The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and/or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre-package comprising the electronic components. The present invention also refers to the methods for forming the pre-package and the smartcard comprising it.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
The present invention relates to a sensor assembly for a gas sensor. The sensor assembly comprises an electronic board, such as a Printed Circuit Board, having a first board side and a second board side, opposite to the first board side, and a transducer comprising a substrate which has a first substrate side and a second substrate side, opposite to the first substrate side, wherein a plurality of nanostructures is deposited on the second substrate side. According to the invention, the second substrate side is attached to the first board side, so that the plurality of nanostructures face the first board side, and the sensor assembly is provided with one or more perforations, in order to allow a gas flow to reach the plurality of nanostructures. The present invention also refers to a method of manufacturing the sensor assembly and to a method of using it, for example in a sensor for detecting thermal runaways of batteries.
B82Y 15/00 - Nanotechnologie pour l’interaction, la détection ou l'actionnement, p. ex. points quantiques comme marqueurs en dosages protéiques ou moteurs moléculaires
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
3.
RADIO FREQUENCY IDENTIFICATION (RFID) RING WITH COIL ANTENNA
The present invention refers to a Radio Frequency Identification (RFID) ring having a main body and comprising an electronic module with a RFID chip, and an RFID antenna electrically connected to the RFID chip, wherein the RFID chip is configured to communicate with an external reader and to perform a predefined operation, such as a payment operation, and the RFID antenna is configured to provide energy to the RFID chip. In the RFID ring according to the present invention, the RFID antenna is a coil antenna comprising more than one winding and the windings form the main body of the RFID ring.
G06K 19/04 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par la forme
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
4.
PRE-LAMINATED STRUCTURE FOR A SMARTCARD WITH NON-INSULATED WIRE CONNECTION
The present invention refers to a pre-laminated structure for a smart card comprising a substrate and a plurality of electronic components directly formed on the substrate. The electronic components include: an electronic module area for placing an electronic module configured for performing a predefined operation of the smart card, for instance a payment operation, the electronic module area comprising a plurality of electronic module terminals for contacting the electronic module; a first antenna, such as a payment antenna, configured for providing energy to the electronic module; an electrical load area for placing an electrical load, for instance a lighting element, such as a Light Emitting Diode (LED), the electrical load area comprising a plurality of load area terminals for contacting the electrical load; a second antenna, such as a harvesting antenna, configured for providing energy to the electrical load. In the pre-laminated structure according to the present invention, the electronic connection between the electronic module terminals and the electrical load terminals is made by means of a non-insulated connection wire. The present invention also relates to the smart card comprising such a pre-laminated structure, and to the methods of forming same.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
5.
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
The invention relates to a printed circuit board which comprises a substrate (1) comprising a dielectric material in sheet form. The substrate (1) comprises two main faces. Each of the main faces supports electrodes (2, 3) made of an electrically conductive material. At least two sensor electrodes (2) are provided on one main face and at least two heating electrodes (3) are provided on the other main face. A layer of carbon nanotubes (7) is deposited between the two sensor electrodes (2) and a layer of heating ink (6) is deposited between the two heating electrodes (3). This layer of heating ink (6) is at least partially deposited opposite the layer of carbon nanotubes (7).
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
The present invention refers to a substrate for an RFID transponder comprising a carrier layer made of an insulating material; one or more metal inlays associated with the carrier layer; a main RFID antenna formed on the carrier layer and configured to communicate with an external electro-magnetic reader; a compensation antenna formed on the carrier layer and configured to offset the detuning effect of the one or more metal inlays and to boost communication of the main RFID antenna with the external electro-magnetic reader. According to the present invention, the main RFID antenna and the compensation antenna may be formed on a same surface of the carrier layer, or they may be not physically connected to each other, and/or they may be self-resonance antennas.
Described is a multilayer stack comprising: a Cu-based layer; a Ni-based layer provided over the Cu-based layer; an Au-based layer provided over the Ni-based layer; and a Pt-based layer provided over the Au-based layer. The multilayer stack exhibits excellent corrosion resistance, especially in chlorinated environments and under oxidizing conditions, and improves the catalytic performance, mechanical properties and/or lifetime of the multilayer stack. A method of manufacturing the aforementioned multilayer stack, the use of the aforementioned multilayer stack as an electrode or an electrical conductor in electrical connectors and/or electric circuits, and a method of improving the corrosion resistance of Ni-plated Cu by making use of the stack configuration are likewise described. In addition, a biosensor comprising the aforementioned multilayer stack is described.
In some illustrative embodiments, an antenna assembly is provided. The antenna assembly comprises a carrier substrate, an antenna wiring pattern formed on the carrier substrate, and a filter component coupled with the antenna wiring pattern. The filter component may comprise a high pass filter component. The high pass filter component is configured to block electrical power induced by frequencies below 800 kHz at the antenna assembly by at least 5dB.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
9.
FLEXIBLE CIRCUIT STRUCTURE AND SMART WEARING ARRANGEMENT WITH SUCH A FLEXIBLE CIRCUIT STRUCTURE
In various aspects, a flexible circuit structure and a smart wearing arrangement with such a flexible circuit structure are provided, such as a smart bandage with such a flexible circuit structure. In some illustrative embodiments herein, the flexible circuit structure comprises a carrier of a flexible insulating material, conductive tracks and one or more electrodes formed on at least one of a first surface of the carrier and a second surface of the carrier opposite the first surface, and connection terminals formed on the first surface and electrically coupling to the electrodes via at least some of the conductive tracks. This flexible circuit structure may be used in a wearing arrangement, such as a bandage.
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61F 13/10 - Bandages ou pansementsGarnitures absorbantes spécialement conçus pour les doigts, les mains ou les brasDoigtiersProtège-ongles
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A61B 5/1477 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques non invasifs
In some aspects, a flexible circuit structure is provided, comprising a carrier of a flexible insulating material, conductive tracks and one or more electrodes formed on at least one of a first surface of the carrier and a second surface of the carrier opposite the first surface, and connection terminals formed on the first surface and electrically coupling to the electrodes via at least some of the conductive tracks. The flexible circuit substrate further comprises a fluid collector system formed on the carrier with the fluid collector system comprising at least one microchannel formed in the second surface. Herein, at least one of the conductive tracks is formed so as to at least partially extend within the at least one microchannel. This flexible circuit structure may be used in a wearing arrangement, such as a bandage, or as a transducer of a biosensor.
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61F 13/10 - Bandages ou pansementsGarnitures absorbantes spécialement conçus pour les doigts, les mains ou les brasDoigtiersProtège-ongles
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A61B 5/1477 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques non invasifs
MICROWAVE-SAFE RFID TAG WITH SLOT CAVITY ELEMENT, A SLOT CAVITY ELEMENT FOR MICROWAVE-SAFE RFID TAGS, A MICROWAVE-SAFE CONTAINER WITH SUCH AN RFID TAG AND USE OF THE CONTAINER IN A MICROWAVE OVEN
In various aspects, a slot cavity element, a microwave-safe RFID tag with a slot cavity element, a microwave-safe container with such a microwave-safe RFID tag and an use of the microwave¬ safe container in a microwave oven are provided. According to some illustrative embodiments, a microwave-safe RFID tag comprises an antenna of substantially planar form and defining a gap and configured to operate at the reading frequency, an RFID chip electrically coupled to the an¬ tenna across the gap, and a slot cavity element (30), wherein the slot cavity element (30) is ar¬ ranged on the antenna. The slot cavity element (30) is provided as a monolithic body comprising an alternating layer stacking of conductive and non-conductive layers configured to provide neg¬ ative interference between receiving signals and induced signals emitted by the slot cavity element in a range from about 2.1 GHz to 2.7 GHz, preferably at 2.45GHz.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
H01Q 1/52 - Moyens pour réduire le couplage entre les antennesMoyens pour réduire le couplage entre une antenne et une autre structure
H01Q 9/26 - Antennes résonnantes avec alimentation intermédiaire entre les extrémités de l'antenne, p. ex. dipôle alimenté par le centre avec élément replié ou éléments repliés, les parties repliées étant espacées l'une de l'autre d'une petite fraction de la longueur d'onde émise
12.
TAGS PROVIDED WITH NEAR FIELD COMMUNICATION (NFC) CHIPS AND SENSORS
The present invention refers to a method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, wherein the method comprises the steps of providing an intermediate circuit comprising the NFC chip connected the sensor, for instance a biosensor, and of providing a single side inlay comprising a substrate and the antenna. Afterwards, the intermediate circuit and the single side inlay are mated together so as to connect the NFC chip to the antenna. The present invention also refers to the integrated circuit or tag produced according to this method.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
13.
ANTENNA INLAY FOR A DOCUMENT AND DOCUMENT WITH SUCH AN ANTENNA INLAY
In various aspects, the present disclosure provides an antenna inlay for a document and a document with such an antenna inlay. In some embodiments herein, an antenna inlay for a document comprises an inlay substrate foldable along a folding line, and an antenna formed one or embedded into the inlay substrate. The antenna comprises a first antenna portion having at least one first antenna portion routed outside the folding line and at least one conductive bridging portion routed to extend across the folding line. The at least one conductive bridging portion is electrically connected with an associated one of the at least one first antenna portion and the at least one conductive bridging portion is routed at the folding line so as to cross the folding line at an inclination angle unequal to 90°.
In various aspects, an RFID tag, a container with such an RFID tag and use of the container in a microwave oven are provided. According to some illustrative embodiments, an RFID tag comprises an antenna having one or more conductive antenna tracks and a slot defining a gap, wherein the antenna is configured to operate at the reading frequency, and the RFID chip electrically coupled to the antenna across the gap. The one or more conductive antenna tracks have a thickness of more than 50 μm.
The present invention refers to a sensor module for a contactless smart card with biometric functionality. The sensor module comprises a biometric sensor, for instance a fingerprint sensor; a micro-controller configured to process signals detected by the biometric sensor; a secure chip configured to store data processed by the micro-controller; a multi-layered PCB substrate having a PCB area; wherein the micro-controller and the secure chip are mounted directly on the biometric sensor, and the biometric sensor is mounted on the multi-layered PCB substrate, so as to form a stacked structure having a maximum area corresponding to the PCB area. The present invention also refers to a biometric contactless smart card comprising said sensor module, and to the methods for forming the sensor module and the smart card.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
The invention relates to a method for manufacturing a printed circuit board, comprising the operations that consist in: - continuously supplying a sheet of electrically conductive material (1); - continuously coating at least one layer of electrically insulating material (2) over at least one area of the surface of one of the faces of the sheet of electrically conductive material (1), this electrically insulating material (2) comprising at least one epoxy resin; - continuously photopolymerising at least some regions of the epoxy resin under UV radiation; and - producing at least one pattern by photolithographic etching in the sheet of electrically conductive material (1), this pattern being supported by the photopolymerised epoxy resin.
The present invention refers to an illumination module for illuminating a portion of a smart card. The illumination module comprises a substrate layer, one or more lighting elements placed on the substrate layer and configured to emit light parallel to the substrate layer, for instance one or more LEDs, and a light guiding body applied to the substrate layer. The light guiding body comprises a light guiding material and a pattern layer applied to the light guiding material and is configured to refract the light parallel to the substrate layer and deviate it along a direction perpendicular to the substrate layer, so as to obtain an emitted light; the pattern layer comprises a series of protrusions distributed so as to make the brightness of the emitted light uniform.
A method for manufacturing flexible printed circuits for smart card modules, wherein a complex material is provided. This complex material includes an assembly including at least two different-colored strata. Zones of this assembly are visible through the layer of electrically conductive material. This manufacturing method includes an operation that consists in laser etching at least one of the two different-colored strata over a portion of that zone of the assembly of strata that is left visible, so as to reveal the color of the other of the two different-colored strata. Printed circuit manufactured by this method. Module and smart card including this printed circuit.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
G06K 1/02 - Méthodes ou dispositions pour marquer les supports d'enregistrement sous la forme numérique par poinçonnage
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H05K 3/22 - Traitement secondaire des circuits imprimés
19.
PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH SUCH A PRINTED CIRCUIT AND REEL-TO-REEL TAPE FOR USE IN A FABRICATION PROCESS OF A SMART CARD
The invention relates in various aspects to a printed circuit for integration into a smart card, a smart card with such a printed circuit and to a reel-to-reel tape for use in a fabrication process of a smart card, wherein the reel-to-reel tape comprises a plurality of such printed circuit. In some illustrative embodiments of an aspect, a printed circuit is provided, the printed circuit comprising a printed circuit support, an antenna wiring pattern of at least one winding continuously extending between a first terminal and a second terminal, and at least one antenna path portion continuously extending between a third terminal and a fourth terminal. Herein, each of the at least one antenna path portion extending between the third and fourth terminal can increase a path length of the antenna wiring pattern if connected to the antenna wiring pattern, adding a path length of the at least one added antenna path portion to the initial path length of the antenna wiring pattern.
The present invention relates to a moisture sensor comprising a support substrate having a first face and a second face, geometrically opposite to the first face, and wherein: the first face is provided with a plurality of pairs of electrodes configured to be in contact with a liquid, and the second face comprises a plurality of means of detection connected to each other in parallel, and each means of detection comprises a transistor associated to a pair of electrodes, and the moisture sensor is sensitive to an equivalent resistance of the plurality of means of detection.
The present disclosure refers to a printed circuit for integration in a smart card, wherein the printed circuit comprises a printed circuit substrate of dielectric material, an antenna having a resonance frequency, one or more contact pads forming an external contact pattern, and at least one surface mount (SMD) capacitor connected to the antenna so as to adjust its resonance frequency, in order to match a predefined resonance frequency, for instance a resonance frequency comprised within the range defined in ISO 14443 standards. The present disclosure also refers to a module comprising the above-indicated printed circuit and an IC chip and to a corresponding smart card.
The present invention refers to a structure for a security document, which comprises a first layer comprising a user identification area for forming an image of a user, and a second layer including a photochromic ink area comprising photochromic ink, wherein the photochromic ink area is placed in correspondence with the user identification area. The present invention further refers to a security document comprising the laminated structure obtained from the disclosed structure.
In various aspects, a sensor tag and a storing container with such a sensor tag are provided. In illustrative embodiments, the sensor tag comprises a flexible base substrate, an antenna pattern formed on a first side of the flexible base substrate, and a sensor device arranged on a second side of the flexible base substrate. The sensor device is configured to sense at least one physical quantity. The antenna pattern and the sensor device are electrically connected.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
24.
DUAL INTERFACE ELECTRONIC MODULE WITH VALUE-ADD COMPONENT AND MANUFACTURING METHOD THEREOF
The present invention refers to a dual interface electronic module for a smart card and to the fabrication method thereof. The dual interface electronic module comprises a contact plate for external connection, which includes at least one antenna electrical connector, and a multilayered PCB including a value-add component, for instance a display. The contact plate and the multilayered PCB are connected together by means of a plurality of interconnects at an interconnection interface; the contact plate has a first area in correspondence of the interconnection interface and the multilayered PCB has a second area in correspondence of the interconnection interface. The first area is larger than the second area, so as to define an excess portion and at least one portion of the at least one antenna electrical connector is placed on the excess portion so as to be exposed for being electrically connected to a corresponding antenna of the smart card. The present invention also refers to the smart card comprising such a dual interface electronic module and to the fabrication method thereof.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
25.
A PRE-LAMINATED STRUCTURE WITH A SEE-THROUGH WINDOW AND A METHOD OF FORMING IT
The present invention refers to a pre-laminated structure for a security document comprising: a core structure comprising one or more core layers; a first cover layer formed on one side of the core structure and having a see-through portion; a second cover layer formed on the opposite side of the core structure and having a cutout portion aligned with the see-through portion; and an inlay; wherein a third cutout portion is formed in at least one of the one or more core layers and the inlay is at least partially inserted in the third cutout portion, and wherein the third cutout portion is positioned so as to have at least one portion aligned with the see-through portion and the cutout portion. The present invention refers also to the security document comprising said pre-laminated structure and to the methods for forming the pre-laminated structure and the security document.
The present invention refers to a Radio Frequency Identification (RFID) ring comprising a main body having an annular shape and comprising a flexible substrate extending along the perimeter of the main body; a main antenna configured to provide energy to a RFID chip; and an array of booster antennas comprising two or more booster antennas, which are coupled to the main antenna. The main antenna and the booster antennas are formed on the flexible substrate and they are one adjacent to the other, and they are distributed along the length of the flexible substrate so that any antenna of the array is coupled to the main antenna, either directly or indirectly via one or more of the other antennas of the array.
G06K 19/04 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par la forme
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
27.
DOCUMENT WITH ANTENNA OF DUAL SHIELDING/COMMUNICATION FUNCTION
In an aspect, the present invention provides a document having a first page and a second page connected by a hinge portion. In illustrative embodiments, the document comprises an RF chip module, a first antenna portion formed on the first page, a second antenna portion formed on the second page, and at least one foldable bridge formed on the hinge portion, wherein the at least one foldable bridge electrically connects endings of the first and second antenna portions such that the first and second antenna portions have a first inductance adapted to provide the document with a first resonance frequency in a closed condition of the document in which the first page is placed on the second page, while the first and second antenna portions have a second inductance adapted to provide the document with a second resonance frequency different from the first resonance frequency in an open condition of the document in which the first page is removed from closed condition.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
28.
Wire pad design of a connection pad in a prelam body of a smart card, prelam body, smart card, method of forming a wire pad design, and method of forming a smart card
In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.
The present disclosure provides in various illustrative embodiments a method of forming a functional substrate foil (1), the method comprising providing a first substrate foil (2) having a plurality of active device regions (2a), arranging microchips (4) on the first substrate foil (2) in the active device regions (2a), and bonding a second substrate foil (5) to the first substrate foil (2) so as to interpose the microchips (4) in between the first substrate foil (2) and the second substrate foil (5) such that the functional substrate foil (1) is formed.
The present invention relates to a rectifying electronic circuit, for instance an electronic carrier for antennas for a smartcard, comprising two electronic circuits. A first electronic circuit comprises a first wire antenna configured to provide energy to an electrical load for a smartcard and a first diode connected to the first wire antenna and having a first forward bias; a second electronic circuit comprises a second wire antenna configured to provide energy to the electrical load and a second diode connected to the second wire antenna and having a second forward bias. An induced current is generated in the first wire antenna and in the second wire antenna when they are exposed to an alternating magnetic field. The first diode and the second diode are positioned on the rectifying electronic circuit in such a way that only one diode has a forward bias that allows flowing of said induced current, given a predefined direction of the alternating magnetic field, so that the induced current can flow alternatively through the first electronic circuit or in the electronic circuit to provide energy to the electrical load in the form of a rectified signal.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
31.
FLUID SENSOR DEVICE WITH A GEL PORTION COVERING AT LEAST PARTIALLY ONE ELECTRODE AND METHOD OF USING SUCH A FLUID SENSOR DEVICE
In various aspects, a fluid sensor device and a method of using such a fluid sensor device are provided. According to some illustrative embodiments herein, the fluid sensor device comprises a sensor substrate, at least one sensor electrode formed on the sensor substrate, and at least one gel portion associated with the at least one sensor electrode. The at least one sensor electrode has a sensor surface for exposure to a sample liquid in an operational state of the fluid sensor device and the sensor surface of the at least one electrode is at least partially covered by the associated gel portion in an non-operational state of the fluid sensor device.
Described is a multisensor array comprising multiple sensors for detection of one or more analyte(s) in the gas phase or in the liquid phase, wherein the multiple sensors comprise: a first sensor configured to detect a variation of an electrical parameter based on a dipole-dipole interaction with the analyte(s); a second sensor configured to detect a variation of an electrical parameter based on a hydrogen bonding interaction with the analyte(s); and a third sensor configured to detect a variation of an electrical parameter based on a dispersive interaction with the analyte(s). Furthermore, a multisensor system is disclosed, which comprises the aforementioned multisensor array and a processing unit comprising a pattern recognition and machine learning analyzer wherein the pattern recognition and machine learning analyzer is configured to receive output signals of the multisensor array and compare them to stored data in order to classify and/or identify the one or more analyte(s); wherein the stored data includes Hansen solubility parameters obtained from a library database, thus enabling classification of unknown analytes. A method of analyzing a sample present in gas or liquid phase by using the aforementioned multisensor array is also described.
The invention relates to a process for manufacturing a chip-card module (4), comprising providing a substrate (7) comprising at least one connection pad (8) and at least one through-cavity (10) in the substrate (7). This process also comprises placing an electronic component (5) in the cavity (10). A reinforcing resin (12) is deposited between the electronic component (5) and the substrate (7). The electronic component (5) is connected to the connection pad (8) by means of a connection wire (13). An encapsulating material (14) is deposited on the electronic component (5) and the connection wire (13). The invention also relates to a chip-card module (4) obtained via said process.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
34.
ULTRA-HIGH FREQUENCY ANTENNA DEVICE, ULTRA-HIGH FREQUENCY ANTENNA ASSEMBLY, DEVICE METHOD OF FORMING SUCH AN ANTENNA DEVICE, AND SUPPORT BODY MATERIAL SUPPLY
The present disclosure provides in various aspects an ultra-high frequency (UHF) antenna device, ultra-high frequency (UHF) antenna assembly, a method of forming an ultra-high frequency (UHF) antenna device, and a support body material supply. In a first aspect of the present disclosure, an ultra-high frequency (UHF) antenna device is provided, the UHF antenna device comprising a radio frequency identification (RFID) chip, and an antenna support body with an antenna-wiring pattern formed on a surface of the antenna support body, and an UHF antenna loop electrically coupled with the RFID chip. The UHF antenna loop is configured to emit and/or receive a frequency range in the UHF band and comprises a first loop portion formed of the antenna-wiring pattern and a second loop portion extending at least partially outside of the antenna support body.
A process for manufacturing a sensor including at least two electrodes, including providing a flexible dielectric substrate having a layer of electrically conductive material on at least one of its sides. The electrodes, conductive connecting tracks and a common current supply track are etched in the layer of electrically conductive material. The process further includes electrodepositing one or more layers on the two electrodes and a step of selectively depositing, electrochemically, on at least one electrode, at least one layer of a material different from the one or more materials already deposited on another electrode.
C25D 5/10 - Dépôt de plusieurs couches du même métal ou de métaux différents
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
36.
Lead-frame, card body of a smart card, smart card, and method of forming a smart card
In various aspects, the present invention relates to a lead frame for integration into a smart card, a card body of a smart card, a smart card, and a method of forming a smart card. In an aspect of the present disclosure, a lead-frame for integration into a smart card is provided comprising a planar lead-frame body portion, at least one contact pad having a planar contact portion, and at least one bridging portion coupled with the planar lead-frame body portion and extending away from the planar lead-frame body towards the at least one contact pad and between the planar contact portion and the planar lead-frame portion, wherein the at least one bridging portion extending out of a plane defined by at least one of the planar lead-frame body portion and the planar contact portion and at least partially in parallel to a substantially normal direction of the planar contact portion.
The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.
In various aspects of the present disclosure, a decomposable composite sheet body, a method of forming a decomposable composite sheet body, a smartcard, and a method of forming a smartcard are provided. According to some illustrative embodiments herein, a smart card comprises a decomposable composite sheet body, comprising a first and second sheet of organic composite material comprising cellulose fibers embedded in a matrix of lignin, and a core sheet interposed between the first and second sheets forming a laminated stacking arrangement. The core sheet comprises at least one of a fabric material and a paper material and the core sheet comprises at least one of a fabric material and a paper material.
B32B 21/14 - Produits stratifiés composés essentiellement de bois, p. ex. une planche de bois, une feuille de placage, une feuille de bois aggloméré comprenant une planche de bois ou une feuille de bois de placage
B32B 7/02 - Propriétés physiques, chimiques ou physicochimiques
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 21/06 - Produits stratifiés composés essentiellement de bois, p. ex. une planche de bois, une feuille de placage, une feuille de bois aggloméré comprenant du bois comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique de papier ou de carton
B32B 21/10 - Produits stratifiés composés essentiellement de bois, p. ex. une planche de bois, une feuille de placage, une feuille de bois aggloméré adjacent à une couche fibreuse ou filamenteuse
B32B 29/00 - Produits stratifiés composés essentiellement de papier ou de carton
B42D 25/36 - Caractéristiques d’identification ou de sécurité, p. ex. pour empêcher la falsification comprenant des matériaux spéciaux
C08L 97/02 - Matériau lignocellulosique, p. ex. bois, paille ou bagasse
39.
PRE-LAMINATED STRUCTURE FOR A SMART CARD AND/OR FOR A DATA PAGE FOR A SECURITY DOCUMENT AND METHOD OF FORMING SAME
The present invention refers to a pre-laminated structure for a smart card and/or a data page for a security document comprising a core structure comprising one or more core layers, a first layer formed on one side of the core structure and having a first cutout portion, a second layer formed on the opposite side of the core structure and having a second cutout portion aligned with the first cutout portion, and an inlay portion inserted into the second cutout portion. According to the invention, the second layer has a first thickness and the inlay portion has a second thickness and a ratio between the second thickness and the first thickness is larger than 1. The pre-laminated structure for a smart card and/or a data page for a security document is advantageously provided with an optical pattern. The present invention also discloses a method for forming said pre-laminated structure for a smart card and/or a data page for a security document.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
B32B 7/00 - Produits stratifiés caractérisés par la relation entre les couchesProduits stratifiés caractérisés par l’orientation relative des éléments caractéristiques entre les couches, ou par les valeurs relatives d’un paramètre mesurable entre les couches, c.-à-d. produits comprenant des couches ayant des propriétés physiques, chimiques ou physicochimiques différentes Produits stratifiés caractérisés par la jonction entre les couches
40.
PRINTED CIRCUIT WITH A LAYER OF GOLD-SUBSTITUTE ALLOY AND METHOD FOR MANUFACTURING SUCH A PRINTED CIRCUIT
Printed circuit (5) comprising a dielectric substrate (4) comprising a first and a second main face, with at least one first sheet (10) of a first electrically conductive material at least on a portion of the first main face, at least one layer (12) of a second electrically conductive material on at least one area of the first sheet (10). The at least one layer (12) of at least one second electrically conductive material is formed of an alloy comprising at least 50% by weight of copper, less than 20% by weight of tin and more than 5% by weight of zinc. The invention also relates to a method for producing said printed circuit.
Method for manufacturing, roll to roll, a carrier for electronic components (18), comprising a step during which at least one electronic component (18) is transferred onto a substrate (11), this electronic component (18) comprising at least one zone called a bonding zone (21) and at least one zone called a connection zone (19). The step of transferring the electronic component (18) onto the substrate (11) comprises bringing said bonding zone (21) of the electronic component (18) into contact with an adhesive face of the substrate (11), said bonding zone (21) being distinct from said connection zone (19). In addition, during the transfer step, a fixing zone (25) is left free, on the side of the adhesive face of the substrate (11), this fixing zone (25) being configured to subsequently receive a layer for fixing the electronic component (18) in a chip card.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
42.
Antenna for a radio frequency identification transponder and radio frequency identification transponder
An antenna for a radio frequency identification transponder includes an electrically conductive main portion, an electrically conductive first transverse portion and an electrically conductive second transverse portion. The first and second transverse portions are connected to opposite portions of the main portion, extend in an antenna width direction and are spaced apart from each other in an antenna length direction. The antenna further includes an electrically conductive first tail portion extending in the antenna length direction and being connected to an end of the first transverse portion distal of the main portion. The main portion includes a loop and a plurality of meanders. The loop includes a pair of contacts configured for connecting the antenna to a radio frequency identification chip. An extension of the meanders in the antenna width direction is smaller than an extension of the loop in the antenna width direction.
The present invention relates to an electronic carrier for antennas for a smartcard comprising an antenna substrate, a first wire antenna configured to provide energy to a lighting element for a smartcard, and a second wire antenna configured to provide energy to an electronic module for contactless data transferfor a smartcard, wherein the first antenna and the second antenna are formed on opposite sides of the antenna substrate. The present invention also refers to a lighting device for a smartcard comprising a lighting element configured for illuminating a portion of the smartcard and a single diode suitable for providing energy to the lighting element when connected to an energy harvesting antenna. Furthermore, the present invention refers to a pre-laminated structure for a smartcard and a smartcard comprising said electronic carrier and/or said lighting device.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
The present invention relates to an electronic carrier for antennas for a smartcard comprising an antenna substrate, a first wire antenna configured to provide energy to a lighting element for a smartcard, and a second wire antenna configured to provide energy to an electronic module for contactless data transfer for a smartcard, wherein the first antenna and the second antenna are formed on opposite sides of the antenna substrate. The present invention also refers to a lighting device for a smartcard comprising a lighting element configured for illuminating a portion of the smartcard and a single diode suitable for providing energy to the lighting element when connected to an energy harvesting antenna. Furthermore, the present invention refers to a pre-laminated structure for a smartcard and a smartcard comprising said electronic carrier and/or said lighting device.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
45.
Method for Depositing a Bronze Alloy on a Printed Circuit and Printed Circuit Obtained by Said Method
Disclosed is a method for depositing a bronze alloy on a printed circuit. Said method includes an operation of electrolytically depositing at least one layer of bronze on a copper sheet. The bronze layer includes, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit obtained by this method.
The present invention relates to card-type information substrates, such as payment cards, and a pre-form thereof, in which a frame, in some embodiments in combination with a metal containing plate, is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame and the metal containing plate, if provided, on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame and/or the plate is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.
A pre-laminate usable for forming a datapage of a security document, includes layers of different optical appearance, such as a clear window-type portion, which may be obtained on the basis of a substantially even or flat surface. Since the desired optical appearances of different areas of the pre-laminate are established in an early manufacturing stage, any process steps to be applied in a later manufacturing stage upon forming, for instance, an optical window, in a datapage, may be omitted, thereby contributing to reduced overall manufacturing costs and enhanced tamper resistance of the resulting datapage.
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 37/18 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification impliquant uniquement l'assemblage de feuilles ou de panneaux individualisés
B42D 25/455 - Fabrication associant plusieurs couches en utilisant la chaleur
48.
DEVICE FOR CAPTURING PERSPIRATION FROM A BODY, AND METHOD FOR MANUFACTURING SUCH A DEVICE
The invention relates to a device (100) configured to capture the perspiration from a perspiring body and to be attached to an electronic component, comprising a multi-layer structure (9) having a contact surface (1) configured to be placed in contact with the body, the structure (9) comprising a microfluidic channel (5) connecting a fluid inlet (3) to a fluid outlet (19), and at least one pair of electrical conductors (27a, 27b), each conductor (27a, 27b) of the pair of conductors (27a, 27b) comprising, at a first end, an electrode (23a, 23b) having a surface area extending along a wall of the microfluidic channel (5), and, at a second end, a connection portion (25a, 25b), the connection portion (25a, 25b) being accessible via a surface (22a, 22b) adjacent to or a surface (17) opposite from the contact surface (1) and being configured to be coupled electrically to the electronic device.
A61B 5/145 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
B01L 3/00 - Récipients ou ustensiles pour laboratoires, p. ex. verrerie de laboratoireCompte-gouttes
A61B 10/00 - Instruments pour le prélèvement d'échantillons corporels à des fins de diagnostic Autres procédés ou instruments pour le diagnostic, p. ex. pour le diagnostic de vaccination ou la détermination du sexe ou de la période d'ovulationInstruments pour gratter la gorge
49.
Method for manufacturing chip card modules and band of flexible material supporting such modules
Method for the manufacture of a chip card module in which a polymer material including conductive particles is deposited in two connection wells or on two conductive pads formed in a conductive sheet positioned on the back face of the module. This polymer material forms, after deposition, an excess thickness on the back face which comes, during the insetting of the module, into contact with the ends of an antenna. Between the manufacture of the modules and their insetting, the modules are positioned on a strip which can be rolled up on itself for the purpose of its storage.
A pre-form for a security document comprising at least a bottom layer, a central layer and a top layer is presented, wherein the central layer comprises one or more insert inlays disposed between a first corner and a second corner of one side, so as to form a horizontal color-coded pattern, wherein said one or more insert inlays comprise a light guide material that can interact with input light entering through at least one window of the pre-form for a security document and exiting from the one or more inserts, so that the color-coded pattern is modified by the interaction between a predefined input light and the light guide material. Moreover, the methods for producing the pre-form for a security document and for operating it in such a way to assure superior tampering resistance are disclosed.
B42D 25/351 - Pièces translucides ou en partie translucides, p. ex. fenêtres
B42D 25/455 - Fabrication associant plusieurs couches en utilisant la chaleur
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
B32B 3/08 - Caractérisés par des caractéristiques de forme en des endroits déterminés, p. ex. au voisinage des bords caractérisés par des éléments ajoutés à des endroits déterminés
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 3/26 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes
51.
Prelam body of a smart card, smart card, method of forming a prelam body and method of forming a smart card
The present invention provides for a prelam body of a smart card, a smart card, a method of forming a prelam body of a smart card, and a method of forming a smart card. In accordance with some embodiments herein, a prelam body comprises a base substrate formed of at least one layer, and at least one overlay sheet layer formed on one side of the base substrate, wherein the at least one overlay sheet layer has a recess formed therein. The recess is at least partially extending through the at least one overlay sheet layer such that an opening of the recess is exposed.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
B32B 37/18 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification impliquant uniquement l'assemblage de feuilles ou de panneaux individualisés
52.
PRE-PACKAGE FOR A PRINTED CIRCUIT BOARD FOR A SMART CARD AND METHOD OF FORMING SAME
The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and/or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre¬ package comprising the electronic components. The present invention also refers to the methods for forming the pre-package and the smartcard comprising it.
The present disclosure provides in various aspects for a prelam body of a smart card, a method of forming a prelam body of a smart card, and a smart card having a card body with such a prelam body. According to some embodiments herein, a prelam body of a smart card comprises a prelam body substrate having an IC landing area provided on a first main surface of the prelam body substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein the at least one contact pad is electrically coupled with at least one conductive line routed in or on the prelam body substrate, and a chip having at least one contact element arranged on a second main surface of the chip, wherein the at least one contact element is in electric connection with the at least one contact pad. The chip is flip-chip bonded to the prelam body substrate such that the first main surface and the second main surface face each other and that the chip at least partially overlies the at least one contact pad. Herein, the at least one dummy island and the at least one contact pad each represent a support for the chip on the prelam body substrate.
The invention relates to an electrical circuit, for example of the printed circuit type, for producing a module intended to be integrated into a chip card. This module has electrical contact—or connector—areas for the connection and communication of the chip to and with a read/write system. In order to give them a different colour from the gilded or silvered ones generally used, these electrical contact areas are at least partially covered with a surface layer comprising a compound of XpOqNrCs type, in which X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, with p, q>0 and r≥0 and/or s≥0. The invention also relates to a method for manufacturing such an electrical circuit.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
55.
Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module
Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.
The present invention refers to a method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, wherein the method comprises the steps of providing an intermediate circuit comprising the NFC chip connected the sensor, for instance a biosensor, and of providing a single side inlay comprising a substrate and the antenna. Afterwards, the intermediate circuit and the single side inlay are mated together so as to connect the NFC chip to the antenna. The present invention also refers to the integrated circuit or tag produced according to this method.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
57.
Method of forming a prelam body of a smart card, a method of forming a smart card, a prelam body, and a smart card
The present disclosure provides in various aspects for a method of forming a prelam body of a smart card and a prelam body of a smart card. In some illustrative embodiments, a prelam body of a smart card comprises at least one contact terminal patch, which comprises a patch base layer and a plurality of conductive pads provided on a surface of the patch base layer, wherein the plurality of conductive pads is arranged on the patch base layer in accordance with a predefined interconnection design, and a prelam sheet with a plurality of openings, each opening accommodating a dedicated one of the conductive pads, wherein the at least one contact terminal patch is mounted to the prelam sheet.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
58.
SECURITY INLAY, METHOD OF FABRICATING A SECURITY INLAY, SECURITY DOCUMENT, METHOD OF FABRICATING A SECURITY DOCUMENT, SYSTEM FOR AUTHENTICATING A SECURITY DOCUMENT HAVING AT LEAST ONE SECURITY FEATURE, AND METHOD OF AUTHENTICATING A SECURITY DOCUMENT
In various aspect, the present disclosure relates to a security inlay, a method of fabricating a security inlay, a security document, a method of fabricating a security document, a system for authenticating a security document having at least one security feature, and a method of authenticating a security document. In some aspects herein, a security inlay for a security document is provided, the security inlay comprising an inlay substrate, an antenna provided in or on the inlay substrate, and a chip or chip module integrated into the inlay substrate and coupled to the antenna. The antenna is equipped with a security feature formed by an antenna wiring pattern having an antenna coding section in which an antenna wire is routed in accordance with a coding pattern.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
G06K 19/14 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code utilisant des marquages de différentes sortes sur le même support d'enregistrement, p. ex. un marquage étant lu optiquement et l'autre par des moyens magnétiques au moins une sorte de marquage étant utilisée pour l'authentification, p. ex. de cartes de crédit ou de cartes d'identité le marquage étant lu par irradiation
59.
Method for electrochemical metallization of a double-sided electrical circuit for a smart card and electrical circuit produced using said method
Method for the electrochemical metallization of a double-sided electrical circuit for a chip card. Contacts and current leads are located on a front face. An antenna and connection pads are located on a rear face. This method includes an operation of electrochemically depositing at least one layer of electrically conductive material on connection pads, while supplying these connection pads with current via the current leads, contacts and metallized holes establishing electrical continuity between the front face and the rear face. This method furthermore includes, after the operation of electrochemically depositing at least one layer of electrically conductive material, an operation of electrically isolating at least one metallized hole from a connection pad. Electrical circuit obtained using this method.
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
In an aspect, the present invention provides a document, comprising an RFID inlay, a shield element and a support portion, wherein the shield element, the support portion, and the RFID inlay are provided in a stack configuration. Herein, the shield element and an antenna of the RFID inlay are only partially overlapping each other.
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
61.
METHOD FOR MANUFACTURING AN ELECTRICAL CIRCUIT WITH AN ANTI-CORROSION LAYER, AND ELECTRICAL CIRCUIT OBTAINED BY THIS METHOD
The invention relates to a method for manufacturing an electrical circuit comprising at least one conductive trace. This method comprises a step of providing (100) a flexible sheet made of electrically conductive material. This method further comprises a step of depositing (1020) a sol-gel metal-organo-mineral composition on at least one region of this sheet. This sol-gel composition comprises conductive nanowires in a mass concentration greater than 10% on a dry matter basis. This method also comprises a heat-treatment step (1030) subsequent to the step of depositing (1020) the sol-gel metal-organo-mineral composition. The invention also relates to an electrical circuit obtained by this method, a smart card with a module comprising such an electrical circuit, and a biometric module and a sensor each comprising such an electrical circuit.
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
62.
PRINTED CIRCUIT WITH SURFACE MOUNT CAPACITOR FOR INTEGRATION INTO A SMART CARD
The present disclosure refers to a printed circuit for integration in a smart card, wherein the printed circuit comprises a printed circuit substrate of dielectric material, an antenna having a resonance frequency, one or more contact pads forming an external contact pattern, and at least one surface mount (SMD) capacitor connected to the antenna so as to adjust its resonance frequency, in order to match a predefined resonance frequency, for instance a resonance frequency comprised within the range defined in ISO 14443 standards. The present disclosure also refers to a module comprising the above-indicated printed circuit and an IC chip and to a corresponding smart card.
The present invention refers to a dual interface electronic module for a smart card and to the fabrication method thereof. The dual interface electronic module comprises a contact plate for external connection, which includes at least one antenna electrical connector, and a multilayered PCB including a value-add component, for instance a display. The contact plate and the multilayered PCB are connected together by means of a plurality of interconnects at an interconnection interface; the contact plate has a first area in correspondence of the interconnection interface and the multilayered PCB has a second area in correspondence of the interconnection interface. The first area is larger than the second area, so as to define an excess portion and at least one portion of the at least one antenna electrical connector is placed on the excess portion so as to be exposed for being electrically connected to a corresponding antenna of the smart card. The present invention also refers to the smart card comprising such a dual interface electronic module and to the fabrication method thereof.
The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
65.
DOCUMENT WITH ANTENNA OF DUAL SHIELDING/COMMUNICATION FUNCTION
In an aspect, the present invention provides a document having a first page and a second page connected by a hinge portion. In illustrative embodiments, the document comprises an RF chip module, a first antenna portion formed on the first page, a second antenna portion formed on the second page, and at least one foldable bridge formed on the hinge portion, wherein the at least one foldable bridge electrically connects endings of the first and second antenna portions such that the first and second antenna portions have a first inductance adapted to provide the document with a first resonance frequency in a closed condition of the document in which the first page is placed on the second page, while the first and second antenna portions have a second inductance adapted to provide the document with a second resonance frequency different from the first resonance frequency in an open condition of the document in which the first page is removed from closed condition.
In various aspects, the present disclosure provides an antenna inlay for a document and a document with such an antenna inlay. In some embodiments herein, an antenna inlay for a document comprises an inlay substrate foldable along a folding line, and an antenna formed one or embedded into the inlay substrate. The antenna comprises a first antenna portion having at least one first antenna portion routed outside the folding line and at least one conductive bridging portion routed to extend across the folding line. The at least one conductive bridging portion is electrically connected with an associated one of the at least one first antenna portion and the at least one conductive bridging portion is routed at the folding line so as to cross the folding line at an inclination angle unequal to 90°.
When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.
B32B 37/22 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification impliquant l'assemblage à la fois de couches individualisées et de couches continues
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
The present invention relates to a moisture sensor (10) comprising a support substrate (12) having a first face (14) and a second face (16) that is geometrically opposite the first face (14), and wherein: the first face (14) is provided with a plurality of electrode pairs (30) configured to be in contact with a liquid, and the second face (16) comprises a plurality of detection means (20) connected to each other in parallel, and each detection means (20) comprises a transistor (T) associated with an electrode pair (30), and the moisture sensor (10) is sensitive to an equivalent resistance (Réq) of the plurality of detection means (20).
A61F 13/00 - Bandages ou pansementsGarnitures absorbantes
A61F 13/42 - Garnitures absorbantes, p. ex. serviettes ou tampons hygiéniques pour application externe ou interne au corpsMoyens pour les maintenir en place ou les fixerApplicateurs de tampons avec un indicateur ou une alarme d'humidité
G01M 3/16 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de l'absorption d'un fluideRecherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
69.
PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH SUCH A PRINTED CIRCUIT AND REEL-TO-REEL TAPE FOR USE IN A FABRICATION PROCESS OF A SMART CARD
The invention relates in various aspects to a printed circuit for integration into a smart card, a smart card with such a printed circuit and to a reel-to-reel tape for use in a fabrication process of a smart card, wherein the reel-to-reel tape comprises a plurality of such printed circuit. In some illustrative embodiments of an aspect, a printed circuit is provided, the printed circuit comprising a printed circuit support, an antenna wiring pattern of at least one winding continuously extending between a first terminal and a second terminal, and at least one antenna path portion continuously extending between a third terminal and a fourth terminal. Herein, each of the at least one antenna path portion extending between the third and fourth terminal can increase a path length of the antenna wiring pattern if connected to the antenna wiring pattern, adding a path length of the at least one added antenna path portion to the initial path length of the antenna wiring pattern.
G06K 19/00 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
G07F 7/08 - Mécanismes actionnés par des objets autres que des pièces de monnaie pour déclencher ou actionner des appareils de vente, de location, de distribution de pièces de monnaie ou de papier-monnaie, ou de remboursement par carte d'identité codée ou carte de crédit codée
H04B 5/00 - Systèmes de transmission en champ proche, p. ex. systèmes à transmission capacitive ou inductive
70.
SENSING SYSTEM, SMART WEARING ARRANGEMENT AND METHOD OF FABRICATING A SENSING SYSTEM
The present invention provides a sensing system, a smart wearing arrangement and a method of fabricating a sensing system. In accordance with illustrative embodiments, the sensing system comprises: a flexible substrate, at least one sensor device, a chip device, and at least one electrical line, the at least one electrical line electrically connecting the chip device and the at least one sensor device. Herein, the at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61F 13/00 - Bandages ou pansementsGarnitures absorbantes
71.
WIRE PAD DESIGN OF A CONNECTION PAD IN A PRELAM BODY OF A SMART CARD, PRELAM BODY, SMART CARD, METHOD OF FORMING A WIRE PAD DESIGN, AND METHOD OF FORMING A SMART CARD
In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad em- bedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.
A smartcard receives biometric capabilities by incorporating a biometric sensor chip based on a “dual” flip chip bonding technique. In particular embodiments, the sensor chip may be incorporated into the card-type substrate after having completed any high temperature process steps required for laminating the various foil layers of the card-type substrate.
In various aspects, the present invention relates to a lead frame for integration into a smart card, a card body of a smart card, a smart card, and a method of forming a smart card. In an aspect of the present disclosure, a lead-frame for integration into a smart card is provided comprising a planar lead-frame body portion, at least one contact pad having a planar contact portion, and at least one bridging portion coupled with the planar lead-frame body portion and extending away from the planar lead-frame body towards the at least one contact pad and between the planar contact portion and the planar lead-frame portion, wherein the at least one bridging portion extending out of a plane defined by at least one of the planar lead-frame body portion and the planar contact portion and at least partially in parallel to a substantially normal direction of the planar contact portion.
A method for manufacturing flexible printed circuits for smart card modules, wherein a complex material is provided. Said complex material comprises a set of at least two different-coloured strata. Areas (64, 65, 66, 67) of said set are visible through the layer of electrically conductive material (60). Said manufacturing method comprises a step of etching, on a portion of the exposed area (64, 65, 66, 67) of the strata set, at least one of the two different-coloured strata, using a laser beam, so as to render visible the other of the two different-coloured strata. A printed circuit manufactured by said method. A module and a smart card comprising said printed circuit.
The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.
A method for manufacturing a sensor comprising at least two electrodes (350, 352), said method including the steps of providing a flexible dielectric substrate (310) having an electrically conductive material layer (320) on at least one of its faces. The electrodes (350, 352), conducting connection tracks (342) and a common current supply track (340) are etched into the layer of electrically conductive material (320). The method further includes electrodepositing one or more layers on the two electrodes (350, 352) and a step of selectively electrochemically depositing, on at least one electrode, at least one layer of a material different from that or those already deposited on another electrode.
The present invention concerns a multilayer structure for a biosensor, comprising a base layer, a biocompatible layer comprising a reagent on the base layer, a self-adhesive layer on the biocompatible layer, such that the reagent is at least partially aligned with a channel formed in the self-adhesive layer, and a top layer on the self-adhesive layer. According to the present invention, the biocompatible layer is deposited directly onto the base layer and is adhesive. The present invention also concerns a biosensor and a method for the manufacture of such a multilayer structure.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/05 - Détection, mesure ou enregistrement pour établir un diagnostic au moyen de courants électriques ou de champs magnétiquesMesure utilisant des micro-ondes ou des ondes radio
A61B 5/1477 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques non invasifs
78.
Antenna for a radio frequency identification transponder and radio frequency identification transponder
An antenna for a radio frequency identification transponder includes an electrically conductive main portion, an electrically conductive first transverse portion and an electrically conductive second transverse portion. The first and second transverse portions are connected to opposite portions of the main portion, extend in an antenna width direction and are spaced apart from each other in an antenna length direction. The antenna further includes an electrically conductive first tail portion extending in the antenna length direction and being connected to an end of the first transverse portion distal of the main portion. The main portion includes a loop and a plurality of meanders. The loop includes a pair of contacts configured for connecting the antenna to a radio frequency identification chip. An extension of the meanders in the antenna width direction is smaller than an extension of the loop in the antenna width direction.
Process for producing bands for biological measurements on the basis of flexible circuits on a carrier strip, provided with a flexible insulating substrate provided, on at least one of its faces, with conductive tracks, contact pads and electrodes, includes the application, to said face, of masking means leaving the contact pads and/or the electrodes of the band visible and the selective deposition of a layer of noble metal on said contact pads and electrodes through said masking means.
Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.
Method for manufacturing a module (2) for a chip card (1), wherein a polymer material (13) comprising conductive particles is deposited in two connection wells (12) or on two conductive tracks which are formed from a conductive sheet arranged at the rear face of the module (2). After being deposited, this polymer material (13) forms, at the rear face, an excess thickness which comes, during the insertion of the module (2), into contact with the ends of an antenna (10). Between the manufacture of the modules (2) and their insertion, the modules are arranged on a band which can be rolled up for storage.
In various aspects, the present disclosure is directed to a device and method enabling communication only in case of a personal identification. In some aspects, a communication device is provided, the communication device comprising a transponder unit configured for at least one of sending data to and receiving data from another communication device, a biometric sensor unit configured to sense biometric data of a user of the communication device, and a security interface unit arranged between the transponder unit and the biometric sensor. Herein, the security interface unit is configured to enable the transponder unit for at least one of sending and receiving data upon biometric data sensed by the biometric sensor being verified as representing verified biometric data, and the transponder unit comprises a communication interface having a state machine. The state machine being enabled independently from the biometric data sensed by the biometric sensor unit being verified by the security interface as representing verified biometric data.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
83.
Datapage for a security document and a method of manufacturing the same
A datapage of a security document includes a non-planar end face that is to be connected to a hinge material, thereby providing for increased overall contact surface area between hinge material and the datapage. Consequently, a respective connecting portion including such an interdigitated structure may provide for superior robustness while still ensuring a high degree of integrity of the datapage and a robust mechanical connection to the remainder of the security document.
B42D 25/30 - Caractéristiques d’identification ou de sécurité, p. ex. pour empêcher la falsification
G06K 19/04 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par la forme
84.
Biometric sensor module for a smart card and method for manufacturing such a module
Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.
Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.
G06K 7/08 - Méthodes ou dispositions pour la lecture de supports d'enregistrement avec des moyens de perception des modifications d'un champ électrostatique ou magnétique, p. ex. par perception des modifications de la capacité entre des électrodes
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
86.
METHOD FOR DEPOSITING A BRONZE ALLOY ON A PRINTED CIRCUIT AND PRINTED CIRCUIT OBTAINED BY SAID METHOD
Disclosed is a method for depositing a bronze alloy on a printed circuit (5). Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit (5) obtained by this method.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01L 23/498 - Connexions électriques sur des substrats isolants
B32B 15/00 - Produits stratifiés composés essentiellement de métal
C25D 5/10 - Dépôt de plusieurs couches du même métal ou de métaux différents
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.
H01L 23/498 - Connexions électriques sur des substrats isolants
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A pre-form for a security document comprising at least a bottom layer, a central layer and a top layer is presented, wherein the central layer comprises one or more insert inlays disposed between a first corner and a second corner of one side, so as to form a horizontal color-coded pattern, wherein said one or more insert inlays comprise a light guide material that can interact with input light entering through at least one window of the pre-form for a security document and exiting from the one or more inserts, so that the color-coded pattern is modified by the interaction between a predefined input light and the light guide material. Moreover, the methods for producing the pre-form for a security document and for operating it in such a way to assure superior tampering resistance are disclosed.
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B42D 25/30 - Caractéristiques d’identification ou de sécurité, p. ex. pour empêcher la falsification
89.
Chip card, antenna support for a chip card and method for manufacturing an antenna support for a chip card
The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
90.
PRELAM BODY OF A SMART CARD, METHOD OF FORMING A PRELAM BODY OF A SMART CARD, AND SMART CARD
The present disclosure provides in various aspects for a prelam body of a smart card, a method of forming a prelam body of a smart card, and a smart card having a card body with such a prelam body. According to some embodiments herein, a prelam body of a smart card comprises a prelam body substrate having an IC landing area provided on a first main surface of the prelam body substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein the at least one contact pad is electrically coupled with at least one conductive line routed in or on the prelam body substrate, and a chip having at least one contact element arranged on a second main surface of the chip, wherein the at least one contact element is in electric connection with the at least one contact pad. The chip is flip-chip bonded to the prelam body substrate such that the first main surface and the second main surface face each other and that the chip at least partially overlies the at least one contact pad. Herein, the at least one dummy island and the at least one contact pad each represent a support for the chip on the prelam body substrate.
The present invention provides for a prelam body of a smart card, a smart card, a method of forming a prelam body of a smart card, and a method of forming a smart card. In accordance with some embodiments herein, a prelam body comprises a base substrate formed of at least one layer, and at least one overlay sheet layer formed on one side of the base substrate, wherein the at least one overlay sheet layer has a recess formed therein. The recess is at least partially extending through the at least one overlay sheet layer such that an opening of the recess is exposed.
The present invention relates to a pre-form for a smartcard, a smartcard and manufacturing method, in which an electronic module for card internal wireless communication may be implemented in an early manufacturing stage. Furthermore, substantially opaque layers may be provided so as to obtain an invisible card antenna, thereby significantly improving the overall manufacturing process and increasing design flexibility for a card manufacturer.
Electrical circuit for a smart card chip module (2), comprising an insulating layer having a front main face and a rear main face (7). An antenna (8) is made in a first conductive layer laying on the rear main face (7). This antenna (8) extends over an antenna area delimited by a peripheral edge (10). The antenna (8) comprises at least one inner loop and one outer loop. The outer loop runs along the peripheral edge (10) except over at least one first connecting segment (16) diverted from the peripheral edge (10), towards or in a central zone (15) of the antenna area. Further, the outer loop of the antenna comprises at least a second connecting segment (18) diverted from the peripheral edge (10) towards a central zone of the antenna area.
The present disclosure provides in various aspects for a method of forming a prelam body (100) of a smart card and a prelam body (100) of a smart card. In some illustrative embodiments, a prelam body of a smart card comprises at least one contact terminal patch (1), which comprises a patch base layer (3) and a plurality of conductive pads (5) provided on a surface of the patch base layer, wherein the plurality of conductive pads is arranged on the patch base layer in accordance with a predefined interconnection design, and a prelam sheet (20) with a plurality of openings (22), each opening accommodating a dedicated one of the conductive pads, wherein the at least one contact terminal patch is mounted to the prelam sheet.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
95.
A METHOD OF FORMING A SMART CARD, A PRELAM BODY, AND A SMART CARD
The present invention provides, in various aspects, a method of forming a smart card, a prelam body, and a smart card. In some illustrative embodiments, a smart card having at least one feature module integrated therein, is formed, wherein a substrate having at least one first landing pad formed thereon is prepared, a solder material is formed on the at least one first landing pad, the substrate with the solder material on the at least one first landing pad is integrated into a prelam body, wherein the substrate is arranged at a first surface of the prelam body, the prelam body is recessed at a second surface of the prelam body opposite the first surface, wherein an upper surface of the solder material on the at least one first landing pad is exposed in a first recess of the prelam body, a first feature module is inserted into the first recess of the prelam body, and the first feature module inserted into the first recess is bonded to the prelam body so as to electrically connect the at least one first landing pad to the first feature module via the solder material.
Method for manufacturing a biometric sensor module for a chip card, including steps of
providing a dielectric substrate having a front face and a back face, and
attaching a biometric sensor for fingerprint detection to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area configured such that a finger is placed on it. At least at the surface of the surface of this detection area, the dielectric substrate has an exposed homogeneous polymer material.
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
In an aspect, the present invention provides a document, comprising an RFID inlay, a shield element and a support portion, wherein the shield element, the support portion, and the RFID inlay are provided in a stack configuration. Herein, the shield element and an antenna of the RFID inlay are only partially overlapping each other.
Method for electrochemical metallisation of a double-sided electrical circuit (3) for a smart card. Contacts (5) and current feeds (4) are located on a front side. An antenna (8) and connection pads (51, 52) are located on a rear side. Said method comprises an operation of electrochemically depositing at least one layer of electrically conductive material (60) onto connection pads (51, 52), by supplying said connection pads (51, 52) with current via the current feeds (4), contacts (5) and plated through-holes (40) establishing electrical continuity between the front side (6) and the rear side (7). Said method further comprises, following the electrochemical deposition of at least one layer of electrically conductive material (60), an operation consisting of electrically isolating at least one plated through-hole (40) from a connection pad (52). Electrical circuit produced using said method.
pqrss type, wherein X can be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, wherein p, q > 0 and r ≥ 0 and/or s ≥ 0. The invention also relates to a method for producing such an electric circuit.
The present invention provides in some aspects a smart card (10) and a method of forming a smart card (10). In illustrative embodiments herein, the smart card (10) has an entirety (3) of electric and electronic components which are all provided with an insert module (1). The insert module (1) having the entirety (3) of electric and electronic components of the smart card (10), is accommodated into a recess provided in a card body (7) of the smart card (10).
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/073 - Dispositions particulières pour les circuits, p. ex. pour protéger le code d'identification dans la mémoire
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
