[Problem] To provide a metal member in which the occurrence of cracks can be suppressed even when subjected to a heat treatment. [Solution] According to the present invention, a metal member which contains a metal as a main component, and in which 50 vol% or more of a nitrogen-containing metal region that contains 0.025 at% or more of nitrogen in the member is formed, especially a metal member in which a part or all of the nitrogen-containing metal region is formed inside the metal member is applied to an electric product or the like. The present invention also provides a plating solution which is capable of industrially advantageously forming a plating film that forms the nitrogen-containing metal region.
An object of the present invention is to provide a method for producing a plating film that can impart excellent corrosion resistance to an object on which a trivalent-chromium plating film is formed, and that can form a trivalent-chromium plating film with excellent brightness. The present invention includes step 1 of forming an electrolytic nickel plating film and step 2 of forming an electrolytic trivalent-chromium plating film on the electrolytic nickel plating film, wherein the electrolytic nickel plating film has a compressive stress of 0 to 100 MPa.
An object of the present invention is to newly provide a copper plating solution for PR pulse electrolysis and a copper plating method by a PR pulse electrolysis method. Provided is a copper plating solution for PR pulse electrolysis, comprising a copper (II) ion, a polyvalent metal ion (excluding copper (II) ions), and an unsaturated fatty acid.
The present invention provides a catalyst-providing liquid useful for forming an electroless plating film having excellent pattern properties and plating-deposition properties on a metal material. Specifically, the present invention provides a catalyst-providing liquid for electroless plating, the liquid comprising: (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants; and (B) a metal catalyst. The (B) metal catalyst includes at least one selected from the group consisting of Pd, Au, Ag, and Pt, and has a pH of 5 or lower. The content of the (A) cationic compound is 0.01-1000 mg/L, and the content of the (B) metal catalyst is 0.01-100 mg/L.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
5.
PLATING FILM FOR METAL SINTERING BONDING, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MOUNTING SUBSTRATE
Provided is a plating film that has excellent heat resistance and thermal shock resistance and that is suitable for metal sintering bonding. The plating film for metal sintering bonding has (A) an electroless nickel-phosphorus plating film, and is characterized in that the phosphorus content of the electroless nickel-phosphorus plating film (A) is 4 mass% or less with respect to 100 mass% of the electroless nickel-phosphorus plating film.
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
6.
ANTI-FINGERPRINT AGENT FOR COATINGS AND METHOD FOR IMPROVING ANTI-FINGERPRINT PROPERTIES OF COATING
The present invention newly provides an anti-fingerprint agent for coatings and a method for improving the anti-fingerprint properties of a coating. This anti-fingerprint agent is for coatings which are anodized aluminum or aluminum-alloy coatings, the anti-fingerprint agent containing a phosphorus-containing chelating agent. The anti-fingerprint agent is for use in a pore-filling treatment and/or a dye fixation treatment of a coating.
The present invention provides a particle dispersion and a particle-containing plating solution which have excellent particle dispersibility. The present invention provides a particle dispersion comprising: particles; and a nonionic surfactant A represented by general formula (1) (in the formula, R1-1and R1-2are the same as or different from each other and represent oxyalkylene groups, and R1-3and R1-4 are the same as or different from each other and represent C1-C10 hydrocarbon groups. m and n are the same as or different from each other and represent integers, and m+n=0-30).
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C09K 23/38 - Alcools, p. ex. produits d'oxydation de paraffines
C09K 23/42 - Éthers, p. ex. éthers polyglycoliques d'alcools ou de phénols
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C25D 3/12 - Dépôt électrochimiqueBains utilisés à partir de solutions de nickel ou de cobalt
The purpose of the present invention is to provide a novel technique for manufacturing a bonded structure by direct bonding. A bonded structure in which a structure 1 and a structure 2 are bonded with a metal plating film interposed therebetween is provided.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
9.
LIGHTFASTNESS IMPROVER FOR ANODIC OXIDE FILM OF DYED ALUMINUM OR ALUMINUM ALLOY AND METHOD FOR IMPROVING LIGHTFASTNESS OF FILM
An object of the present invention is to provide a technique for improving the lightfastness of a dyed anodic oxide film of aluminum or an aluminum alloy. Provided are a Lightfastness improver for a dyed anodic oxide film of aluminum or an aluminum alloy, and a method for improving the Lightfastness of the film.
The purpose of the present invention is to provide a novel copper film. Disclosed is a copper film which is formed on a metal lead frame, and is composed of a particle assembly film that has a specific surface area of 1.3 × 10-3m2/g to 2.2 × 10-3m2/g, wherein particle assemblies that form the particle assembly film have a size of 15 µm or less.
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
Produits et services
Chemicals for use in the manufacture of semiconductors;
surface treatment agents for electronic components; etchants
for use in the manufacture of semi-conductors; plating
removing preparations; release solvent for photoresists;
chemicals for use in metal plating; industrial chemicals;
chemicals for use in plating; plating preparations; plating
solutions; plating solution additives; metal surface
treatment agents; chemicals for use in metal surface
treatment; chemicals for metal industries; catalytic agents;
catalysts; ungluing preparations; etching agents. Surface treatment equipment for use in the manufacture of
semi-conductors; semiconductor manufacturing machines;
machines for manufacturing semi-conductors; plating machines
for use in the manufacture of semi-conductors; surface
treatment equipment for semiconductor wafers and
integrated-circuits; semi-conductor substrates manufacturing
machines; semiconductor wafer processing machines; etching
machines and equipment for semiconductor substrates; plating
machines; processing tanks for plating being parts of
machines; chemical processing tanks being parts of machines;
machines and equipment for use in manufacturing and
processing electronic circuit printed boards; apparatus for
machining; electroplating apparatus.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
Produits et services
Chemicals for use in the manufacture of semiconductors; chemical surface treatment agents for use in the manufacture of electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparations, namely, chemical agents for removing metal plating from microelectronic components and semiconductors; release solvent for photoresists being solvent type processing compositions for use in the electronics industry; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; chemical plating solutions, namely, lithium plating solutions, sodium plating solutions, aluminum plating solutions, magnesium plating solutions, chromium plating solutions, manganese plating solutions, iron plating solutions, cobalt plating solutions, nickel plating solutions, electroless nickel plating solutions, acid copper plating solutions, copper plating solutions, electroless copper plating solutions, zinc plating solutions, gallium plating solutions, germanium plating solutions, ruthenium plating solutions, electroless ruthenium plating solutions, rhodium plating solutions, electroless rhodium plating solutions, palladium plating solutions, electroless palladium plating solutions, silver plating solutions, electroless silver plating solutions, tin plating solutions, iridium plating solutions, platinum plating solutions, electroless platinum plating solutions, gold plating solutions, electroless gold plating solutions, bismuth plating solutions, electroless bismuth plating solutions; metal plating chemical compositions; chemical additives for metal plating chemical compositions; metal surface treatment agents, namely, chemical compositions for use in metal plating processes; chemicals for use in metal surface treatment, namely, chemical compositions for use in metal plating processes; chemical preparations for use in metal industries; catalytic agents; catalysts for chemical plating processes; ungluing preparations, namely, chemical solvents and degreasing solvents for use in manufacturing processes; etching agents being etching solutions for metals; etching agents being etching solutions for the surface of aluminum and aluminum alloys; etching agents being etching solutions for the surface of glass. Surface treatment equipment for use in manufacture of semiconductors, namely, semiconductor wafer plating processing machines for use in manufacture; semiconductor manufacturing machines; metal plating machines for use in the manufacture of semiconductors; semiconductor wafers plating processing machines for use in the manufacture of semiconductors; surface treatment equipment for semiconductor wafers and integrated circuits, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment; semiconductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; electrolessplating machines; electroplating machines; liquid metal processing tanks for electronic components and semiconductor wafer plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boards, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment.
The present invention provides a copper etchant which is for removing a copper seed and has sufficient copper seed layer removability and with which an increase in the surface roughness of a copper wiring or a copper electrode and circuit thinning are suppressed. The present invention provides a copper etchant for removing a copper seed layer, the copper etchant being characterized by containing an organic acid and hydrogen peroxide and having a pH of 5.0-8.0.
The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.
C03C 17/36 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes un revêtement au moins étant un métal
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a trivalent chromium plating film having excellent glossiness. The present invention provides a plating film manufacturing method that is characterized by comprising a step 1 for forming an electrolytic nickel plating film and a step 2 for forming an electrolytic trivalent chromium plating film on the electrolytic nickel plating film, and that is characterized in that the electrolytic nickel plating film has a compression stress of 0-100 MPa.
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
C25D 3/06 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome à partir des solutions de chrome trivalent
The present invention provides a palladium catalyst liquid which is suppressed in corrosion of copper and is capable of imparting a copper surface with excellent nickel plating deposition properties, while being also capable of imparting excellent patterning properties by suppressing spreading of nickel plating on the copper surface. The present invention provides a palladium catalyst liquid which is characterized by containing (A) an organic acid, (B) a chloride and (C) a palladium salt.
The purpose of the present invention is to provide: a novel copper plating solution for PR pulse electrolysis; and a novel copper plating method by means of PR pulse electrolysis. The present invention provides a copper plating solution for PR pulse electrolysis, the copper plating solution containing copper (II) ions, polyvalent metal ions (excluding copper (II) ions), and an unsaturated fatty acid.
The purpose of the present invention is to newly provide a desmutting agent. This silicon-containing aluminum alloy desmutting agent contains an alkaline compound and a silicate.
The present invention provides a plating film that exhibits excellent adhesion with respect to a glass substrate. The plating film according to the present invention is characterized by having an oxide layer, an electroless plating film, and an electrolytic copper plating film in the stated order.
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/32 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux
C23C 18/36 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs d'hypophosphites
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
Anti-corrosive preparations; colorants; colorants for dyeing
aluminum; dyestuffs; dyes for aluminum anodizing; pigments;
paints; printing ink, other than mimeographing inks.
21.
LIGHTFASTNESS IMPROVER FOR ANODIC OXIDE FILM OF DYED ALUMINUM OR ALUMINUM ALLOY AND METHOD FOR IMPROVING LIGHTFASTNESS OF FILM
In this invention, excellent dye fastness is imparted to an anodic oxide film of dyed aluminum or aluminum alloy by using a surface treatment agent which contains a phosphoric species, a phosphate, or a chelating agent containing phosphor in the structure thereof.
To provide a catalyst-imparting solution used for pretreatment when electroless plating is performed on a metal material, the catalyst-imparting solution having superior bath stability, as well as being useful for forming an electroless plating film having superior plating deposition, selective deposition, barrier properties, bondability, etc. A catalyst-imparting solution for electroless plating contains a cobalt compound and a reducing agent.
The present invention provides a technique for improving a micropore filling property in intermittent electroplating. The present invention provides an intermittent electroplating method which is for microporous objects to be plated and which includes use of a plating liquid that contains multivalent metal ions.
The present invention provides technology for improving the filling properties of micropores in intermittent electroplating. This intermittent electroplating method is for performing intermittent electroplating of a plated object having micropores and includes the use of a plating liquid containing polyvalent metal ions.
Provided are a novel chemical polishing agent and a chemical polishing method. Specifically, the present invention provides: a chemical polishing agent for aluminum or aluminum alloys that includes water (A), an alkali metal salt (B), and a water soluble organic solvent or a sugar alcohol having 4–9 hydroxyl groups (C), said chemical polishing agent having a mass ratio (alkali metal salt/water) of alkali metal salt to water that is at least 0.075; and a chemical polishing method for aluminum or aluminum alloys that includes a step in which aluminum or an aluminum alloy is soaked in a chemical polishing agent for aluminum or aluminum alloys that includes water (A), an alkali metal salt (B), and a water soluble organic solvent or a sugar alcohol having 4–9 hydroxyl groups (C) , said chemical polishing method providing a mass ratio (alkali metal salt/water) of alkali metal salt to water of at least 0.075.
An object of the present invention is to provide a treatment liquid and a treatment method that are capable of enhancing the corrosion resistance of a metal material. This object is achieved by, after forming a chemical conversion treatment film on the surface of a metal material, forming a film using a film-forming treatment liquid, the treatment liquid comprising: a silicon compound containing at least one member selected from the group consisting of alkoxysilyl, alkoxysilylene, and a siloxane bond; an organometallic compound; and water.
C23C 22/48 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 ne contenant ni phosphates, ni composés du chrome hexavalent, ni fluorures ou fluorures complexes, molybdates, tungstates, vanadates ou oxalates
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
29.
Black mixed oxide material and method for manufacturing same
The present invention addresses the problem of providing a novel pore-sealing treatment solution for an anodic oxide coating film on an aluminum alloy. A pore-sealing treatment solution for an anodic oxide coating film on an aluminum alloy is characterized by containing a thickening polysaccharide.
Improved plating is provided. The present invention provides a plated product which comprises a base, a deposit layer formed by plating on a surface of the base, and a silica-compound-containing coating layer formed on the surface of the deposit layer. The coating layer has a thickness of 0.1-100 μm, preferably 0.1-20 μm, more preferably 0.1-10 μm, even more preferably 0.1-5 μm. The coating layer may contain a dye and/or a pigment.
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B05D 3/10 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par d'autres moyens chimiques
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
32.
SURFACE TREATMENT AGENT FOR DYED ANODE OXIDIZED FILM OF ALUMINUM OR ALUMINUM ALLOY, AND SURFACE TREATMENT METHOD, SEALING TREATMENT METHOD, AND ARTICLE USING SAID AGENT
The present invention provides a surface treatment agent and a surface treatment method capable of improving the light resistance and dye fastness of an anode oxidized film of aluminum or an aluminum alloy, the film being dyed with a dye. This surface treatment agent for a dyed anode oxidized film of aluminum or an aluminum alloy is characterized by containing a zirconium fluoride salt and by having a pH of 3.4 or less.
The present invention provides a dyeing/fixing means and a sealing treatment method whereby decoloration is suppressed and the fixing properties of dyeing can be enhanced even when a sealing treatment is performed after a dyeing treatment of an aluminum alloy anodic oxidation coating. The present invention provides a dye fixing treatment agent for an aluminum alloy anodic oxidation coating, characterized by containing a manganese salt and by having a pH of 5.0 or lower.
Provided are a treatment solution and a treatment method which are capable of further improving the corrosion resistance of a metal material. According to the present invention, a chemically converted film is formed on the surface of a metal material, and then a film is formed by using a treatment solution which is for film formation and contains: a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond; an organometallic compound; and water.
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
Provided are a treatment liquid and a treatment method capable of improving both anti-rust performance and the insulating properties of a metal material. The treatment liquid for forming a film having corrosion-resistance performance and insulating performance contains water, an organic metal compound, and a silicon compound having at least one selected from the group consisting of an alkoxysilyl group, an alkoxysilylene group, and a siloxane bond.
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
Provided are: a black mixed oxide material which does not contain chromium per se of any valency as a main component, dose not contain cobalt as a main component too, has a high safety and good color tone and is economically advantageous; and a method for manufacturing the same. Also provided are various products using the black mixed oxide material. The mixed oxides comprise oxides containing La, Mn and Cu as main components but containing neither Cr nor Co as a main component, wherein the contents of La, Mn and Cu in the mixed oxides satisfy the following ratios, each in terms of oxide relative to the weight of the total mixed oxides (100 wt%): the La content as La2O3 being 35-70 wt%; the Mn content as MnO2 being 25-60 wt%; and the Cu content as CuO being 0.5-10 wt%.
C04B 35/50 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de composés de terres rares
The present invention provides: a composition for pretreatment for electroless plating, which is capable of exhibiting high plating deposition performance without using harmful chromic acid and expensive palladium, while enabling reduction of the number of steps; a pretreatment method; and an electroless plating method. The present invention provides a composition for pretreatment for electroless plating, which is characterized by containing 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
The purpose of the present invention is to provide a method for treating metal materials that can further increase the rustproofing properties of metal material. A method for treating metal materials that comprises steps 1 or 2: (Step 1) a step for treating a metal material with a chemical conversion treatment solution A containing a zirconium compound and an amphoteric surfactant; or (Step 2) a step comprising steps 2a and 2b: (step 2a) a step for treating the metal material with a chemical conversion treatment solution B containing a zirconium compound, and (step 2b) a step for treating the chemical conversion-treated metal material obtained in step 2a with a siliceous coating-forming treatment solution.
C23C 22/34 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des fluorures ou des fluorures complexes
B05D 3/10 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par d'autres moyens chimiques
B05D 7/14 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers à du métal, p. ex. à des carrosseries de voiture
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
39.
SEALING LIQUID FOR ANODIC OXIDE COATING FILMS OF ALUMINUM ALLOY, CONCENTRATED LIQUID AND SEALING METHOD
The present invention provides a sealing liquid which does not contain a nickel salt but is capable of achieving a sealing performance equivalent to that in cases where a sealing liquid containing a nickel salt is used, and which enables an anodic oxide coating film sealed therewith to exhibit excellent contamination resistance. The present invention provides a sealing liquid for anodic oxide coating films of aluminum alloys, which contains a metal salt, a pH buffering agent and a surfactant, and which is characterized in that the metal salt is at least one salt selected from among alkali metal salts and alkaline earth metal salts.
An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.
C01G 55/00 - Composés du ruthénium, du rhodium, du palladium, de l'osmium, de l'iridium, ou du platine
C25D 5/56 - Dépôt électrochimique sur des surfaces non métalliques de matières plastiques
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
The present invention addresses the problem of providing a coating formation composition that enables formation of a lamination coating in which a chemical conversion coating and a surface treatment coating are laminated by applying and heating the coating formation composition on the surface of a metal material, without conducting a chemical conversion treatment on the metal material separately from the surface treatment, and that can impart excellent rust prevention properties to the metal material. The present invention also addresses the problem of providing a metal material treatment method. The present invention provides a coating formation composition characterized by comprising an alkoxysilane oligomer, a metal salt, and a solvent and characterized in that the solvent is water and/or a water-soluble organic solvent, and the content for the metal salt is 0.1-30 parts by mass with respect to 100 parts by mass of the alkoxysilane oligomer.
C23C 26/00 - Revêtements non prévus par les groupes
C23C 22/48 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 ne contenant ni phosphates, ni composés du chrome hexavalent, ni fluorures ou fluorures complexes, molybdates, tungstates, vanadates ou oxalates
The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.
C08J 7/14 - Modification chimique par des acides, leurs sels ou anhydrides
C25F 1/00 - Nettoyage, dégraissage, décapage ou enlèvement de battitures par voie électrolytique
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C08J 7/00 - Traitement chimique ou revêtement d'objets façonnés faits de substances macromoléculaires
The present invention addresses the problem of providing a chemical conversion surface treatment solution capable of forming a chemical conversion film with excellent corrosion resistance and design on an article, in which the surface portion comprises aluminum or an aluminum alloy, using a process similar to conventional chemical conversion without using components that have high environmental impact such as hexavalent chromium, trivalent chromium, or fluorine. The present invention relates to a chemical conversion solution for aluminum or aluminum alloy comprising an aqueous alkaline solution that contains a permanganic acid compound and at least one kind of metal oxygen acid compound selected from a group consisting of vanadic acid compounds, molybdic acid compounds, tungstic acid compounds, zirconic acid compounds and niobic acid compounds.
(iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and crosslinked polyamide polyamines.
C23C 22/52 - Traitement du cuivre ou des alliages à base de cuivre
C23C 22/58 - Traitement d'autres matériaux métalliques
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C25D 3/38 - Dépôt électrochimiqueBains utilisés à partir de solutions de cuivre
C25D 3/04 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome
C25D 3/12 - Dépôt électrochimiqueBains utilisés à partir de solutions de nickel ou de cobalt
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
C25D 5/34 - Prétraitement des surfaces métalliques à revêtir de métaux par voie électrolytique
C25D 5/54 - Dépôt électrochimique sur des surfaces non métalliques
C25D 1/18 - Galvanoplastie par électrophorèse de matières organiques
Provided is an electrolytic stripping agent for a jig, with which it is possible to remove to a satisfactory extent palladium deposited on an electrically conducting section of a plating jig, as well as remove palladium deposited on an insulating material-coated section, and with which it is possible to minimize erosion of metal in an electrically conducting section of a plating jig. This electrolytic stripping agent for a jig contains the following components (A) to (C): (A) at least one compound selected from nitric acid and salts thereof; (B) at least one compound selected from the group consisting of ammonia, ammonium salts, ethyleneamine compounds, alkyl diamine compounds, and amino acids; (C) bromides.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Industrial antibacterial and antifungal chemical agents for aluminum dyeing baths, for aluminum alloys dyeing baths, and for the surface treatment of metals; defoaming chemical agents for aluminum dyeing baths, for aluminum alloys dyeing baths, and for the surface treatment of metals; dyeing assistant auxiliaries for aluminum dyeing baths, for aluminum alloys dyeing baths, and for the surface treatment of metals; weather resistance improver agents for dyed aluminum anodizing films, for dyed aluminum alloys anodizing films, and for the surface treatment of metals; surface conditioners for aluminum anodizing films, for aluminum alloys anodizing films, and for the surface treatment of metals; dyes fixing agents for aluminum anodizing films, for aluminum alloys anodizing films, and for the surface treatment of metals; chemical agents for aluminum anodizing films, for aluminum alloys anodizing films, and for the surface treatment of metals; chemicals for aluminum anodizing films, for aluminum alloys anodizing films, for the surface treatment of metals, and for dyeing metals. Dyes for aluminum anodizing films and for aluminum alloys anodizing films; industrial dyes for aluminum anodizing films and for aluminum alloys anodizing films; dipping type dyes for aluminum anodizing films and for aluminum alloys anodizing films; water soluble dyes for anodized aluminum; pigments for aluminum anodizing films and for aluminum alloys anodizing films; industrial pigments for aluminum anodizing films and for aluminum alloys anodizing films.
The objective of the present invention is to provide a copper-tin alloy plating bath which is capable of forming a thick film without using cyanide ions, and which is able to be suited to barrel plating. The present invention relates to a copper-tin alloy plating bath which is composed of an aqueous solution that contains a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1) and an aromatic compound having a hydroxyl group. R-(CH2)l-S-(CH2)m-S-(CH2)n-R (1) (In the formula, R represents H, OH or SO3Na; and each of l, m and n independently represents an integer of 0-3.)
The present invention provides a printed wiring board which enables reduction of waste (a large amount of waste liquid) during the manufacturing process, and which also enables reduction of the manufacturing time. A printed wiring board (100) is provided with: an insulating base (10); a through hole (11a) that is formed to penetrate the insulating base (10); a first via (11) that is formed by filling the through hole (11a) with a first conductive paste (1); and a first wiring line (21) that is provided on the insulating base (10) and is connected to the first via (11). The first wiring line (21) comprises: a first seed layer (21a) that is formed from a second conductive paste (2) as a base film of the first wiring line (21) and is connected to the first via (11); and a first electroless plating layer (21b) that covers the first seed layer (21a).
Provided is a resin plating method that uses an etching bath having manganese as the active ingredient, and that can stably maintain etching performance even during sustained use. The resin plating method includes an etching step, which has an article containing a resin material as a processing subject and uses an acidic etching bath containing manganese, and a catalyst imparting step, which uses palladium as a catalyst metal, and the resin plating method is characterized by further containing a step for maintaining the palladium concentration in the acidic etching bath at no greater than 100 mg/L.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products containing copper-based or silver-based metals, such as other various kinds of copper, copper alloys, silver, and silver alloys. The present invention provides a composition for blackening copper-based or silver-based metals, said composition comprising an aqueous solution containing (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom–containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and cross-linked polyamide polyamines.
The objective of the present invention is to provide a multilayer plating film having excellent corrosion resistance. The present invention relates to a multilayer plating film that comprises at least a chromium plating film and a tin-nickel plating film. The chromium plating film serves as the outermost layer; and the tin-nickel plating film is formed below the chromium plating film using an acidic tin-nickel alloy plating liquid that contains a divalent tin compound, a nickel compound, a triamine compound and a fluoride.
C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
C25D 3/60 - Dépôt électrochimiqueBains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'étain
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
E03C 1/042 - Dispositions sur les robinets de lavabos ou de baignoires pour les fixer au mur
53.
Composition for etching treatment of resin material
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.
The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C09K 13/04 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique
C03C 15/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par attaque chimique
C03C 25/68 - Traitement chimique, p. ex. lixiviation, traitement acide ou alcalin par attaque chimique
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
4 group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
C25D 5/34 - Prétraitement des surfaces métalliques à revêtir de métaux par voie électrolytique
C25D 5/54 - Dépôt électrochimique sur des surfaces non métalliques
C25D 3/38 - Dépôt électrochimiqueBains utilisés à partir de solutions de cuivre
B05D 1/18 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par immersion
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical products for treating the surface of aluminum and aluminum alloys; industrial chemicals for use in plating; chemical agent for use in etching the surface of aluminum and aluminum alloys; chemical conversion treatment agent for treating the surface of aluminum and aluminum alloys; chemical rust prevention treatment agent for treating the surface of aluminum and aluminum alloys; metal [ and plastic ] plating chemical compositions; [ metal etching mordants; ]industrial chemicals
The present invention addresses the issue of providing a novel conductive film-forming bath comprising an alkaline aqueous solution, that can be used when forming an electroplating film on a non-conductive plastic material, does not reduce adhesiveness to the non-conductive plastic material, and is capable of forming an electroplating film having a good external appearance. The present invention pertains to a conductive film-forming bath comprising an aqueous solution containing a water-soluble polymer having a copper compound, a complexing agent, an alkali metal hydroxide, and a polyoxyalkylene structure.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/40 - Revêtement avec du cuivre en utilisant des agents réducteurs
57.
COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL
The present invention provides a composition for an etching treatment of a resin material, which comprises an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more, containing acid components at the total concentration of 10 mol/L or more, and meeting at least one requirement selected from the following requirements: (1) an organic sulfonic acid is contained in an amount of 1.5 mol/L or more; (2) the molar concentration of bivalent manganese ions is 15 folds or more of the molar concentration of permanganate ions; and (3) the amount of a magnesium anhydrous salt to be added is 0.1 to 1.0 mol/L. The composition for the etching treatment according to the present invention does not contain hexavalent chromium, has excellent etching performance, and also has good bath stability.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C09K 13/04 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique
C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
The present invention provides a blackening treatment method for a black Cr—Co alloy plating film, the method comprising bringing a black Cr—Co alloy plating film having a Cr content of 1 to 15 wt. % into contact with a blackening treatment solution comprising an aqueous solution with a pH value of −1 to 5. According to the present invention, the blackish color of a less blackish plating film formed from a plating bath containing trivalent chromium is enhanced to further improve decorativeness. Furthermore, the corrosion resistance of the film can be more improved by performing electrolytic chromate treatment after blackening treatment.
C23C 22/58 - Traitement d'autres matériaux métalliques
C23C 8/40 - Diffusion à l'état solide uniquement d'éléments non métalliques dans la couche superficielle de matériaux métalliquesTraitement chimique de surface par réaction entre le matériau métallique de la surface et un gaz réactif, laissant dans le revêtement des produits de la réaction, p. ex. revêtement de conversion, passivation des métaux au moyen de liquides, p. ex. au moyen de bains de sels, de suspension dans des liquides
C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
C25D 9/08 - Revêtement électrolytique autrement qu'avec des métaux avec des matières inorganiques par des procédés cathodiques
C25D 3/04 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome
C25D 3/06 - Dépôt électrochimiqueBains utilisés à partir de solutions de chrome à partir des solutions de chrome trivalent
C25D 3/56 - Dépôt électrochimiqueBains utilisés à partir de solutions d'alliages
C23C 22/00 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux
The present invention provides a trivalent chromium plating bath which comprises an aqueous solution containing a trivalent chromium compound, a complexing agent, a fluoride, aluminum sulfate and a boric acid compound. According to the present invention, a novel trivalent chromium plating bath can be produced, which has a high coating film deposition rate, is suitable for thick plating, and has improved deposition performance in a low current density range and an improved deposition rate.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry; degreasing agents for aluminium materials, degreasing agents for industrial use; electrolytic treatment agents being chemicals; chemicals for coloring surface of aluminum materials; dyeing assistant auxiliaries being chemicals; chemical preservatives for use in the manufacture of food and beverages; chemicals for use in the food processing and manufacturing industries; chemical additives for use in the manufacture of food; auxiliary fluids for use with abrasives; chemicals for use for plating solution in the treatment of plastics; chemicals for use in plating processes; chemical preparations for plating solutions; chemicals for use in the preparation of plating solutions; chemical preparations for the treatment of waste water; chemicals for treatment of printed wiring board; chemical preparations for use in manufacturing or protecting electrics or electronics components; coating agents for decoration, other than paint; coating agents for anti-bacterial protection; coating agents for protection; ungluing agents; mordants for metals. Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists; Dyestuffs; pigments; printing inks; protective preparations for metals.
The present invention provides a conductive coating film forming bath which is composed of an aqueous solution that contains (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) an aliphatic polyalcohol compound having 2-5 carbon atoms, and (E) at least one compound that is selected from the group consisting of reducing compounds having a -COOM group (wherein M represents H, an alkali metal or an -NH4 group) and reducing saccharides having 6 or more carbon atoms. According to the present invention, there is provided a composition for forming a conductive coating film that exhibits excellent performance as a base for electroplating, said conductive coating film able to be effectively utilized in order to form a uniform decorative electroplating film having excellent appearance on a non-conductive plastic molded article.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemicals for plating pretreatments, namely, degreasing agents for plastics and metal surfaces, chemical agents for etching plastics and metal surfaces, chemical agents for activating plastics and metal surfaces, and chemical agents for lowering electric resistance on plastic surfaces; chemicals for use in plating processes; chemical plating solutions; industrial chemicals
64.
BLACKENING TREATMENT SOLUTION FOR BLACK Cr-Co ALLOY PLATING FILM
The present invention provides a method for the blackening treatment of a black Cr-Co alloy plating film, said method being characterized by comprising bringing a black Cr-Co alloy plating film having a Cr content of 1 to 15 wt% into contact with a blackening treatment solution comprising an aqueous solution having a pH value of -1 to 5. According to the present invention, it becomes possible to improve the degree of blackness of a plating film that is formed from a plating bath containing trivalent chromium and has poor blackness, and to further improve the decorativeness of the plating film. It also becomes possible to further improve corrosion resistance of the plating film by carrying out the blackening treatment and then carrying out an electrolytic chromate treatment.
C23C 22/48 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 ne contenant ni phosphates, ni composés du chrome hexavalent, ni fluorures ou fluorures complexes, molybdates, tungstates, vanadates ou oxalates
C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
C25D 9/08 - Revêtement électrolytique autrement qu'avec des métaux avec des matières inorganiques par des procédés cathodiques
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminum materials, degreasing agents for industrial use; chemical agents for electrolytic treatments; chemicals for use as dying assistant auxiliaries, namely, chemicals to speed up the dyeing process; [ chemical additives and preservatives for use in the manufacture of food and beverages; ] auxiliary fluids for use with abrasives for general industrial use; metal and plastic plating chemical compositions; chemicals for the treatment of wastewater; chemicals for use for plating solution in the treatment of plastics; chemicals for use in plating processes; chemical plating solutions; chemical coatings used in the manufacture of printed circuit boards; chemical additives for use in the manufacture of electronic components; [ ungluing agents for industrial use; ] industrial chemicals; etching mordants for metal Dyestuffs; pigments; [ paints; ] printing inks; rust inhibiting preparations in the nature of a coating for preserving metal plates; protective preparations in the nature of protective coatings for protecting metals from tarnishing; anti-tarnishing preparations for coating metals; colorants . [; mordant dyes; mordants for use on metal in the electronics industry ] Product research and testing in the fields of plating, metal materials, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals; Chemical analysis and research; material testing; Quality control for others; Technical research in the fields of plating, metal materials, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals ; [ Product research and development; scientific research and development; ] chemistry services
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Sealing agents for aluminum and aluminum alloys anodizing
film; chemicals for use in plating processes; chemical
plating solutions; industrial chemicals.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Industrial chemicals for use in electroless nickel plating;
industrial chemicals for use in electroless nickel composite
plating; chemicals for use in plating processes; chemical
plating solutions; industrial chemicals.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Conducting agents for forming electro-conductive film for
use in electroplating on plastics surface; chemicals for use
in plating processes; chemical plating solutions; industrial
chemicals.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Brightening additives for nickel plating; semi-brightening
additives for nickel plating; chemicals for use in plating
processes; chemical plating solutions; industrial chemicals.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical agents for use in decorative plating on plastics;
conducting agents for forming electro-conductive film for
use in electroplating on plastics surface; chemicals for use
in plating processes; chemical plating solutions.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminium materials, degreasing agents
for industrial use; electrolytic treatment agents being
chemicals; chemicals for coloring surface of aluminum
materials; dyeing assistant auxiliaries being chemicals;
chemical preservatives for use in the manufacture of food
and beverages; chemicals for use in the food processing and
manufacturing industries; chemical additives for use in the
manufacture of food; auxiliary fluids for use with
abrasives; chemicals for use for plating solution in the
treatment of plastics; chemicals for use in plating
processes; chemicals plating solutions; chemical
preparations for the treatment of waste water; chemicals for
treatment of printed wiring board; chemical preparations for
use in manufacturing or protecting electrics or electronics
components; coating agents for decoration, other than paint;
coating agents for anti-bacterial protection; coating agents
for protection; ungluing agents; chemicals for industrial
purposes; mordants for metals. Dyestuffs; pigments; paints; printing inks; protective
preparations for metals; colorants. Analysis, survey, testing or research of plating; analysis,
survey, testing or research of metal materials; analysis,
survey, testing or research of inorganic materials;
analysis, survey, testing or research of food additives;
analysis, survey, testing or research of paints or inks;
analysis, survey, testing or research of glass materials;
analysis, survey, testing or research of ceramics materials;
analysis, survey, testing or research of chemicals; chemical
research and analyses; material testing; quality control;
research and development for others; technical project
studies; technical research.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Coating agents for decoration, other than paint; chemical
coatings for anti-bacterial protection for use in plating
processes; chemical coatings for protection for use in
plating processes; mordants for metals; chemicals for
industrial purposes; ceramic glazings; priming putty;
nonferrous metals; non-metallic minerals; chemical
preparations for use in photography; unprocessed plastics
(plastics in primary form). Dyestuffs; pigments; paints; printing inks; protective
preparations for metals; anti-rust greases; nonferrous
metals in foil or powder form for painters, decorators,
printers and artists; precious metals in foil or powder form
for painters, decorators, printers and artists.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminium materials, degreasing agents
for industrial use; electrolytic treatment agents being
chemicals; chemicals for coloring surface of aluminum
materials; dyeing assistant auxiliaries being chemicals;
chemical preservatives for use in the manufacture of food
and beverages; chemicals for use in the food processing and
manufacturing industries; chemical additives for use in the
manufacture of food, other than for medical use; auxiliary
fluids for use with abrasives; chemicals for use for plating
solution in the treatment of plastics; chemicals for use in
plating processes; chemical plating solutions; chemical
preparations for the treatment of waste water; chemicals for
treatment of printed wiring boards; chemical preparations
for use in manufacturing or protecting electric or
electronic components; coating agents in the nature of
chemicals for decoration, other than paints; chemical
coatings for anti-bacterial protection for use in plating
processes; chemical coatings for protection for use in
plating processes; ungluing agents; chemicals for industrial
purposes; mordants for metals. Dyestuffs; pigments; paints; printing inks; protective
preparations for metals; colorants. Analysis, survey, testing or research of plating; analysis,
survey, testing or research of metal materials; analysis,
survey, testing or research of inorganic materials;
analysis, survey, testing or research of food additives;
analysis, survey, testing or research of paints or inks;
analysis, survey, testing or research of glass materials;
analysis, survey, testing or research of ceramics materials;
analysis, survey, testing or research of chemicals; chemical
research and analyses; material testing; quality control;
research and development for others; technical project
studies; technical research.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical agents for use in decorative plating on plastics; conducting agents for forming electro-conductive film for use in electroplating on plastics surface; chemicals for use in plating processes; chemical plating solutions
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Conducting agents for forming electro-conductive film for use in electroplating on plastics surface; chemicals for use in plating processes; chemical plating solutions; industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical agents for sealing aluminum and aluminum alloys anodizing film; chemicals for use in plating processes; chemical plating solutions; industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical agent for use in etching the surface of aluminum and aluminum alloys; degreasing agents for aluminum materials and for industrial use; metal plating chemical compositions, namely, electrolytic acid aluminum solutions; [ auxiliary fluids for use with abrasives for general industrial use; metal and plastic plating chemical compositions; chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; ] chemical additives for use in the manufacture of electronic components; [ coatings used in the manufacture of printed circuit boards; ] metal etching mordants; industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Plastics plating chemical compositions for the prevention of air pockets; degreasing agents for aluminum materials and for industrial use; [ metal plating chemical compositions, namely, electrolytic acid aluminum solutions; auxiliary fluids for use with abrasives for general industrial use; ] metal and plastic plating chemical compositions; [ chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; ] chemical additives for use in the manufacture of electronic components; [ coatings used in the manufacture of printed circuit boards; ] metal etching mordants; industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical products for treating the surface of aluminum and aluminum alloys with zinc; industrial chemicals for use in tin plating; chemical products for treating the surface of aluminum and aluminum alloys with tin; [degreasing agents for aluminum materials and for industrial use; metal plating chemical compositions, namely, electrolytic acid aluminum solutions; auxiliary fluids for use with abrasives for general industrial use;] metal and plastic plating chemical compositions; [chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards;] chemical additives for use in the manufacture of electronic components; coatings used in the manufacture of printed circuit boards; metal etching mordants; industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical products for removing the residues of etching after chemical etching the surface of aluminum and aluminum alloys; [ degreasing agents for aluminum materials and for industrial use; metal plating chemical compositions, namely, electrolytic acid aluminum solutions; auxiliary fluids for use with abrasives for general industrial use; metal and plastic plating chemical compositions; chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; chemical additives for use in the manufacture of electronic components; coatings used in the manufacture of printed circuit boards; metal etching mordants; ] industrial chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chromium plating chemical compositions for the prevention of mists; degreasing agents for aluminum materials and for industrial use; [ metal plating chemical compositions, namely, electrolytic acid aluminum solutions; auxiliary fluids for use with abrasives for general industrial use; ] metal and plastic plating chemical compositions; [ chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; ] chemical additives for use in the manufacture of electronic components; [ coatings used in the manufacture of printed circuit boards; ] metal etching mordants; industrial chemicals
88.
METHOD FOR PRODUCING TRIVALENT CHROMIUM-PLATED MOLDED ARTICLE AND TRIVALENT CHROMIUM-PLATED MOLDED ARTICLE
Provided is a trivalent chromium-plated film structure having excellent appearance, corrosion resistance, and abrasion resistance. Also provided is a treatment step that can be used industrially. A method for producing a trivalent chromium-plated molded article in which the surface of a molded article is plated comprises (a) a step for forming a copper plating film on the surface of a molded article by lustrous copper sulfate plating, (b) a step for preparing a trivalent chromium plating bath comprising trivalent chromium ions and a complexing agent, wherein the complexing agent content ratio is 0.1 to 2 mol/L, and (c) a step for forming a trivalent chromium plating film on the surface of the copper plating film by performing trivalent chromium plating using the trivalent chromium plating bath, with the carbon content in the trivalent chromium plating film being 3 at% or greater.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
[ Degreasing agents for aluminum materials, degreasing agents for industrial use; chemical agents for electrolytic treatments; chemicals for coloring the surface of aluminum materials; chemicals for use as dyeing assistant auxiliaries, namely, chemicals to speed up the dyeing process; chemical preservatives for use in the manufacture of food and beverages; chemicals for use in the food processing and manufacturing industries; chemical additives for use in the manufacture of food; artificial sweeteners; higher fatty acids for use in the food industry; auxiliary fluids for use with abrasives for use in the metal plating industry; chemicals for use in plating plastics; chemicals for use in plating processes; chemical plating solutions; chemical preparations for the treatment of waste water; chemicals for treatment of printed wiring board; chemical preparations for use in manufacturing and protecting electrics and electronics components; ]polymer coating agents for decoration, other than paint; chemical coating agents for decoration, other than paint; polymer coating agents for anti-bacterial protection; chemical coating agents for anti-bacterial protection; polymer coating agents for protection [; chemical coating agents for protection; ungluing agents for industrial use; etching mordants for metals ] [ Dyestuffs; ] pigments; [ paints; ] printing inks [; rust inhibiting preparations in the nature of a coating for preserving metal plates; protective preparations in the nature of protective coatings for protecting metals from tarnishing; anti-tarnishing preparations for coating metals; colorants; mordant dyes; mordants for use on metal in the electronics industry ] Analysis, testing and research of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; material testing; quality control for others; engineering services, namely, technical project planning for the plating process, and the manufacture of metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; technical research in the field of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminum materials, degreasing agents for industrial use; chemical agents for electrolytic treatments; chemicals for coloring the surface of aluminum materials; chemicals for use as dyeing assistant auxiliaries, namely, chemicals to speed up the dyeing process; [ chemical preservatives for use in the manufacture of food and beverages; chemicals for use in the food processing and manufacturing industries; chemical additives for use in the manufacture of food; artificial sweeteners; higher fatty acids for use in the food industry; ] auxiliary fluids for use with abrasives for use in the metal plating industry; chemicals for use in plating plastics; chemicals for use in plating processes; chemical plating solutions; chemical preparations for the treatment of waste water; chemicals for treatment of printed wiring board; chemical preparations for use in manufacturing and protecting electrics and electronics components; polymer coating agents for decoration, other than paint; chemical coating agents for decoration, other than paint; polymer coating agents for anti-bacterial protection; chemical coating agents for anti-bacterial protection; polymer coating agents for protection; chemical coating agents for protection; ungluing agents for industrial use; etching mordants for metals Dyestuffs; pigments; [ paints; printing inks; ] rust inhibiting preparations in the nature of a coating for preserving metal plates; protective preparations in the nature of protective coatings for protecting metals from tarnishing; anti-tarnishing preparations for coating metals [ ; colorants; mordant dyes; mordants for use on metal in the electronics industry ] Analysis, testing and research of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; material testing; quality control for others; engineering services, namely, technical project planning for the plating process and the manufacture of metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; technical research in the field of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminium materials, degreasing agents for industrial use; chemical agents for electrolytic treatments; chemicals for coloring the surface of aluminum materials; chemicals for use as dyeing assistant auxiliaries, namely, chemicals to speed up the dyeing process; [ chemical preservatives for use in the manufacture of food and beverages; chemicals for use in the food processing and manufacturing industries; chemical additives for use in the manufacture of food; artificial sweeteners; higher fatty acids for use in the food industry; ] auxiliary fluids for use with abrasives for use in the metal plating industry; chemicals for use in plating plastics; chemicals for use in plating processes; chemical plating solutions; chemical preparations for the treatment of waste water; chemicals for treatment of printed wiring board; chemical preparations for use in manufacturing and protecting electrics and electronics components; [ polymer coating agents for decoration, other than paint; ]chemical coating agents for decoration, other than paint; [ polymer coating agents for anti-bacterial protection; ] chemical coating agents for anti-bacterial protection; [ polymer coating agents for protection; ] chemical coating agents for protection; [ ungluing agents for industrial use; ] etching mordants for metals Dyestuffs; pigments; [ paints; ] printing inks; rust inhibiting preparations in the nature of a coating for preserving metal plates; protective preparations in the nature of protective coatings for protecting metals from tarnishing; anti-tarnishing preparations for coating metals; colorants; [ mordant dyes; mordants for use on metal in the electronics industry ] Analysis, testing and research of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; material testing; quality control for others; engineering services, namely, technical project planning for the plating process, and the manufacture of metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals; technical research in the field of the plating process, metal materials, inorganic materials, food additives, paints, inks, colorants, glass materials, ceramics and chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminium materials and for industrial use; chemical agents for electrolytic treatment; chemicals for use as dyeing assistant auxiliaries, namely chemicals to speed up the dyeing process; chemical additives and preservatives for use in the manufacture of food and beverages; auxiliary fluids for use with abrasives for general industrial use; metal and plastic plating chemical compositions; chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; chemical additives for use in the manufacture of electronic components; coatings used in the manufacture of printed circuit boards; ungluing agents for industrial use; metal etching mordant; industrial chemicals Dyestuffs; pigments; [ paints; ] printing inks; anti-tarnishing preparations for metals; colorants Product research and testing in the fields of plating, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals; metal materials testing and analyzing; material testing; chemical analysis and research; quality control for others; product research and development; scientific research and development; technical research in the fields of plating, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Degreasing agents for aluminum materials and for industrial use; chemical agents for electrolytic treatment; chemicals for use as dyeing assistant auxiliaries, namely, chemicals to speed up the dyeing process; chemical additives and preservatives for use in the manufacture of food and beverages; auxiliary fluids for use with abrasives for general industrial use; metal and plastic plating chemical compositions; chemicals for the treatment of wastewater; chemical coatings used in the manufacture of printed circuit boards; chemical additives for use in the manufacture of electronic components; coatings used in the manufacture of printed circuit boards; ungluing agents for industrial use; metal etching mordant; industrial chemicals Dyestuffs; pigments; [ paints; ] printing inks; anti-tarnishing preparations for metals; colorants Product research and testing in the fields of plating, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals; metal materials testing and analyzing; material testing; chemical analysis and research; quality control for others; product research and development; scientific research and development; technical research in the fields of plating, inorganic materials, food additives, paints, inks, glass, ceramics and chemicals
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Degreasing agents for aluminium materials, chemical agents for electrolytic treatment, chemicals for coloring surface of aluminum materials; dyeing assistant auxiliaries; industrial chemicals [ ; unprocessed plastics (plastics in primary form); ceramic glazings in the nature of a dry chemical preparation for use in the manufacture of ceramics ] [ Pigments, ] dyes for aluminum, [ pigments for aluminium; ] screen printing inks; printing inks; mimeographing ink [ ; color pigments for drawing pictures ]
A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.
B05D 3/04 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des gaz
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
C08J 7/18 - Modification chimique par des composés polymérisables en utilisant des ondes énergétiques ou le rayonnement de particules
G21H 5/00 - Applications du rayonnement des sources radioactives ou dispositions à cet effet, non prévues ailleurs
Disclosed is a trivalent chromium plating bath which is characterized by being composed of an aqueous solution containing a water-soluble trivalent chromium compound, a conductive salt and a pH buffering agent. The trivalent chromium plating bath is also characterized in that the aqueous solution has a trivalent chromium ion concentration of 0.003-0.12 mol/L. Also disclosed are a chromium plating method comprising a step of forming a chromium plating film on an object to be plated by using the object as a cathode in the trivalent chromium plating bath and then washing the plated object with a washing water containing a complexing agent for trivalent chromium ions, and an article having a chromium plating film formed by using the trivalent chromium plating bath. The chromium plating bath of the present invention is a commercially effective novel trivalent chromium plating bath which has solved various problems of conventional trivalent chromium plating baths.
A composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts. The etching composition of the invention is an etching solution capable of forming a plating film having a good adhesion to various resin molded articles made of ABS resins or the like, and can be used in place of chromic acid mixtures. The composition is highly safe so that the liquid waste is easily disposed of.
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c.-à-d. non caractérisé par le procédé de revêtement
C23F 1/00 - Décapage de matériaux métalliques par des moyens chimiques
99.
PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT
Disclosed is a pretreatment process for electroless plating of a resin molded body, which is characterized by comprising a step wherein a resin molded body is subjected to an etching using an etching liquid containing a manganate salt and then brought into contact with an aqueous solution containing a reducing compound and an inorganic acid. Also disclosed is a method for plating a resin molded body which comprises the pretreatment process. Further disclosed are various processing agents used in the plating method. The pretreatment process enables to form a plating layer having sufficient adhesion when an etching process is performed using an etching liquid containing a manganate salt in an electroless plating of a resin molded body.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
Disclosed is a composition for use in the etching treatment of a resin molded article, which comprises an aqueous solution containing 20 to 1200 g/l of inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of a halogen oxo acid, a halogen oxo acid salt, a persulfate salt and a bismuthate salt. The composition can form a plating film having good adhesion to various resin molded articles made of ABS resin or the like, and therefore can be used as a novel etching treatment solution which is an alternative to a chromic acid mixture. The composition is highly safe, and its liquid waste can be disposed easily.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
