The present invention relates to improvement of a surface plate to be used in a polishing apparatus, with a polishing pad to be attached on the surface plate. The surface plate of the present invention includes: a surface plate body; and a release layer including a release film or release paper formed on a surface of the surface plate body on which the polishing pad is to be attached. The release layer has a peel force of a surface thereof of 0.08 N/50 mm or more and 5.0 N/50 mm or less. The present invention can be suitably used in a polishing apparatus utilizing a general polishing pad including a pressure-sensitive adhesive. The present invention allows polishing pad fixing work and replacement work to be performed more easily than in a conventional technique.
The present invention relates to an improvement of a surface plate which is used in a polishing device and to which a polishing pad is to be adhered. The surface plate according to the present invention includes a surface plate main body and a release layer composed of a release film or release paper formed on a face of the surface plate main body to which the polishing pad is to be adhered. The release layer has a surface peel force of 0.08 N/50 mm to 5.0 N/50 mm inclusive. The present invention can be suitably used in a polishing device employing a common polishing pad provided with an adhesive. According to the present invention, a fixing operation and an exchange operation for the polishing pad can be made easier than before.
A polishing method using a polishing pad including a specific adsorption layer. The polishing pad has an adsorption layer including a silicone including linear polyorganosiloxane having vinyl groups only at both ends, and the like. The polishing pad is fixed to a surface plate, and a product to be polished is pressed against the polishing pad, and simultaneously slid to polish the product to be polished. In this case, the surface roughness (Ra) of the surface plate is set to 0.01 to 0.7 μm, and the adsorption layer of the polishing pad is then adsorbed and fixed to the surface plate to perform polishing work. By adjusting the surface roughness of the surface plate as described above, a surface of the product to be polished can be inhibited from being unpredictably scratched or roughened. The method for adjusting the surface roughness of the surface plate is preferably a method in which a film having a surface roughness as described above is bonded to a surface of the surface plate.
B24B 37/22 - Tampons de rodage pour travailler les surfaces planes caractérisés par une structure multicouche
B24B 37/24 - Tampons de rodage pour travailler les surfaces planes caractérisés par la composition ou les propriétés des matériaux du tampon
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
B32B 27/12 - Produits stratifiés composés essentiellement de résine synthétique adjacente à une couche fibreuse ou filamenteuse
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
4.
POLISHING PAD AND POLISHING METHOD WITH USE OF SAID POLISHING PAD
The present invention relates to a polishing pad which is composed of: a base material; and an adsorption layer and a polishing layer, which are formed on the base material. The adsorption layer is formed of a composition which is obtained by crosslinking at least one silicone that is selected from among a silicone composed of a linear polyorganosiloxane that has vinyl groups only at both ends, and the like. In addition, the present invention is characterized by comprising a ring-like shield member on the adsorption layer, said shield member being arranged along the outer circumference of the polishing pad. This polishing pad is used by having the adsorption layer adsorbed and affixed onto a polishing plate, while supplying a polishing slurry onto the polishing layer during the polishing work. According to the present invention, the ring-like shield member suppresses incursion of the polishing slurry to the interface between the adsorption layer and the polishing plate.
The present invention relates to a sheet-like underlay to be installed between a polishing pad and a surface plate when the polishing pad is fixed onto the surface plate. The underlay is a novel assistance member in which, in a surface that contacts the polishing pad, at least one annular groove is formed along an outer edge of the underlay, and in which further at least one discharge groove extending from an annular groove formed on the outer-most edge side in the direction of the outer edge of the underlay and having an opening at an outer edge end portion is formed. After the underlay is fixed onto the surface plate, a polishing pad may be fixed to the underlay, whereby peeling and the like of the polishing pad due to a polishing slurry can be suppressed.
The present invention pertains to a method for polishing using a polishing pad provided with a prescribed adsorption layer. The polishing pad is provided with an adsorption layer that comprises, inter alia, silicone comprising a linear polyorganosiloxane having a vinyl base solely on the two terminal ends. In the present invention, after the polishing pad is fixed to a platen and when an object to be polished is polished by being slid while pressed against the polishing pad, the surface roughness (Ra) of the platen is set to 0.01-0.7 μm, and then the adsorption layer of the polishing pad is fixed by adsorption to the platen and a polishing operation is performed. Adjusting the surface roughness of the platen in this manner makes it possible to suppress unexpected scratching and/or roughening of the surface of the object to be polished. Bonding a film having the above-described surface roughness to the surface of the platen is preferred as the method for adjusting the surface roughness of the platen.
The present invention is a holding pad including a holding layer for holding a member to be polished, in which the holding layer includes on a part of a surface thereof a template fixing portion for sticking a template for preventing lateral displacement of the member to be polished, the template fixing portion has on a surface thereof an adsorption layer for adsorbing and fixing the template the template fixing portion, and the adsorption layer is formed of a composition which is formed by crosslinking a silicone composed of a predetermined siloxane.
B24B 37/00 - Machines ou dispositifs de rodageAccessoires
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
The present invention relates to a holding pad for holding a member to be polished. A holding pad according to the present invention comprises a holding layer. This holding pad is characterized in that: the holding layer has a template fixation part on a part of the surface, to said template fixation part a template for preventing horizontal displacement of a member to be polished being bonded; the template fixation part has an adsorption layer on the surface, said adsorption layer being used for the purpose of fixing the template by adsorption; and the adsorption layer is formed from a composition that is obtained by crosslinking a silicone that is formed of a specific siloxane. This holding pad is capable of firmly fixing a template during a polishing work, while having the template in a removable state.
To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.
Disclosed is a polishing pad (14) that is suitable for polishing extremely hard semiconductor materials. The aforementioned polishing pad (14) is used for polishing in combination with free abrasive grains and is equipped with a cloth, which comprises high strength organic fibers with a tensile strength of at least 15 cN/dtex, on a surface (15) for polishing an object to be polished (16). In the cloth, the single fiber fineness of the high strength organic fibers may, for example, be around 0.3 to 15 dtex, and the total fineness of the high strength organic fibers may be around 3 to 3,000 dtex. Fully aromatic polyester fibers, for example, are included as the high strength organic fibers.
D03D 1/00 - Tissus conçus pour faire des articles particuliers
D03D 15/00 - Tissus caractérisés par la matière, la structure ou les propriétés des fibres, des filaments, des filés, des fils ou des autres éléments utilisés en chaîne ou en trame
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
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