Abrégé

A highly heat-conducting and detachable polyurethane structural rubber and a preparation method therefor. The polyurethane structural rubber comprises a component A and a component B, wherein the component A contains a polyol monomer, a structure control agent, a first heat-conducting filler, a dehydrating agent, a catalyst, an inhibitor and a first auxiliary agent, and the component B contains an isocyanate monomer, a second heat-conducting filler, a dehydrating agent and a second auxiliary agent; the structure control agent is a monohydric alcohol monomer containing a nitrogen heteroatom electron donating group; the catalyst is an amine catalyst; and the inhibitor is a metal compound of group IIA to group VIA. By means of the structure control agent and the inhibitor in the polyurethane structural rubber, the detachable performance of the polyurethane structural rubber can be effectively improved on the premise of ensuring a good bonding effect of the polyurethane structural rubber, and the curing rate of the polyurethane structural rubber is controlled, so as to gain more fault-tolerant time for actual operations.

Classes IPC  ?

• C09J 175/14 - Polyuréthanes comportant des liaisons non saturées carbone-carbone
• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C08G 18/28 - Polymérisats d'isocyanates ou d'isothiocyanates avec des composés contenant des hydrogènes actifs caractérisés par l'emploi de composés spécifiés contenant un hydrogène actif
• C08G 18/42 - Polycondensats contenant des groupes ester carboxylique ou carbonique dans la chaîne principale
• C08G 18/32 - Composés polyhydroxylésPolyaminesHydroxyamines
• C08G 18/48 - Polyéthers
• C08G 18/36 - Esters hydroxylés d'acides gras supérieurs
• C08G 18/66 - Composés des groupes , ou
• C08G 18/18 - Catalyseurs contenant des amines secondaires ou tertiaires ou leurs sels

Abrégé

The present invention relates to the field of heat-conducting interface materials, and in particular relates to single-component high-thermal-conductivity silicone mud and a preparation method therefor. The single-component high-thermal-conductivity silicone mud is composed of the following components: 100 parts of silicone oil, 10-50 parts of an MQ silicone resin, and 1500-2600 parts of a high-thermal-conductivity powder. The silicone mud further comprises 0.3-10 parts of a chain extender, 0.5-5 parts of a cross-linking agent, 1-10 parts of a catalyst, 5-20 parts of a tackifier, 5-15 parts of a plasticizer, and 1-5 parts of a pigment. In the present application, by cooperating both the silicone oil and the MQ silicone resin with a heat-conducting filler and other components, the heat-conducting silicone mud, which has good plasticity, high heat conductivity, low oil permeability and low high-and-low-temperature plastic deformability, can be obtained. Moreover, by further regulating and controlling the structures of the silicone oil and the MQ resin and the reaction conditions in the preparation process, the comprehensive performance of the silicone mud is further improved.

Classes IPC  ?

• C08L 83/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
• C08L 83/04 - Polysiloxanes
• C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
• C08K 3/22 - OxydesHydroxydes de métaux
• C08K 3/38 - Composés contenant du bore
• C08K 7/18 - Sphères pleines inorganiques

Abrégé

A method for semi-quantitative determination of the anti-poisoning performance of an addition-type organosilicon potting adhesive and the use thereof. The method comprises the following steps: (S.1) preparing poisonous substance simulating reagents having different concentrations; (S.2) sequentially adding an addition-type organosilicon potting adhesive to test dishes which contain the poisonous substance simulating reagents having different proportions, so as to bring the addition-type organosilicon potting adhesive into contact with the poisonous substance simulating reagents on the premise that the addition-type organosilicon potting adhesive is not mixed with the poisonous substance simulating reagents; and (S.3) heating and curing the addition-type organosilicon potting adhesive in the test dishes, then cooling same to room temperature, stripping the cured potting adhesive from the poisonous substance simulating reagents on the bottom layers of the test dishes, and determining the anti-poisoning performance of the addition-type organosilicon potting adhesive. The determination method can semi-quantitatively determine the degree of the influence of poisonous substance simulating reagents on the curing of a potting adhesive, and can provide help and data reference for quality detection and performance comparison regarding the anti-poisoning performance of an addition-type organosilicon potting adhesive.

Classes IPC  ?

• G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes

Abrégé

The present invention relates to the technical field of heat transfer, and in particular relates to a low-volatility, high-thermal-conductivity and single-component addition-type thermal conductive cement and a preparation method therefor. The thermal conductive cement is prepared from, in parts by weight, the following raw materials: 100 parts of a vinyl-terminated polydimethylsiloxane, 700-1000 parts of a thermal conductive filler, 0-5 parts of fumed silica, 1-10 parts of a hydrogen-containing silicone oil, and 0.2-2 parts of a catalyst. The main body of the thermal conductive filler is mesoporous alumina; at least part of the surface of the mesoporous alumina is loaded with nano-copper particles, and at least part of the surface of the mesoporous alumina and nano-copper particles is coated with a silicon dioxide layer; and the surface of the silicon dioxide layer is grafted with an inhibitor containing an unsaturated functional group. By means of the preparation method of the present invention, the inhibitor containing an unsaturated functional group is grafted and introduced into the thermal conductive filler, such that the catalytic activity of a platinum catalyst at normal temperature can be effectively inhibited, thereby effectively reducing the reaction activity of the thermal conductive cement, and improving the normal-temperature storage performance thereof.

Classes IPC  ?

• C08L 83/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 11/08 - Additifs macromoléculaires
• C09J 183/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
• C09J 183/04 - Polysiloxanes

Abrégé

The present invention relates to the field of silicone potting compounds, and in particular to a thermally conductive filler, a two-component silicone potting compound comprising the thermally conductive filler, and a preparation method for the two-component silicone potting compound. The thermally conductive filler comprises mesoporous alumina. Nano-copper particles are loaded on at least part of the surface of mesoporous alumina. At least part of the surface of the mesoporous alumina and nano-copper particles is coated with a layer of silicon oxide. According to the present application, by introducing nano-copper particles and a silicon oxide coating into a thermally conductive filler, the thermal conductivity of the thermally conductive filler is effectively enhanced without affecting the electrical conductivity.

Classes IPC  ?

• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 11/08 - Additifs macromoléculaires
• C09J 183/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
• C09J 183/04 - Polysiloxanes

Abrégé

A low-stress organosilicon double-component potting compound and a preparation method therefor. The potting compound comprises a component A and a component B, wherein the component A comprises 80 parts of a base material, 15-20 parts of methyl silicone oil and 0.5-1 part of a platinum catalyst, and the component B comprises 80 parts of the base material, 15-20 parts of methyl silicone oil, 1.5-2 parts of hydrogen-containing silicone oil and 0.01-0.05 part of an inhibitor. The base material comprises 5-25 parts of mono-vinyl-terminated silicone oil, 5-15 parts of a first heat conduction filler, 20-40 parts of a second heat conduction filler, 5-15 parts of methyl silicone oil and 0.1-0.6 part of a filler treatment agent, the first heat conduction filler comprising nano-copper particles and a silicon dioxide layer coating the surfaces of the nano-copper particles. The present application uses the mono-vinyl-terminated silicone oil as a raw material, thereby effectively reducing reaction sites between the present application and hydrogen-containing silicone oil. In addition, the present application further reduces the dosages of the heat conduction fillers while ensuring the heat conduction performance of the heat conduction fillers, thereby reducing the internal stress of the organic silicon potting compound after curing of same, and further improving the fluidity thereof and reducing the hardness of same.

Classes IPC  ?

• C09J 183/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
• C09J 11/04 - Additifs non macromoléculaires inorganiques

Abrégé

The present invention relates to the field of organosilicon potting compounds, in particular to an ultra-low-density super-flame-retardant organosilicon thermal-insulating potting compound and a preparation method therefor. The potting compound consists of a component A and a component B, and the component A and the component B are filled with a modified flame-retardant light-weight filler. In the present invention, by means of combining a plurality of flame-retardant materials of different types and having different specific gravities for use according to a specific proportion, and by means of filling with the light-weight filler, the viscosity of the potting compound is controlled to be within 1000-6000 cps (25℃), thereby endowing the potting compound with good processability and facilitating construction and use; and in addition, the thermal insulating performance of the potting compound is remarkably improved, the density of the potting compound is remarkably reduced, and the potting compound is endowed with excellent flame-retardant performance. Therefore, the potting compound has great application prospects in new energy automobile lithium batteries, and can satisfy requirements such as reducing weight of automobile lithium batteries and preventing explosibility of power batteries.

Classes IPC  ?

• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 183/04 - Polysiloxanes

Abrégé

The present invention relates to the field of organic silicon, and in particular to a two-component sealant for solar photovoltaic modules and a preparation method therefor. The two-component sealant for solar photovoltaic modules comprises a component A and a component B. The component A comprises the following raw materials: α,ω-dihydroxy polydimethylsiloxane, a plasticizer, a reinforcing filler, and a divalent or higher valent metal salt; the component B comprises the following raw materials: α,ω-dihydroxy polydimethylsiloxane, a reinforcing filler, a coupling agent, a cross-linking agent, and a catalyst; the plasticizer comprises an amino acid structure or an imide structure; the cross-linking agent comprises a main chain of a branched structure; an end group of the main chain is grafted with a ketoxime group and a pyrrolidone group. Compared with traditional single-component deoximation-type sealants, the present invention realizes a higher curing speed, and effectively improves various mechanical properties of silicone sealants by means of multiple cross-linking mechanisms.

Classes IPC  ?

• C09J 183/04 - Polysiloxanes
• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C09J 11/08 - Additifs macromoléculaires
• C09J 11/06 - Additifs non macromoléculaires organiques

Abrégé

The present invention relates to the field of silicone structural sealants, and in particular to a single-component transparent silicone structural sealant for photovoltaics and a preparation method therefor. The single-component transparent silicone structural sealant for photovoltaics is composed of raw materials comprising the following components: α,ω-dihydroxypolydimethylsiloxane, fumed silica, a reinforcing resin, a silane coupling agent, a crosslinking agent, and a catalyst, wherein the reinforcing resin contains a linear polyphosphazene main chain, and a side chain containing an alkoxysilyl group is grafted on the linear polyphosphazene main chain. According to the present invention, polyphosphazene is introduced into the silicone structural sealant, so that the capabilities of resistance to aging and to acid and alkali impurities of the silicone structural sealant can be effectively improved, and the heat-resistant properties and the bonding properties are further improved, thereby meeting use requirements for photovoltaic products.

Classes IPC  ?

• C09J 183/04 - Polysiloxanes
• C09J 185/02 - Adhésifs à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant des atomes autres que le silicium, le soufre, l'azote, l'oxygène et le carboneAdhésifs à base de dérivés de tels polymères contenant du phosphore
• C09J 11/08 - Additifs macromoléculaires
• C08G 79/025 - Polyphosphazènes

Abrégé

The present invention relates to the field of silicone rubbers, and in particular relates to a dealcoholization-type room temperature vulcanized silicone rubber and a preparation method therefor. The dealcoholization-type room temperature vulcanized silicone rubber is prepared from raw materials comprising the following components: α,ω-dihydroxy polydimethylsiloxane, dimethyl silicone oil, a reinforcing filler, a cross-linking agent, a silane coupling agent, an organic tin catalyst and a co-catalyst. In the present invention, a certain amount of the co-catalyst is added to the dealcoholization-type room temperature vulcanized silicone rubber, such that the reaction activity of hydroxyl-terminated polydimethylsiloxane and the catalytic activity of the organic tin catalyst can be effectively balanced, and a viscosity peak will not be generated during the molding process of the room temperature vulcanized silicone rubber.

Classes IPC  ?

• C08L 83/04 - Polysiloxanes
• C08G 77/38 - Polysiloxanes modifiés par post-traitement chimique
• C08G 77/395 - Polysiloxanes modifiés par post-traitement chimique contenant des atomes autres que le carbone, l'hydrogène, l'oxygène ou le silicium contenant du phosphore
• C08G 77/398 - Polysiloxanes modifiés par post-traitement chimique contenant des atomes autres que le carbone, l'hydrogène, l'oxygène ou le silicium contenant du bore ou des atomes métalliques
• C08G 77/12 - Polysiloxanes contenant du silicium lié à l'hydrogène
• C08K 3/36 - Silice
• C08K 5/57 - Composés organostanniques
• C08K 5/5419 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison Si—O contenant au moins une liaison Si—C
• C08K 5/5435 - Composés contenant du silicium contenant de l'oxygène contenant de l'oxygène dans un cycle
• C08K 7/26 - Composés contenant du silicium
• C08K 3/26 - CarbonatesBicarbonates
• C08K 5/5425 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison C=C

Abrégé

The present invention relates to the field of silicone sealants, in particular to a low-toxicity single-component silicone sealant for a photovoltaic frame and a preparation method therefor. The silicone sealant is composed of raw materials comprising the following components: α,ω-dihydroxy-polydimethylsiloxane, a filler, a cross-linking agent, a silane coupling agent and a catalyst, wherein the cross-linking agent contains a linear or branched reinforced chain segment, and the side group or the end group of the reinforced chain segment contains an acetoximido group or a pentanoximido group. The silicone sealant in the present invention does not release diacetylmonoxime containing cancerogenic substances when reacting with moisture in the air, and has good applicability. In addition, the cross-linking agent of the present invention comprises a linear or branched reinforced chain segment, which can effectively improve the interaction force between adjacent cross-linking nodes in the silicone sealant, thereby effectively improving the cohesiveness and mechanical properties of the silicone sealant.

Classes IPC  ?

• C09J 183/04 - Polysiloxanes
• C09J 11/06 - Additifs non macromoléculaires organiques
• C09J 11/04 - Additifs non macromoléculaires inorganiques
• C07F 7/08 - Composés comportant une ou plusieurs liaisons C—Si
• C07F 9/53 - Oxydes des organo-phospinesSulfures des organo-phosphines