A semiconductor device (16) is formed through: a temporary fixing layer forming step in which a first surface (2a) and a second surface (2b) of a substrate body (2) made of silicon are formed parallel to each other, a metal film (3) is formed on at least the first surface (2a) of the substrate body (2), and using the silicon substrate as a carrier substrate (1), a temporary fixing layer (11) is formed on either the first surface (2a) side or the second surface (2b) side thereof; a semiconductor device forming step in which at least part of the semiconductor device (16) is formed on the temporary fixing layer; and a peeling step in which the temporary fixing layer (11) and the carrier substrate (1) are peeled off after the semiconductor device forming step.
Provided is a treatment method for a lithium/nickel/cobalt-containing material that includes a leaching step (S01) for adding an acidic solution that contains an inorganic acid to a lithium/nickel/cobalt-containing material to leach lithium, nickel, and cobalt into the acidic solution, a reduction leaching step (S02) for adding a reducing agent to the acidic solution to leach more lithium, nickel, and cobalt, a neutralization step (S03) for adding a calcium compound to the lithium/nickel/cobalt leachate to generate a nickel/cobalt precipitate that includes nickel and cobalt, a solid/liquid separation step (S04) for separating the nickel/cobalt precipitate and the lithium leachate, and a nickel/cobalt recovery step (S05) for recovering nickel and cobalt from the nickel/cobalt precipitate.
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
Provided is a method for treating a lithium-nickel-cobalt-containing material, the method comprising: a first leaching step (S01) for obtaining a lithium-nickel-cobalt leachate by adding an acidic solution to a lithium-nickel-cobalt-containing material; a neutralization step (S02) for adding a neutralizing agent to the lithium-nickel-cobalt leachate; a first solid-liquid separation step (S03) for separating a lithium leachate and a nickel-cobalt precipitate; a second leaching step (S04) for leaching the nickel-cobalt precipitate in an acidic solution to obtain a nickel-cobalt leachate; a hydrogen peroxide addition step (S05) for adding hydrogen peroxide to the acidic solution; and a second solid-liquid separation step (S06) for separating the nickel-cobalt leachate and a solid component, wherein in the hydrogen peroxide addition step (S05), hydrogen peroxide is added until the oxidation-reduction potential reaches 200 mV or more within a pH range of 1.5-2.0.
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
A copper/ceramic bonded body in which a copper member consisting of copper or a copper alloy and a ceramic member are bonded to each other, in which an active metal compound layer containing a compound of one or more active metals selected from the group consisting of Ti, Zr, Nb, and Hf, or a magnesium oxide layer is formed in a region of the ceramic member on a copper member side, and a transition metal layer containing one or more transition metals selected from the group consisting of V, Cr, Mn, Fe, Co, Ni, Mo, Ta, and W is formed in an interface of the active metal compound layer or the magnesium oxide layer on the copper member side.
Disclosed is a silicon electrode plate for a plasma processing apparatus, the silicon electrode plate being characterized by having a plurality of slit-shaped gas flow paths (11) that penetrate the silicon electrode plate from a first surface (301) to a second surface (302), which is positioned on the reverse side of the first surface (301), in the plate thickness direction (D1) in each of a plate center part, an outer peripheral part, and an intermediate part of the silicon electrode plate. This silicon electrode plate for a plasma processing apparatus is also characterized in that: the gas flow paths (11) are each formed so that the aspect ratio, which is obtained by dividing, by the slit width (A), the depth (C) from an inlet (111) in the first surface (301) to an outlet (112) in the second surface (302) is 10 or more and 80 or less; and the average value n1 of the total number of chippings, which are formed on the linear long edges and the arc-shaped short edges of the inlet (111) and the outlet (112) of one gas flow path (11) and have a width of 0.1 mm or more, is three or less (n1 ≤ 3).
H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
B23H 1/00 - Usinage par décharge électrique, c.-à-d. enlèvement de métal au moyen de séries de décharges électriques à cadence élevée entre une électrode et une pièce en présence d'un fluide diélectrique
C23C 16/50 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement au moyen de décharges électriques
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
H05H 1/46 - Production du plasma utilisant des champs électromagnétiques appliqués, p. ex. de l'énergie à haute fréquence ou sous forme de micro-ondes
6.
ALUMINUM ALLOY POWDER, ALUMINUM ALLOY SINTERED BODY, AND METHOD FOR PRODUCING ALUMINUM ALLOY SINTERED BODY
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Kobayashi, Keigo
Kato, Jun
Hirayama, Yusuke
Liu, Zheng
Takagi, Kenta
Abrégé
Provided is an aluminum alloy powder comprising 0.1-2.0 mass% or one or more metal elements from among rare earth metal elements comprising the lanthanide elements and yttrium, wherein the iron content is suppressed to not more than 2.0 mass%. The rare earth metal element is preferably one of praseodymium, neodymium, europium, samarium, terbium, gadolinium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium.
H01B 1/10 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques sulfures
C01B 25/14 - Composés de phosphore et de soufre, sélénium ou tellure
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
This copper alloy deposition model is formed of a Cu-Cr-Ni-Si-based alloy, the Cu-Cr-Ni-Si-based alloy having a Cr content within the range of 0.1-0.8 mass%, a Si content within the range of 0.4-0.8 mass%, and a Ni content within the range of 1.8-3.0 mass%. The model density is 99.5% or more, and the area ratio of a crystal having a plane orientation of (101) ± 15° in a specific direction is 51% or more as determined by crystal orientation measurement by means of electron backscattered diffraction.
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 10/28 - Fusion sur lit de poudre, p. ex. fusion sélective par laser [FSL] ou fusion par faisceau d’électrons [EBM]
B22F 10/38 - Commande ou régulation des opérations pour obtenir des caractéristiques spécifiques du produit, p. ex. le lissage de la surface, la densité, la porosité ou des structures creuses
B33Y 80/00 - Produits obtenus par fabrication additive
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
9.
LITHIUM SULFIDE AND SULFIDE SOLID ELECTROLYTE PRODUCTION METHOD
This lithium sulfide is characterized in that the 50% diameter on a volume basis is in the range of 0.1-600 μm, inclusive, and the half-value width of a peak at 2θ= 27°±0.03° as measured using X-ray diffraction is in the range of 0.10-0.50°, inclusive. This sulfide solid electrolyte production method is characterized by using said lithium sulfide as a starting material.
Provided is a method for producing a sulfide-based solid electrolyte, the method having: a raw material preparation step for preparing an electrolyte raw material containing an element other than sulfur among elements constituting the sulfide-based solid electrolyte, and elemental sulfur and forming a raw material aggregate; and a synthesis step for heating the raw material aggregate to synthesize the sulfide-based solid electrolyte, wherein in the raw material preparation step, a molar ratio of the elemental sulfur to a lithium element in the raw material aggregate is set to be 1.5 to 6.5.
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 1/10 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques sulfures
This additively manufactured copper alloy object comprises a Cu-Cr-Zr-based alloy, and is characterized in that: the Cu-Cr-Zr-based alloy has a Cr content within a range of 0.5-1.5 mass% and a Zr content within a range of 0.02-0.2 mass%; the density of the manufactured object is not less than 99.1%; and, as a result of measuring the crystal orientation of the same by electron backscatter diffraction, the area ratio of crystals having a plane orientation of {101}±15° in a specific direction is not less than 50%.
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 10/28 - Fusion sur lit de poudre, p. ex. fusion sélective par laser [FSL] ou fusion par faisceau d’électrons [EBM]
B22F 10/36 - Commande ou régulation des opérations des paramètres du faisceau d’énergie
B22F 10/38 - Commande ou régulation des opérations pour obtenir des caractéristiques spécifiques du produit, p. ex. le lissage de la surface, la densité, la porosité ou des structures creuses
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
B33Y 80/00 - Produits obtenus par fabrication additive
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
This Au-Sn alloy has an Sn content of 15.0–25.0 mass%, the remainder being Au and impurities, and an α-ray emission amount of no more than 0.010 cph/cm2. The amount of Cu, Pb, As, Sb, and Ag included as impurities is no more than 10 mass ppm each.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
A silicon member is characterized by comprising a polycrystalline region, having a percentage of coincidence grain boundary in the crystal grain boundary of the polycrystalline region of 80% or greater, and having a recess depth from the surface of 0.5 μm or less. The percentage of the Σ3 grain boundary in the coincidence grain boundary is preferably 80% or greater. The percentage of the Σ9 grain boundary in the coincidence grain boundary is preferably from 3% to 20%. The percentage of random grain boundaries in the crystal grain boundary of the polycrystalline region is preferably 15% or less.
C30B 11/14 - Croissance des monocristaux par simple solidification ou dans un gradient de température, p. ex. méthode de Bridgman-Stockbarger caractérisée par le germe, p. ex. par son orientation cristallographique
H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
14.
METAL OXIDE FINE PARTICLES AND DISPERSION OF METAL OXIDE FINE PARTICLES
In an aspect of metal oxide fine particles, with regard to a transmission spectrum measured under conditions where the metal oxide fine particles are dispersed in a dispersion medium at a concentration of 0.7 mass % to prepare a dispersion and the dispersion is put into a 1 mm cell, an inclination k1 obtained by linearly approximating the transmission spectrum in a wavelength range of 290 nm to 330 nm by a least squares method is in a range of 0.90 or more and 1.60 or less.
This thermally conductive resin material (10) includes a resin (11) and a particulate filler (12) that is dispersed in the resin (11). A graph that represents the particle size distribution of the filler (12) of the thermally conductive resin material (10) has a first peak, a second peak, and a third peak. The first peak is at at least 20 μm but no more than 80 μm, the second peak is at at least 1 μm but no more than 10 μm, and the third peak is at at least 0.1 μm but less than 1 μm. The filler (12) includes first particles (21) that have a particle size of at least 10 μm, second particles (22) that have a particle size of at least 1 μm but less than 10 μm, and third particles (23) that have a particle size of at least 0.1 μm but less than 1 μm. The average circularity of a random sample of 30 of the third particles (23) that have a circle equivalent diameter of less than 1 μm is no more than 0.7.
A surface-coated cutting tool characterized in that: a substrate includes a binder phase containing Co and/or Ni as a main component, a hard phase containing W carbide as a main component, and a γ phase having an FCC structure and containing Zr as an optional component, V as an optional component, and a composite carbide of at least one element selected from the group consisting of Ti, Ta, Nb, and Hf as a main component; the substrate does not include unreacted carbon or free carbon, and has C00 porosity; and in the case where the Vickers hardness is measured under a load of 500 g every 4 μm toward the substrate interior from a substrate-interior position 2 μm from the interface between the substrate and a coating layer, the substrate has a reference hardness average value of A (HV0.5) at a depth of 2-450 μm, the substrate has a relative hardness average value of 0.70A-0.78A (HV0.5) at a depth of 2-14 μm, and the substrate has a relative hardness average value of 1.04A-1.10A (HV0.5) at a depth of 2-150 μm.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23P 15/28 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'outils de coupe
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C22C 27/04 - Alliages à base de tungstène ou de molybdène
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
A surface-coated cutting tool characterized in that: a substrate includes a binder phase containing Co and/or Ni as a main component, a hard phase containing W carbide as a main component, and a γ phase having an FCC structure and containing Zr as an optional component, V as an optional component, and a composite carbide of at least one element selected from the group consisting of Ti, Ta, Nb, and Hf as a main component; the substrate does not include unreacted carbon or free carbon, and has C00 porosity; and in the case where the Vickers hardness is measured under a load of 500 g every 4 μm toward the substrate interior from a substrate-interior position 2 μm from the interface between the substrate and a coating layer, the substrate has a reference hardness average value of A (HV0.5) at a depth of 2-450 μm, the substrate has a relative hardness average value of 0.80A-0.86A (HV0.5) at a depth of 2-14 μm, and the substrate has a relative hardness average value of 1.11A-1.17A (HV0.5) at a depth of 2-150 μm.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23P 15/28 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'outils de coupe
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
This cutting tool made of cermet is characterized by comprising a hard phase, a binder phase, and a carbonitride phase, wherein: the hard phase contains TiCN and TiMCN (M is at least one element selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, and W) as a main component; the binder phase contains Co as a main component; and the carbonitride phase is dispersed within the binder phase and contains a carbonitride of the element M as a main component.
C22C 29/04 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbonitrures
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
A cutting tool having a substrate comprising a first hard phase, a second hard phase, and a binder phase, wherein the first hard phase is a composite carbonitride containing 3.0 mass% or less of at least one selected from Zr, V, Nb, Ta, Mo, and W, less than 0.2 mass% of Cr, and 18.0-22.0 mass% in total of C and N, with the remainder comprising Ti and inevitable impurities, the second hard phase is a composite carbonitride containing 10.0-25.0 mass% of at least one selected from Zr, V, Nb, Ta, Mo, and W, more than 0.0 and less than 1.0 mass% of Cr (higher content than the first hard phase), and 15.0-20.0 mass% in total of C and N, with the remainder comprising Ti and inevitable impurities, the binder phaser contains less than 5.0 mass% in total of Ni and Fe, and 1.0-8.0% of Cr in terms of mass ratio with respect to the Co content, with the remainder comprising Co and inevitable impurities, and the Vickers hardness of the substrate monotonically decreases from the flank face toward the inside to 100 μm, with 1700-2100 Hv up to 40 μm and 1600-1780 Hv at a position of 600 μm inside.
C22C 29/04 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbonitrures
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
This thermally conductive resin composition has an organo-polysiloxane blended therein in an amount in a range of 0.1-10.0 parts by mass with respect to 100 parts by mass of a filler. A polysiloxane compound having, at one terminal of a main chain, an ester functional group having a terminal modified by a hydroxyl group is blended in an amount in a range of 0.4-5.0 parts by mass with respect to 100 parts by mass of the filler. With respect to 100 parts by mass of the filler, an alkoxy silane compound is blended in an amount in a range of 1.2X to 10.0X parts by mass, where X represents a value obtained by dividing, by the minimum coated area (m2/g) of the alkoxy silane compound, a value obtained by multiplying the specific surface area (m2/g) of the filler with 100 parts by mass indicating the amount of the filler.
Provided is a temperature sensor which is inserted into an object to be measured and is reliably prevented from falling out. A temperature sensor 1 according to the present invention is inserted into a sensor hole of a socket section provided in an object to be measured. The temperature sensor 1 comprises: a belt-shaped insulating substrate 3; a heat-sensitive element 4 which is provided on one end side of the insulating substrate; a pair of pattern wires 5 which are formed on the insulating substrate and one end of which is connected to the heat-sensitive element; and a leaf spring member 6 which is attached to one end side of the insulating substrate. The leaf spring member comprises: a bottom plate part 6a to the upper surface of which one end side of the insulating substrate is fixed; and an upper plate part 6b which is connected to one end of the bottom plate part, extends gradually away from the bottom plate part toward the other end side of the bottom plate part, and has a biasing force in a direction away from the bottom plate part. The socket section has a through-hole penetrating from the inside of the sensor hole to the upper surface. The upper plate part comprises a locking part 6c that protrudes upward and is fitted into the through-hole when inserted into the sensor hole.
G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
Provided is a surface coated cutting tool including a substrate and a coating layer, wherein: the substrate contains 4.0 to 16.0 mass% of Co and/or Ni in total, 0.0 to 0.5 mass% of Cr, 4.0 to 12.0 mass% of at least one of Ti, Ta, Nb, Zr, Hf and V, and 6.0 to 7.5 mass% of C, with the remainder comprising W and unavoidable impurities; and in crystal grains constituting a hard phase, a ratio (d99/d50) of the cumulative equivalent circle diameter area proportion 99% grain size to the cumulative equivalent circle diameter area proportion 50% grain size is 2.0 to 2.4 in an internal cross-sectional region 300 μm or more toward the inside of the substrate from an interface between the substrate and the coating layer, and 3.0 to 4.0 in a cross-sectional region from the interface to 20 μm toward the inside of the substrate.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C22C 27/04 - Alliages à base de tungstène ou de molybdène
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
24.
METHOD FOR PRODUCING METAL SULFATE CRYSTAL AND METAL SULFATE
The present invention provides a method for producing a metal sulfate crystal, in which a metal sulfate crystal is crystallized and recovered from a metal sulfate solution that contains a metal sulfate and has a pH of less than 4.0. This method for producing a metal sulfate crystal is characterized by including: an alkaline metal compound addition step in which an alkaline metal compound of the metal that constitutes the metal sulfate is added to the metal sulfate solution that has a pH of less than 4.0 to so as to increase the pH to 4.5 or more; a crystallization step in which the metal sulfate crystal is crystallized from the metal sulfate solution that has a pH of 4.5 or more so as to obtain a metal sulfate crystal-containing slurry that contains the metal sulfate crystal; and a solid-liquid separation step in which the metal sulfate crystal-containing slurry is separated into the metal sulfate crystal and the residual liquid.
This solder paste contains solder powder and a spacer. The spacer content is 1 mass% or less. The spacer does not dissolve in the solder even if the melting temperature is higher than the melting temperature of the solder powder and the spacer is heated for 5 minutes at a temperature that is 20°C higher than the melting point of the solder powder. The spacer has a columnar shape or a tube shape, and the diameter variation σ/Da of the spacer calculated from the average diameter Da of the spacer and the standard deviation σ is 6.0% or less.
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY (Japon)
Inventeur(s)
Arai Koya
Oya Takahide
Abrégé
A liquid detecting sensor element (20) according to the present invention detects a change of state of a target substance between a solid and a liquid, or a change of state of a target substance between dry and wet, the liquid detecting sensor element being characterized by including a liquid holding portion (25) into which the target substance in a liquid state is impregnated and held, and a first electrode portion (21) and a second electrode portion (22) which are arranged with the liquid holding portion (25) interposed therebetween, wherein the liquid holding portion (25) consists of an electrically conductive fiber body or an electrical-conductor-containing fiber body obtained by dispersing an electrical conductor in an insulating fiber body.
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/06 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un liquide
27.
COPPER TERMINAL MATERIAL WITH PLATING FILM AND METHOD FOR MANUFACTURING SAME
65655 alloy layer is an ally layer having a compound in which a part of the copper is substituted with nickel, and a part of the alloy layer is exposed on the surface of the tin layer. The exposed area ratio of the copper-tin alloy layer exposed on the surface of the tin layer is 1-60%. The tin layer has an average thickness of 0.20-1.20 μm, and the nickel layer has an average thickness of 0.05-2.00 μm. The arithmetic average curve Spc of the crest point on the surface of the coating film exceeds 70 mm-1but does not exceed 200 mm-1, and the standard deviation/average value of Spc found when visual field measurement is performed 10 times is 30% or less.
231-yy1-xx3233 (wherein Ma represents at least one trivalent metal element having an ion radius greater than that of Y, Mb represents at least one of Mg, Ca, Sr, and Ba, and 0.0≤x≤1.0, 0.0
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
C04B 35/01 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes
C04B 35/50 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de composés de terres rares
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
29.
THERMISTOR ELEMENT, TEMPERATURE SENSOR PROVIDED WITH SAME, AND THERMISTOR ELEMENT MANUFACTURING METHOD
Provided are a thermistor element with minimal characteristic variation over time in a high temperature environment and during a heat resistance test, a temperature sensor including the thermistor element, and a thermistor element manufacturing method. This thermistor element comprises: a thermistor element body 2 having a crystal structure which includes a perovskite-type oxide thermistor material; and a pair of electrodes 3 on which the thermistor element body is formed. The electrodes comprise a Pt electrode layer 3a formed on the surface of the thermistor element body, and an intermetallic compound layer 3b including Pt, Sn, and M formed on the outside of the Pt electrode layer, wherein M is at least one of Ag, Ni, Co, and Mn, and the thickness of the intermetallic compound layer is 50 nm or more.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
30.
MELTING/SOLIDIFICATION SENSOR ELEMENT AND MELTING/SOLIDIFICATION SENSOR
A melting/solidification sensor element (20) according to the present invention detects a state change between solid and liquid in a target substance having electroconductivity in a liquid state, the melting/solidification sensor element (20) being characterized by including a liquid-holding part (25) in which the target substance in a liquid state is impregnated and held, and a first electrode part (21) and a second electrode part (22) that are arranged with the liquid-holding part (25) interposed therebetween, a state change between solid and liquid of the target substance held by the liquid-holding part (25) being detected according to an electric signal generated between the first electrode part (21) and the second electrode part (22).
G01N 27/06 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un liquide
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
31.
ATOMIZATION AGENT REPLENISHING LIQUID FOR PLATING SOLUTION AND METHOD FOR MANUFACTURING TIN-BASED PLATING MATERIAL
This atomization agent replenishing liquid for a plating solution replenishes a tin-based plating solution with an atomization agent containing one or more compounds selected from the group consisting of benzaldehyde, 1-naphthaldehyde, 1-naphthoic acid, 1-acetonaphthone, DL-1-(1-naphthyl)ethylamine, and benzylideneacetone. This atomization agent replenishing liquid for a plating solution comprises a phenyl glycol-based surfactant, the atomization agent, and water, where the atomization agent content is in the range from 0.1 g/L to 10.0 g/L, the phenyl glycol-based surfactant content is in the range from 5 g/L to 50 g/L, and the alcohol content is less than 1 mass%.
This silicon member includes a plurality of plate-shaped members consisting of a Si-containing material, the plate-shaped members are bonded in a thickness direction, a bonding layer is formed between the plate-shaped members, and an area ratio of Si phases in the bonding layer is 12% or less. An aspect ratio of the Si phase in the bonding layer is preferably 3.0 or less.
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C22C 21/02 - Alliages à base d'aluminium avec le silicium comme second constituant majeur
33.
METHOD FOR BONDING CU PILLARS, AND METHOD FOR MANUFACTURING CU PILLAR BONDED BODY
This method for bonding Cu pillars includes a Cu particle layer forming step for forming a Cu particle layer composed of a plurality of Cu particles on one or both of a bonding surface of a first Cu pillar and a bonding surface of a second Cu pillar, a stacking step for stacking the first Cu pillar and the second Cu pillar on one another with the Cu particle layer interposed therebetween, and a bonding step for heating the stacked first Cu pillar and second Cu pillar while applying pressure thereto in the stacking direction, to perform solid phase diffusion bonding of the first Cu pillar and the second Cu pillar, wherein, in the bonding step, a deformation amount L (μm), in the stacking direction, before and after bonding satisfies the relationship L≥1.4 μm, and the deformation amount L and a bonding surface area A (μm2) of the first Cu pillar and the second Cu pillar satisfy the relationship L/A≥0.0025.
B23K 20/00 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a drill (10) having a body (1) extending in the axial direction around a central axis (O). The body (1) includes: chip discharge grooves (4) that open in a leading end face (3) and an outer peripheral surface (8) of the body (1) and that extend from the leading end face (3) to the trailing end side; recessed thinnings (5) that are disposed at the distal end of the body (1) and that are continuous with the chip discharge grooves (4) and the leading end face (3); and cutting edges (7) that are disposed at the distal end of the body (1). The cutting edges (7) have thinning edges (70) that are disposed at the radially inner ends of the cutting edges (7). The thinning edges (70) have curved concave-curved edges (71) that are continuous with ridge lines (6) at which the thinnings (5) and the leading end face (3) meet and that are recessed toward the side opposite to the drill rotation direction (T) about the central axis (O).
This acidic electrolytic copper plating solution is characterized by comprising a soluble copper salt, an azole compound, a carboxylic acid, water, and an acid, the azole compound content being 5-100 mmol/L, and the carboxylic acid content being 5-500 mg/L.
This drill (10) is provided with a body (1) extending axially centered on the center axis (O) of the body. The body (1) has: chip discharge grooves (4) that opens onto a tip-end face (3) and an outer peripheral surface (8) of the body (1), and that extends from the tip-end face (3) toward the rear end; thinnings (5) in the form of recesses disposed at the tip-end portion of the body (1) and connected to the chip discharge grooves (4) and the tip-end face (3); and cutting edges (7) disposed at the tip-end portion of the body (1). The cutting edges (7) have a thinning edge (70) disposed at a radially inner end portion of the cutting edges (7). Ridge lines (6) connecting the thinnings (5) and the tip-end face (3) have a curved section (60) stretching to the thinning edge (70) and concave in the drill rotation direction (T) about the center axis (O), the curved section (60) having a radius of curvature that grows larger as heading radially outward.
In this valuable-metal-recovery method, a valuable metal composed of cobalt and/or nickel is recovered from a raw solution that contains cobalt and/or nickel and also contains copper, wherein an ion adsorption step S01 for bringing the raw solution into contact with a chelate resin having a bispicolylamine group to adsorb metals in the raw solution onto the chelate resin, and a cobalt and nickel elution step S02 for eluting the cobalt andand/or nickel adsorbed onto the chelate resin by using a sulfuric acid solution, said method further comprising a copper elution step S04 for eluting the copper adsorbed onto the chelate resin by using an aqueous ammonia solution according to the amount of copper adsorbed onto the chelate resin.
C22B 3/14 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques alcalines contenant de l'ammoniaque ou des sels d'ammonium
C22B 3/24 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques par adsorption sur des substances solides, p. ex. par extraction avec des résines solides
This base with a bonding bump is characterized in that a bonding bump having a structure in which a seed layer and a nanoporous Cu layer are laminated is formed on the surface of a base, and the seed layer is composed of a metal that is less electropositive than Cu.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
C23C 28/02 - Revêtements uniquement de matériaux métalliques
C25D 3/12 - Dépôt électrochimiqueBains utilisés à partir de solutions de nickel ou de cobalt
C25D 3/38 - Dépôt électrochimiqueBains utilisés à partir de solutions de cuivre
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A wafer-holding ring member (10) for use in a polishing device is characterized by being provided with a polishing surface (12) and by being made from a silicon material. The wafer-holding ring member is preferably made from a silicon material having a purity of 99.9999 mass % or more. The contact angle of water on the polishing surface (12) is preferably 30° or less.
Provided is a charging plug in which it is not necessary to open a hole and onto which a temperature sensor has been attached in a high heat-joining state. This charging plug is provided with: a pin-like plug body (2); a temperature sensor (3); and a metal clip member (4) having been attached to the plug body in a state in which the temperature sensor is in contact with the plug body. The plug body is provided with a pin section (2a) that is inserted into a counterpart connector and plug-in connected thereto, and a plug basal-end section (2b) provided on the basal end-side of the pin section. The clip member, with the temperature sensor being in contact with the plug basal-end section, clasps the temperature sensor between the clip member itself and the plug basal-end section, and is anchored to the plug basal-end section.
H01R 13/66 - Association structurelle avec des composants électriques incorporés
B60L 53/16 - Connecteurs, p. ex. fiches ou prises, spécialement adaptés pour recharger des véhicules électriques
G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
H01R 13/04 - Broches ou lames destinées à coopérer avec des alvéoles
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
42.
COPPER ALLOY POWDER FOR METAL AM AND METHOD FOR MANUFACTURING ADDITIVE MANUFACTURING PRODUCT
This copper alloy powder for a metal AM is used in the metal AM and includes a copper alloy containing Cr and Zr, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.
A copper alloy powder for a metal AM includes a copper alloy containing Cr, Si, and Ni, and any one or both of a CrSi-based compound containing Cr and Si and a NiSi-based compound containing Ni and Si are precipitated on a copper crystal grain boundary of a surface of a copper alloy particle constituting the copper alloy powder.
Provided is a surge protection element capable of reducing damage caused by surges and suppressing fluctuation in discharge start voltage. A surge protection element according to the present invention comprises: an insulating tube (2); a pair of sealing electrodes (3) that close off both end openings of the insulating tube and seal a discharge control gas in the interior thereof; a pair of discharge electrodes (4) in which base ends are in contact with inner surfaces of the sealing electrodes and tip ends protrude into the insulating tube and face each other; and an insulating member (5) sandwiched between tip end surfaces of the pair of discharge electrodes and accommodated inside the insulating tube. The insulating member has a columnar shape having an axial line orthogonal to an axial line of the insulating tube, and is such that groove portions (5a) extending along the axial line of the insulating member are formed in an outer circumferential surface exposed between the pair of discharge electrodes.
H01T 4/12 - Limiteurs de surtension utilisant des éclateurs ayant un intervalle simple ou plusieurs intervalles disposés en parallèle scellés hermétiquement
x1−xy1−yz1−z−mmmN (where: M is at least one selected from the group consisting of Cr, Mo, Ta, B, Si, W, and lanthanoids; on average, 0.45 ≤ z ≤ 0.65; on average, 0.01 ≤ m ≤ 0.20; and x < z < y).
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
46.
COPPER ALLOY POWDER FOR METAL AM AND METHOD FOR MANUFACTURING ADDITIVE MANUFACTURING PRODUCT
This copper alloy powder for a metal AM is formed of a copper alloy containing Cr, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
B22F 10/28 - Fusion sur lit de poudre, p. ex. fusion sélective par laser [FSL] ou fusion par faisceau d’électrons [EBM]
B22F 10/64 - Traitement de pièces ou d'articles après leur formation par des moyens thermiques
A method for manufacturing an insulated circuit board with a heat sink, the circuit board comprising a heat sink including a flat, plate-shaped top plate portion and a heat-dissipating fin, an insulation layer provided on the top plate portion side of the heat sink, and a circuit layer provided on the insulation layer, the method comprising: a material formation step for fabricating the top plate portion separately from the fin; a first bonding step in which the top plate portion is laminated on one surface side of the insulation layer, and a metal plate for the circuit layer is laminated on the other surface side of the insulation layer, followed by bonding the laminated members together; and a second bonding step in which, after the first bonding step, the fin is bonded to a surface of the top plate portion opposite to the surface bonded to the insulation layer.
The present invention is provided with: a substrate (11); a silicon oxide layer (12) formed on at least the front surface of the substrate (11); an electrode layer (13) laminated on the silicon oxide layer (12); and a PZT-based ferroelectric layer (14) laminated on the electrode layer (13). The Pb content in the silicon oxide layer (12) is 1 atom% or less. Preferably, an insulating oxide layer (15) is formed between the silicon oxide layer (12) and the electrode layer (13). Preferably, a conductive oxide layer (16) is formed between the electrode layer (13) and the PZT-based ferroelectric layer (14).
H01G 4/33 - Condensateurs à film mince ou à film épais
H10N 30/20 - Dispositifs piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique, p. ex. fonctionnant comme actionneurs ou comme vibrateurs
49.
TERMINAL MATERIAL FOR CONNECTOR, METHOD FOR MANUFACTURING SAME, AND CONNECTOR
In the present invention, a coating film is formed on a surface of a substrate made of copper or a copper alloy. The coating film comprises: a nickel layer that is composed of nickel or a nickel alloy and is formed on the surface of the substrate; a copper-tin alloy layer that is composed of an alloy of copper and tin and is formed on the nickel layer; and a tin layer that is composed of tin or a tin alloy and is formed on the copper-tin alloy layer. The average thickness of the nickel layer is 0.05 μm to 3.00 μm, the arithmetic mean peak curvature Spc of the surface of the copper-tin alloy layer is 700 mm-1to 2200 mm-1, the average thickness of the tin layer is 0.05 μm to 2.00 μm, and the average thickness of the copper-tin alloy layer is 0.15 μm to 1.55 μm.
A heat-storing thermally conductive material characterized by comprising: a heat storage material; a thermally conductive filler; and an oil-gelling agent or a two-component curable base resin.
C09K 5/06 - Substances qui subissent un changement d'état physique lors de leur utilisation le changement d'état se faisant par passage de l'état liquide à l'état solide, ou vice versa
C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
22 gas is blown into the lithium carbonate slurry so as to produce lithium bicarbonate, thereby obtaining a lithium bicarbonate solution; a first solid-liquid separation step (S53) in which calcium carbonate suspended in the lithium bicarbonate solution is separated; a purified lithium carbonate crystallization step (S54) in which the lithium bicarbonate solution after the removal of the calcium carbonate is warmed so as to decompose the lithium bicarbonate, thereby precipitating purified lithium carbonate; a second solid-liquid separation step (S55) in which the precipitated purified lithium carbonate is separated from the mother liquid; and a mother liquid returning step (S56) in which the mother liquid obtained in the second solid-liquid separation step (S55) is returned to the slurrying step (S51).
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
This method for producing lithium carbonate (S04) comprises: a first carbonation reaction step (S41) for adding a soluble carbonate compound to a lithium-containing liquid in which calcium ions are also present and heating to produce calcium carbonate; a first solid-liquid separation step (S42) for separating the calcium carbonate generated in the first carbonation reaction step (S41) and the lithium-containing liquid; a second carbonation reaction step (S43) for adding a soluble carbonate compound to the lithium-containing liquid separated in the first solid-liquid separation step (S42) and heating to produce lithium carbonate; and a second solid-liquid separation step (S44) for separating the lithium carbonate generated in the second carbonation reaction step (S43) and the mother liquor.
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
This lithium-concentrated liquid production method (S03) is characterized by comprising: a carbonation reaction step (S31) in which a soluble carbonic acid compound is added to a lithium-containing liquid having calcium ions coexisting therein to produce calcium carbonate; a solid-liquid separation step (S32) in which the calcium carbonate produced in the carbonation reaction step (S31) and the lithium-containing liquid are separated; a decarbonation step (S33) in which an inorganic acid is added to the lithium-containing liquid separated in the solid-liquid separation step (S32) and the dissolved carbonic acid compound is removed from the lithium-containing liquid as carbon dioxide gas; and a membrane separation step (S34) in which, after the decarbonation step (S33), a reverse osmosis membrane is used to obtain a lithium-concentrated liquid in which lithium ions in the lithium-containing liquid are concentrated.
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
54.
ALUMINUM POWDER PRODUCT, METHOD FOR PRODUCING SAME, AND ADDITIVE MANUFACTURED ARTICLE
This aluminum powder product has powder particle bodies made of aluminum or an aluminum alloy, and barrier layers formed on surfaces of the powder particle bodies. An oxygen content in the aluminum powder product is 0.5 mass % or less, and in a case where a test, in which a mixture obtained by mixing the aluminum powder product and pure water at a mass ratio of 1:100 is held at 80° C. for 12 hours, is performed, no aluminum hydroxide phase is formed on a surface of the aluminum powder product after the test.
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Providing technical advice relating to the selection of
cutting tools; providing technical advice relating to the
selection of metalworking machines and tools; technological
consultancy services relating to the selection and usage of
metalworking machines and tools; providing on-line
non-downloadable computer software for the selection of
tools and power tools for machine tools; providing on-line
non-downloadable computer software for the selection of
cutting tools for machine tools; software as a service
[SaaS]; providing online non-downloadable computer software.
56.
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THERMALLY CONDUCTIVE POLYMER COMPOSITION, AND THERMALLY CONDUCTIVE POLYMER
The thermally conductive polymer composition contains a liquid rubber having two or more hydroxyl groups in one molecule, a solvent having one or more hydroxyl groups in one molecule, a curing agent having, in one molecule, two or more functional groups which are reactive with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent, and a filler having thermal conductivity.
C08G 18/28 - Polymérisats d'isocyanates ou d'isothiocyanates avec des composés contenant des hydrogènes actifs caractérisés par l'emploi de composés spécifiés contenant un hydrogène actif
This method for leaching an electrode material is a method for subjecting an electrode material of a lithium ion secondary battery to acid leaching, the method including a leaching step of reacting the electrode material of a lithium ion secondary battery with sulfuric acid to obtain a leachate in which metals contained in the electrode material are leached, in which the leaching step includes a sulfuric acid adding step of adding the sulfuric acid to the electrode material to obtain a sulfuric acid-added electrode material, a kneading step of kneading the sulfuric acid-added electrode material to form a leaching paste, and a diluting step of diluting the leaching paste with water.
C22B 1/248 - AgglutinationBriquetage de déchets métalliques ou d'alliages cokéfiés
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
A thermally conductive filler includes: coarse inorganic particles; and the small inorganic particles, wherein the coarse inorganic particles includes large fused alumina particles having an average particle size in the range of 20 μm or more and 50 μm or less and the medium inorganic particles having an average particle size in the range of 1.0 μm or more and 10 μm or less, in a mass ratio of 60:40 to 100:0, the small inorganic particles have an average particle size of 0.1 μm or more and less than 1.0 μm, and a content of the small inorganic particles is in a range of 15% by mass or more and 30% by mass or less.
A turning tool according to the present invention includes a tool main body that extends along a tool axis (J) and that has a base at a tip portion on one side in an axial direction (Dj) along the tool axis (J), a cutting insert detachably attached to the base, and a camera provided in the tool main body and configured to image a machined surface of a work material cut by the cutting insert, in which the camera is disposed to image an outer side in a radial direction (Dr) of the tool main body intersecting with the axial direction (Dj).
B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p. ex. pouvant être fixés par des brides
A cutting tool includes a lower layer having an average thickness At from 0.3 μm to 6.0 μm and an upper layer having an average thickness Bt from 0.1 to 3.0 μm, and 2.0≤At/Bt≤5.0; the lower layer includes an alternating laminate of A1α sublayers with an average thickness αt and A1β sublayers with an average thickness βt, and 0.5 nm≤αt≤4.0 nm, 0.5 nm≤βt≤4.0 nm, and 0.7≤βt/αt≤1.3; the A1α sublayers each have a composition AlxTi1-xN (the average xavg of x is 0.35≤xavg≤0.55); the A1β sublayers each have a composition AlyTi1-yN (average yavg of y is 0.60≤yavg≤0.80); 1.2≤yavg/xavg; and the upper layer has a composition AlaTi1-a-bSibN (average values of aavg and bavg are represented by 0.35≤aavg≤0.60 and 0.00
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C22C 29/00 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
C25D 9/12 - Revêtement électrolytique autrement qu'avec des métaux avec des matières inorganiques par des procédés cathodiques sur les métaux légers
61.
RESIN COMPOSITION, RESIN MOLDED BODY, AND METHOD FOR PRODUCING RESIN COMPOSITION
A resin composition includes a thermoplastic resin; a carbon fiber; and a silane coupling agent, in which a content of the thermoplastic resin is within a range of 59 parts by mass or more and 88 parts by mass or less, a content of the carbon fiber is within a range of 1 part by mass or more and 18 parts by mass or less, and a content of the silane coupling agent is within a range of 0.3 parts by mass or more and 7 parts by mass or less, with respect to a total of 100 parts by mass of the resin composition, and the carbon fiber is an isotropic pitch-based carbon fiber.
This heat transfer member is a heat transfer member constituted of a fired body of a molded object including a fluorine-based resin or a fluorine-based elastomer, in which a hardness measured using a type AM durometer conforming to JIS K 6253-3:2012 is lower by 7 or greater than a hardness of the molded object. This heat transfer member has a high plasma resistance and can maintain a high state of adhesion with respect to various members over a long period of time.
A surface coated cutting tool includes a substrate and a coating layer. The coating layer includes a complex carbonitride layer. The complex carbonitride layer has an average thickness of 1.0 μm or more and 20.0 μm or less. The complex carbonitride layer includes NaCl-type face-centered cubic crystal grains, each containing: metal components Ti, V, Zr, and Nb in atomic fractions a1, a2, a3, and a4, respectively, where the total atomic fraction of the metal components in the layer is 1; non-metallic components C and N in atomic fractions b1 and b2, respectively, where the total atomic fraction of the non-metallic components is 1; and inevitable impurities. The atomic fractions a1, a2, a3, a4, b1, and b2 satisfy the relations:
A surface coated cutting tool includes a substrate and a coating layer. The coating layer includes a complex carbonitride layer. The complex carbonitride layer has an average thickness of 1.0 μm or more and 20.0 μm or less. The complex carbonitride layer includes NaCl-type face-centered cubic crystal grains, each containing: metal components Ti, V, Zr, and Nb in atomic fractions a1, a2, a3, and a4, respectively, where the total atomic fraction of the metal components in the layer is 1; non-metallic components C and N in atomic fractions b1 and b2, respectively, where the total atomic fraction of the non-metallic components is 1; and inevitable impurities. The atomic fractions a1, a2, a3, a4, b1, and b2 satisfy the relations:
0.01
≤
a
1
≤
0.6
,
0.01
≤
a
2
≤
0.6
,
0.01
≤
a
3
≤
0.6
,
0.01
≤
a
4
≤
0.6
,
0.2
≤
b
1
≤
0.8
,
and
0.2
≤
b
2
≤
0.8
.
A copper alloy catalyst according to the present invention is characterized by being composed of a bulk material of a copper alloy which contains one or more kinds of alloy elements that are selected from among Zn, Al, Ca, Mg, Ni, Si, Mn, In, Fe, Co, Ag, and Sn, and which has a Cu content of 50 atom% or more. The copper alloy catalyst is also characterized in that if a droplet of ion exchange water is dropped on the surface of the bulk material, the contact angle measured by a θ/2 method is 95° or more.
B01J 23/80 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer en combinaison avec des métaux, oxydes ou hydroxydes prévus dans les groupes avec du zinc, du cadmium ou du mercure
B01J 23/78 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer en combinaison avec des métaux, oxydes ou hydroxydes prévus dans les groupes avec des métaux alcalins ou alcalino-terreux ou du béryllium
B01J 23/89 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer combinés à des métaux nobles
B01J 23/825 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer en combinaison avec des métaux, oxydes ou hydroxydes prévus dans les groupes avec du gallium, de l'indium ou du thallium
B01J 23/835 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer en combinaison avec des métaux, oxydes ou hydroxydes prévus dans les groupes avec du germanium, de l'étain ou du plomb
C07C 29/154 - Préparation de composés comportant des groupes hydroxyle ou O-métal liés à un atome de carbone ne faisant pas partie d'un cycle aromatique à six chaînons par réduction exclusivement des oxydes de carbone avec de l'hydrogène ou des gaz contenant de l'hydrogène caractérisée par le catalyseur utilisé contenant du cuivre, de l'argent, de l'or ou leurs composés
C07C 29/156 - Préparation de composés comportant des groupes hydroxyle ou O-métal liés à un atome de carbone ne faisant pas partie d'un cycle aromatique à six chaînons par réduction exclusivement des oxydes de carbone avec de l'hydrogène ou des gaz contenant de l'hydrogène caractérisée par le catalyseur utilisé contenant des métaux du groupe du fer, des métaux du groupe du platine, ou leurs composés
C22C 9/01 - Alliages à base de cuivre avec l'aluminium comme second constituant majeur
C22C 9/02 - Alliages à base de cuivre avec l'étain comme second constituant majeur
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22C 9/05 - Alliages à base de cuivre avec le manganèse comme second constituant majeur
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
C22C 9/10 - Alliages à base de cuivre avec le silicium comme second constituant majeur
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C25B 3/07 - Composés contenant au moins un atome d’oxygène
C25B 9/00 - Cellules ou assemblages de cellulesÉléments de structure des cellulesAssemblages d'éléments de structure, p. ex. assemblages d'électrode-diaphragmeCaractéristiques des cellules relatives aux procédés
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Kobayashi Keigo
Kato Jun
Hirayama Yusuke
Liu Zheng
Takagi Kenta
Abrégé
This powder for sintering contains: a primary powder composed of aluminum or an aluminum alloy; and an oxide of at least one rare earth metal element selected from scandium, yttrium, and lanthanoid elements. This powder (1) for sintering is composed of a mixed powder having: particles (2) of a primary powder composed of aluminum or an aluminum alloy; and additive particles (3) composed of an oxide of at least one rare earth metal element selected from scandium, yttrium, and lanthanoid elements, wherein at least some of the additive particles (3) may adhere to the surface of the particles (2) of the primary powder.
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/12 - Poudres métalliques contenant des particules non métalliques
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
C22C 1/04 - Fabrication des alliages non ferreux par métallurgie des poudres
66.
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THERMALLY CONDUCTIVE POLYMER COMPOSITION, THERMALLY CONDUCTIVE POLYMER
The thermally conductive polymer composition includes: a liquid rubber having two or more hydroxyl groups in one molecule; a solvent having one or more hydroxyl groups per molecule; a curing agent having two or more functional groups capable of reacting with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent in one molecule; and a filler, wherein a compression modulus of a cured thermally conductive polymer at room temperature is 4.5N/mm2 or more and 5.5N/mm2 or less, the cured thermally conductive polymer being obtained after mixing the thermally conductive polymer composition and then allowing the thermally conductive polymer composition that is mixed to stand in an atmosphere at 25° C. for 24 hours or more.
In an aluminum powder product for metal additive manufacturing, a purity of aluminum in the entire powder is 98 mass % or more, 0.01 mass % or more and 0.5 mass % or less of Mg is contained, and a ratio Mg amount/oxygen amount of a contained amount of Mg (mass %) to a contained amount of oxygen (mass %) is 0.1 or more and 2.0 or less.
A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.
Provided is a porous Cu member which comprises: a member main body (11) that is formed of Cu or a Cu alloy and has a porous structure; and a nano-Cu structure layer (16) that is formed on at least a part of the surface of the member main body (11). The member main body (11) has a porosity in the range of 38% to 95% inclusive and a thickness in the range of 0.1 mm to 1.0 mm inclusive. The nano-Cu structure layer (16) is configured as a layer by laminating Cu particles, which have an average length of 20 µm to 1 nm, on the surface.
A heatsink-integrated insulated circuit board includes a heatsink, an insulation layer formed on a top plate part of the heatsink, and a circuit layer formed on a surface of the insulation layer opposite to the heatsink, in which an electronic component is mounted on a mounting surface of the circuit layer. The circuit layer is made of copper or a copper alloy, and when a component occupancy ratio, which is a ratio of an occupied area of the electronic component to an area of the mounting surface of the circuit layer, is defined as X and a ratio λR/tR of a thermal conductivity λR of the insulation layer to a thickness tR of the insulation layer is defined as Y, in a range in which the component occupancy ratio X is 0.6 or less, a thickness tC of the circuit layer is set within a range of 0.7×(−5X−0.005Y+4.5)≤tC≤1.3×(−5X−0.005Y+4.5).
A method for processing a lithium ion secondary battery includes: a crushing and sorting step (S02) of crushing and classifying a lithium ion secondary battery to obtain an electrode material containing at least lithium; a leaching step (S03) of immersing the electrode material in an acid to obtain a leachate; a pH adjustment step (S04) of adding lithium hydroxide to the leachate to adjust a pH; a metal recovery step (S05) of recovering a metal other than lithium in the leachate to obtain a lithium-containing liquid; and a lithium hydroxide recovery step (S06) of recovering lithium in the lithium-containing liquid as lithium hydroxide, in which the lithium hydroxide recovered in the lithium hydroxide recovery step (S06) is used in the pH adjustment step (S04).
The surface coated cutting tool has the same multiple cutting edges. The coating layer of the flank face has a composition represented by (AlxTi1-x) (CyN1-y) (the average content xavg of x is 0.60 to 0.95 and the average content yavg of y's is 0.0000 to 0.0050); the crystal grains in each flank face have an average value I(200) of 200 diffraction intensities and a standard deviation σI(200), where the σI(200)/I(200) is 0.00 to 0.20; the average value Lavg and standard deviation σL of the thicknesses Lm's of the coating layer on a line 100 μm away from the ridge of each cutting edge in the direction of the flank face is within a σL/Lavg of 0.00 to 0.20; and the coating layer on each flank face has a region containing variable amounts of Al and Ti, and the difference between the maximum xmax and the minimum xmin is 0.02 to 0.40.
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
74.
THERMOPLASTIC ELASTOMER COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND HEAT-DISSIPATING STRUCTURE
The thermoplastic elastomer composition contains a base polymer containing a styrene-based thermoplastic elastomer and an ethylene-propylene-based rubber, and a thermally conductive filler, in which the thermoplastic elastomer composition contains 200 parts by mass or more and 4,000 parts by mass or less of the thermally conductive filler with respect to 100 parts by mass of the base polymer.
Provided is a catalyst for hydrogen generation comprising a mixture of tungsten carbide and cobalt, the catalyst for hydrogen generation being characterized in that the absolute value of the cathode current per mg of the catalyst is 0.10 mA/mg or more when the catalyst for hydrogen generation is loaded on a glassy carbon electrode and subjected to potential scanning at -1.2 V with respect to a silver/silver chloride reference electrode under nitrogen bubbling in a 1 mol/L sodium hydroxide aqueous solution.
B01J 35/70 - Catalyseurs caractérisés par leur forme ou leurs propriétés physiques, en général caractérisés par leurs propriétés cristallines, p. ex. semi-cristallines
C25B 11/091 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’au moins un élément catalytique et d’au moins un composé catalytiqueÉlectrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé de plusieurs éléments catalytiques ou composés catalytiques
76.
LITHIUM SULFIDE AND METHOD FOR MANUFACTURING SULFIDE SOLID ELECTROLYTE
The purpose of the present invention is to provide: lithium sulfide that has sufficiently high purity and is particularly suitable as a feedstock for a sulfide solid electrolyte; and a method, for manufacturing a sulfide solid electrolyte, that uses this lithium sulfide. The present invention pertains to: lithium sulfide characterized in that the L*value (brightness) as defined in the L*a*b* color space is 85 or more; and a method for manufacturing a sulfide solid electrolyte, the method being characterized in that the aforementioned lithium sulfide is used as a feedstock.
Provided is a sulfide solid electrolyte that is characterized by having an LGPS type crystal structure belonging to the space group P42/nmc, and is characterized in that the half value width of a peak of 2θ=29.58°±1.0° is 0.1 or less in an X-ray diffraction measurement using CuKα rays.
H01B 1/10 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques sulfures
C01B 25/14 - Composés de phosphore et de soufre, sélénium ou tellure
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
78.
DIMENSION MEASUREMENT DEVICE, CUTTING TOOL SYSTEM, AND DIMENSION MEASUREMENT METHOD
This dimension measurement device comprises a sensor unit (3) and a measurement device body (100). The sensor unit (3) includes a first distance sensor (31) that uses an eddy current sensor, and a signal conversion unit (35A, 35B) that outputs, as a detection value, an output signal from the distance sensor for each preset time interval. The measurement device body (100) is provided with: a detection control unit (101) that causes the sensor unit (3) to detect the distance to a material being cut while rotating the material being cut; an acquisition unit (103) that acquires a plurality of detection values outputted from the sensor unit (3) for each time interval within a preset stipulated time; a calculation unit (105) that calculates the average value of the plurality of detection values acquired by the acquisition unit (103); and a result output unit (107) that outputs a measurement result for the material being cut, the measurement result being based on the average value of the detection values that was calculated by the calculation unit (105).
B23Q 17/20 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer les caractéristiques de la pièce, p. ex. contour, dimensions, dureté
Provided is a copper-clad laminate (10) in which a base material (11) containing a fluororesin and a metal copper layer (12) are laminated, the copper-clad laminate (10) being characterized in that: an alloy layer (13) is formed between the base material (11) and the metal copper layer (12), the alloy layer (13) being composed of 25.0-75.0 at% Co, with the balance being Mo and unavoidable impurities; and the metal copper layer (12) has a copper plating layer.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
80.
METHOD FOR MANUFACTURING COPPER ALLOY POWDER FOR METAL AM
A method for manufacturing a copper alloy powder for a metal AM includes a casting step of manufacturing a copper alloy ingot with a casting apparatus including a molten copper supply unit which melts a copper raw material consisting of high-purity copper having a purity of 99.99 mass % or more to obtain molten copper, an addition unit which adds alloy elements of a copper alloy to the molten copper, and a mold to which the molten copper alloy is supplied, and an atomizing treatment step of powdering the copper alloy ingot by performing melting and decomposing by an atomizing treatment in an inert gas or a vacuum atmosphere using the copper alloy ingot, in which the O concentration of the copper alloy ingot is set to 10 mass ppm or less, and the H concentration of the copper alloy ingot is set to 5 mass ppm or less.
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
C22C 1/02 - Fabrication des alliages non ferreux par fusion
COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL APPARATUS, COMPONENT FOR FLEXIBLE DEVICE, COMPONENT FOR HEAT DISSIPATION, AND METAL SEALING MATERIAL
Provided is a copper alloy having a composition containing 15 to 57 mass% of Zn, containing 12 mass% or less of Al, and having a Zn content of A mass% and an Al content of B mass% where A + 5 × B ≥ 30 and A + 3.5 × B ≤ 57 are satisfied, with the balance being Cu and unavoidable impurities. The copper alloy has a β-phase volume fraction of 50% or greater, the average value of Kernel average misorientation (KAM) values of the β phase is 2.0° or less, said average value having been obtained by measuring a measurement area of 1 mm2 or greater using an EBSD method at measurement intervals of 1-μm steps and excluding measurement points at which a CI value obtained by being analyzed using data analysis software OIM is 0.1 or less. The copper alloy has excellent conductivity, a low Young's modulus, and a sufficiently large elastic deformation amount, and is not likely to plastically deform even when subjected to significant deformation.
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22C 18/02 - Alliages à base de zinc avec le cuivre comme second constituant majeur
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/16 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des autres métaux ou de leurs alliages
82.
COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COMPONENT FOR FLEXIBLE DEVICE, HEAT DISSIPATION COMPONENT, AND METAL SEALING MATERIAL
A copper alloy according to the present invention has a composition comprising 15-57 mass% of Zn and 12 mass% or less of Al, with the remainder being Cu and inevitable impurities, and when the content of Zn is denoted by A mass% and the content of Al is denoted by B mass%, the composition satisfies A+5×B ≥ 30 and A+3.5×B ≤ 57. A volume fraction of a β-phase is 50% or more, and when a measurement area of 8 mm2 or more is measured at a measurement interval of 8 μm steps by an EBSD method and analyzed except at measurement points at which an CI value analyzed by data analysis software OIM is 0.1 or less, and a boundary between measurement points at which an orientation difference between adjacent measurement points is 5º or greater is defined as a crystal grain boundary, the ratio of each corresponding grain boundary length of 3 ≤ Σ ≤ 29 to all crystal grain boundary lengths L where the measured β-phases contact each other is 4% or more. The copper alloy has excellent conductivity, has a low Young's modulus and a sufficiently large elastic deformation amount, and does not easily undergo plastic deformation even when subjected to large deformation.
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22C 18/02 - Alliages à base de zinc avec le cuivre comme second constituant majeur
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/16 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des autres métaux ou de leurs alliages
In this drill, a cutting blade (7) has a thinning blade (70) that is disposed at a radial inner end part of the cutting blade (7), and a main cutting blade (71) that is disposed on the radially outer side of the thinning blade (70) and that is connected to a leading edge (12) via an outer peripheral corner (15), the main cutting blade (71) and the leading edge (12) having honing in which a cross section perpendicular to ridge line parts has a convex curve shape, the honing curvature radius at a position within 1.5 mm from the outer peripheral corner (15) toward the rear end side of the leading edge (12) being 25-80 μm, and being smaller than the honing curvature radius of a radial outer end part connected to the outer peripheral corner (15) of the main cutting blade (71).
In a drill according to the present invention, a thinning blade, a main cutting blade, and a leading edge each have honing (H) where a cross section perpendicular to each ridge line part is formed in a convex curved shape. In this cross section, among both end parts (h1) and (h2) of the honing H, a surface connected to the first end part (h1) is defined as a first surface (101), a surface connected to the second end part (h2) is defined as a second surface (102), the distance to the first end part h1 from an intersection point P of an extension line of the first surface (101) and an extension line of the second surface (102) is defined as a first width dimension (L1), the distance to the second end part h2 from the intersection point P is defined as a second width dimension (L2), and [L1/L2] is defined as a width ratio. The thinning blade and the main cutting blade each have the first surface (101) as a rake face, and the second surface (102) as a flank face, and the width ratio of the thinning blade is larger than the width ratio of a radial outer end part connected to an outer peripheral corner of the main cutting blade.
This Cu-Zn-Si-Pb-P-based alloy continuous cast wire rod material comprises more than 60.0 mass% but less than 65.0 mass% of Cu, Si in the range of 0.40 mass% to 1.20 mass% inclusive, Pb in the range of 0.002 mass% to 0.250 mass% inclusive, and P in the range of 0.040 mass% to 0.190 mass% inclusive, and comprises, as an optional element, 0.001 mass% to 0.100 mass% inclusive of Bi, with the balance being Zn and impurities, wherein: the total content of Fe, Mn, Co, and Cr, which are impurities, is 0.450 mass% or less; the total content of Sn and Al is 0.30 mass% or less; and in a cross section perpendicular to the casting direction, the area ratio between the α phase and the β phase is α:β = 40 to 70:60 to 30, the area ratio of the γ phase is 0.1% or less, and the area ratio of a fine α phase in which the particle diameter is 10 μm or less is 30% to 60% inclusive.
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
B22D 11/00 - Coulée continue des métaux, c.-à-d. en longueur indéfinie
B22D 11/04 - Coulée continue des métaux, c.-à-d. en longueur indéfinie dans des moules sans fond
B23B 1/00 - Méthodes de tournage ou méthodes de travail impliquant l'utilisation de toursUtilisation d'équipements auxiliaires en relation avec ces méthodes
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Providing technical advice relating to the selection of cutting tools; providing technical advice relating to the selection of metalworking machines and tools; technological consultancy services relating to the selection and usage of metalworking machines and tools; providing on-line non-downloadable computer software for the selection of tools and power tools for machine tools; providing on-line non-downloadable computer software for the selection of cutting tools for machine tools; software as a service [SaaS]; providing online non-downloadable computer software.
This WC-based cemented carbide, which is suitable for a substrate of a surface-coated cutting tool or the like, contains 6.0-10.0 mass% of Co, 0.08-0.90 mass% of Cr (where the ratio Cr content (mass%)/Co content (mass%) is 10% or lower), 0.0-3.8 mass% of M (where M is one or more of V, Ta, Nb, Ti, and Zr), and 4.5-7.5 mass% of C, the balance being W and unavoidable impurities. The WC-based cemented carbide has a binder phase, a hard phase, and a γ phase, the binder phase containing Co as the main component, the hard phase containing a carbide of W as the main component, and the γ phase containing a carbide of M as the main component. In crystal particles constituting the hard phase, the grain diameter C99 (μm) for 99% cumulative particle count is 3.30 or lower, and the ratio C99/C50 (grain diameter C99 (μm) for 99% cumulative particle count to grain diameter C50 (μm) for 50% cumulative particle count) is 4.80-6.50. The proportion (L) of the phase interface length along which the hard phase and the binder phase are in contact with respect to the total phase interface length of the hard phase is 35% or greater.
C22C 29/08 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p. ex. cermets, ou d'autres composés métalliques, p. ex. oxynitrures, sulfures à base de carbures ou de carbonitrures à base de carbures mais ne contenant pas d'autres composés métalliques à base de carbure de tungstène
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
C22C 27/04 - Alliages à base de tungstène ou de molybdène
A surface-coated cutting tool includes a substrate and a coating layer provided on the substrate, wherein
1) the coating layer includes an alternating layer of A sublayers and B sublayers,
2) the A sublayers are each A Al1-aTiaN (where 0.30≤a≤0.70),
3) the B sublayers are each Cr1-cM2cN (where M2 is B and/or Si, where 0.01≤c≤0.40),
4) the A and B sublayers each have an average thickness of 1 nm or more and 500 nm or less, and
5) the alternating layer has an average thickness of 0.3 μm or more and 7.0 μm or less,
6) the adjoining A and B sublayers satisfy the relation: 0.1≤TA/TB≤0.8 or 1.2≤TA/TB≤10.0, where TA is the average thickness of the A sublayers and TB is the average thicknesses of the B sublayers.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
Performance is improved. There is provided a negative electrode material for a battery, in which the negative electrode material includes carbon, sodium tungstate, and silicon particles 33 including silicon, and in the silicon particle 33, a ratio of the amount of Si in Si2p derived from elemental silicon to the amount of Si in Si2p derived from SiO2 in a surface layer when measured by X-ray photoelectron spectroscopy is 3 or more on an atomic concentration basis.
A copper/ceramic bonded body (10) formed by bonding copper member (12, 13) and a ceramic member (11), wherein the copper member has a Cu content of at least 99.96 mass%, and the ratio C/D is 0.93-1.05, where C is the proportion of KAM values of 0.25° or less in a measurement field of view arranged around a grain boundary triple point, and D is the proportion of KAM values of 0.25° or less within grains on the basis of the observation of a cross section of the copper member along a thickness direction after 3000 cycles of a thermal cycle test including holding at -65°C for 5 minutes and then holding at 150°C for 5 minutes in a liquid bath per cycle.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
91.
COPPER/CERAMIC JOINED BODY AND INSULATING CIRCUIT BOARD
This copper/ceramic joined body is obtained by joining a copper member and a ceramic member. The copper member has a Cu content of at least 99.96 mass%, and has, in a cross section along the thickness direction of the copper member, an average crystal grain size of at most 100 μm after performing 3000 cycles of a heat cycle test in which the copper member is, in a liquid tank, held at -65°C for 5 minutes and then held at 150°C for 5 minutes in a single cycle.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
A hafnium compound-containing sol-gel liquid contains an alcohol as a solvent and a hafnium compound as a hafnia source, in which the hafnium compound-containing sol-gel liquid contains one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, a mass ratio WM/WHf of a content WM of the elements M to a content WHf of Hf as a metal component is within a range of 0.2% or more and 5.0% or less. A hafnia-containing film containing hafnia (HfO2) and one or two or more elements M selected from the group consisting of Zr, Ti, and Nb, and in which a mass ratio WM/WHfO2 of a content WM of the elements M to a content WHfO2 of the HfO2 is within a range of 0.05% or more and 5.0% or less.
B01J 13/00 - Chimie des colloïdes, p. ex. production de substances colloïdales ou de leurs solutions, non prévue ailleursFabrication de microcapsules ou de microbilles
This method for separating cobalt and nickel includes a step (S3) of immersing an electrode material of a lithium ion secondary battery in a treatment liquid containing sulfuric acid and hydrogen peroxide to obtain a leachate, a step (S4) of adding a hydrogen sulfide compound to the leachate to precipitate copper, either one of a first treatment step (S5A) or a second treatment step (S5B), a step (S6) of obtaining a precipitate substance containing cobalt sulfide and nickel sulfide and a residual liquid containing lithium, and a re-dissolution step (S7) of dissolving cobalt and nickel in a suspension obtained by suspending the precipitate substance in distilled water or dilute sulfuric acid, in which, in the re-dissolution step (S7), the suspension is bubbled with an oxidizing gas containing oxygen using a fine-bubble generation apparatus.
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/26 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par extraction liquide-liquide utilisant des composés organiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
94.
TIN OXIDE PARTICLE DISPERSION AND METHOD FOR PRODUCING TIN OXIDE PARTICLE LAMINATED FILM
Provided are: a tin oxide particle dispersion in which tin oxide particles are dispersed in a solvent, from which it is possible to form a tin oxide particle laminated film having excellent conductivity as a result of the tin oxide particles being arranged uniformly, and which is characterized by having a zeta potential of -35 mV or less at pH 10; and a method for producing a tin oxide particle laminated film. The tin oxide particles may be doped with a different element. The different element is preferably one or more selected from antimony, fluorine, and phosphorus. The primary particle size of the tin oxide particles is preferably in the range of 1.5-100 nm.
In the present invention, the following steps are carried out: a leaching step S01 in which a lithium-containing substance is immersed in an acidic solution to leach lithium into the acidic solution, thereby obtaining a lithium leachate; a heavy metal and first fluorine precipitation step S02 in which a first calcium compound is added to the lithium leachate to produce a metal hydroxide precipitate and a fluorine-containing precipitate; a first solid-liquid separation step S03 in which the precipitated metal hydroxide precipitate and fluorine-containing precipitate are removed from the lithium leachate; a second fluorine precipitation step S04 in which a second calcium compound is added to the lithium leachate from which the precipitates have been removed, to precipitate dissolved fluorine; and a second solid-liquid separation step S05 in which the precipitated dissolved fluorine and unreacted second calcium compound are removed from the lithium leachate.
C22B 3/04 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation
C22B 3/06 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques acides
C22B 3/20 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
96.
Pure copper material, insulating substrate, and electronic device
2 or more is measured by an EBSD method at a measurement interval of 1 μm, measurement points at which a CI value obtained by an analysis using data analysis software OIM is 0.1 or less are excluded, and boundaries between adjacent pixels with a misorientation of 5° or more are regarded as crystal grain boundaries, an average of local orientation spread (LOS) is 2.00° or less.
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 18/00 - Produits stratifiés composés essentiellement de céramiques, p. ex. de produits réfractaires
In a cutting insert and an edge replaceable end mill according to the present invention, a cutting blade (14) has: a main cutting blade (17) that is disposed on a first side of four sides of a quadrangular surface (11); a sub-cutting blade (18) that is disposed on a second side; and a corner blade (19). The sub-cutting blade (18) has a curved blade part (18a) that is connected to the corner blade (19), and forms a curved shape protruding toward a front side; and a linear blade part (18b) that is connected to the curved blade part (18a), and linearly extends toward a rear side as extending toward the side opposite to the curved blade part (18a) in the left-right direction. A flank (16) has: a first sub-flank (16b) that is connected to the curved blade part (18a), and forms a curved surface shape protruding toward the front side; and a planar second sub-flank (16c) that is connected to the linear blade part (18b).
Provided is an insulated circuit board in which a metal layer formed from pure aluminum is bonded to at least one surface of a ceramic substrate. In this circuit board: the pure aluminum is aluminum having a purity of 99.9%mass or more; a slip plane of metal crystal in the metal layer and the bonding interface with the ceramic substrate form an angle of 40° or less; and a second metal layer formed from any of aluminum, an aluminum alloy, copper, or a copper alloy may be bonded on the metal layer.
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/04 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
99.
Pure copper material, insulating substrate, and electronic device
This pure copper material includes Cu in an amount of 99.96 mass % or more, either one or both of one or more A-group elements selected from Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and one or more B-group elements selected from O, S, Se, and Te are included in a total amount of 10 mass ppm or more and 300 mass ppm or less, an average crystal grain size in a rolled surface is 15 μm or more, and a high-temperature Vickers hardness at 850° C. is 4.0 HV or more and 10.0 HV or less.
An adhesive structure according to the present invention is characterized in that a tube array structure (20) formed by erecting a plurality of tube bodies (21) formed from a metal oxide is formed on at least a portion of the surface of a base material that comprises an inorganic material. The adhesive structure can be stably used even in high-temperature environments and clean environments and makes it possible to achieve sufficient adhesive force. The metal oxide is preferably an aluminum oxide or a titanium oxide. The tube bodies (21) preferably have an average outer diameter D of at least 40 nm and an average height H of at least 300 nm.
