Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.
F21V 29/74 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques avec ailettes ou lames
Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.
F28F 7/00 - Éléments non couverts par les groupes , ou
F21V 29/74 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques avec ailettes ou lames
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H01R 13/717 - Association structurelle avec des composants électriques incorporés avec une source lumineuse intégrée
H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
F21Y 107/30 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur la surface extérieure de surfaces cylindriques, p. ex. de supports en forme de barre ayant une section circulaire ou polygonale
Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21Y 105/16 - Sources lumineuses planes comprenant un réseau bidimensionnel d’éléments générateurs de lumière ponctuelle caractérisées par la forme d’ensemble du réseau bidimensionnel carrée ou rectangulaire, p. ex. pour les panneaux de lumière
H01R 12/72 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
F21Y 107/30 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur la surface extérieure de surfaces cylindriques, p. ex. de supports en forme de barre ayant une section circulaire ou polygonale
6.
Solid state lighting circuit with current bias and method of controlling thereof
In an embodiment, a solid-state lighting circuit is included herein having a first plurality of emitters configured to output light of a first color and a second plurality of emitters configured to output light of a second color. The circuit further includes a current limiting circuit and at least one biasing resistor operably connected to the first plurality of emitters and the current limiting circuit. Current is biased toward the first plurality of emitters until a preselected current limit is reached for the first plurality of emitters, such that the first plurality of emitters outputs the light of the first color. When current is provided by the constant current power supply that is at or above the preselected current limit, current passes through the second plurality of emitters such that the second plurality of emitters outputs the light of the second color. Other embodiments are also included herein.
G05F 1/573 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final sensible à une condition du système ou de sa charge en plus des moyens sensibles aux écarts de la sortie du système, p. ex. courant, tension, facteur de puissance à des fins de protection avec détecteur de surintensité
H05B 45/14 - Commande de l'intensité de la lumière à l'aide d'une rétroaction électrique provenant de LED ou de modules de LED
H05B 45/10 - Commande de l'intensité de la lumière
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
F21Y 107/30 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur la surface extérieure de surfaces cylindriques, p. ex. de supports en forme de barre ayant une section circulaire ou polygonale
Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.
H01R 12/73 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
H01R 12/72 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
H01R 13/6592 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un câble blindé
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
H01R 13/717 - Association structurelle avec des composants électriques incorporés avec une source lumineuse intégrée
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
F21Y 107/30 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur la surface extérieure de surfaces cylindriques, p. ex. de supports en forme de barre ayant une section circulaire ou polygonale
23.
Flexible circuit board interconnection and methods
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
F21Y 107/30 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur la surface extérieure de surfaces cylindriques, p. ex. de supports en forme de barre ayant une section circulaire ou polygonale
24.
Circuit board having a plated through hole through a conductive pad
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
H01R 13/717 - Association structurelle avec des composants électriques incorporés avec une source lumineuse intégrée
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
F21Y 101/02 - Structure miniature, p. ex. diodes électroluminescentes (LED)
F21Y 111/00 - Sources lumineuses de forme non couverte par les groupes
25.
Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
H05K 1/14 - Association structurale de plusieurs circuits imprimés
Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
27.
Layered structure for use with high power light emitting diode systems
A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.
B32B 33/00 - Produits stratifiés caractérisés par des propriétés particulières ou des caractéristiques de surface particulières, p. ex. par des revêtements de surface particuliersProduits stratifiés conçus pour des buts particuliers non couverts par une seule autre classe
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
F21K 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
F21V 29/70 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.
H01R 12/00 - Association structurelle de plusieurs éléments de connexion électrique isolés les uns des autres, spécialement conçue pour des circuits imprimés, p. ex. des cartes de circuit imprimé [PCB], des câbles plats ou à ruban ou des structures similaires généralement planes, p. ex. barrettes de raccordement, blocs de connexionDispositifs de couplage spécialement conçus pour des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planesBornes spécialement conçues pour établir le contact avec, ou pour être insérées dans des circuits imprimés, des câbles plats ou à ruban ou des structures similaires généralement planes
In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.
