An electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process including an electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method. The electroless plating process includes a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present disclosure is formed by this process.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
Produits et services
Metal plating in the nature of composite plating provided with a plurality of lamination; Metal plating in the nature of composite plating containing a nickel layer and a gold layer; Metal plating in the nature of composite plating containing a nickel layer, a gold layer and a palladium layer; Metal plating in the nature of composite plating provided with a plurality of lamination containing a nickel layer
3.
ELECTROLESS PLATING PROCESS AND TWO-LAYER PLATING FILM
The purpose of the present invention is to provide an electroless plating process in which manufacturing costs are suppressed and a two-layer plating film obtained through said process. In order to achieve this purpose, there is employed an electroless plating process in which a nickel plating film and a gold plating film are formed in the stated order on the surface of a copper material through an electroless plating method, wherein the electroless plating process comprises a step for forming a boron-containing nickel plating film through a reductive electroless nickel strike plating method, and a step for forming a gold plating film through a reductive electroless gold plating method. The two-layer plating film according to the present invention is formed through the abovementioned process.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
37 - Services de construction; extraction minière; installation et réparation
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Chemicals which contains precious metals. A precious-metals recovery system; a gold recovery system; a silver recovery system; a platinum recovery system; a palladium recovery system; precious-metals plating machines. Precious metals; gold and its alloys; gold ingots; silver and its alloys; silver ingots; platinum and its alloys; platinum ingots; Palladium, a palladium alloy; palladium ingots; ruthenium ingots. Repair or maintenance of a precious-metals recovery system. Recovery of the precious metals from a scrap and waste fluid; reproduction and refinement, or processing of noble metal. The inspection and research, or analysis of a noble metal material; the inspection and research, or analysis of nonferrous-metals raw materials; testing or research on wastewater treatment; testing or research on prevention of pollution; the inspection and research, or analysis on environment.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
37 - Services de construction; extraction minière; installation et réparation
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Metal plating chemical compositions, namely, precious-metals plating medicine; Chemicals containing precious metals for use in the manufacture of a wide variety of goods Metal working machines, namely, a precious-metals recovery system; Metal working machines, namely, a gold recovery system; Metal working machines, namely, a silver recovery system; Metal working machines, namely, a platinum recovery system; Metal working machines, namely, a palladium recovery system Repair and maintenance of metal working machines, namely, precious-metals recovery systems Recovery of the precious metals from a scrap and waste fluid; Reproduction and refinement, and processing of noble metal The inspection and research, and analysis of a noble metal material; The inspection and research, and analysis of nonferrous-metals raw materials; Testing and research on waste water treatment; Testing and research on prevention of pollution; The inspection and research, and analysis on environment
An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
The purpose of the present invention is to provide an electroless plating process which is capable of obtaining a film equipped with excellent mounting properties and capable of making the thickness of the nickel plating film thin when a nickel plating film and a gold plating film are formed in this order on the surface of a copper material. This electroless plating process for forming a nickel plating film and a gold plating film in this order on the surface of a copper material by using an electroless plating method is characterized by being provided with a step for forming a nickel plating film on the surface of a copper material by using an electroless strike plating method, and a step for forming a gold plating film by using a reduction-type electroless plating method.
C23C 18/52 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique en utilisant des agents réducteurs pour le revêtement avec des matériaux métalliques non prévus par un seul des groupes
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
H01L 21/28 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p. ex. dépôt électrolytique
H01L 21/3205 - Dépôt de couches non isolantes, p. ex. conductrices ou résistives, sur des couches isolantesPost-traitement de ces couches
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
8.
ELECTROLESS NICKEL STRIKE PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING FILM
The purpose of the present invention is to address the problem of providing an electroless nickel plating solution capable of forming a nickel plating film which is capable of definitively covering the surface of a copper material even when the film is thin, and a method for forming the nickel plating film which uses the electroless nickel plating solution. In order to solve this problem, this electroless nickel strike plating solution to be used in order to form a nickel plating film on the surface of a copper material is characterized by containing: a water-soluble nickel salt in the amount of 0.002-1g/L by nickel content; one or more types of carboxylic acids or salts thereof; and one or more types of reducing agents selected from the group consisting of dimethylamine borane, trimethylamine borane, hydrazine, and a hydrazine derivative.
C23C 18/34 - Revêtement avec l'un des métaux fer, cobalt ou nickelRevêtement avec des mélanges de phosphore ou de bore et de l'un de ces métaux en utilisant des agents réducteurs
H01L 21/28 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p. ex. dépôt électrolytique
H01L 21/3205 - Dépôt de couches non isolantes, p. ex. conductrices ou résistives, sur des couches isolantesPost-traitement de ces couches
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
The present invention addresses the problem of providing an electroless palladium/gold plating process capable of forming a palladium/gold plating film selectively only on copper even on small single electrodes or narrow L/S wiring without the occurrence of defective palladium deposition. In order to solve said problem, an electroless palladium/gold plating process is characterized in being provided with: a step (S4) for adjusting the copper surface potential by immersing an insulating base material, the surface of which is provided with copper, in an aqueous sulfur-containing solution containing at least one kind of sulfur compound selected from a group consisting of thiosulfate salts and thiols; a step (S5) for performing electroless palladium plating on the insulating base material with adjusted copper surface potential to form a palladium plating film on the copper; and a step (S6) for performing electroless gold plating on the insulating base material in which a palladium plating film has been formed on the copper to form a gold plating film on the palladium plating film.
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
The purpose of the present invention is to provide: an electroless palladium plating solution that makes it possible to form a crack-containing palladium coating without performing a heating process after an electroless plating process, has an excellent bath stability, and enables a continuous plating process; a method for preparing the electroless palladium plating solution; and an electroless palladium plating method in which the electroless palladium plating solution is used. The electroless palladium plating solution is used when forming a crack-containing palladium coating, and is characterized in containing 0.9 mmol to 45 mmol of a palladium salt, 9 mmol to less than 100 mmol of ethylenediamine, and 4 mmol to 40 mmol of sodium hypophosphite, and containing a palladium complex.
The purpose of the present invention is to provide a hard gold plating solution by which deposition of gold at unwanted locations can be reliably suppressed. Provided is a hard gold plating solution which is for electroplating and which contains a gold ion supply material, an electrically conductive salt, a complexing agent, a metal salt that contains an element that alloys with gold, and a gold deposition-controlling agent. The hard gold plating solution is characterized in that the gold ion supply material is contained at a quantity of 0.5-14 g/L in terms of gold, the specific gravity of the solution is 2-16 ºBe' at a solution temperature of 25ºC, and the electrical conductivity is 10-70 mS/cm at a solution temperature of 25ºC.
Provided is an electroless platinum plating solution with which excellent solution stability can be obtained without using heavy metal ions or thiol compounds and with which generation of ammonia gas can be prevented. The electroless platinum plating solution is characterized in comprising a water-soluble platinum compound and at least one kind of reducing agent selected from a group consisting of formalin, glucose, and formic acid salts. Preferably, the water-soluble platinum compound is at least one kind of water-soluble platinum compound selected from a group consisting of: platinous (II) chloride, chloroplatinic (II) acid, chloroplatinic (II) acid salts, platinic (IV) chloride, chloroplatinic (IV) acid, chloroplatinic (IV) acid salts, hexahydroxoplatinic (IV) acid, hexahydroxoplatinic (IV) acid salts, and tetraammine(dichloro)platinum (II). It is preferable that the electroless platinum plating solution comprises an organic acid.
The purpose of the present invention is to provide an electroless gold plating solution which does not contain harmful substances and is capable of achieving good wire bonding performance, while suppressing corrosion of a base metal. In order to achieve this purpose, an electroless plating solution that contains a water-soluble gold compound, citric acid or a citrate, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate, hexamethylenetetramine and a chain polyamine containing three or more amino groups and an alkyl group having three or more carbon atoms is employed as a reduction-type electroless gold plating solution which is used for the purpose of forming an electroless gold plating film on the surface of an object to be plated by means of electroless plating.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
Produits et services
Inorganic salts; organic acid; metallic oxide; salts of
precious metal; salts from rare earth metals; industrial
chemicals; precious metal plating solution; additives to
plating solution; remover of plated metal. Precious metals, unwrought or semi-wrought. Precious metal plating; metal treating; recycling of waste
and trash; incineration of waste and trash.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
Produits et services
Inorganic salts; organic acid; metallic oxide; salts of
precious metal; salts from rare earth metals; industrial
chemicals; precious metal plating solution; additives to
plating solution; remover of plated metal. Precious metals, unwrought or semi-wrought. Precious metal plating; metal treating; recycling of waste
and trash; incineration of waste and trash.
Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 moles/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.
An electrolytic recovery device for gold or silver is constituted so that gold or silver electroplated onto cathodes can be easily stripped off so that a barrel cathode (3) can be repeatedly used. An electrolytic recovery device for gold or silver, which comprises an electrolysis layer (1), a control device (2), anode (4), and barrel cathode (3), is constituted so that an insulating cap is fitted onto the entire circumference of a lower edge, a plurality of strip-shaped insulators are detachably applied with gaps provided therebetween in the longitudinal direction at one location of the outer circumferential surface of the barrel cathode (3), and electroplated gold or silver can be thereby easily stripped off from the barrel cathode by removing the strip-shaped insulators.
An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
An electroless pure palladium plating solution capable of forming a pure palladium plating film with less unevenness of plating film is provided. The solution is characterized by comprising an aqueous solution containing (a) 0.001 to 0.5 mol/L of a water-soluble palladium compound, (b) 0.005 to 10 mol/L of at least two members selected from aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/L of phosphoric acid and/or phosphate, and (d) 0.005 to 10 mol/L of sulfuric acid and/or sulfate.
