Samsung Electro-mechanics Co., Ltd.
République de Corée
Nouveaux brevets et marques déposées la semaine dernière
Dernière mise à jour : 2026-07-26
Sommaire
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Marques |
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Viewing 1 - 13 of 13
marques
brevets
| # | ID | Juridiction | Title |
|---|---|---|---|
| 1 | 19397520 |
|
CAMERA MODULE |
| 2 | 19442270 |
|
CAMERA MODULE |
| 3 | 19281923 |
|
OPTICAL ELEMENT AND CAMERA MODULE INCLUDING OPTICAL ELEMENT |
| 4 | 19572185 |
|
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRATED CIRCUIT PACKAGE |
| 5 | 19279549 |
|
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 6 | 19398958 |
|
MULTILAYER ELECTRONIC COMPONENT |
| 7 | 19393812 |
|
LENS MODULE |
| 8 | 19397454 |
|
MOUNTING STRUCTURE OF MULTILAYER ELECTRONIC COMPONENT |
| 9 | 19393418 |
|
MULTILAYER ELECTRONIC COMPONENT |
| 10 | 19394023 |
|
MULTILAYER ELECTRONIC COMPONENT |
| 11 | 19018458 |
|
PRINTED CIRCUIT BOARD |
| 12 | 19547864 |
|
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
| 13 | 19567495 |
|
OPTICAL IMAGING SYSTEM |
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