The present invention addresses the problem of providing: an etching liquid with which it is easy to maintain the original function of an etching liquid such as side etching suppression; a replenishing liquid; and a copper wire forming method which makes it easy to maintain the function of the etching liquid. As a means for solving the problem of the present invention, disclosed herein is a copper etching liquid including an acid, an oxidizing metal ion, a bromide ion, a compound having a piperazine skeleton, and an imidazole compound, wherein the compound having a piperazine skeleton is represented by general formula (1). In the formula, R1 and R2 each independently represent a hydrogen atom, an amino group-containing substituent, or a C1-10 hydrocarbon-deriving group that is not an amino group-containing substituent.
Provided is a production method for a resin film having a roughened shape on at least part of a surface of the resin film, said method comprising a transferring step for bringing a metal casting mold that has a roughened surface on at least a part of a surface thereof into contact with a resin film, thereby transferring the roughened shape of the roughened surface to the resin film, wherein the roughened surface of the metal casting mold has a root mean square slope (Sdq) of 0.14-0.99 and a developed area ratio (Sdr) of 0.094-0.4285 as measured in accordance with ISO 25178.
A cleaning agent capable of removing an organic substance and copper oxide that are attached to a copper wiring surface while suppressing etching of copper. The cleaning agent contains a water-soluble carboxylic acid and hydrogen peroxide, wherein the concentration of hydrogen peroxide is less than 0.75% by weight, and the pH of the cleaning agent is less than 2.5.
A solvent extraction method for selectively extracting cobalt from a leach liquor obtained by subjecting discarded lithium ion batteries to wet processing and containing at least cobalt and nickel, the solvent extraction method comprising: step A in which a halide salt having an amine chelate skeleton is added to the leach liquor; and step B in which neodecanoic acid is used as an extractant to thereby selectively extract cobalt from the leach liquor.
C22B 3/26 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par extraction liquide-liquide utilisant des composés organiques
The physical property value prediction method include: acquiring a prediction target image of a prediction target material; inputting the prediction target image into a prediction model machine-learned so as to receive an input of the image of the material as an explanatory variable and output the physical property value of the material, and outputting the physical property value of the material appearing in the prediction target image as a predicted value.
G06V 10/77 - Traitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source
G06V 10/774 - Génération d'ensembles de motifs de formationTraitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source méthodes de Bootstrap, p. ex. "bagging” ou “boosting”
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
G06V 20/69 - Objets microscopiques, p. ex. cellules biologiques ou pièces cellulaires
6.
PHYSICAL PROPERTY VALUE PREDICTION METHOD AND PHYSICAL PROPERTY VALUE PREDICTION SYSTEM
The physical property value prediction method include: inputting a plurality of prediction target images for each of which a measured value of the physical property value is known into a machine-learned prediction model, and outputting a predicted value and a feature map of each of the plurality of prediction target images; identifying, on a basis of prediction results from images almost identical in measured physical property value among the plurality of prediction target images, a poor prediction image and a good prediction image; and extracting a feature group representing a factor in poor prediction on a basis of a difference between a frequency distribution of a plurality of features constituting the feature map of the poor prediction image and a frequency distribution of a plurality of features constituting the feature map of the good prediction image.
G06V 10/98 - Détection ou correction d’erreurs, p. ex. en effectuant une deuxième exploration du motif ou par intervention humaineÉvaluation de la qualité des motifs acquis
G06V 10/77 - Traitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
Provided is a method for processing lithium-ion battery waste, wherein a leachate containing at least cobalt and nickel dissolved therein is obtained through a wet treatment of lithium-ion battery waste. The method comprises: a wet treatment step in which at least one compound (1) selected from the group consisting of ammonia and a salt thereof, and an amine compound and a salt thereof is added to lithium-ion battery waste and the resultant is mixed to obtain a leachate containing at least cobalt and nickel dissolved therein; and a solid-liquid separation step in which, after the wet treatment step, at least a portion of the metal that does not dissolve in the leachate is removed through solid-liquid separation.
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
B09B 3/70 - Traitement chimique, p. ex. ajustement du pH ou oxydation
B09B 3/80 - Destruction de déchets solides ou transformation de déchets solides en quelque chose d'utile ou d'inoffensif impliquant une étape d'extraction
B09B 5/00 - Opérations non couvertes par une seule autre sous-classe ou par un seul autre groupe de la présente sous-classe
C22B 3/14 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions inorganiques alcalines contenant de l'ammoniaque ou des sels d'ammonium
C22B 3/16 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés par lixiviation dans des solutions organiques
Provided is an antibacterial and antiviral treatment method for a metal member that includes a roughening treatment step that imparts antibacterial and antiviral properties to the surface of the metal member by bringing a microetching agent into contact with the surface of the metal member to form a roughened surface on the metal member. The roughening treatment step preferably has three steps: a pretreatment step, a main treatment step, and a post-treatment step. The microetching agent is preferably at least one microetching agent selected from the group consisting of an organic acid microetching agent, an inorganic acid microetching agent, an alkali microetching agent, and a hydrogen peroxide microetching agent. The metal member is preferably aluminum, an aluminum alloy, copper, or a copper alloy.
C23F 1/20 - Compositions acides pour l'aluminium ou ses alliages
A61L 2/18 - Procédés ou appareils de désinfection ou de stérilisation de matériaux ou d'objets autres que les denrées alimentaires ou les lentilles de contactAccessoires à cet effet utilisant des substances chimiques des substances liquides
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
C23F 1/34 - Compositions alcalines pour le cuivre ou ses alliages
C23F 1/36 - Compositions alcalines pour l'aluminium ou ses alliages
Provided is an antiviral treatment method for a resin member, said method comprising: a roughening treatment step for bringing a micro-etching agent into contact with a surface of a metal member and forming a roughening shape on the surface of the metal member; and a transfer step for transferring the roughening shape formed on the surface of the metal member to a surface of a resin member, thereby providing antiviral properties to the surface of the resin member. The roughening treatment step preferably has a pretreatment step, a main treatment step, and an aftertreatment step. The micro-etching agent is preferably at least one micro-etching agent selected from the group consisting of organic acid-based micro-etching agents, inorganic acid-based micro-etching agents, alkali-based micro-etching agents, and hydrogen peroxide-based micro-etching agents. The resin member is preferably a thermoplastic resin, a thermosetting resin, or a UV-curable resin.
C07F 7/18 - Composés comportant une ou plusieurs liaisons C—Si ainsi qu'une ou plusieurs liaisons C—O—Si
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 15/14 - Produits stratifiés composés essentiellement de métal adjacent à une couche fibreuse ou filamenteuse
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
The present invention addresses the problem of providing a copper etchant capable of stably maintaining smoothness after etching. As a means for solving this problem, the etchant contains hydrogen peroxide, sulfuric acid, an aromatic compound, and a chlorine ion, and the aromatic compound contains a structure in which a hydroxyl group and/or carboxyl group is bonded to a benzene ring.
A surface treatment fluid according to the present invention is an aqueous solution comprising: a water-soluble copper salt; a thio compound that has a structure in which at least one nitrogen atom and at least one sulfur atom are covalently bonded to one carbon atom; and at least one nitrogen-containing basic compound selected from a basic amino acid, a guanidine compound, and a quaternary ammonium salt. In the surface treatment fluid, the water-soluble copper salt concentration is preferably 0.05-70 mM and the thio compound concentration is preferably 0.005-20 mM. Bringing the surface treatment fluid into contact with the surface of copper makes it possible to improve the joining performance of tin.
C23C 26/00 - Revêtements non prévus par les groupes
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
13.
ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD
The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.
The present invention addresses the problem of, inter alia, providing a production method capable of the continuous production of an aluminum-resin composite that exhibits a high bonding strength, and providing a surface treatment agent that can be used in this method. Said production method comprises: a first surface treatment step for bringing a surface of an aluminum member into contact with an alkaline surface treatment agent that contains an alkali source, an amphoteric metal ion, an oxidizing agent, and a thio compound; a second surface treatment step for bringing the aluminum member surface that has gone through the first surface treatment step into contact with an acidic surface treatment agent that contains halogen ion, aluminum ion, ammonium ion, and acid, and that contains the acid at 3.0 mass% to 4.9 mass% as the acid concentration and contains the aluminum ion at 0.2 mass% to 3.8 mass%; and a bonding step for bonding a resin composition to the aluminum member surface that has gone through the second surface treatment step.
C23F 1/20 - Compositions acides pour l'aluminium ou ses alliages
C23F 1/36 - Compositions alcalines pour l'aluminium ou ses alliages
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
15.
CLEANING AGENT, CLEANING METHOD AND SUPPLEMENTARY LIQUID
The purpose of the present invention is to provide a cleaning agent which is capable of removing organic matters and copper oxide adhering to the surface of a copper wiring line, while suppressing etching of copper. The cleaning agent contains a water-soluble carboxylic acid and hydrogen peroxide, and has a concentration of the hydrogen peroxide of less than 0.75% by weight and a pH of less than 2.5. Copper oxide is able to be removed from the surface of a copper wiring line by means of the water-soluble carboxylic acid. Organic matters adhering to the surface of the copper wiring line are able to be removed by means of the hydrogen peroxide. This is considered to be possible since hydrogen peroxide and the water-soluble carboxylic acid react with each other in the cleaning agent, thereby generating a percarboxylic acid. The cleaning agent is also able to suppress etching of the copper wiring line. This is considered to be possible since the water-soluble carboxylic acid adsorbs onto the copper surface. Since the concentration of the hydrogen peroxide is less than 0.75% by weight, etching is able to be further suppressed. Since the pH is less than 2.5, more copper oxide is able to be removed.
Provided is a system whereby it becomes possible to lead an infant or a non-human animal to take action desired by a manager. The music providing system for action supporting purpose is provided with: a first database in which the correlativeness between the state of action of a target animal and a music feature parameter is recorded; a sound source storage unit in which a plurality of pieces of music information are recorded; a second database in which the music feature parameter is recorded in association with the music information; a candidate music feature parameter extraction unit for extracting a candidate music feature parameter in which the degree of correlation with a desired state of action of the target animal shows a value equal to or more than a predetermined first threshold value with reference to the first database; a candidate music extraction unit for extracting at least one piece of candidate music information having a music feature parameter in which the deviation from the candidate music feature parameter shows a value equal to or less than a predetermined second threshold value with reference to the second database; a regenerated music generation unit for generating a music for regeneration by an arithmetic processing using the candidate music information; and a music output unit for sending the music for regeneration to a speaker arranged in a zone in which the target animal is present.
In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1):
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
C22C 19/05 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel avec du chrome
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
18.
Regenerating method of removal liquid and regenerated removal liquid preliminary
A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japon)
Inventeur(s)
Akagi,masako
Hascoet,tristan
Deng,xuejia
Abrégé
This physical property value predicting method includes: acquiring a prediction target image G1 obtained by imaging a material for prediction; and inputting the prediction target image G1 into a prediction model and outputting, as a predicted value, a physical property value (Y) relating to the material appearing in the prediction target image G1, the prediction model having been subjected to machine learning to accepting input of images obtained by imaging materials, as predictor variables, and to output the physical property value (Y) relating to the material.
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
G01N 21/17 - Systèmes dans lesquels la lumière incidente est modifiée suivant les propriétés du matériau examiné
20.
PHYSICAL PROPERTY VALUE PREDICTION METHOD AND PHYSICAL PROPERTY VALUE PREDICTION SYSTEM
According to the present invention, a physical property value prediction method involves inputting a plurality of images for prediction that have known measured values for a physical property value into a prediction model 21 that has been trained by machine learning, outputting a prediction value and a feature quantity map for each of the plurality of images for prediction, using the prediction results for images that have similar measured physical property values from among the plurality of images for prediction to specify a bad prediction image G3 for which the error between measured value and prediction value is at or above a first threshold value and a good prediction image G4 for which the error between measured value and prediction value is at or below a second threshold value that is smaller than the first threshold value, and extracting a feature quantity group that represents factors for bad prediction on the basis of the difference between the frequency distribution of the plurality of feature quantities that constitute the feature quantity map for the bad prediction image G3 and the frequency distribution of the plurality of feature quantities that constitute the feature quantity map for the good prediction image G4.
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
G01N 21/17 - Systèmes dans lesquels la lumière incidente est modifiée suivant les propriétés du matériau examiné
This method includes: a first roughening step for bringing an alkaline surface roughening agent that contains 5.0-9.3 wt% (inclusive) of NaOH as hydroxide ions, 1.9-3.5 wt% (inclusive) of Zn ions, nitrate ions, and thiosulfate ions into contact with the surface of an aluminum alloy that contains 0.5-16 wt% (inclusive) of Si and 0.5-5.5 wt% (inclusive) of Cu; a second roughening step for bringing an acidic surface roughening agent that contains 2.4-4.2 wt% (inclusive) of hydrochloric acid as the acid concentration and 4.1-5.8 wt% (inclusive) of aluminum chloride as the aluminum concentration into contact with the surface of the aluminum alloy that has undergone the first roughening step; a cleansing step for ultrasonically cleansing the surface of the aluminum alloy that has undergone the second roughening step; and a bonding step for bonding a resin composition to the surface of the aluminum alloy that has undergone the cleansing step.
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29C 65/64 - Assemblage d'un élément en matière autre que plastique avec un élément en matière plastique, p. ex. à force
B29C 65/70 - Assemblage d'éléments préformésAppareils à cet effet par moulage
According to the present invention, when a printed wiring board is produced by a semi-additive method, a used remover liquid after usage for removal of a nickel/chromium-containing layer (5) is regenerated by being brought into contact with a chelating resin that has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms; and some of the hydrogen atoms may be substituted by halogen atoms.
C23F 1/46 - Régénération des compositions de décapage
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
23.
METHOD FOR REGENERATING REMOVER LIQUID, AND REGENERATED REMOVER LIQUID
This method for regenerating a remover liquid comprises: a step wherein a nickel/chromium-containing layer is removed from a substrate, which is provided with the nickel/chromium-containing layer and a copper-containing layer, with use of a remover liquid during the production of a printed wiring board by means of a semi-additive method; a step wherein the remover liquid after use is recovered; and a step wherein the remover liquid, which has been recovered in the recovery step, is brought into contact with a chelating resin. With respect to this method for regenerating a remover liquid, the chelating resin has a functional group represented by formula (1). In formula (1), a plurality of R moieties represent a same divalent hydrocarbon group having from 1 to 5 carbon atoms. Some of the hydrogen atoms in the hydrocarbon group may be substituted by halogen atoms.
C23F 1/46 - Régénération des compositions de décapage
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
24.
ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD
The present invention provides an etching agent that selectively etches a copper layer of a product to be treated in which a copper layer and a noble metal layer containing metals more noble than copper are both present. The etching agent contains: copper ions; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more endocyclic nitrogen atoms and an amino group-containing compound having eight or less carbons; polyalkylene glycol; halogen ions; 0.0005 wt% to 7 wt% of polyalkylene glycol; and 1 ppm to 250 ppm of halogen ions.
An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.
Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.
C09D 1/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de substances inorganiques
B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
This etching agent is an aqueous solution that includes hydrogen peroxide, an acid, an amino acid, and a nitrogen-containing heterocyclic compound. The acid is an inorganic acid or an organic acid other than a hydrohalic acid. The molecular weight of the amino acid is 300 or less. The nitrogen-containing heterocyclic compound is one or more selected from the group consisting of azoles, pyridines, and N-substituted morpholines. This etching agent is used to etch copper, has little change in surface shape between before and after etching, and can maintain surface smoothness even after etching.
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Katayama, Daisuke
Nakazawa, Masato
Igami, Kaori
Sugahara, Takahiro
Nakamoto, Takayuki
Miki, Takao
Uchida, Sohei
Abrégé
The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.
A microetching agent for copper, said microetching agent being used for surface roughening of copper. This microetching agent for copper is an acidic aqueous solution which contains an inorganic acid, a cupric ion source, a halide ion source and a polymer, wherein: the polymer is a water-soluble polymer that contains an amino group or a quaternary ammonium group in a side chain, while having a weight average molecular weight of 1,000 or more; if Cs (mol/L) is the molar concentration of a sulfate ion source and Ch (mol/L) is the molar concentration of the halide ion source, Cs and Ch satisfy 0 ≤ (Cs/Ch) ≤ 0.004; and the molar concentration of the halide ion source is 3.875 times the molar concentration of the cupric ion source or less.
In order to achieve a music providing system capable of controlling the behavioral state of a non-human animal using music, this music providing system for a non-human animal is provided with: a state information acquisition unit for acquiring state information relating to the motion state of an animal of interest; a state estimation processing unit for estimating the current behavioral state of the animal of interest from the state information; a target state storage unit for storing information relating to a target behavioral state for the animal of interest; a sound source storage unit for storing multiple music information pieces; a music information selection unit for detecting the degree of divergence of the current behavioral state from the target behavioral state and selecting one specific music information piece on the basis of the multiple music information pieces stored in the sound source storage unit; and a music information output unit for outputting the specific music information by wireless communication or wired communication to a speaker provided within a region in which the animal of interest is present. The music information selection unit performs the processing for selecting a different specific music information piece until the degree of divergence becomes a first threshold value or less.
Provided is a novel system capable of entertaining various animals, such as a pet animal, through sound. This sound providing system is provided with a plurality of child device speakers each including a sound data receive unit for receiving sound data in the form of a digital signal, and a parent device configured to be able to transmit to the child device speakers sound data according to a first communication scheme. The parent device is provided with a sound source storing unit in which sound data are stored, a sound data transmit unit configured to be able to transmit sound data to the child device speakers, and an output destination speaker determining unit which determines an output destination speaker at a switch timing based on speaker switch information relating to a method for switching an output destination speaker determined from sound data output destination candidates including the plurality of child device speakers. The sound data transmit unit outputs sound data selectively to the output destination speaker determined by the output destination speaker determining unit.
An adhesive composition for forming an adhesive layer on the surface of a metal for adhesion with a resin that is a thermosetting resin. This composition is an aqueous solution which contains a low-molecular-weight organic compound that has two or more nitrogen atoms in each molecule and one or more kinds of metal ions that are selected from the group consisting of trivalent aluminum ions and trivalent chromium ions, and which has a pH of 12 or less; the concentration of the low-molecular-weight organic compound is 0.01-150 g/L; and the molar concentration of the metal ions is 0.005-100 mmol/L. This adhesive composition is able to improve adhesion between a resin and the surfaces of a plurality of metals.
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C23C 24/08 - Revêtement à partir de poudres inorganiques en utilisant la chaleur ou une pression et la chaleur
33.
Microetching agent for copper, copper surface roughening method and wiring board production method
A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
Inventeur(s)
Katayama Daisuke
Nakazawa Masato
Igami Kaori
Sugahara Takahiro
Nakamoto Takayuki
Miki Takao
Uchida Sohei
Abrégé
The present invention pertains to a copper powder for 3D printing, a method for producing said copper powder, a 3D printed article, and a method for producing the 3D printed article, etc. The problem addressed is the provision of a copper powder for 3D printing which can adequately improve the mechanical strength and electroconductivity of 3D laminated articles. The means of the present invention for solving the abovementioned problem is a copper powder for 3D printing having an average particle size of 1 µm to 150 µm, containing 0.10 g/m2to 7.0 g/m2 of copper oxide per unit of surface area, and 0.5% to 9.4% by mass per unit of mass.
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/02 - Traitement particulier des poudres métalliques, p.ex. en vue de faciliter leur mise en œuvre, d'améliorer leurs propriétés; Poudres métalliques en soi, p.ex. mélanges de particules de compositions différentes comportant un enrobage des particules
B22F 3/105 - Frittage seul en utilisant un courant électrique, un rayonnement laser ou un plasma
B22F 3/16 - Compactage et frittage par des opérations successives ou répétées
The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
C09J 5/02 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un traitement préalable des surfaces à joindre
C09J 11/04 - Additifs non macromoléculaires inorganiques
C23C 22/06 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6
C23C 22/63 - Traitement du cuivre ou des alliages à base de cuivre
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
36.
Microetchant for copper and method for producing wiring board
Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
37.
Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite
The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.
C23C 22/05 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
C23C 22/18 - Orthophosphates contenant des cations du manganèse
In order to achieve a music providing system capable of controlling the behavioral state of a non-human animal using music, this music providing system for a non-human animal is provided with: a state information acquisition unit for acquiring state information relating to the motion state of an animal of interest; a state estimation processing unit for estimating the current behavioral state of the animal of interest from the state information; a target state storage unit for storing information relating to a target behavioral state for the animal of interest; a sound source storage unit for storing multiple music information pieces; a music information selection unit for detecting the degree of divergence of the current behavioral state from the target behavioral state and selecting one specific music information piece on the basis of the multiple music information pieces stored in the sound source storage unit; and a music information output unit for outputting the specific music information by wireless communication or wired communication to a speaker provided within a region in which the animal of interest is present. The music information selection unit performs the processing for selecting a different specific music information piece until the degree of divergence becomes a first threshold value or less.
This integrated molding in which a metal and a resin are attached through a primer layer is characterized in that the primer layer is formed from a primer composition containing an oxazoline group-containing polymer as a base polymer. Said integrated molding has excellent bonding strength (adhesive strength) between the metal and the resin.
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29C 65/44 - Assemblage d'un élément en matière autre que plastique chauffé avec un élément en matière plastique
B29C 65/70 - Assemblage d'éléments préformésAppareils à cet effet par moulage
40.
Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite
The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
The present invention addresses the problem of providing, inter alia, a method for producing a film formation substrate with which it is possible to adequately improve both bleeding of a resin composition and the adhesiveness between the resin composition and a metal substrate surface. A method for producing a film formation substrate in which a film of a resin composition is formed on a metal substrate surface, wherein the method for producing a film formation substrate is provided with an etching step for etching the metal substrate surface using a microetching agent, a surface treatment step for bringing a surface treatment agent into contact with the etched metal substrate surface and conducting surface treatment such that the contact angle of water on the surface is 50-150°, and a film formation step for forming a film of the resin composition by an ink jet method on the surface-treated metal substrate surface.
B05D 3/10 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par d'autres moyens chimiques
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
B05D 7/14 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers à du métal, p. ex. à des carrosseries de voiture
C09D 11/30 - Encres pour l'impression à jet d'encre
C23C 22/26 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des composés du chrome hexavalent et des composés organiques
C23C 22/52 - Traitement du cuivre ou des alliages à base de cuivre
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
42.
MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND WIRING BOARD PRODUCTION METHOD
A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of the halide ion is 0.005-0.1 moles/L. By bringing the microetching agent into contact with the surface of copper, the copper surface is roughened. An amount of 0.4 µm or less is preferred for the average amount of etching in the depth direction during roughening. This microetching agent is able to impart on copper surfaces a roughened form having excellent adhesiveness to, for example, resins even with low etching amounts.
This microetching agent contains an inorganic acid, cupric ions, halide ions, and a water-soluble cationic polymer which contains a quaternary ammonium group in a side chain, while having a weight average molecular weight of 1,000 or more. The molar concentration of the halide ions is 5 to 100 times the molar concentration of the cupric ions in this microetching agent. It is preferable that the pH of this microetching agent is 2 or less. By using this microetching agent, a copper surface is able to be provided with a roughened shape that exhibits excellent adhesion to a resin and the like even if the amount of etching is low.
This film-forming composition contains: an aromatic compound having an amino group and an aromatic ring in one molecule; and a thio compound (not including sulfur oxo-acids having a pKa of -1.9 or less and salts thereof). The pH of the film-forming composition is preferably 4-10. The thio compound is preferably one that ionizes in a solution to form anions, and thiosulfate and thiocyanate are especially preferable. By bringing the film-forming composition into contact with the surface of a metal member, a film is formed on the surface of the metal member, and a surface-treated metal member can be obtained.
C23C 26/00 - Revêtements non prévus par les groupes
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09D 201/02 - Compositions de revêtement à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
C23C 22/06 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6
C23C 22/63 - Traitement du cuivre ou des alliages à base de cuivre
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
45.
COMPOSITION FOR FORMING COATING, PRODUCTION METHOD FOR SURFACE-TREATED METAL MEMBER, AND PRODUCTION METHOD FOR METAL-RESIN COMPOSITE
This composition for forming a coating is a solution that has a pH of 4-10 and contains an aromatic compound having an amino group and an aromatic ring per molecule, a polybasic acid having two or more carboxy groups, and an oxidizer. As the oxidizer, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, an organic peroxide, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The composition for forming a coating is used to form a coating on, for example, the surface of a metal member.
C23C 22/05 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
The film-forming composition of the invention is a pH 6-9 solution including an aromatic compound having an amino group and an aromatic ring in the molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the film-forming composition is 0.05-10 times the content of aromatic compound, and the halide ion concentration is 5-600 mM. A film having excellent adhesiveness with a resin on the metal surface can be formed on the surface of a metal member by bringing the film-forming composition into contact with the surface of a metal member.
C09D 177/00 - Compositions de revêtement à base de polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions de revêtement à base de dérivés de tels polymères
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
48.
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
Provided are: a microetchant which forms roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shapes excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a process for producing a wiring board which includes a step in which a copper surface is roughened using the microetchant. The microetchant for copper of the present invention is an acidic aqueous solution containing an inorganic acid, a source of cupric ions, a source of halide ions, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetchant contain a source of sulfate ions.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemicals; industrial chemicals; surface treatment chemicals
for use in the treatment of metals; surface modification
chemicals for use in the modification of metals; etching
chemicals; chemicals for etching metals; corrosive
preparations; stripping chemicals; metal resist remover;
photoresist remover; degreasing agents for use in
manufacturing; chemicals for metal surface cleaning; metal
degreasing chemicals; soldering fluxes; brazing fluxes;
plating fluxes; surface treatment chemicals for use in the
treatment of plastics; surface modification chemicals for
use in the modification of plastics; chemicals for use in
manufacturing electronic circuit boards; chemicals used for
anti-tarnishing, plating, soldering, etching, stripping and
deterging metal surface for use in the manufacturing
processes of electronic components and electronic equipment;
chemicals used for anti-tarnishing, plating, soldering,
etching, stripping and deterging metal surface for use in
the manufacturing processes of electronic circuit boards.
50.
ETCHING SOLUTION, REPLENISHMENT SOLUTION, AND COPPER WIRING FORMATION METHOD
The present invention is a copper etching solution comprising an acid and at least one kind of compound selected from a group consisting of aliphatic noncyclic compounds, aliphatic heterocyclic compounds and hetero-aromatic compounds. The aliphatic noncyclic compounds are C2 to C10 saturated aliphatic noncyclic compounds (A) with at least two nitrogens only as hetero-atoms. Said aliphatic heterocyclic compounds are compounds (B) comprising a five- to seven-membered ring with at least one nitrogen as a hetero-atom configuring the ring. The hetero-aromatic compounds are compounds (C) comprising a hetero-aromatic six-membered ring with at least one nitrogen as a hetero-atom configuring the ring. This copper etching solution provides: an etching solution capable of limiting side-etching without reducing copper wiring linearity (wiring width (W2) of the apex of the copper wiring) and capable of limiting variation in the wiring width (W1) of the bottom of the copper wiring; a replenishment solution therefor; and a copper wiring formation method.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemicals, namely, chemicals for use in the manufacturing processes of electronic circuit boards; industrial chemicals; surface treatment chemicals for use in the treatment of metals; surface modification chemicals for use in the modification of metals; etching chemicals, namely, etching solutions for metals for use in the manufacturing processes of electronic circuit boards; chemicals for etching metals; photoresist remover; degreasing agents for use in manufacturer- chemicals for metal surface cleaning; soldering fluxes; brazing fluxes; metal degreasing chemicals, namely, degreasing solutions for metals for use in the manufacturing processes of electronic circuit boards; plating fluxes; surface treatment chemicals for use in the treatment of plastics; surface modification chemicals for use in the modification of plastics; chemicals for use in manufacturing electronic circuit boards; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic components and electronic equipment; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic circuit boards
52.
Microetching solution for copper, replenishment solution therefor and method for production of wiring board
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
C23F 1/34 - Compositions alcalines pour le cuivre ou ses alliages
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
The purpose of the present invention is to provide: an etching liquid which is capable of selectively etching titanium in the presence of copper, while having low toxicity and excellent storage stability; and an etching method which uses this etching liquid. An etching liquid according to the present invention contains: at least one acid that is selected from the group consisting of sulfuric acid, hydrochloric acid and trichloroacetic acid; and at least one organic sulfur compound that is selected from the group consisting of thioketone compounds and thioether compounds. This etching liquid is capable of selectively etching titanium in the presence of copper.
C23F 1/44 - Compositions pour enlever des matériaux métalliques d'un substrat métallique de composition différente
C23F 1/26 - Compositions acides pour les métaux réfractaires
C23G 5/032 - Nettoyage ou dégraissage des matériaux métalliques par d'autres méthodesAppareils pour le nettoyage ou le dégraissage de matériaux métalliques au moyen de solvants organiques au moyen de solvants organiques contenant des composés comportant de l'oxygène
C23G 5/036 - Nettoyage ou dégraissage des matériaux métalliques par d'autres méthodesAppareils pour le nettoyage ou le dégraissage de matériaux métalliques au moyen de solvants organiques au moyen de solvants organiques contenant des composés comportant de l'oxygène contenant aussi de l'azote
54.
WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER
The present invention relates to: a washing solution for a tin plating film, which can be used for washing in advance of the washing with water after electroless tin plating; and a method for forming a tin plating layer, which includes a step of washing with the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution contains the chloride ion at a concentration of 2% by weight or more, and also contains tin at a concentration of 0.5% by weight or less. The washing solution according to the present invention has good washing performance against the surface of a tin plating film, can maintain the properties of the tin plating film readily, has a small influence on the surface of the plating film even when used continuously, and has excellent long-term stability.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
55.
ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITE
This etching agent is obtained from an aqueous solution containing at least one kind of acid selected from a group consisting of inorganic acids other than nitric acid and organic acids, as well as an organic nitrogen compound comprising N-OH or N-O- in the molecular structure. The concentration of acid in the etching agent is 0.05-3 weight% and the concentration of the organic nitrogen compound is 0.005-5 weight%. By bringing said etching agent into contact with the surface of a magnesium component, it is possible to form fine roughening patterns on the surface of the magnesium component even when etching depth is large.
C23F 1/22 - Compositions acides pour le magnésium ou ses alliages
B29C 45/02 - Moulage par transfert, c.-à-d. en transférant par un piston le volume déterminé de matière à mouler d'une cavité de charge à une cavité de moulage
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
This etching agent for iron and steel materials is an acidic aqueous solution containing ferrous ions, ferric ions, and a water-soluble compound containing acetylene groups. When the concentration of ferrous ions in the etching agent is A wt% and the concentration of ferric ions is B wt%, the A/B value is preferably 0.1 to 2.5. This replenishing liquid is a replenishing liquid that is added to the etching agent when the etching agent is continuously or repeatedly used, and is an aqueous solution containing a water-soluble compound containing acetylene groups.
The purpose of the present invention is to provide a wiring formation method which makes it possible to minimize the side etching of a copper wiring pattern, and an etching solution to be used therein. This wiring formation method involves contacting an etching solution and one part of a copper layer (3) of a layered plate (100) obtained by layering the copper layer (3) on a substrate (1), and forming a copper wiring pattern (7) by etching the one part of the copper layer (3). The copper layer (3) has a thickness of 1.5μm or less. The etching solution is an acidic aqueous solution containing 0.1-3 wt% of a cupric ion, 0.1-30 wt% of a halide ion, and 0.05-20 wt% of polyalkylene glycol. This wiring formation method involves setting the temperature of the etching solution when etching the copper layer (3) to (T-10)°C or higher. T is the temperature at which the etching solution starts to become turbid.
Provided are the following: an etching liquid able to inhibit side etching without impairing the linearity of copper wiring; a replenishing liquid therefor; and a method for forming copper wiring. This etching liquid is an etching liquid for copper, and is an aqueous solution that contains an acid, oxidizing metal ions and a heteroaromatic compound. The heteroaromatic compound contains, in the molecule, a heteroaromatic 5-membered ring having at least one nitrogen atom as a heteroatom that constitutes the ring, and a heteroaromatic 6-membered ring having at least one nitrogen atom as a heteroatom that constitutes the ring.
Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
C23F 1/34 - Compositions alcalines pour le cuivre ou ses alliages
60.
Microetching solution for copper, replenishment solution therefor and method for production of wiring board
Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.
Provided are: an etching solution which can minimize side etching without impairing the straightness of copper wiring; a replenishing solution for the same; and a method for forming copper wiring. This etching solution is a copper-etching solution characterized in that: the etching solution consists of an aqueous solution which contains an aliphatic heterocyclic compound having a 5- to 7-membered aliphatic heterocycle that has only nitrogen as the heteroatom constituting the heterocycle, an acid, and oxidizing metal ions; and the aliphatic heterocyclic compound is at least one compound selected from among (A) aliphatic heterocyclic compounds, each of which has two or more nitrogen atoms as the heteroatoms constituting the heterocycle and (B) aliphatic heterocyclic compounds which are each substituted with an amino-bearing group. This method for forming copper wiring (1) is a method which comprises subjecting a portion of a copper layer to etching, said portion being not covered with an etching resist (2), and which is characterized in that the etching is conducted using the etching solution.
The present invention pertains to a copper etching solution that can suppress side etching of a copper wiring pattern, to a replenishment solution thereof, and to a method for forming wiring. The copper etching solution comprises an acidic aqueous solution containing cupric ions, halide ions, and a non-ionic surfactant. The clouding point of the non-ionic surfactant is 15 to 55℃. According to this method for forming wiring, a layered wiring pattern (10) including a patterned metal oxide layer (9) and a copper wiring pattern (7) can be formed by bringing the etching solution in sequential contact with a copper layer (3) and a metal oxide layer (2).
Provided are an etching fluid that is capable of suppressing side etching while not impairing the linearity of copper wiring, a replenishing fluid for the same, and a method for forming copper wiring. This etching fluid is a copper etching fluid characterized in being an aqueous solution containing acid, oxidizing metal ions, and a compound (A), the compound (A) having in molecules thereof an amino group and at least one sulfur-containing functional group selected from the group consisting of thiole groups, sulfide groups, and disulfide groups (where the sulfide and disulfide groups are groups in which the sulfur atoms and the heteroatoms linked thereto are linked by a single bond, and which do not form π conjugates).
Provided is a method for manufacturing a printed circuit board, and a surface treatment device for use in said method, that not only can suppress hole diameter fluctuation caused by transporting scratches incurred during horizontal transport but also can reduce laser machining energy. This method for manufacturing a printed circuit board comprises a pretreatment step in which a copper layer (3) that is a surface layer of a laminate for printed circuit board manufacturing (10), and a laser machining step in which holes are formed in the surface of the copper layer (3) after the pretreatment step by irradiation with laser light. The pretreatment step comprises a first surface treatment step in which the surface of the copper layer (3) is brought into contact with an aqueous solution (A) in an oxygen-containing atmosphere, and a second surface treatment step in which the surface of the copper layer (3) after the first surface treatment step is brought into contact with an aqueous solution (B). In the present invention, in the second surface treatment step, the surface of the copper layer (3) is brought into contact with the aqueous solution (B) without oxygen being supplied.
Provided are: a microetching agent; a replenishment solution for the microetching agent; and a method for producing a wiring board using the microetching agent. A microetching agent of the present invention is composed of an aqueous solution that contains cupric ions, an organic acid, halide ions, an amino group-containing compound having a molecular weight of 17-400, and a polymer. The polymer is a water-soluble polymer that has a polyamine chain and/or a cationic group, while having a weight average molecular weight of 1,000 or more. With respect to this microetching agent, if A (wt%) is the concentration of the amino group-containing compound and B (wt%) is the concentration of the polymer, the value of A/B is 50-6,000. According to the present invention, adhesion between copper and a resin or the like can be maintained even if the amount of etching is small.
The present invention pertains to a microetching agent, a supplementary liquid to be added to said microetching agent, and a circuit board manufacturing method using said microetching agent. The microetching agent for copper comprises an aqueous solution containing copper (II) ions, organic acid, halide ions, a polymer, and a non-ionic surfactant. The polymer is water soluble, has a polyamine chain and/or a cationic group, and a weight-average molecular weight of at least 1000. In the microetching agent of the present invention, if the concentration of the halide ions is represented by A mass%, the concentration of the polymer is represented by B mass%, and the concentration of the nonionic surfactant is represented by D mass%, it is preferable that the value of A/B is 2000-9000, and the value of A/D is 500-9000. Using this etching agent, it is possible to uniformly maintain adhesion with a resin or the like, even with only a small amount of etching.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
Produits et services
Chemicals; industrial chemicals; surface treatment chemicals for use in the treatment of metals; surface modification chemicals for use in the modification of metals; etching chemicals; chemicals for etching metals; corrosive preparations; stripping chemicals; metal resist remover; photoresist remover; degreasing agents for use in manufacture; chemicals for metal surface cleaning; metal degreasing chemicals; soldering fluxes; brazing fluxes; plating fluxes; surface treatment chemicals for use in the treatment of plastics; surface modification chemicals for use in the modification of plastics; chemicals for use in manufacturing electronic circuit boards; chemicals used for anti- tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic components and electronic equipment; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic circuit boards. Foils of non-ferrous metals and their alloys; non-ferrous metals and their alloys; foils of non-ferrous metals for storage batteries. Processing of metal surfaces using chemical products, etching of metal surfaces using chemical products, metal treating, processing of rubber, processing of plastics.
The present invention provides a method for producing an aluminum-resin complex whereby the adhesion between aluminum and a resin composition can be enhanced without the use of an adhesive agent, and for which waste treatment is easy. In this method for producing an aluminum-resin complex, a roughening step for roughening the surface of an aluminum component with an etching agent is carried out, as is a bonding step for bonding the resin composition to the roughened surface. The etching agent is one or more types selected from: an alkali-based etching agent that includes amphoteric metal ions, an oxidant, and an alkali source; and an acid-based etching agent that includes an acid as well as ferric ions and/or cupric ions.
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29C 65/70 - Assemblage d'éléments préformésAppareils à cet effet par moulage
Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.
H01L 21/302 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer leurs caractéristiques physiques de surface ou leur forme, p. ex. gravure, polissage, découpage
H01L 21/461 - Traitement de corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer les caractéristiques physiques ou la forme de leur surface, p. ex. gravure, polissage, découpage
C09K 13/00 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage
C09K 13/02 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un hydroxyde d'un métal alcalin
C23F 1/36 - Compositions alcalines pour l'aluminium ou ses alliages
Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
C09J 9/00 - Adhésifs caractérisés par leur nature physique ou par les effets produits, p. ex. bâtons de colle
C23C 22/07 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses acides d'un pH < 6 contenant des phosphates
C23C 22/52 - Traitement du cuivre ou des alliages à base de cuivre
C23C 26/00 - Revêtements non prévus par les groupes
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 22/68 - Traitement chimique de surface de matériaux métalliques par réaction de la surface avec un milieu réactif laissant des produits de réaction du matériau de la surface dans le revêtement, p. ex. revêtement par conversion, passivation des métaux au moyen de solutions aqueuses au moyen de solutions aqueuses avec un pH compris entre 6 et 8
C23F 1/18 - Compositions acides pour le cuivre ou ses alliages
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
71.
METHOD FOR PRODUCING POSITIVE ELECTRODE COLLECTOR FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERIES AND METHOD FOR PRODUCING POSITIVE ELECTRODE FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERIES
Provided are: a method for producing a positive electrode collector for nonaqueous electrolyte secondary batteries, which is capable of improving electron conductivity between an active material and a collector; and a method for producing a positive electrode for nonaqueous electrolyte secondary batteries. This method for producing a positive electrode collector for nonaqueous electrolyte secondary batteries, wherein the surface of a collector base that is formed of aluminum is roughened by an etching agent, is characterized in that the etching agent is composed of one or more agents that are selected from among alkaline aqueous solution-based etching agents, each of which contains an alkali source and amphoteric metal ions, and aqueous ferric-ion solution-based etching agents, each of which contains a ferric ion source, a cupric ion source, a manganese ion source and an inorganic acid.
H01M 4/70 - Supports ou collecteurs caractérisés par la forme ou la configuration
H01M 4/131 - Électrodes à base d'oxydes ou d'hydroxydes mixtes, ou de mélanges d'oxydes ou d'hydroxydes, p. ex. LiCoOx
H01M 4/136 - Électrodes à base de composés inorganiques autres que les oxydes ou les hydroxydes, p. ex. sulfures, séléniures, tellurures, halogénures ou LiCoFy
H01M 4/1391 - Procédés de fabrication d'électrodes à base d'oxydes ou d'hydroxydes mixtes, ou de mélanges d'oxydes ou d'hydroxydes, p. ex. LiCoOx
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals; industrial chemicals; surface treatment chemicals
for use in the treatment of metals; surface modification
chemicals for use in the modification of metals; etching
chemicals; chemicals for etching metals; corrosive
preparations; stripping chemicals; metal resist remover;
photoresist remover; degreasing agents for use in
manufacture; chemicals for metal surface cleaning; metal
degreasing chemicals; soldering fluxes; brazing fluxes;
plating fluxes; surface treatment chemicals for use in the
treatment of plastics; surface modification chemicals for
use in the modification of plastics; chemicals for use in
manufacturing electronic circuit boards; chemicals used for
anti- tarnishing, plating, soldering, etching, stripping and
deterging metal surface for use in the manufacturing
processes of electronic components and electronic equipment;
chemicals used for anti-tarnishing, plating, soldering,
etching, stripping and deterging metal surface for use in
the manufacturing processes of electronic circuit boards. Anti-rust preparations; anti-rust preparations for
preservation of metal surface; anti-tarnish agent;
anti-tarnish agent for metals. Foils of non-ferrous metals and their alloys; non-ferrous
metals and their alloys; foils of non-ferrous metals for
storage batteries.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Chemicals; industrial chemicals; surface treatment chemicals
for use in the treatment of metals; surface modification
chemicals for use in the modification of metals; etching
chemicals; chemicals for etching metals; corrosive
preparations; stripping chemicals; metal resist remover;
photoresist remover; degreasing agents for use in
manufacturing processes; chemicals for metal surface
cleaning; metal degreasing chemicals; soldering fluxes;
brazing fluxes; plating fluxes; surface treatment chemicals
for use in the treatment of plastics; surface modification
chemicals for use in the modification of plastics; chemicals
for use in manufacturing electronic circuit boards;
chemicals used for anti-tarnishing, plating, soldering,
etching, stripping and deterging metal surface for use in
the manufacturing processes of electronic components and
electronic equipment; chemicals used for anti-tarnishing,
plating, soldering, etching, stripping and deterging metal
surface for use in the manufacturing processes of electronic
circuit boards. Anti-rust preparations; anti-rust preparations for
preservation of metal surface; anti-tarnish agent;
anti-tarnish agent for metals.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Anti-tarnishing chemicals for metals; Metal plating chemical compositions; Soldering chemicals; Etching solution for metals; Stripping preparations for metals, namely, chemical solutions for removing metal coatings; Surface coating removal chemicals and surface cleaning chemicals for metals; all for use in the manufacturing processes of electronic circuit boards
75.
SURFACE ROUGHENING AGENT FOR ALUMINUM, AND SURFACE ROUGHENING METHOD USING SAID SURFACE ROUGHENING AGENT
Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
Produits et services
Chemicals, namely, chemicals for use in the manufacturing processes of electronic circuit boards; industrial chemicals; surface treatment chemicals for use in the treatment of metals; surface modification chemicals for use in the modification of metals; etching chemicals, namely, etching solutions for metals for use in the manufacturing processes of electronic circuit boards; chemicals for etching metals; photoresist remover; degreasing agents for use in manufacturing processes; chemicals for metal surface cleaning; soldering fluxes; brazing fluxes; metal degreasing chemicals, namely, degreasing solutions for metals for use in the manufacturing processes of electronic circuit boards; plating fluxes; surface treatment chemicals for use in the treatment of plastics; surface modification chemicals for use in the modification of plastics; chemicals for use in manufacturing electronic circuit boards; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic components and electronic equipment; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic circuit boards Anti-rust preparations, namely, anti-rust solutions for metals for use in the manufacturing processes of electronic circuit boards; anti-rust preparations for preservation of metal surface
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
06 - Métaux communs et minerais; objets en métal
Produits et services
Chemicals, namely, chemicals for use in the manufacturing processes of electronic circuit boards; industrial chemicals; surface treatment chemicals for use in the treatment of metals; surface modification chemicals for use in the modification of metals; etching chemicals, namely, etching solutions for metals for use in the manufacturing processes of electronic circuit boards; chemicals for etching metals; photo resist remover; degreasing agents for use in manufacture; chemicals for metal surface cleaning; soldering fluxes; brazing fluxes; metal degreasing chemicals, namely, degreasing solutions for metals for use in the manufacturing processes of electronic circuit boards; plating fluxes; surface treatment chemicals for use in the treatment of plastics; surface modification chemicals for use in the modification of plastics; chemicals for use in manufacturing electronic circuit boards; chemicals used for anti- tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic components and electronic equipment; chemicals used for anti-tarnishing, plating, soldering, etching, stripping and deterging metal surface for use in the manufacturing processes of electronic circuit boards Anti-rust preparations, namely, anti-rust solutions in the nature of coatings for metals for use in the manufacturing processes of electronic circuit boards; anti-rust preparations in the nature of coatings for preservation of metal surface [ Foils of non-ferrous metals and their alloys; non-ferrous metals and their alloys; foils of non-ferrous metals for storage batteries ]
The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.
Provided is a buffer stop for an automobile, in which power can be supplied easily to a parked electric automobile without disposing an electric outlet device on the side of a parking lot. The buffer stop made of a metal pipe has a central elongation portion elongating with a predetermined length to abut onto a wheel, first and second bending ends formed integrally at the opposite ends of the central elongation portion by bending the metal pipe at an angle of about 90 degrees relative to the elongation direction of the metal pipe, and plate portions bonded to the other ends of the first and second bending ends and being fixed onto the floor surface. The buffer stop further includes an electric cable disposed in the metal pipe, and an electric outlet fixed to the outer surface of the metal pipe and connected with the electric cable to be connected with an electric automobile, and the electric outlet is connected with a power supply cable elongated from an electric automobile.
The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
Disclosed is a copper surface treating agent satisfying both heat resistance and solderability. Also disclosed is a surface treatment method. Specifically disclosed is a copper surface treating agent containing an acid, a benzimidazole compound and water, which is characterized in that at least a first benzimidazole compound and a second benzimidazole compound having a melting point lower than that of the first benzimidazole compound by 70˚C or more are contained as the benzimidazole compound.
C23F 11/00 - Inhibition de la corrosion de matériaux métalliques par application d'inhibiteurs sur la surface menacée par la corrosion ou par addition d'inhibiteurs à l'agent corrosif
B23K 1/20 - Traitement préalable des pièces ou des surfaces destinées à être brasées, p. ex. en vue d'un revêtement galvanique
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
chemicals used for anti-rust, plating, soldering, etching, deterging metal surface and other chemical preparations for use in manufacturing processes of printed circuit board
