This WC-based cemented carbide, which is suitable for a substrate of a surface-coated cutting tool or the like, contains 6.0-10.0 mass% of Co, 0.08-0.90 mass% of Cr (where the ratio Cr content (mass%)/Co content (mass%) is 10% or lower), 0.0-3.8 mass% of M (where M is one or more of V, Ta, Nb, Ti, and Zr), and 4.5-7.5 mass% of C, the balance being W and unavoidable impurities. The WC-based cemented carbide has a binder phase, a hard phase, and a γ phase, the binder phase containing Co as the main component, the hard phase containing a carbide of W as the main component, and the γ phase containing a carbide of M as the main component. In crystal particles constituting the hard phase, the grain diameter C99 (μm) for 99% cumulative particle count is 3.30 or lower, and the ratio C99/C50 (grain diameter C99 (μm) for 99% cumulative particle count to grain diameter C50 (μm) for 50% cumulative particle count) is 4.80-6.50. The proportion (L) of the phase interface length along which the hard phase and the binder phase are in contact with respect to the total phase interface length of the hard phase is 35% or greater.
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C22C 27/04 - Alliages à base de tungstène ou de molybdène
A surface-coated cutting tool includes a substrate and a coating layer provided on the substrate, wherein
1) the coating layer includes an alternating layer of A sublayers and B sublayers,
2) the A sublayers are each A Al1-aTiaN (where 0.30≤a≤0.70),
3) the B sublayers are each Cr1-cM2cN (where M2 is B and/or Si, where 0.01≤c≤0.40),
4) the A and B sublayers each have an average thickness of 1 nm or more and 500 nm or less, and
5) the alternating layer has an average thickness of 0.3 μm or more and 7.0 μm or less,
6) the adjoining A and B sublayers satisfy the relation: 0.1≤TA/TB≤0.8 or 1.2≤TA/TB≤10.0, where TA is the average thickness of the A sublayers and TB is the average thicknesses of the B sublayers.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
Performance is improved. There is provided a negative electrode material for a battery, in which the negative electrode material includes carbon, sodium tungstate, and silicon particles 33 including silicon, and in the silicon particle 33, a ratio of the amount of Si in Si2p derived from elemental silicon to the amount of Si in Si2p derived from SiO2 in a surface layer when measured by X-ray photoelectron spectroscopy is 3 or more on an atomic concentration basis.
A copper/ceramic bonded body (10) formed by bonding copper member (12, 13) and a ceramic member (11), wherein the copper member has a Cu content of at least 99.96 mass%, and the ratio C/D is 0.93-1.05, where C is the proportion of KAM values of 0.25° or less in a measurement field of view arranged around a grain boundary triple point, and D is the proportion of KAM values of 0.25° or less within grains on the basis of the observation of a cross section of the copper member along a thickness direction after 3000 cycles of a thermal cycle test including holding at -65°C for 5 minutes and then holding at 150°C for 5 minutes in a liquid bath per cycle.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
5.
COPPER/CERAMIC JOINED BODY AND INSULATING CIRCUIT BOARD
This copper/ceramic joined body is obtained by joining a copper member and a ceramic member. The copper member has a Cu content of at least 99.96 mass%, and has, in a cross section along the thickness direction of the copper member, an average crystal grain size of at most 100 μm after performing 3000 cycles of a heat cycle test in which the copper member is, in a liquid tank, held at -65°C for 5 minutes and then held at 150°C for 5 minutes in a single cycle.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
A hafnium compound-containing sol-gel liquid contains an alcohol as a solvent and a hafnium compound as a hafnia source, in which the hafnium compound-containing sol-gel liquid contains one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, a mass ratio WM/WHf of a content WM of the elements M to a content WHf of Hf as a metal component is within a range of 0.2% or more and 5.0% or less. A hafnia-containing film containing hafnia (HfO2) and one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, and in which a mass ratio WM/WHfO2 of a content WM of the elements M to a content WHfO2 of the HfO2 is within a range of 0.05% or more and 5.0% or less.
B01J 13/00 - Chimie des colloïdes, p. ex. production de substances colloïdales ou de leurs solutions, non prévue ailleursFabrication de microcapsules ou de microbilles
This method for separating cobalt and nickel includes a step (S3) of immersing an electrode material of a lithium ion secondary battery in a treatment liquid containing sulfuric acid and hydrogen peroxide to obtain a leachate, a step (S4) of adding a hydrogen sulfide compound to the leachate to precipitate copper, either one of a first treatment step (S5A) or a second treatment step (S5B), a step (S6) of obtaining a precipitate substance containing cobalt sulfide and nickel sulfide and a residual liquid containing lithium, and a re-dissolution step (S7) of dissolving cobalt and nickel in a suspension obtained by suspending the precipitate substance in distilled water or dilute sulfuric acid, in which, in the re-dissolution step (S7), the suspension is bubbled with an oxidizing gas containing oxygen using a fine-bubble generation apparatus.
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/26 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par extraction liquide-liquide utilisant des composés organiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
8.
TIN OXIDE PARTICLE DISPERSION AND METHOD FOR PRODUCING TIN OXIDE PARTICLE LAMINATED FILM
Provided are: a tin oxide particle dispersion in which tin oxide particles are dispersed in a solvent, from which it is possible to form a tin oxide particle laminated film having excellent conductivity as a result of the tin oxide particles being arranged uniformly, and which is characterized by having a zeta potential of -35 mV or less at pH 10; and a method for producing a tin oxide particle laminated film. The tin oxide particles may be doped with a different element. The different element is preferably one or more selected from antimony, fluorine, and phosphorus. The primary particle size of the tin oxide particles is preferably in the range of 1.5-100 nm.
In the present invention, the following steps are carried out: a leaching step S01 in which a lithium-containing substance is immersed in an acidic solution to leach lithium into the acidic solution, thereby obtaining a lithium leachate; a heavy metal and first fluorine precipitation step S02 in which a first calcium compound is added to the lithium leachate to produce a metal hydroxide precipitate and a fluorine-containing precipitate; a first solid-liquid separation step S03 in which the precipitated metal hydroxide precipitate and fluorine-containing precipitate are removed from the lithium leachate; a second fluorine precipitation step S04 in which a second calcium compound is added to the lithium leachate from which the precipitates have been removed, to precipitate dissolved fluorine; and a second solid-liquid separation step S05 in which the precipitated dissolved fluorine and unreacted second calcium compound are removed from the lithium leachate.
C22B 3/04 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
C22B 3/20 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
10.
Pure copper material, insulating substrate, and electronic device
2 or more is measured by an EBSD method at a measurement interval of 1 μm, measurement points at which a CI value obtained by an analysis using data analysis software OIM is 0.1 or less are excluded, and boundaries between adjacent pixels with a misorientation of 5° or more are regarded as crystal grain boundaries, an average of local orientation spread (LOS) is 2.00° or less.
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 18/00 - Produits stratifiés composés essentiellement de céramiques, p. ex. de produits réfractaires
In a cutting insert and an edge replaceable end mill according to the present invention, a cutting blade (14) has: a main cutting blade (17) that is disposed on a first side of four sides of a quadrangular surface (11); a sub-cutting blade (18) that is disposed on a second side; and a corner blade (19). The sub-cutting blade (18) has a curved blade part (18a) that is connected to the corner blade (19), and forms a curved shape protruding toward a front side; and a linear blade part (18b) that is connected to the curved blade part (18a), and linearly extends toward a rear side as extending toward the side opposite to the curved blade part (18a) in the left-right direction. A flank (16) has: a first sub-flank (16b) that is connected to the curved blade part (18a), and forms a curved surface shape protruding toward the front side; and a planar second sub-flank (16c) that is connected to the linear blade part (18b).
Provided is an insulated circuit board in which a metal layer formed from pure aluminum is bonded to at least one surface of a ceramic substrate. In this circuit board: the pure aluminum is aluminum having a purity of 99.9%mass or more; a slip plane of metal crystal in the metal layer and the bonding interface with the ceramic substrate form an angle of 40° or less; and a second metal layer formed from any of aluminum, an aluminum alloy, copper, or a copper alloy may be bonded on the metal layer.
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/04 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
13.
Pure copper material, insulating substrate, and electronic device
This pure copper material includes Cu in an amount of 99.96 mass % or more, either one or both of one or more A-group elements selected from Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and one or more B-group elements selected from O, S, Se, and Te are included in a total amount of 10 mass ppm or more and 300 mass ppm or less, an average crystal grain size in a rolled surface is 15 μm or more, and a high-temperature Vickers hardness at 850° C. is 4.0 HV or more and 10.0 HV or less.
An adhesive structure according to the present invention is characterized in that a tube array structure (20) formed by erecting a plurality of tube bodies (21) formed from a metal oxide is formed on at least a portion of the surface of a base material that comprises an inorganic material. The adhesive structure can be stably used even in high-temperature environments and clean environments and makes it possible to achieve sufficient adhesive force. The metal oxide is preferably an aluminum oxide or a titanium oxide. The tube bodies (21) preferably have an average outer diameter D of at least 40 nm and an average height H of at least 300 nm.
Provided is a program for instructing a processor of a map creation device, which communicates with a monitoring device that includes one or more sensors and moves together with a user being monitored, to execute: a process for acquiring an output value of the sensor of the monitoring device and the location of the user of the monitoring device; a process for determining that a prescribed event has occurred to the user of the monitoring device on the basis of information acquired from the monitoring device; a process for creating map information for displaying a map image representing the number or frequency of the events for each place where the prescribed event has occurred; and a process for outputting the map information to another terminal device.
G08G 1/13 - Systèmes de commande du trafic pour véhicules routiers indiquant la position de véhicules, p. ex. de véhicules à horaire déterminé à une station centrale l'indicateur étant sous la forme d'une carte
G09B 29/00 - CartesPlansGraphiquesTracés, p. ex. tracés de routes
G09B 29/10 - Spots pour la lecture des cartes ou indicateurs de position par coordonnéesAides pour la lecture des cartes
Provided is an adhesive structure in which a fiber structure layer configured from a plurality of fiber bodies composed of an inorganic material is formed on at least a portion of the surface of a base material composed of an inorganic material, the equivalent circle diameter D of a cross-section orthogonal to the extension direction of a fiber body (21) constituting the fiber structure layer is within the range of 15-400 nm, an aspect ratio H/D calculated from the height H and the equivalent circle diameter D of the fiber body (21) is 3 or greater, and the adhesive structure can be stably used even in a high-temperature environment and a clean environment and can achieve sufficient adhesive force.
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
17.
MONITORING DEVICE, MONITORING MANAGEMENT DEVICE, AND MONITORING SYSTEM
This monitoring device is incorporated into or accommodated in a shoe and is detachably attached thereto, the monitoring device comprising: one or more left-foot pressure sensors; one or more right-foot pressure sensors; and a determination unit that acquires output values from the one or more left-foot pressure sensors and the one or more right-foot pressure sensors, and determines that the user has fallen when all of the output values indicate values lower than a threshold value.
G08B 25/04 - Systèmes d'alarme dans lesquels l'emplacement du lieu où existe la condition déclenchant l'alarme est signalé à une station centrale, p. ex. systèmes télégraphiques d'incendie ou de police caractérisés par le moyen de transmission utilisant une ligne de signalisation unique, p. ex. en boucle fermée
A43B 3/44 - Chaussures caractérisées par la forme ou l'utilisation avec dispositions électriques ou électroniques avec capteurs, p. ex. pour détecter le contact ou la position
A43B 3/48 - Chaussures caractérisées par la forme ou l'utilisation avec dispositions électriques ou électroniques avec dispositifs de transmission, p. ex. GSM ou Wi-Fi®
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
A61B 5/11 - Mesure du mouvement du corps entier ou de parties de celui-ci, p. ex. tremblement de la tête ou des mains ou mobilité d'un membre
A61B 5/022 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins par application d'une pression pour fermer les vaisseaux sanguins, p. ex. contre la peauOphtalmodynamomètres
A61B 5/0245 - Mesure du pouls ou des pulsations cardiaques utilisant des capteurs engendrant des signaux électriques
G01S 1/68 - Marqueur, balise d'extrémité, indicatif d'appel ou toutes balises analogues transmettant des signaux ne portant pas d'information directionnelle
G01S 5/14 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques déterminant des distances absolues à partir de plusieurs points espacés d'emplacement connu
G08B 21/02 - Alarmes pour assurer la sécurité des personnes
G08B 25/08 - Systèmes d'alarme dans lesquels l'emplacement du lieu où existe la condition déclenchant l'alarme est signalé à une station centrale, p. ex. systèmes télégraphiques d'incendie ou de police caractérisés par le moyen de transmission utilisant les lignes de communication
G08B 25/10 - Systèmes d'alarme dans lesquels l'emplacement du lieu où existe la condition déclenchant l'alarme est signalé à une station centrale, p. ex. systèmes télégraphiques d'incendie ou de police caractérisés par le moyen de transmission utilisant des systèmes de transmission sans fil
This drill (1) comprises a shaft-shaped tool body (10) that is rotated about a central axis, the drill having a chip discharge groove (14) formed on the outer periphery of the tool body (10), and a cutting blade (15) formed at an intersecting ridge portion between the chip discharge groove (14) and a tip flank (13) of the tool body (10)). The tool body (10) has a base material and a hard coating (17) formed in a region of a prescribed length from the tip of the base material. The chip discharge groove (14) has, in the central axis direction, in order from the tip of the tool body (10), a first section (S1) having a first surface roughness and a second section (S2) positioned closer to the rear end side than the first section (S1) and having a second surface roughness less than the first surface roughness. The first section (S1) has a length of at least 0.5 times a tool diameter (D). The hard coating (17) is formed in the first section (S1), and a hard coating (S17) is not formed in the second section (S2).
This aluminum powder mixture is an aluminum powder mixture obtained by mixing two or more powders containing aluminum, in which an oxygen content of the aluminum powder mixture is 0.3 mass % or less, and a total content of one or more elements selected from Ca, Cu, Fe, Mg, Mn, Ni, Si, and Zn contained in the aluminum powder mixture is 0.4 mass % or more and 5.0 mass % or less.
A titanium substrate material includes: a substrate main body made of a sintered titanium particle body; and a titanium oxide film formed on the substrate main body, wherein a proportion of anatase titanium oxide among titanium oxide constituting the titanium oxide film is 90% or more. It may have a porosity of the substrate main body is within a range of 30% or more and 92% or less. It may have a compressive strength of the titanium substrate is 0.5 MPa or more.
This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
B22F 1/107 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des matériaux organiques comportant des solvants, p. ex. pour la coulée en moule poreux ou absorbant
C09J 1/00 - Adhésifs à base de constituants inorganiques
A ball end mill includes an end mill body; a chip discharge groove, a first gash, and a bottom cutting edge. A second gash is formed at an interval from the bottom cutting edge on at least a first wall surface of the first gash. A minimum curvature radius in a cross section perpendicular to an axis of the second gash is larger than a minimum curvature radius in a cross section perpendicular to an axis of a groove bottom portion of the first gash.
This copper alloy powder includes a copper alloy that contains 5% by mass or more and 50% by mass or less of Ni. This copper alloy powder may contain 45% by mass or more and 95% by mass or less of Cu. This copper alloy powder may contain 1% by mass or more and 42% by mass or less of Zn. This copper alloy powder may contain 7% by mass or less of Mn.
Provided is a bonded body (10) obtained by bonding a first member (11) and a second member (12) with a bonding layer (13) interposed therebetween. The bonded body (10) is characterized in that the bonding layer (13) is composed of an Au-Sn alloy and has a thickness of less than 10 μm, and the area ratio of deformed voids having a roundness of 60% or less in the bonding layer (13) is less than 15% of the bonding area of the bonding layer (13). The area ratio of voids in the bonding layer (13) is preferably less than 25% of the bonding area thereof.
A tungsten compound is appropriately disposed on a surface of carbon. The negative electrode material is a negative electrode material for a battery that includes amorphous carbon and sodium tungstate is attached on a surface on the amorphous carbon and provided on the surface of the amorphous carbon. The sodium tungstate may have at least one of a cubic crystal and a tetragonal crystal.
This copper alloy has a composition containing Mg in an amount of 0.10 mass % or greater and 2.6 mass % or less, with a balance being Cu and inevitable impurities, in which in a plastic deformation region of a stress-strain curve obtained in a low-speed tensile test at a strain rate of 1.0×10−6/s, an average value of a period of a strain of a saw edge-shaped curve is 0.01% or greater and 1.0% or less, an average value of a difference in level of stress of the saw edge-shaped curve is 0.1 MPa or greater and 2 MPa or less, and there are five or more saw edge-shaped curves with a period of strain of 0.01% or greater and 1.0% or less and a difference in the level of stress of 0.1 MPa or greater and 2 MPa or less.
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
09 - Appareils et instruments scientifiques et électriques
39 - Services de transport, emballage et entreposage; organisation de voyages
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
Produits et services
Iron and steel; common metals and their alloys; common
metals, unwrought or semi-wrought; nonferrous metals and
their alloys; copper and its alloys; metal materials for
building or construction; metal pulleys, springs and valves
[not including machine elements]; metal pipe couplings;
metal flanges; small items of metal hardware; industrial
packaging containers of metal; metal nameplates and door
nameplates; joinery fittings of metal; metal safes. Metalworking machines and tools; drilling bits [parts of
metalworking machines]; metal working machines; metal
cutting tools [parts of machines]; cutting tools for
machinery; cemented carbide cutting tools; drilling tools
for use with metalworking machines; boring tools operated by
metalworking machine; power operated metalworking machine
tools, namely, turning tools; power operated metalworking
machine tools, namely, grooving tools; milling tools [parts
for metalworking machines]; tool holders for metalworking
machines [machine parts]; drill chucks [parts of machines];
holders of cutting tools for machinery; end mills
[machines]; bits for power drills; tool bits for
metalworking machines; mining machines and apparatus; bits
for mining machines; construction machines and apparatus;
loading-unloading machines and apparatus; semiconductor
manufacturing machines; stone working machines and
apparatus; non-electric prime movers, not for land vehicles;
parts of non-electric prime movers; machine elements, not
for land vehicles. Measuring or testing machines and instruments; power
distribution or control machines and apparatus; rotary
converters; phase modifiers; solar batteries; electrical
cells and batteries; electric or magnetic meters and
testers; electric wires and cables; telecommunication
machines and apparatus; personal digital assistants;
semiconductor wafers; electronic data processing apparatus;
computer software, recorded; computer software,
downloadable; computer application software, downloadable;
application software; monitors [computer programs]; computer
programs, recorded; computer programs, downloadable;
magnetic cores; resistance wires; electrodes; downloadable
image files; recorded video discs and video tapes;
electronic publications. Transport by rail; transport by car; vessel transport;
transport by air; collection of recyclable goods
[transportation]; warehousing services; distribution of
energy; distribution of renewable energy; distribution of
gas; electricity distribution; distribution of heat;
collection of waste and trash. Metalworking; processing of rubber; processing of plastics;
ceramic processing; woodworking; paper treating; stone
treating; recycling of waste; recycling of waste metals;
rental of metal treating machines and tools; sorting and
disposal of waste and trash.
A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.
This cutting insert is a plate-shaped cutting insert having a center line, and includes an upper surface that forms one surface of two surfaces facing each other in an axial direction along the center line; a lower surface that forms the other surface of the two surfaces facing each other; a side surface that connects the upper surface and the lower surface in the axial direction; and a mounting hole that passes through the cutting insert in the axial direction, in which the side surface extends obliquely inward in a radial direction perpendicular to the center line from the upper surface toward the lower surface in the axial direction.
B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p. ex. pouvant être fixés par des brides
30.
LITHIUM RECOVERY METHOD AND LITHIUM RECOVERY DEVICE
Provided are a lithium recovery method and a lithium recovery device with which it is possible to improve the lithium recovery rate while reducing impurities when recovering lithium from a roasted spent lithium ion battery (black mass), said lithium recovery method having: a leaching step in which an acidic solution containing an inorganic acid is added to a lithium-containing starting material to cause lithium to leach into the acidic solution; a precipitating step in which a first slurry obtained in the leaching step is neutralized to obtain a precipitate; a solid-liquid separating step in which a second slurry obtained in the precipitating step is subjected to solid-liquid separation; a washing step in which a solid phase obtained in the solid-liquid separating step is washed with a washing liquid; and a recycling step in which a post-washing liquid obtained in the washing step is reused in one or both of the leaching step and the precipitating step.
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
C22B 3/20 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
31.
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVALUATING ORGANIC RESIDUES OF JOINED BODY
What is provided is a joined body in which a first member and a second member are joined through a solder layer therebetween, in which the joined body is dipped in isopropanol to extract organic residues contained in the joined body, a UV absorption spectrum of an extract having the extracted organic residues is measured, the obtained UV absorption spectrum is normalized with the absorbance set to 100 at a wavelength of 207 nm, and the absorbance at a wavelength of 300 nm obtained from the normalized UV absorption spectrum is 4 or less.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
0000 is the loss tangent when the strain is 0.01%. The viscosity measured at a temperature of 25°C and a shear rate of 6/s is preferably within the range of 50-100 Pa·s.
This copper/ceramic bonded body includes a copper member consisting of copper or a copper alloy and a ceramic member, wherein the copper member is bonded to the ceramic member, an active metal compound layer consisting of an active metal compound is formed on a side of the ceramic member at a bonded interface between the ceramic member and the copper member, microcracks that extend from the bonded interface toward an inner side of the ceramic member are present in the ceramic member, and at least a part of the microcracks are filled with the active metal compound.
1−xxyy (where M is one or more from among Zr, Hf, V, Nb, Ta, Cr, Mo, and W, x is 0.05-0.50, and y is 1.0-2.5) having an average thickness of 0.5-5.0 μm; (b) in the boride layer, the x has variations in repetition over the entirety of the boride layer in the thickness direction; (c) the difference Δx between the average value of the maximum values of x and the average value of the minimum values of x is 0.02-0.10; and (d) the average interval Γ in the thickness direction between the maximum values of x and the minimum values of x is 2-20 nm.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23C 5/16 - Outils de fraisage caractérisés par des particularités physiques autres que la forme
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
35.
NEGATIVE ELECTRODE MATERIAL, BATTERY, METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL, AND METHOD FOR PRODUCING BATTERY
Performance of a negative electrode material is improved. The negative electrode material is a negative electrode material for a battery that includes carbon, sodium tungstate provided on a surface of the carbon, and silicon provided on the surface of the carbon.
A method for recovering valuable metals according to the present invention comprises: a cementation step S01 for adding a metal less noble than copper to a raw solution containing at least one of cobalt and nickel; a pH adjustment step S02 for adjusting the pH of the raw solution to a predetermined range; a first ion exchange step S04 for bringing the raw solution into contact with a first ion exchange resin; a water cleaning step S05 for cleaning the first ion exchange resin with water; a first elution step S06 for bringing the first ion exchange resin into contact with a low-concentration sulfuric acid; and a second elution step S07 for bringing the first ion exchange resin into contact with high-concentration sulfuric acid. When recovering cobalt, an iron removal step S61, a second ion exchange step S62, and a cobalt concentrate recovery step S63 are performed, and when recovering nickel, a nickel concentrate recovery step S71 is performed.
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/24 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques par adsorption sur des substances solides, p. ex. par extraction avec des résines solides
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 3/46 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques par substitution, p. ex. par cémentation
37.
TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL
A terminal material having a plating film which can be used as a terminal for electric connection and a contact for a connector, including a base material made of copper or copper alloy and a plating film formed on the base material; the plating film has a tin layer made of tin or tin alloy; a surface-part KAM value measured by analyzing a cross section of a surface part by the EBSD method in a range of depth 1 μm in a thickness direction of the base material from an interface between the base material and the plating film is 0.15° or more and less than 90°; and a center-part KAM value in a center part of a plate thickness of the base material is 0.1 times or more and 0.6 times or less of the surface-part KAM value.
Provided is a cobalt recovery method for recovering cobalt from a cobalt sulfate solution. The method is characterized by comprising: adding, to the cobalt sulfate solution, an additive of which the solubility becomes lower at a pH of at most 2.0; and electrolytically recovering cobalt from the cobalt sulfate solution to which the additive has been added. The additive preferably has a pH-buffering effect in a pH range of 2.0-4.5.
C25C 1/08 - Production, récupération ou affinage électrolytique des métaux par électrolyse de solutions des métaux du groupe du fer, de métaux réfractaires ou du manganèse du nickel ou du cobalt
39.
BLACK DISPERSION, ULTRAVIOLET-RAY-CURABLE BLACK COMPOSITION, RESIN COMPOSITION, BLACK MATRIX FOR COLOR FILTERS, AND CMOS CAMERA MODULE
This black dispersion includes a solvent, a black pigment, and a polymer dispersant, in which the solvent contains either one or both of a monofunctional monomer having an ethylenically unsaturated bond and a difunctional monomer having an ethylenically unsaturated bond, the black pigment contains zirconium nitride, and the polymer dispersant contains a comb polymer, the comb polymer has a main chain and a plurality of side chains bonded to the main chain, the main chain is a polyalkyleneimine, and each of the plurality of side chains is a group containing an oxyethylene group and an oxypropylene group.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
This free-machining copper alloy contains prescribed amounts of Cu, Si, Pb, and P, and contains a prescribed amount of Bi as an optional element, with the remainder being Zn and unavoidable impurities. Among the unavoidable impurities, the total content of Fe, Mn, Co, and Cr is less than a prescribed amount, and the Al content is less than a prescribed amount. The compositional relationships f1 and f2, which are defined from the elemental composition, the structural relationships f3, f4, and f5, which are defined from the surface area ratios of the constituent phases of the metallographic structure, and structural/compositional relationship f6, which is defined from the composition and the metallographic structure, each fall within prescribed ranges. When etched using a liquid mixture of hydrogen peroxide and aqueous ammonia, grain boundaries can be observed in a β1 phase.
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
41.
FREE-MACHINING COPPER ALLOY AND PRODUCTION METHOD FOR FREE-MACHINING COPPER ALLOY
This free-machining copper alloy contains prescribed amounts of Cu, Si, Pb, and P, and contains a prescribed amount of Bi as an optional element, with the remainder being Zn and unavoidable impurities. Among the unavoidable impurities, the total content of Fe, Mn, Co, and Cr is less than a prescribed amount, and the Al content is less than a prescribed amount. The compositional relationships f1, f2, and f0, which are defined from the elemental composition, the structural relationships f3, f4, and f5, which are defined from the surface area ratios of the constituent phases of the metallographic structure, and structural/compositional relationship f6, which is defined from the composition and the metallographic structure, each fall within prescribed ranges. A modified β1 phase has visible grain boundaries when et\ched using a liquid mixture of hydrogen peroxide and aqueous ammonia.
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
42.
COPPER STRIP FOR EDGEWISE BENDING, COMPONENT FOR ELECTRIC OR ELECTRONIC DEVICE, AND BUS BAR
A copper strip for edgewise bending can be edgewise-bent under a condition that a ratio R/W of a bending radius R to a width W is 5.0 or less. In the copper strip, a thickness t is in a range of 1 mm or more and 10 mm or less, and area ratio B/(A+B) is in a range of more than 10% and 100% or less in a square region where the length of one side is 1/10 of the thickness t, where an intersection of a straight line which contacts a surface and is parallel to a width direction and a straight line which contacts an end face and is perpendicular to the width direction is used as a reference in a cross section orthogonal to a longitudinal direction, A is an area where copper is present, and B is an area where copper is not present.
H01B 5/02 - Barres, barreaux, fils ou rubans simplesBarres omnibus
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
H01B 7/28 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par l'humidité, la corrosion, les attaques chimiques ou les conditions atmosphériques
43.
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where in an edge region E of each of the copper members (12) and (13), an area ratio of each of Ag solid solution parts (12A) and (13A) having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
Disclosed is a method for managing an electrodeposition liquid that is used for the formation of an electrodeposition film on a conductive base material by means of anionic electrodeposition, wherein the concentration of an organic acid contained in the electrodeposition liquid is adjusted by performing an anion exchange treatment on the electrodeposition liquid. Also disclosed is an electrodeposition device (10) which is used when an electrodeposition film is formed on a conductive base material by means of anionic electrodeposition, and which comprises: an electrodeposition tank (20) in which an electrodeposition liquid is retained, and the base material and a counter electrode are immersed therein; an anion exchange means (30) for performing an anion exchange treatment on the electrodeposition liquid; and an electrodeposition liquid circulation means (40) for circulating the electrodeposition liquid between the electrodeposition tank (20) and the anion exchange means (30).
C02F 1/42 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par échange d'ions
C09D 5/44 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte pour des applications électrophorétiques
C09D 7/63 - Adjuvants non macromoléculaires organiques
C09D 127/12 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un halogèneCompositions de revêtement à base de dérivés de tels polymères non modifiés par un post-traitement chimique contenant des atomes de fluor
C09D 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C25D 9/02 - Revêtement électrolytique autrement qu'avec des métaux avec des matières organiques
C25D 13/06 - Revêtement électrophorétique caractérisé par le procédé avec des matières organiques polymères
C25D 13/10 - Revêtement électrophorétique caractérisé par le procédé caractérisé par les additifs utilisés
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region of each of the copper members is 10% or less.
An electrodeposition liquid for electrodepositing an electrodeposition film on a conductive base material by anionic electrodeposition includes water, an organic solvent, a solid component, a neutralizing agent, and an organic acid. The solid component includes at least a polyimide-based resin. An insulating coating film production method for forming an insulating coating film on the surface of a base material includes: an electrodeposition film forming step (S02) for immersing the base material and a counter electrode in the electrodeposition liquid, and, by using the base material as a positive electrode and the counter electrode as a negative electrode, applying a voltage between the positive electrode and the negative electrode to form an electrodeposition film on the base material; and a baking process (S03) for baking the electrodeposition film.
C25D 13/10 - Revêtement électrophorétique caractérisé par le procédé caractérisé par les additifs utilisés
C09D 5/44 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte pour des applications électrophorétiques
C09D 7/63 - Adjuvants non macromoléculaires organiques
C09D 127/12 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un halogèneCompositions de revêtement à base de dérivés de tels polymères non modifiés par un post-traitement chimique contenant des atomes de fluor
C09D 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C25D 9/02 - Revêtement électrolytique autrement qu'avec des métaux avec des matières organiques
C25D 13/00 - Revêtement électrophorétique caractérisé par le procédé
C25D 13/06 - Revêtement électrophorétique caractérisé par le procédé avec des matières organiques polymères
This Cu pillar joined body is obtained by joining a first Cu pillar and a second Cu pillar via a joining layer, wherein: the joining layer has a porous Cu layer formed on the first Cu pillar side, a solder layer formed on the second Cu pillar side, and an intermetallic compound layer formed between the porous Cu layer and the solder layer; and the porosity in the porous Cu layer is within the range of 5-80%.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
48.
ALUMINUM-OXIDE-BASED-COMPOSITION-CONTAINING ZIRCONIUM NITRIDE POWDER AND METHOD FOR PRODUCING SAME
This aluminum-oxide-based-composition-containing zirconium nitride powder contains particles each of which is mainly composed of zirconium nitride and has a surface to which an aluminum oxide-based composition partially adheres, in which the aluminum-oxide-based-composition-containing zirconium nitride powder contains aluminum in a proportion of greater than 1% by mass and 15% by mass or less in terms of a total content of 100% by mass, and has a specific surface area of 30 m2/g to 90 m2/g measured by a BET method. This powder has relatively high light shielding properties in a near infrared region with a wavelength of 1,000 nm, has excellent patterning and visible light shielding properties, and has favorable moisture resistance, when the powder is used to form a black patterned film as a black pigment.
A surface-coated cutting tool having a substrate and a hard coating film formed on the surface of the substrate, wherein the hard coating film has a lower layer made of AlCrXZ film, an intermediate layer consisting of alternating laminated films of layer A made of AlCrX'Z film and layer B made of AlCrBWX''Z film, and an upper layer made of TiSiX'''Z film, the lower layer and the intermediate layer have crystalline structures preferentially oriented in the (111) plane of the face-centered cubic structure, and the upper layer has a crystalline structure preferentially oriented in the (200) plane of the face-centered cubic structure.
C23C 28/04 - Revêtements uniquement de matériaux inorganiques non métalliques
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c.-à-d. non caractérisé par le procédé de revêtement
This method for producing lithium sulfide is characterized by having a heat treatment step in which lithium sulfide is produced by circulating and heating a sulfur gas in a reaction vessel storing a lithium salt therein. Excess sulfur gas can be discharged as waste gas, and as a result, it is possible to suppress residual unreacted raw material and the expression of by-products, and to stably produce high-quality lithium sulfide.
Agglomeration of metal particles is to be suppressed. A metal ink contains metal particles, a solvent, and a polyhydric alcohol containing two or more OH groups and soluble in water and ethanol.
This method for manufacturing a square silicon substrate having a first surface for forming a circuit and a second surface positioned opposite to the first surface comprises: a slicing step for slicing a silicon ingot to form a square plate-shaped member; a grinding step for grinding both surfaces of the plate-shaped member; and a polishing step for mechanically polishing one surface of the plate-shaped member, which has been subjected to the grinding step, to form a square silicon substrate having a first surface, wherein chemical etching is not performed during the grinding step, during the polishing step, and between the grinding step and the polishing step, and the square silicon substrate is formed to have a thickness of 0.5-2.0 mm. Moreover, in the square silicon substrate, the TTV in the first surface is at most 100.0 μm, and the maximum peak height Rp of the first surface is at most 100.0 nm. In the polishing step, a finishing slurry composed of finishing abrasive grains and a liquid having a hydrogen ion exponent of 7.0-9.0 is used.
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet
Provided is a film-provided copper terminal material which prevents the occurrence of adhesion when used as a connector and in which insertion and extraction force is stably reduced. In the present invention, a film is formed on a base material composed of copper or a copper alloy. The film has, on the surface thereof, a tin layer composed of tin or a tin alloy having an average thickness of 0.2-2.0 μm. The arithmetic average curvature Spc of peak apexes on the surface of the film is 10-70 mm-1, and the standard deviation/average value of Spc measured at ten visual fields is 30% or less.
avgavgavgavgavgavgavgavgavgavgavg = 100.0) are 20.0 ≤ a ≤ 30.0, 20.0 ≤ b ≤ 30.0, 10.0 ≤ c ≤ 20.0, 20.0 ≤ d ≤ 30.0, and 5.0 ≤ e ≤ 15.0, and the average value of σa, σb, σc, σd, σe, which are standard deviations of a, b, c, d, and e, respectively, is 0.40 or less.
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
The present invention provides a thermoelectric element which has high thermoelectric conversion efficiency and is capable of achieving a high ZT value, while being able to be surface mounted and miniaturized. A thermoelectric element according to the present invention is provided with: a first thermoelectric material unit 1 which has one end 1a and the other end 1b; a second thermoelectric material unit 2 which is joined to the first thermoelectric material unit directly or via a conductor 2a; and a pair of electrodes 3 which are connected to the first thermoelectric material unit. The first thermoelectric material unit has a higher absolute value of the Seebeck coefficient and a higher electrical resistivity than the second thermoelectric material unit, a joined body 4 of the first thermoelectric material unit and the second thermoelectric material unit has end surfaces on one end side and the other end side, and the pair of electrodes are in contact with the first thermoelectric material unit without being in contact with the second thermoelectric material unit, while being formed on the one end-side end surface and the other end-side end surface of the joined body.
H10N 10/857 - Matériaux actifs thermoélectriques comprenant des compositions changeant de façon continue ou discontinue à l'intérieur du matériau
H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
H10N 10/852 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques comprenant du tellure, du sélénium ou du soufre
Provided is a thermoelectric device that has high thermoelectric conversion efficiency, can achieve a high ZT value, can be surface mounted, and can be made compact. This thermoelectric device comprises: a first thermoelectric material part 1 having one end 1a and the other end 1b; a second thermoelectric material part 2 joined to the first thermoelectric material part directly or via a conductor 2a; and a pair of electrodes 3 connected to the first thermoelectric material part, wherein the first thermoelectric material part has a Seebeck coefficient and an electrical resistivity higher than those of the second thermoelectric material part, the first thermoelectric material part is formed in a chip shape, the pair of electrodes are disposed on the surface of the one end and the surface of the other end of the first thermoelectric material part, and the second thermoelectric material part is formed on the outer circumferential surface of the first thermoelectric material part without contacting the pair of electrodes.
H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
H10N 10/852 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques comprenant du tellure, du sélénium ou du soufre
H10N 10/857 - Matériaux actifs thermoélectriques comprenant des compositions changeant de façon continue ou discontinue à l'intérieur du matériau
57.
THERMOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING SAME
Provided are: a thermoelectric element which has high thermoelectric conversion efficiency and is capable of achieving a high ZT value; and a method for manufacturing this thermoelectric element. A thermoelectric element according to the present invention is provided with: a first thermoelectric material unit 1 which has one end part 1a and the other end part 1b; a second thermoelectric material unit 2 which is joined to the first thermoelectric material unit directly or via a conductor 2a; and a pair of electrodes 3 which are connected to the first thermoelectric material unit. The first thermoelectric material unit has a higher absolute value of the Seebeck coefficient and a higher electrical resistivity than the second thermoelectric material unit, and the pair of electrodes are connected to the one end part side and the other end part side of the first thermoelectric material unit, while being separated from each other.
H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
POPOOPOPP in a direction parallel to the longitudinal direction of precipitate particles found in a cross-section including the longitudinal direction and having a particle diameter of not less than 150 nm but less than 1,000 nm is 0.8 or less.
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
This cutting tool unit comprises a cutting tool and a holder attached to the cutting tool. The cutting tool is provided with a tool body that has a base at a tip end part on one side in an axial direction along a tool shaft, a cutting insert that is removably attached to the base, a sensor that is provided to the tool body and that detects a physical quantity, and an AD converter that converts an analog electric signal detected by the sensor into a digital electric signal. The holder is provided with a holder body and a control substrate that is provided to the holder body and that is connected to the AD converter via connection wiring.
B23B 27/00 - Outils pour machines à tourner ou à aléserOutils de type similaire en généralAccessoires de ces outils
B23Q 17/09 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la pression de coupe ou l'état de l'outil de coupe, p. ex. aptitude à la coupe, charge sur l'outil
B23Q 17/22 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la position réelle ou désirée de l'outil ou de la pièce
This film laminate is characterized in that a metal copper layer is laminated on one surface or both surfaces of a fluororesin film, and an amorphous oxide layer is formed between the fluororesin film and the metal copper layer. The thickness of the amorphous oxide layer preferably falls within the range of 10 nm to 100 nm. An oxide constituting the amorphous oxide layer preferably includes at least one selected from among Ge, Si, Al, Ti, Ta, Zr and Cr.
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 15/082 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines vinyliquesProduits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines acryliques
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
This tin recovery method for recovering tin from a tin-containing material is characterized by comprising: an oxidation leaching step (S01) for obtaining an post-leaching liquid containing tin by performing oxidative leaching of tin in the tin-containing material into a leachate composed of a sulfuric acid-acidic solution; an oxidation step (S02) for oxidizing divalent tin ions contained in the post-leaching liquid to tetravalent tin ions by adding, to the post-leaching liquid obtained in the oxidation leaching step (S01), sodium chloride and a substance that supplies divalent copper ions; and a neutralization step (S03) for obtaining a tin-containing precipitate by neutralizing the post-leaching liquid after the oxidation step (S02).
This method for manufacturing a cutting tool (10) comprises: a film formation step (S2) for forming a hard coating film (2) that has an oxide layer (22), at least, on the surface of a tool base body (1) that is formed of a sintered alloy; and an ultraviolet laser peening step (S3) for directly irradiating the hard coating film (2) with a pulse laser having, in a gas, a wavelength of 190 nm to 380 nm (inclusive) and a pulse width of 30 fs to 2 ps (inclusive). Due to the ultraviolet laser peening step (S3), a compressive residual stress is imparted to a surface layer (1a) of the tool base body (1) immediately below the oxide layer (22), while leaving the oxide layer (22) in the hard coating film (2).
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/356 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface par traitement par choc
B23P 15/28 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'outils de coupe
This aluminum powder product (1) has a BET specific surface area of 0.16 m2/g or more and a phosphorus concentration of the powder product (1) of 1×10-3P2sCl2pP2sCl2pCl2p at 199.0 eV is 1.00 or more.
The purpose of the present invention is to provide: a method for producing lithium carbonate, with which high quality lithium carbonate can be obtained while reducing usage costs and the amount of carbon dioxide discharged; and an apparatus for producing lithium carbonate. This method for producing lithium carbonate has: a carbon dioxide generation step for generating carbon dioxide by adding an inorganic acid to a raw material containing a carbonate; a carbon dioxide recovery step for recovering the carbon dioxide; and a lithium carbonate generation step for obtaining lithium carbonate by adding the recovered carbon dioxide to a lithium-containing liquid. This apparatus for producing carbon dioxide has: a reaction tank in which carbon dioxide is generated using an inorganic acid and a raw material containing a carbonate; a carbon dioxide recovery device in which said carbon dioxide is recovered; and a lithium carbonate generation tank in which carbon dioxide is supplied from the carbon dioxide recovery device to a lithium-containing liquid to generate lithium carbonate.
C22B 1/00 - Traitement préliminaire de minerais ou de débris ou déchets métalliques
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
A cBN sintered compact comprises: cubic boron nitride grains and a binder phase, wherein
1) the binder phase comprises a Ti—Al alloy containing at least one element selected from the group consisting of Si, Mg, and Zn, and further comprises Ti2CN and TiB2;
2) the ratio ITi2CN/ITi-Al in XRD is 2.0 or more and 30.0 or less where ITi2CN represents the peak intensity of Ti2CN appearing at 2θ angle from 41.9° to 42.2° and ITi-Al represents the peak intensity of the Ti—Al alloy at 2θ angle from 39.0° to 39.3°;
3) areas where Ti and B elements overlap have an average aspect ratio of 1.7 or more and 6.5 or less and an area rate of 0.025% or more and 0.120% or less, in a mapping image of the Ti and B elements by Auger electron spectroscopy.
C22C 29/16 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de nitrures
C22C 29/00 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures
66.
BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING BONDED BODY
To suppress a decrease of strength, a bonding paste includes a copper particle, a solvent, and an additive composed of a phosphate ester. In the bonding paste, a content of the additive is in the range of 0.5% to 3.0% by mass both inclusive relative to a total of the bonding paste.
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 1/107 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des matériaux organiques comportant des solvants, p. ex. pour la coulée en moule poreux ou absorbant
B22F 7/06 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
B32B 3/26 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
67.
CLAMP STRUCTURE OF CUTTING INSERT AND INDEXABLE CUTTING TOOL
A cutting insert has a surface to be pressed and a surface to be restrained. A supporter has a supporter main body, an elastically deformable gripping arm, a pocket, and a slit. The supporter main body has a restraining surface that comes into contact with the surface to be restrained. The gripping arm has a pressing surface that comes into contact with the surface to be pressed. The slit has a pocket opening that is open to the pocket. The pocket opening is disposed between the restraining surface and the pressing surface.
B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p. ex. pouvant être fixés par des brides
68.
METHOD FOR PRODUCING CARBON AND HYDROGEN, CARBON MATERIAL, REDUCING AGENT, AND METHOD FOR DECOMPOSING CARBON DIOXIDE
Provided are a carbon dioxide decomposition step of generating magnetite that has a surface to which carbon adheres, a carbon separation step of generating carbon and iron chloride, a hydrogen production step of generating magnetite, hydrogen, and a hydrogen chloride gas, and a reducing agent regeneration step of generating the reducing agent used in the carbon dioxide decomposition step, in which the reducing agent is an oxygen-deficient iron oxide represented by Fe3O4-δ (where, δ is 1 or more and less than 4) obtained by reducing magnetite while maintaining a magnetite crystal structure, an oxygen-completely deficient iron (δ=4) obtained by completely reducing magnetite, an oxygen-deficient iron oxide obtained by reducing hematite or a used disposable warmer, or an oxygen-completely deficient iron obtained by completely reducing hematite or a used disposable warmer.
C01B 32/05 - Préparation ou purification du carbone non couvertes par les groupes , , ,
C01B 3/08 - Production d'hydrogène ou de mélanges gazeux contenant de l'hydrogène par réaction de composés inorganiques comportant un hydrogène lié électropositivement, p. ex. de l'eau, des acides, des bases, de l'ammoniac, avec des agents réducteurs inorganiques avec des métaux
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
09 - Appareils et instruments scientifiques et électriques
39 - Services de transport, emballage et entreposage; organisation de voyages
Produits et services
Irons and steels; common metals and their alloys; common metals, unwrought or semi-wrought; nonferrous metals and their alloys; copper and its alloys; building materials of metal, namely, fascia, soffits, hinges of metal, handrails of metal, door knockers of metal, non-electric hinge pin door closers of metal, and knobs of metal; construction materials of metal, namely, braces, shores, supports, wall tiles of metal, and fittings of metal for building, namely, fittings of metal for windows, fittings of metal for pipes, metal joinery fittings; metal pulleys, springs and valves, not including machine elements; metal pipe couplings; metal flanges; metal hardware, namely, nuts, washers, nails, screws, bolts of metal, rivets, pegs of metal, and screwnails of metal; industrial packaging containers of metal; metal nameplates and door nameplates; metal safes Metalworking machines and tools; drilling bits (parts of metalworking machines); metal working machines; metal cutting tools (parts of machines); cutting tools for machinery; cemented carbide cutting tools; drilling tools for use with metalworking machines; boring tools operated by metalworking machine; power operated metalworking machine tools, namely, turning tools; power operated metalworking machine tools, namely, grooving tools; milling tools (parts for metalworking machines); tool holders for metalworking machines (machine parts); drill chucks (parts of machines); holders of cutting tools for machinery; end mills (machines); bits for power drills; tool bits for metalworking machines; mining machines and apparatus; bits for mining machines; construction machines and apparatus; loading-unloading machines and apparatus; semiconductor manufacturing machines; stone working machines and apparatus; non-electric prime movers, not for land vehicles; parts of non-electric prime movers; machine elements, not for land vehicles Metalworking; processing of rubber; processing of plastics; ceramic processing; woodworking; paper treating; stone treating; recycling of waste; recycling of waste metals; rental of metal treating machines and tools; sorting and disposal of waste and trash Measuring or testing machines and instruments; power distribution or control machines and apparatus; rotary converters; phase modifiers; solar batteries; electrical cells and batteries; electric or magnetic meters and testers; electric wires and cables; telecommunication machines and apparatus; personal digital assistants; semiconductor wafers; electronic data processing apparatus; computer software, recorded; computer software, downloadable; computer application software, downloadable; application software; monitors (computer programs); computer programs, recorded; computer programs, downloadable; magnetic cores; resistance wires; electrodes; downloadable image files; recorded video discs and video tapes; electronic publications Transport by rail; transport by car; vessel transport; transport by air; collection of recyclable goods (transportation); warehousing services; distribution of energy; distribution of renewable energy; distribution of gas; electricity distribution; distribution of heat; collection of waste and trash
This lead recovery method is for recovering lead from copper refining flue cinders, characterized by comprising: a sulfuric acid leaching step S01 for leaching copper from the copper refining flue cinders by using sulfuric acid; and a reduction-smelting step S02 for subjecting leaching residues acquired in the sulfuric acid leaching step S01 to reduction-smelting to acquire crude lead, wherein: in the sulfuric acid leaching step S01, an iron compound is added such that the concentration of the trivalent Fe in a leaching solution is at least 40 g/L; and, in the reduction-smelting step S02, metal refining slag is added.
This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.
B22F 1/17 - Particules métalliques revêtues de métal
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 37/06 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par le procédé de chauffage
B32B 37/16 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification
C25D 5/00 - Dépôt électrochimique caractérisé par le procédéPrétraitement ou post-traitement des pièces
This tin oxide particle dispersion is characterized by having a solvent and tin oxide particles dispersed in the solvent, and by having an isoelectric point of from 1.0 to 3.8. Preferably, the tin oxide particles do not aggregate when the pH is adjusted to 8.0. The tin oxide particles may be doped with a different element.
What is provided is stannous oxide having an α-ray emission amount of 0.002 cph/cm2 or less after heating in an atmosphere at 100° C. for 6 hours. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepare a tin sulfate aqueous solution, and lead sulfate is precipitated in the aqueous solution and removed. While stirring the tin sulfate aqueous solution from which lead sulfate has been removed, a lead nitrate aqueous solution containing lead having an α-ray emission amount of 10 cph/cm2 or less is added to cause lead sulfate to be precipitated in the tin sulfate aqueous solution, and simultaneously the tin sulfate aqueous solution is circulated while removing the lead sulfate from the aqueous solution. A neutralizing agent is added to the tin sulfate aqueous solution to collect stannous oxide.
This drill (1) comprises a body (10) that extends along a center axis (O), a cutting blade (15) located at a distal end of the body (10), and a chip discharge groove (14) that extends toward a rear-end side of the body (10) from the cutting blade (15). The body (10) has a first outside diameter section (21) and a second outside diameter section (22) having mutually different outside diameters. The first outside diameter section (21) and the second outside diameter section (22) both have a back-tapered shape in which the outside diameter of the body gradually decreases from the distal-end side to the rear-end side. The amount of tapering in the first outside diameter section (21) is greater than the amount of tapering in the second outside diameter section (22). An outside-diameter transition section (24) having a smooth concave shape that is recessed toward the radial inside of the body is provided at a boundary between the first outside diameter section (21) and the second outside diameter section (22).
This drill (10) comprises a body (1) extending in an axial direction with a central axis (O) as a center, and the body (1) includes a chip removal flute (4), a rake face, a flank face (6), and a cutting edge (7). The rake face includes a first rake face, and a second rake face that is disposed radially outward of the first rake face, and connected to an outer peripheral face 8. The second rake face extends toward a direction opposite to a drill rotation direction (T) around the central axis (O) as the second rake face goes radially outward. The cutting edge (7) includes a first cutting edge (72) extending along a tip edge of the first rake face, and a second cutting edge (73) connected to a radially outside end of the first cutting edge (72), and extending along a tip edge of the second rake face (73). The second cutting edge (73) has a linear shape or an inwardly curved shape, and a radial rake angle (7θ) of the second cutting edge (73) is a negative angle over the entire length of the second cutting edge (73).
JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Doi, Toshihiro
Takamura, Yuzuru
Hirose, Daisuke
Abrégé
A sensor includes a first electrode, a second electrode, a third electrode, a semiconductor film that connects the first electrode and the second electrode, and a solid electrolyte membrane that covers the first electrode, the second electrode, and the semiconductor film, in which the solid electrolyte membrane has an exposed surface exposed to an outside, and the third electrode is configured to be disposed at a position where when the exposed surface of the solid electrolyte membrane is in contact with a conductive liquid (Lq), it is possible to apply an electric field to the exposed surface of the solid electrolyte membrane through the conductive liquid (Lq).
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23C 5/16 - Outils de fraisage caractérisés par des particularités physiques autres que la forme
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
The present invention at least comprises: a metal sulfide generation step for generating a metal sulfide by reacting a sulfurizing agent with a metal eluate that contains ions of a metal which forms a sulfide hardly soluble in water; a solid-liquid separation step for carrying out solid-liquid separation of a liquid phase and a solid phase containing the metal sulfide; a metal sulfide dissolution step for dissolving the metal as ions by reacting, at a liquid temperature of not lower than 20°C, an inorganic acid with the metal sulfide contained in the solid phase, and generating a hydrogen sulfide; and a recirculation step for recirculating, as at least part of the sulfurizing agent in the metal sulfide generation step, the hydrogen sulfide or a sulfur compound reacted with the hydrogen sulfide.
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/24 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques par adsorption sur des substances solides, p. ex. par extraction avec des résines solides
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
COPPER/CERAMIC ASSEMBLY, INSULATING CIRCUIT SUBSTRATE, PRODUCTION METHOD FOR COPPER/CERAMIC ASSEMBLY, AND PRODUCTION METHOD FOR INSULATING CIRCUIT SUBSTRATE
This copper/ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member, wherein the copper member and the ceramic member are bonded to each other. At a bonded interface between the ceramic member and the copper member, an active metal compound layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal compound layer toward a side of the copper member, an area rate of an active metal carbide is 8% or less.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
81.
WIRE-NET STACKED POROUS BODY AND PIPE PROVIDED WITH POROUS BODY
The present invention has a structure in which a plurality of wire nets (21, 21) are stacked with a gap therebetween, wherein the wire nets (21, 21) adjacent in the stacked direction are stacked while being relatively rotated to each other. When the wires of the stacked plurality of wire nets (21) are projected onto a projection plane orthogonal to the stacking direction, the proportion of the area of projection of the wires of the plurality of wire nets (21) on the projection plane is 85% or more, and the opening length of the aperture of the wire nets is in the range from 1.2 mm to 1.5 mm.
F28F 1/40 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements les moyens étant uniquement à l'intérieur de l'élément tubulaire
F28F 13/02 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution en influençant la couche limite
F28F 13/18 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution par application de revêtements, p. ex. absorbant les radiations ou les réfléchissantDispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution par application d'un traitement de surface, p. ex. un polissage
F28D 20/00 - Appareils ou ensembles fonctionnels d'accumulation de chaleur en généralAppareils échangeurs de chaleur de régénération non couverts par les groupes ou
82.
METAL NET LAMINATED POROUS BODY AND POROUS BODY-CONTAINING PIPE
Provided are a metal net laminated porous body, and a porous body-containing pipe, the metal net laminated porous body being characterized by having a structure in which metal nets (21), of which the mesh aperture and the wire diameter are the same, are spaced apart from each other and the metal nets (21) adjacent to each other in the lamination direction rotate relative to each other and are laminated, wherein the open length of the mesh aperture of the metal nets (21) is within the range of 0.5-0.7 mm inclusive.
F28F 1/40 - Éléments tubulaires ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des saillies, avec des évidements les moyens étant uniquement à l'intérieur de l'élément tubulaire
F28F 13/02 - Dispositions pour modifier le transfert de chaleur, p. ex. accroissement, diminution en influençant la couche limite
F28D 20/00 - Appareils ou ensembles fonctionnels d'accumulation de chaleur en généralAppareils échangeurs de chaleur de régénération non couverts par les groupes ou
83.
ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS AND METHOD FOR PRODUCING SAME
This electrode plate is provided with: a gas feed part (31) through which a plurality of gas flow channels (11) penetrate; and a peripheral part (32) which is formed around the gas feed part (31). The gas feed part (31) and the peripheral part (32) form a flush first surface (301). This electrode plate also comprises a projection part (32A) where the peripheral part (32) protrudes in the thickness direction around a second surface (302) which is on the reverse side of the gas feed part (31) from the first surface (301), and in which the gas feed part (31) is formed thinner than the peripheral part (32) in the thickness direction. Each gas flow channel (11) has an inlet (111) that is formed in the first surface (301), and an outlet (112) that is formed in the second surface (302). The area ratio occupied by adhering matter in a peripheral region, which is adjacent to the outlet (112) of the gas flow channel (11) in the second surface (302), is 10% or less. The number of gas flow channels (11), to the inner circumferential surfaces (113) of which adhering matter is adhering, accounts for 20% or less of the total number of the gas flow channels (11).
This metal/nitride laminate comprises a metal solidified layer joined with an active metal nitride layer containing either one or both of Ti-N and Zr-N, and comprises a modified nitride layer formed between the active metal nitride layer and the metal solidified layer and having a composition where some of the active metal of the active metal nitride layer is replaced by either one or both of Al and Si.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
B23K 35/28 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 950 C
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
A method of manufacturing a metal compound film is a method of manufacturing a metal compound film in which a compound generating liquid containing, as a solute component, a substance that generates a metal compound is applied to a substrate having an opening portion on a surface and sintered to form a metal compound film, including: a pre-wet liquid application step of applying a pre-wet liquid to the surface of the substrate, and filling the opening portion with the pre-wet liquid, the pre-wet liquid having better wettability to the substrate than the compound generating liquid; a compound generating liquid application step of applying the compound generating liquid to stack the compound generating liquid on the pre-wet liquid on the substrate, and diffusing the solute component of the compound generating liquid in the pre-wet liquid; and a sintering step of sintering the applied compound generating liquid to form metal compound film.
B05D 1/36 - Applications successives de liquides ou d'autres matériaux fluides, p. ex. sans traitement intermédiaire
B05D 1/00 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces
B05D 3/02 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par cuisson
86.
METALLIC INK, METHOD FOR PRODUCING METALLIC INK, METHOD FOR PRODUCING SINTERED OBJECT, SINTERED OBJECT, AND LIQUID DETERGENT
A metallic ink (10) which, when used as a metallic ink, is inhibited from aggregation of the metal particles, has improved sinterability, and can give a sintered object that allows visible light to adequately pass therethrough and which, when used as a liquid detergent, shows improved cleaning properties and inhibits or eliminates clogging. The metallic ink (10) comprises metal particles (12), a solvent (16), a polyhydric alcohol (14) which contains two or more OH groups and is soluble in water and lower alcohols, and an additive (17) comprising a phosphoric acid compound soluble in water.
HAFNIUM COMPOUND-CONTAINING SOL-GEL SOLUTION, METHOD FOR PRODUCING HAFNIUM COMPOUND-CONTAINING SOL-GEL SOLUTION, AND METHOD FOR PRODUCING HAFNIA-CONTAINING FILM
A hafnium compound-containing sol-gel solution contains a lower alcohol having 5 or less carbon atoms that serves as a solvent, a hafnium compound that serves as a hafnium source, and a polyalcohol having either or both of an ether group and a N atom in a molecule, as a wettability improver. The hafnium compound-containing sol-gel solution preferably further contains a stabilizer. It is preferable that the content of the hafnium compound is regulated within a range of 0.05 mass % or more and 10 mass % or less, and the content of the polyalcohol is regulated within a range of 0.05 mass % or more and 20 mass % or less.
B01J 13/00 - Chimie des colloïdes, p. ex. production de substances colloïdales ou de leurs solutions, non prévue ailleursFabrication de microcapsules ou de microbilles
This clay-like thermally conductive composition is characterized by containing a liquid polyol and an inorganic filler, and is also characterized in that: the amount of the inorganic filler relative to 100 parts by mass of the liquid polyol is within the range from 1,000 to 3,300 parts by mass (inclusive); and the tackiness index as determined by the integral value of regions to which a tensile load is applied when the probe is lifted in a tackiness tester is 10 g∙s or more.
C08L 101/06 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 15/00 - Compositions contenant des dérivés du caoutchouc
C08L 23/26 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique
C08L 67/00 - Compositions contenant des polyesters obtenus par des réactions créant une liaison ester carboxylique dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
A cBN sintered compact in accordance with an embodiment of the present invention comprises: cBN grains in the amount of 40 vol % or more and 80 vol % or less; and a binder phase containing titanium boride grains. The cBN sintered compact satisfies the following relation: 3.0≤X/Y≤10.0, where Y is the sum of the lengths of envelopes on which the cBN grains are in contact with the binder phase, and X is the sum of the interfacial lengths of the titanium boride grains that are present within 2 μm from the surfaces of each cBN grain and have an oblateness of 1.3 or more and 30.0 or less where the oblateness is defined by L2/(4πS), where L is the interfacial length and S is the area of the titanium boride grain.
C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique
C04B 35/58 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures
90.
COPPER/CERAMIC ASSEMBLY AND INSULATING CIRCUIT SUBSTRATE
This copper/ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member consisting of silicon nitride, wherein the copper member and the ceramic member are bonded. At a bonded interface between the ceramic member and the copper member, an active metal nitride layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal nitride layer toward a side of the copper member, an area rate of an active metal compound containing Si and an active metal is 10% or less. A ratio PA/PB of an area rate PA of the active metal compound in a peripheral part region of the copper member to an area rate PB of the active metal compound in a central part region of the copper member is in a range of 0.7 or more and 1.4 or less.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
This continuous cast wire rod contains Cu: 62.0 mass % or greater and 70.0 mass % or less, Sn: 0.3 mass % or greater and 0.9 mass % or less, Zr: 0.0050 mass % or greater and 0.1000 mass % or less, and P: 0.0050 mass % or greater and 0.1000 mass % or less, with a balance being Zn and impurities, and a mass ratio Zr/P of Zr to P is 0.3 or greater.
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
B22D 11/00 - Coulée continue des métaux, c.-à-d. en longueur indéfinie
C22C 1/02 - Fabrication des alliages non ferreux par fusion
C22C 9/02 - Alliages à base de cuivre avec l'étain comme second constituant majeur
92.
METHOD FOR RECOVERING VALUABLE METAL FROM USED LIB
This method for recovering a valuable metal from a used LIB includes: a step of adding, to an electrode assembly taken out of a detoxified used LIB, metallic zinc in an excess amount relative to a mass of the electrode assembly; a step of heating a mixture of the electrode assembly and the metallic zinc to form a molten metal; a step of taking out the molten metal and separating the molten metal into an alloy metal and a slag; and a step of heating the alloy metal to volatilize zinc in the alloy metal, and thereby, recovering an alloy metal of a valuable metal.
Provided is a more appropriate method of producing lithium sulfide having high ionic conductivity and no by-products generated. The method of producing lithium sulfide includes a temperature rising step (Step S14) of reducing lithium sulfate fed into a furnace in a state of heating to a temperature of more than 700° C. under an atmosphere of a reduced pressure of 0.05 MPa or less.
A cutting tool (10) comprising a cemented carbide tool substrate (1) having a WC-containing hard phase and a Co-containing bonding phase, a cutting edge (3) disposed on a ridge part of the tool substrate (1), a rake surface (5) disposed adjacent to the cutting edge (3), and a hard film (2) disposed over at least the cutting edge (3) and the rake surface (5) on the surface of the tool substrate (1), wherein: the hard film (2) includes at least one of an oxide, a carbide, a nitride, a carbonitride, or a boride; the film thickness of the entire hard film (2) is 1-25 μm inclusive; the residual stress at an outer layer (1a) of an edge part of the tool substrate (1) is −1 GPa or lower; and when crystal structure surface analysis using an electron backscatter diffraction device is conducted at a cross-section of the edge part of the tool substrate (1), the average value of the ratio of hcp/fcc for Co within the range of 40-100 μm inclusive in depth from the surface of the tool substrate (1) toward the interior thereof is greater than 0.1.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B22F 3/24 - Traitement ultérieur des pièces ou objets
B23P 15/28 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'outils de coupe
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C23C 16/30 - Dépôt de composés, de mélanges ou de solutions solides, p. ex. borures, carbures, nitrures
Provided is a cBN sintered compact in which the average particle size of cBN particles is 1000-6000 nm. On the surface or cross section of the sintered compact, the sum of the areas of cBN particles in which the average roughness of a concavo-convex portion formed by the contour line and the contour approximation line thereof is 13-28 nm constitutes 45-90% of the total area of all cBN particles in the sintered compact. The cBN sintered compact has a bonded phase which is an aggregate of bonded phase particles having an average particle size of 100-230 nm and contains an Al compound, wherein the Al compound occupies 1-12% of the total area of the cBN sintered compact.
C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23B 27/20 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants constitués par des diamants
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
C22C 5/08 - Alliages à base d'argent avec le cuivre comme second constituant majeur
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
96.
TIN OXIDE PARTICLE DISPERSION LIQUID, TIN OXIDE PARTICLE LAMINATION FILM MANUFACTURING METHOD, AND TIN OXIDE PARTICLE LAMINATION FILM
This tin oxide particle dispersion liquid is obtained by dispersing, in a solvent, a plurality of tin oxide particles (20) linked to each other in a rosary-like manner. This tin oxide particle lamination film manufacturing method comprises a coating step for coating a substrate with said tin oxide particle dispersion liquid. Regarding a tin oxide particle lamination film formed by said manufacturing method, the average of the film thickness is within a range of 10-100 nm, the standard deviation of the film thickness is within a range of 3-40 nm, and the coefficient of variation CV of the film thickness is 50% or lower.
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
In a copper/ceramic bonded body according to the present invention, copper members and are each bonded to one surface and the other surface of a ceramic member, active metal nitride layers and are formed on the ceramic member side of the copper members and, area rates A1 and A2 of an active metal compound containing Si and an active metal are set to 10% or less in regions (E1) and (E2) of 10 μm from the active metal nitride layers and to the copper members and, and a ratio A1/A2 of the area rate A1 of the active metal compound on a side of the one surface and the area rate A2 of the active metal compound on a side of the other surface is set in a range of 0.7 or more and 1.4 or less.
This cBN sintered body is characterized in that: the average particle size of cBN particles is 1000-6000 nm; in a surface or cross-section of the sintered body, the sum of the areas of cBN particles for which the median value of recess-projection areas formed by a contour line and contour approximation line thereof is 500-2200 nm2 accounts for 45-90% of the total area of all the cBN particles in the sintered body; a binder phase is an aggregate of binder phase particles having an average particle size of 100-230 nm, and further contains an Al compound; and the Al compound accounts for 1-12 area% with respect to the total of the cBN sintered body.
C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23B 27/20 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants constitués par des diamants
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
C22C 5/08 - Alliages à base d'argent avec le cuivre comme second constituant majeur
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
99.
NITRIDE INSULATOR MATERIAL, METHOD FOR PRODUCING SAME, HEAT FLOW SWITCHING ELEMENT, AND THERMOELECTRIC CONVERSION ELEMENT
Provided are a nitride insulator material having low lattice thermal conductivity, a method for producing the same, a heat flow switching element, and a thermoelectric conversion element. The nitride insulator material of the present invention consists of a metal nitride represented by the general formula: M-Si—N—Te (where M represents at least one of Ta and Hf, and Te is an arbitrary element) and has a nanocrystalline structure. In addition, the heat flow switching element of the present invention includes: an N-type semiconductor layer 3; an insulator layer 4 laminated on the N-type semiconductor layer; and a P-type semiconductor layer 5 laminated on the insulator layer, wherein the insulator layer is made of the above-described nitride insulator material.
H01B 3/12 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques céramiques
H01B 19/04 - Traitement des surfaces, p. ex. application de revêtements
H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
Produits et services
Metallic oxides; nickel sulphate; lithium carbonate;
industrial chemicals; carbide; tungsten carbide; selenium;
bismuth; tellurium. Iron and steel; common metals and their alloys; common
metals, unwrought or semi-wrought; alloys of common metal;
drawn and polished metal bars; ingots of common metal. Precious metals; precious metals, unwrought or semi-wrought;
alloys of precious metal; gold, unwrought or beaten; ingots
of precious metals; palladium; rhodium; ruthenium.
