
|
Package with polymer pillars and raised portions. The present disclosure is directed to semicondu... |
|
|
Invention
|
Optical sensor package and method of making an optical sensor package. A molded carrier is formed... |
|
|
Invention
|
Method for manufacturing a wafer level chip scale package (wlcsp). Trenches are opened from a top... |
|
|
Invention
|
Molded range and proximity sensor with optical resin lens. A method for forming a molded proximit... |
|
|
Invention
|
Split-gate trench power mosfet with self-aligned poly-to-poly isolation. A semiconductor substrat... |
|
|
Invention
|
Embedded wafer level optical sensor packaging. The present disclosure is directed to a sensor die... |
|
|
Invention
|
Wafer level chip scale packaging with sensor.
The present disclosure is directed to a package (e... |
|
|
Invention
|
Slanted glass edge for image sensor package. A digital image sensor package includes an image sen... |
|
|
Invention
|
Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transi... |
