OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Watanabe, Yomi
Sato, Hirofumi
Kobayashi, Hideaki
Hoshina, Ryosuke
Katagiri, Kazumi
Abrégé
Provided is a method of producing a lower alcohol ester of fatty acid lower alcohol ester of fatty acid-containing composition, the method being capable of increasing a proportion of a lower alcohol ester of EPA in a lower alcohol ester of fatty acid-containing composition. The method of producing a lower alcohol ester of fatty acid-containing composition includes subjecting a raw material oil and fat containing an EPA-containing glyceride with a lipase at 25°C or less to produce a lower alcohol ester of fatty acid-containing composition including a lower alcohol ester of EPA.
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Ohashi, Yasunori
Zhou, Lin
Yamamoto, Maiko
Kimura, Hajime
Otsuka, Keiko
Matsumoto, Akihiro
Abrégé
This impregnated sheet includes a substrate and a resin composition with which the substrate is impregnated. The resin composition contains a resol-type phenolic resin and a carboxylic acid-modified lignin.
C08J 5/04 - Renforcement des composés macromoléculaires avec des matériaux fibreux en vrac ou en nappes
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
C08L 61/06 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes avec des phénols
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
3.
IMPREGNATED SHEET, LAMINATED SHEET, AND RESIN COMPOSITION
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Ohashi, Yasunori
Zhou, Lin
Yamamoto, Maiko
Kimura, Hajime
Otsuka, Keiko
Matsumoto, Akihiro
Abrégé
This impregnated sheet includes a substrate and a resin composition with which the substrate is impregnated. The resin composition contains a reaction product of a lignin, a phenol, and an aldehyde.
C08J 5/04 - Renforcement des composés macromoléculaires avec des matériaux fibreux en vrac ou en nappes
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
C08L 61/12 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes avec des phénols avec des phénols polyhydriques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
4.
COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Fujiwara, Takeshi
Inagaki, Jyunichi
Hinatsu, Masako
Okada, Akinori
Agari, Yasuyuki
Hirano, Hiroshi
Kadota, Joji
Abrégé
The invention of the present application provides: a composition capable of forming heat-dissipation members having high thermal conductivity; and a heat-dissipation member. The composition for heat-dissipation members includes: a first inorganic filler which is thermally conductive, and which is bonded to one terminal of a coupling agent; and a second inorganic filler which is thermally conductive, is bonded to one terminal of a coupling agent, and also has, bonded to another terminal of the coupling agent bonded thereto, a polymerizable compound that is at least bifunctional. In the composition for heat-dissipation members, curing is used to bond, to the polymerizable compound of the second inorganic filler, another terminal of the coupling agent bonded to the first inorganic filler.
C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Fujiwara, Takeshi
Inagaki, Jyunichi
Yada, Yukito
Okada, Akinori
Agari, Yasuyuki
Hirano, Hiroshi
Kadota, Joji
Abrégé
The invention of the present application provides: a composition capable of forming heat-dissipation members having high thermal conductivity; and a heat-dissipation member. The composition for heat-dissipation members includes: a polymerizable liquid crystal compound which has, at both ends, a structure including an oxiranyl group or an oxetanyl group; a curing agent for curing the polymerizable liquid crystal compound; and an inorganic filler formed from a nitride. The curing temperature of the composition for heat-dissipation members is more than or within the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and less than or within the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. A heat-dissipation member formed from this composition is capable of exhibiting excellent thermal conductivity as a result of the synergistic effect of the inorganic filler formed from the nitride and the alignment of the liquid crystal compound.
C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
7.
HEAT-INSULATING STRUCTURE FOR ELECTRONIC APPARATUS
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Aoki, Takahiro
Agari, Yasuyuki
Hirano, Hiroshi
Kadota, Joji
Okada, Akinori
Abrégé
Provided is a heat-insulating structure for an electronic apparatus characterized in that: the heat-insulating structure is provided with a substrate comprising a mounted heat-generating component, a casing housing the substrate, and a heat-insulating sheet which is disposed on the inner surface of the casing at a position facing the heat-generating component with a gap therebetween; the heat-insulating sheet comprises a metal layer applied across a bonding layer on the inner surface of the casing and a surface layer stacked upon the metal layer; the surface layer comprises a transparent resin layer stacked directly, or across a second bonding layer, upon the metal layer; and the thickness of the surface layer is 1 to 10 μm.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques Détails
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Saibara Masahiko
Ashida Kazuhito
Mizuno Takumi
Ito Takatoshi
Mihara Masatoshi
Iwai Toshiyuki
Nakai Takeo
Abrégé
The present invention addresses the problem of providing a novel bis(hydroxyphenyl)benzoxazole compound which is useful as a raw material resin for resins such as epoxy and polybenzoxazole, and as a medicine, agrochemical, dye and electronic material, or an intermediate or raw material therefor. Provided as a means for solving this problem is a bis(hydroxyphenyl)benzoxazole compound represented by general formula (1) (in the formula, R1 denotes an alkyl group having 1-8 carbon atoms, an alkoxy group having 1-8 carbon atoms, a phenyl group or a halogen atom, R2 denotes a hydrogen atom, an alkyl group having 1-8 carbon atoms, an alkoxy group having 1-8 carbon atoms, a phenyl group or a halogen atom, A denotes a cycloalkylidene group having 5-10 carbon atoms, and n is 0 or an integer between 1 and 4).
C07D 263/62 - Composés hétérocycliques contenant des cycles oxazole-1, 3 ou oxazole-1, 3 hydrogéné condensés avec des carbocycles ou avec des systèmes carbocycliques avec plusieurs systèmes cycliques contenant des cycles condensés d'oxazole-1, 3
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
DAIHACHI CHEMICAL INDUSTRY CO., LTD. (Japon)
Inventeur(s)
Matsukawa, Kimihiro
Watase, Seiji
Mitamura, Koji
Hirata, Manabu
Abrégé
Provided are: a method by which a patterned thin film having high refractive index and high transparency can be easily produced in a short time; and a thin film having high refractive index, which is produced by this method. A method for producing a thin film, which comprises: a first step for forming a coating film on a substrate using a sol that contains a metal oxide modified with a phosphorus compound represented by formula (1) (in formula (1), R1 represents a hydrogen atom, an alkyl group, an alkynyl group, an alkenyl group, an aryl group, an aliphatic heterocyclic group or an aromatic heterocyclic group; R2 represents a divalent organic residue; and n represents 1 or 2); a second step for curing the coating film on the substrate, which is obtained in the first step, by irradiation of light; and a third step for providing the cured product, which is obtained in the second step, with energy by heating and/or irradiation of light.
B05D 3/06 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des rayonnements
B05D 3/02 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par cuisson
B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
KITAMURA CHEMICALS CO., LTD. (Japon)
DAIHACHI CHEMICAL INDUSTRY CO., LTD. (Japon)
Inventeur(s)
Agari, Yasuyuki
Hirano, Hiroshi
Kadota, Joji
Okada, Akinori
Mutou, Masahiro
Abrégé
The present invention addresses the problem of providing: a plasticized polylactic acid-based resin film which is produced by an inflation molding method and which does not cause problematic tight winding; and a process for manufacturing the same. A process for manufacturing a plasticized polylactic acid-based resin film by inflation-molding a polylactic acid -based resin composition which comprises 100 parts by weight of polylactic acid and 10 to 30 parts by weight of a plasticizer, characterized by including a heat treatment step subsequent to the step for ejecting the polylactic acid-based resin composition through an orifice for inflation molding.
OSAKA MUNICIPAL TECHNICAL RESEACH INSTITUTE (Japon)
Inventeur(s)
Nagase Ayumi
Kamei Hiroshi
Kidani Naoki
Aoki Makoto
Shinagawa Tsutomu
Abrégé
The present invention pertains to a process for producing a ceramic copper-metallized wiring board, said process including: forming a film which comprises 150 to 250 zinc oxide needle crystals per μm2 on a ceramic base material by a wet method of immersing the ceramic base material in a zinc plating liquid, said zinc oxide needle crystals having a diameter of 20 to 100nm and a length of 120 to 280nm; heat-treating the resulting ceramic base material in the atmosphere at a temperature of 500 to lower than 900º; forming a copper deposit by electroless copper plating or copper electroplating; and subjecting the copper deposit to patterning with an etching resist to form a wiring pattern. According to the process, a ceramic copper-metallized wiring board which exhibit excellent adhesion and which is usable as a wiring board for a power module can be obtained.
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
12.
MODIFIED LIGNIN, AND HEAT-CURABLE RESIN MOLDING MATERIAL CONTAINING SAME
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Ohashi, Yasunori
Ogi, Takeshi
Kimura, Hajime
Matsumoto, Akihiro
Otsuka, Keiko
Abrégé
Modified lignin according to the present invention has, in the molecule thereof, many phenolic hydroxy groups each produced by the ring-opening of a benzoxazine ring. The modified lignin can be produced by, for example, the ring-opening polymerization of a benzoxazine ring that is formed by reacting lignin, a phenol, an amine and an aldehyde with one another. A heat-curable resin molding material according to the present invention comprises a heat-curable resin and the modified lignin.
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Ito, Tetsuya
Tadokoro, Hiroki
Masaki, Hisaharu
Mikuni, Katsuhiko
Murakami, Hiromi
Kiso, Taro
Kiryu, Takaaki
Abrégé
The present invention provides a D-glucaric acid-producing bacterium, and a method for manufacturing D-glucaric acid. The invention is characterized in that: the D-glucaric acid, or a salt thereof, is manufactured from one or two glucides which are selected from a group comprising D-glucose, D-gluconic acid, and D-glucuronic acid, and the reaction is catalyzed by a specified alcohol dehydrogenase PQQ-ADH (1), and a specified aldehyde dehydrogenase PQQ-ALDH (2); and the D-glucaric acid, or the salt thereof, is manufactured, in the presence of the one or two glucides, using a microorganism having the PQQ-ADH (1) and PQQ-ALDH (2), or the substance obtained by processing the microorganism. This invention can provide a microscopic organism which has improved D-glucaric acid-producing properties for use in the manufacture of D-glucaric acid, and an effective method for manufacturing D-glucaric acid.
C12N 1/21 - BactériesLeurs milieux de culture modifiés par l'introduction de matériel génétique étranger
C12N 9/02 - Oxydoréductases (1.), p. ex. luciférase
C12N 9/04 - Oxydoréductases (1.), p. ex. luciférase agissant sur des groupes CHOH comme donneurs, p. ex. oxydase de glucose, déshydrogénase lactique (1.1)
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
DAIHACHI CHEMICAL INDUSTRY CO., LTD. (Japon)
Inventeur(s)
Matsukawa, Kimihiro
Watase, Seiji
Hirata, Manabu
Abrégé
The present invention addresses: the problem of providing an organic-inorganic hybrid acrylic polymer which has increased refractive index and higher transparency, while being suppressed in decrease of abrasion resistance; the problem of providing a metal oxide dispersion and a polymerizable composition, each of which serves as a starting material for the polymer; and the problem of providing the organic-inorganic hybrid polymer which can be prevented from the occurrence of cracks during the production procedure. The present invention also addresses the problem of providing an antireflection film which utilizes the organic-inorganic hybrid polymer and exhibits high performance. A metal oxide dispersion of the present invention contains a phosphorus compound represented by formula (1) and a metal oxide. (In formula (1), R1 represents a hydrogen atom, an alkyl group, an alkynyl group, an alkenyl group, an aryl group, an aliphatic heterocyclic group or an aromatic heterocyclic group; R2 represents an organic residue; and n is 1 or 2.)
C08F 30/04 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal
C01G 23/053 - Obtention par voie humide, p. ex. par hydrolyse de sels de titane
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08F 30/02 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant du phosphore
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Ougi, Takeshi
Kimura, Hajime
Matsumoto, Akihiro
Otsuka, Keiko
Abrégé
This water-insoluble lignin has an average particle size of 230 μm or less (but not including 0μm). This water-insoluble lignin preferably derives from herbaceous plants. This water-insoluble lignin, for example, is used as a thermosetting resin molding material by mixing with a thermosetting resin.
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Ougi, Takeshi
Ishibashi, Yoshiaki
Yamano, Koji
Kimura, Hajime
Matsumoto, Akihiro
Otsuka, Keiko
Abrégé
This modified lignin has a benzoxazine ring in each molecule, and is preferably obtained from a plant-derived lignin. This modified lignin can be obtained by reacting, for example, lignin, an amine and an aldehyde. In addition, a phenolic resin molding material of the present invention contains a phenolic resin and the above-described modified lignin.
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Fujimoto, Nobutaka
Kawakita, Tomoki
Miyabara, Ryou
Nakamoto, Masami
Ohno, Toshinobu
Yamamoto, Mari
Kashiwagi, Yukiyasu
Abrégé
The present invention provides a metal paste composition which is to be used in a wiring board in a baked state and which can yield a baked body having a low volume resistivity. More particularly, the present invention provides a metal paste composition which comprises a metal, an aliphatic polycarbonate, and an organic solvent.
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
AMC CO., LTD. (Japon)
Inventeur(s)
Morisada, Yoshiaki
Mizuno, Tadashi
Abe, Genryu
Kitamura, Yusuke
Nagaoka, Toru
Fukusumi, Masao
Abrégé
The present invention is a laser cladding method for forming a cladding layer in which vanadium carbide is uniformly dispersed, wherein a cladding layer that contains vanadium carbide is formed on the surface of a base by means of a laser processing head that is capable of discharging a cladding material powder coaxially with the optical axis of the laser light, said cladding material powder being composed of an iron-based material containing 7-15% by mass of V, preferably an iron-based material containing 10-15% by mass of V.
B23K 26/34 - Soudage au laser pour des finalités autres que l’assemblage
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
19.
FULLERENE DERIVATIVE AND PHOTOELECTRIC TRANSDUCER USING SAME
Osaka Municipal Technical Research Institute (Japon)
Kyoto University (Japon)
Inventeur(s)
Ohno, Toshinobu
Takao, Yuko
Moriwaki, Kazuyuki
Matsumoto, Fukashi
Ito, Takatoshi
Iwai, Toshiyuki
Yoshikawa, Susumu
Sagawa, Takashi
Uchida, Soichi
Ikeda, Satoru
Abrégé
Provided is a fullerene derivative which exhibits high LUMO energy and a high open-circuit voltage based thereon and which is highly soluble in polymers and exhibits excellent charge mobility and charge separation ability. A fullerene derivative which has an electron-donating group in close vicinity to the fullerene nucleus, represented by general formula (I) [wherein the encircled FL represents fullerene C60 or C70; Donor-Sub represents a substituent which has at least one electron-donating substitutional atom at a position that is separated from the fullerene nucleus by two bonds; R is hydrogen, Donor-Sub, or a group having 1 to 20 carbon atoms in total, said group being alkyl, cycloalkyl, alkoxy, alkoxy-substituted alkyl, alkoxy-substituted alkoxy, alkylthio-substituted alkoxy, alkylthio, alkylthio-substituted alkylthio, alkoxy-substituted alkylthio, benzyl or phenyl; and n is an integer of 1 to 10].
C07C 43/21 - Éthers une liaison sur l'oxygène de la fonction éther étant sur un atome de carbone d'un cycle aromatique à six chaînons contenant des cycles autres que des cycles aromatiques à six chaînons
C08K 9/04 - Ingrédients traités par des substances organiques
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01L 51/05 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés au redressement, à l'amplification, à la génération d'oscillations ou à la commutation et ayant au moins une barrière de potentiel ou une barrière de surface; Condensateurs ou résistances à l'état solide, ayant au moins une barrière de potentiel ou une barrière de surface
H01L 51/40 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
H01L 51/42 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Miyazaki, Hiroka
Moriguchi, Hideki
Utsumi, Yoshiharu
Fujii, Hidetoshi
Morisada, Yoshiaki
Abrégé
The present invention provides friction stir welding tool with excellent abrasion resistance and defect resistance. This friction stir welding tool is used in friction stir welding processes, and is characterized in that: a base material is contained therein; the base material contains a first hard phase, a second hard phase, and a binder phase; the first hard phase comprises WC particles; the second hard phase comprises a compound comprising one or more metals selected from a group comprising Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W, and one more types of elements selected from a group comprising nitrogen, carbon, boron and oxygen, or a solid solution (excluding WC) of said compound; the binder phase comprises a ferrous metal; and with regards to the composition ratio of the first hard phase and the second hard phase, the percentage by volume of the second hard phase is higher than or the same as that of the first hard phase.
B23K 20/12 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage la chaleur étant produite par frictionSoudage par friction
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Miyazaki, Hiroka
Moriguchi, Hideki
Utsumi, Yoshiharu
Fujii, Hidetoshi
Morisada, Yoshiaki
Abrégé
The present invention provides friction stir welding tool with excellent abrasion resistance and defect resistance. This friction stir welding tool is used in friction stir welding processes, and is characterized in that: a base material is contained therein; the base material contains a first hard phase and a binder phase, and has a coefficient of thermal conductivity of not more than 45 W/m·K; the first hard phase comprises WC particles; and the binder phase comprises a ferrous metal, and comprises 8 vol% to 28 vol% of the base material.
B23K 20/12 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage la chaleur étant produite par frictionSoudage par friction
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Moriguchi, Hideki
Miyazaki, Hiroka
Utsumi, Yoshiharu
Fujii, Hidetoshi
Morisada, Yoshiaki
Abrégé
Provided is a tool for friction stir welding, which has excellent wear resistance and provides welding of good quality, and wherein a coating layer is not easily separated from a base. This tool for friction stir welding is provided with a base and a coating layer that is formed on the base and is characterized in that: the base comprises a first hard phase, a second hard phase and a binder phase; the first hard phase is formed of WC particles; the second phase is formed of a compound, which is composed of one or more metals that are selected from the group consisting of Ti, Zr, Hf, Nb, Ta, Cr, Mo and W and one or more elements that are selected from the group consisting of nitrogen, carbon, boron and oxygen, or a solid solution of the compound (excluding WC); the second hard phase is contained in an amount of 3-30% by volume (inclusive) relative to the base; the binder phase is formed of an iron group metal and is contained in an amount of 8-28% by volume (inclusive) relative to the base; and the constituent ratio of the first hard phase is larger than the constituent ratio of the second hard phase in terms of volume.
B23K 20/12 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage la chaleur étant produite par frictionSoudage par friction
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Ougi, Takeshi
Ishibashi, Yoshiaki
Yamano, Koji
Kimura, Hajime
Matsumoto, Akihiro
Otsuka, Keiko
Abrégé
Provided is a lignin-added thermosetting resin such as a novolac type or resol type phenolic resin, which is a biomass thermosetting resin that contains a herbaceous lignin in the form of a dried powder and has improved characteristics such as mechanical strength, heat resistance, electric insulation and water resistance. A lignin-added thermosetting resin molded article is provided by molding the lignin-added thermosetting resin into a predetermined shape.
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Suetsugu, Kazuhiro
Morita, Satoshi
Yamada, Yasuhiro
Ohno, Toshinobu
Ito, Takatoshi
Iwai, Toshiyuki
Matsumoto, Fukashi
Abrégé
The present invention provides a method for synthesizing a zederone analogue derived from natural materials, a precursor useful in synthesis of the zederone analogue, and an intermediate useful for synthesizing the zederone precursor. Specifically, the present invention uses (E) -5-halegeno-4-hexanoic acid alkyl ester as a starting material to synthesize a zederone analogue, a precursor useful in synthesis of the zederone analogue, and an intermediate useful for synthesizing the zederone precursor.
A61K 8/49 - Cosmétiques ou préparations similaires pour la toilette caractérisés par la composition contenant des composés organiques contenant des composés hétérocycliques
A61Q 19/02 - Préparations pour les soins de la peau pour décolorer ou blanchir la peau chimiquement
C07D 307/60 - Deux atomes d'oxygène, p. ex. anhydride succinique
C07D 307/93 - Composés hétérocycliques contenant des cycles à cinq chaînons comportant un atome d'oxygène comme unique hétéro-atome du cycle condensés en ortho ou en péri avec des carbocycles ou avec des systèmes carbocycliques condensés avec un cycle autre qu'un cycle à six chaînons
C07D 317/16 - Radicaux substitués par des atomes d'halogènes ou des radicaux nitro
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Shiraki Masanori
Date Noriaki
Agari Yasuyuki
Abrégé
Provided is a heat-conductive elastomer composition that is useful for a heat-dissipating member of an electric or electronic part and the like. Elastomer heat conductivity is improved by mixing an elastomer composition, which is primarily a styrene elastomer, with a heat-conductive filler formed from an aluminum hydroxide, the surface of which is coated with an organic coupling agent, and/or a heat-conductive filler formed from a magnesium oxide obtained by coating the surface of deactivated magnesium oxide in the form of magnesia clinker with an inorganic substance and/or an organic substance.
C08L 23/00 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères
C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères
Osaka Municipal Technical Reseach Institute (Japon)
KABUSHIKIKAISHA AMC (Japon)
OSAKA UNIVERSITY (Japon)
Inventeur(s)
Morisada, Yoshiaki
Fukuzumi, Masao
Nagaoka, Toru
Mizuno, Tadashi
Abe, Genryu
Fujii, Hidetoshi
Abrégé
Disclosed is a method for forming a metal membrane with a superfine structure and a structural member with a metal membrane formed by the use of said method. In particular, a better method for forming a metal membrane whereby minute carbides are distributed evenly is disclosed. The disclosed method for forming a metal membrane comprises a first step in which metal powder is built up on a base surface by the use of laser cladding and a second step in which a metal membrane with a superfine structure is formed on said built-up region by the appliction of friction stir processing.
C23C 24/08 - Revêtement à partir de poudres inorganiques en utilisant la chaleur ou une pression et la chaleur
B23K 20/12 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage la chaleur étant produite par frictionSoudage par friction
B23K 26/34 - Soudage au laser pour des finalités autres que l’assemblage
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Agari, Yasuyuki
Miyoshi, Akira
Tsuboi, Ryohei
Abrégé
Provided is a transparent heat-radiating coating composition with which a coating layer having excellent transparency and heat-radiating properties can be formed. The transparent heat-radiating coating composition is a transparent heat-radiating coating composition comprising a binder resin, a hydrotalcite compound, and a resin dispersant having an amine value of 0 to 90 mg KOH/g. The heat-radiating coating composition comprises 50 to 290 parts by weight of the hydrotalcite compound per 100 parts by weight of the binder resin.
C09D 201/00 - Compositions de revêtement à base de composés macromoléculaires non spécifiés
B01F 17/52 - Résines naturelles ou synthétiques ou leurs sels
B05D 5/00 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
C09D 133/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions de revêtement à base de dérivés de tels polymères
28.
METHOD FOR MODIFICATION OF CEMENTED CARBIDES AND CEMENTED CARBIDES MODIFIED BY THE METHOD
Osaka Municipal Technical Research Institute (Japon)
KABUSHIKIKAISHA AMC (Japon)
OSAKA UNIVERSITY (Japon)
Inventeur(s)
Morisada, Yoshiaki
Nagaoka, Toru
Fukuzumi, Masao
Mizuno, Tadashi
Abe, Genryu
Fujii, Hidetoshi
Abrégé
Provided are a method for the modification of cemented carbides and cemented carbides modified by the method, and more particularly, an advantageous method for modifying a cemented carbide layer which has been formed by thermal spraying on the surface of a metal substrate. The method for the modification of cemented carbides includes applying friction stir processing to a cemented carbide to refine the grains of the binder phase contained in the cemented carbide. In particular, effective modification can be attained by applying friction stir processing to a cemented carbide layer which has been formed by thermal spraying on the surface of a metal substrate.
Osaka Municipal Technical Research Institute (Japon)
JX Nippon Oil & Energy Corporation (Japon)
Inventeur(s)
Ohno Toshinobu
Takao Yuko
Moriwaki Kazuyuki
Matsumoto Fukashi
Uchida Souichi
Ikeda Satoru
Abrégé
Provided are novel methanofullerene derivatives which can be applied as organic semiconductor materials to electronic elements such as organic FET and electroluminescent elements or solar cells. Specifically provided are methanofullerene derivatives represented by general formula (I), which are characterized in that the average of the chemical shift values of C2 and C2' in 13C-NMR is 80.10ppm or more, C2 and C2' being carbon atoms which are present on a fullerene (FL) and which are bonded to C1. In general formula (I), FL is a fullerene; X1 and X2 are each an aromatic hydrocarbon group, an alkyl group, or the like; C2 and C2' are carbon atoms which are present on FL and to which C1 is bonded; and n is an integer of 1 to 10.
C07C 13/68 - Hydrocarbures polycycliques ou leurs dérivés hydrocarbonés acycliques à cycles condensés à plus de trois cycles condensés le système cyclique condensé ne contenant que quatre cycles à système cyclique ponté
C07D 333/24 - Radicaux substitués par des atomes de carbone comportant trois liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. radicaux ester ou nitrile
H01L 51/42 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Yamashita Kenji
Omoto Takashi
Moriyoshi Kunihiko
Kawano Hiroaki
Abrégé
Disclosed is an antibacterial agent which contains a compound containing a metal other than aluminum, and a phosphorus adsorbent. Also disclosed is a method for using an antibacterial agent, wherein the antibacterial properties of a compound containing a metal other than aluminum are improved by using the compound containing a metal other than aluminum and a phosphorus adsorbent in combination. Consequently, in the antibacterial agent and the method for using an antibacterial agent, the antibacterial properties of a compound containing a metal other than aluminum, particularly the antibacterial properties of a silver-containing compound are significantly improved.
A01N 61/00 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des substances de composition non connue ou indéterminée, p. ex. des substances caractérisées uniquement par leur mode d'action
Osaka Municipal Technical Research Institute (Japon)
Inventeur(s)
Nagakawa Keiichi
Kawasaki Noriaki
Karita Kazusa
Matsukawa Kimihiro
Abrégé
A coating composition for forming, without using any lubricant or the like, a transparent coating layer which exhibits scratch resistance, wear resistance, excellent flexibility, and sufficient hardness; and a laminate using the composition. Provided are a resin composition for the formation of a transparent coating layer, which is characterized by containing both (A) an organosilicon compound having a reactive functional group and (B) a polythiol compound; a process for the production of the composition; and a laminate.
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 27/16 - Produits stratifiés composés essentiellement de résine synthétique spécialement traitée, p. ex. irradiée
C09D 183/00 - Compositions de revêtement à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carboneCompositions de revêtement à base de dérivés de tels polymères
32.
COMPOSITE NANOPARTICLE AND PROCESS FOR PRODUCING SAME
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
DAIKEN CHEMICAL CO., LTD. (Japon)
Inventeur(s)
Nakamoto, Masami
Yamamoto, Mari
Kashiwagi, Yukiyasu
Yoshida, Yukio
Kakiuchi, Hiroshi
Matsumura, Shinsuke
Abrégé
Metal nanoparticles having superior migration resistance; and a process for producing composite nanoparticles, which is characterized by heat-treating a mixture containing an organic silver compound and an organic copper compound at 150°C or higher in a non-oxidative atmosphere in the presence of a tertiary amine compound represented by the following general formula: R1R2R3N [wherein R1 to R3 independently represent an alkyl or aryl group which may have a substituent, provided that R1 to R3 may be linked together to form a cyclic structure and R1 to R3 may independently have 5 to 18 carbon atoms], thereby producing composite nanoparticles which contain at least silver and copper in each particle.
B22F 9/30 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec décomposition de mélanges métalliques, p. ex. par pyrolyse
33.
COPPER-CONTAINING NANOPARTICLE AND PROCESS FOR PRODUCING SAME
OSAKA MUNICIPAL THECHNICAL RESEARCH INSTITUTE (Japon)
DAIKEN CHEMICAL CO., LTD. (Japon)
Inventeur(s)
Nakamoto, Masami
Yamamoto, Mari
Kashiwagi, Yukiyasu
Yoshida, Yukio
Kakiuchi, Hiroshi
Matsumura, Shinsuke
Abrégé
Copper-containing nanoparticles having excellent oxidation resistance; and a process for producing copper-containing nanoparticles, which is characterized by heat-treating an organic copper compound at a temperature equal to or higher than a temperature at which the decomposition of the compound starts and lower than a temperature at which the compound is completely decomposed in a non-oxidative atmosphere in the presence of an organic material comprising a 1,2-alkanediol having 5 or more carbon atoms and/or a derivative thereof, thereby producing copper-containing nanoparticles which contain an organic component.
B22F 9/30 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec décomposition de mélanges métalliques, p. ex. par pyrolyse
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
H01B 5/00 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
Osaka Municipal Technical Research Institute (Japon)
OSAKA UNIVERSITY (Japon)
KABUSHIKIKAISHA AMC (Japon)
Inventeur(s)
Morisada, Yoshiaki
Nagaoka, Takashi
Fukuzumi, Masao
Fujii, Hidetoshi
Mizuno, Masashi
Abrégé
[PROBLEMS] To provide a method for refining the texture of a surface layer part in a ferrous material, to provide a ferrous material having a microscopic texture which can realize improved properties and prolonged service life of cutting tools, blades and the like, and to provide a blade with a cutting edge formed by fabricating a microscopic texture region, wherein the expression 旜refining a texture” means the refinement of base metal crystal grains and the refinement of carbides. [MEANS FOR SOLVING PROBLEMS] A method for refining the texture of a ferrous material, comprising a first step of forming a carbide refined region and a second step of forming a texture refined region. In the first step, the surface layer part in the ferrous material is locally and rapidly heated by a laser beam to form a melt reservoir which is then rapidly solidified to form a carbide refined region. In the second step, the carbide refined region formed in the first step is subjected to a friction agitation process to form a texture refined region.
C21D 1/09 - Durcissement de surface par application directe d'énergie électrique ou ondulatoireDurcissement de surface par radiation particulaire
B23K 20/12 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage la chaleur étant produite par frictionSoudage par friction
C21D 9/18 - Traitement thermique, p. ex. recuit, durcissement, trempe ou revenu, adapté à des objets particuliersFours à cet effet pour couteaux, faux, ciseaux ou autres outils à couper à main similaires
35.
THERMALLY CONDUCTIVE THERMOSETTING RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
Inventeur(s)
Kamiyahata, Tsuneo
Kato, Yoko
Agari, Yasuyuki
Hasegawa, Kiichi
Abrégé
It is intended to provide a thermally conductive thermosetting resin composition which has high thermal conductivity and is excellent in molding processability and a process for producing the same. The thermally conductive thermosetting resin composition of the invention contains 2 to 80% by volume of a thermally conductive filler composed of 10% by volume or more of a thermosetting resin, a metal powder with a melting point of not lower than 500°C and a carbon filler, and 1 to 20% by volume of a low melting point alloy with a melting point of not higher than 300°C.
OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE (Japon)
OSAKA PREFECTURAL GOVERNMENT (Japon)
OSAKA PREFECTURE UNIVERSITY (Japon)
OSAKA INDUSTRIAL PROMOTION ORGANIZATION (Japon)
Inventeur(s)
Shimada, Yasuhito
Kita, Yasuo
Nosaka, Toshikazu
Nakayama, Yoshikazu
Okuda, Toshiyuki
Abrégé
A resin material having high strength and high vibration-damping properties. The resin material comprises a matrix resin and carbon nanocoils incorporated therein. Since carbon nanocoils have conductivity, the incorporation of carbon nanocoils into the matrix resin facilitates the conversion of a vibrational energy generated in the resin material to heat. Thus, the vibrational energy can be damped in a short time. Since the carbon nanocoils are in a coil form, they are more effective in heightening vibration-damping properties than conductive materials such as carbon nanotubes and graphite.