Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm
A MEMS die comprises a substrate having an opening, a diaphragm attached to the substrate around a periphery of the opening so as to cover the opening, the diaphragm having an aperture, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate, the backplate comprising a plug that extends toward the aperture from an attached end to a free end. In an embodiment the free end of the plug has a smaller area than the aperture, and the plug is separated from the diaphragm by a gap, wherein a size of the gap determines a level of fluid communication across the diaphragm through the aperture.
An ear-worn hearing device is disclose and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. A physiological or activity sensor is located at a side of the body portion, and a resilient lobe extends from or is disposed at least partially about the body portion. The resilient lobe has greater stiffness on a side of the body portion opposite the side at which the sensor is located, wherein the resilient lobe biases the sensor toward ear tissue when the hearing device is worn by a user.
An ear-worn hearing device is disclosed and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. a resilient portion protrudes from a side of the body portion and includes a physiological or activity sensor coupled to a flexible portion of a flex harness. The resilient portion at least partially covers a portion of the flex harness without impeding operation of the sensor, wherein the flexible portion and the sensor are flexible toward and away from the body portion upon depression and release of the resilient portion.
A sensor assembly including a transducer and interface circuit with a DSL-controlled input voltage is disclosed. The interface circuit includes a logic circuit configured to generate and provide a pulse width and amplitude modulated (PWAM) signal to an n-bit iDAC coupled to an analog front end (AFE) amplifier or buffer. The PWAM signal is based on an output of a forward signal-path ADC or low-power ADC coupled to the AFE amplifier or buffer, wherein the n-bit iDAC regulates a voltage at the input of the AFE amplifier or buffer based on the PWAM signal.
An ear-worn hearing device with occlusion reduction is disclosed. The hearing device includes a signal processor configured to generate an anti-occlusion signal based on a feedforward signal from a vibration sensor located to detect tissue-propagated vibration within the user's at least partially occluded ear canal. Optionally, the anti-occlusion signal can also be based on a feedback signal from a microphone located to detect sound within the at least partially occluded ear canal. Unwanted vibrations detected by the vibration sensor can optionally be removed from the anti-occlusion signal based on filtering the anti-occlusion signal.
G10K 11/178 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets d'interférenceMasquage du son par régénération électro-acoustique en opposition de phase des ondes acoustiques originales
An ear-worn hearing device includes a speaker disposed in a housing comprising a portion configured for wear over, on, or at least partially in a canal of a user's ear. Microphones are integrated with the housing, and a digital signal processing chain is coupled to and located between the microphones and the speaker. The digital signal processing chain includes active noise cancellation (ANC) circuitry configured to generate an anti-noise signal, and speaker-performance-enhancement circuitry coupled to the ANC circuitry and configured to generate a signal based on the anti-noise signal for the speaker. The digital signal processing chain is configured to communicate audio signals between the ANC circuitry and the speaker-performance-enhancement circuitry without changing a format of the audio signals.
G10K 11/178 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets d'interférenceMasquage du son par régénération électro-acoustique en opposition de phase des ondes acoustiques originales
An acoustic device and method generates an acoustic signal by applying an excitation signal to a first coil disposed about an armature of an acoustic receiver. A second coil magnetically coupled to the first coil generates an electrical output signal in response to the excitation signal applied to the first coil, wherein the output signal of the second coil is indicative of a change in a state or operation of the receiver or acoustic device. In some embodiments, the first and second coils are wired independently of each other, and the acoustic device further includes an electrical circuit which determines the change in the acoustic performance based on a change in the electrical output signal of the second coil.
A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.
A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The present application provides a microelectromechanical systems (MEMS) sensor. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes a buffer circuit including an amplifier input stage having an input coupled to an output of the MEMS motor. The electrical circuit still further includes a frequency dependent input attenuator including a feedback capacitor and an input attenuator low pass filter, the input attenuator low pass filter having an input coupled to the output of the amplifier input stage and an output coupled to a first terminal of the feedback capacitor, where a second terminal of the feedback capacitor is coupled to the input of the amplifier input stage.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
H02N 1/00 - Générateurs ou moteurs électrostatiques utilisant un porteur mobile de charge électrostatique qui est solide
11.
ELECTRICAL CABLE ASSEMBLY FOR EAR-WORN HEARING DEVICES
An ear-worn hearing device and an electrical cable assembly for such a hearing device are disclosed. The electrical cable assembly includes a discrete retention member rotationally and axially fixing the retention member at least partially about an end portion of an electrical conductor conduit. The retention member also axially and rotationally fixes the cable assembly to a housing. The housing can include an acoustic receiver and be configured for insertion at least partially in the user's ear. Alternatively, the housing can be part of a connector plug that mates with a base unit worn outside the user's ear.
A microelectromechanical system (MEMS) die includes a substrate, a diaphragm made from a conductive material and supported over the substrate, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate. The backplate includes a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.
A capacitive sensor assembly is disclosed, including a capacitive motor coupled to a charge pump circuit via a low pass filter, and a frontend amplifier circuit having an input coupled to the capacitive motor interface and an output coupled to an output of the electrical circuit. An injection current source (ICS) is coupled to the charge pump circuit output and configured to control voltage across a diode-based resistive element of the low pass filter during a transient startup phase of the charge pump circuit, wherein a settling time of the charge pump is reduced.
An ear-worn hearing device component is disclosed and includes an electrical connector a housing and multiple connector contacts integrated with a contact carrier. A portion of the contact carrier and connector contacts protrudes from the housing and each connector contact is connected to a corresponding contact of a circuit board located in a cavity of the housing. Wires of an electrical cable mechanically coupled to the electrical connector are connected to the connector contacts via the circuit board.
H01R 24/62 - Engagements par glissement avec une face uniquement, p. ex. dispositifs de couplage à prise modulaire
H01R 12/53 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à des câbles à l'exclusion des câbles plats ou à rubans
H01R 13/502 - SoclesBoîtiers composés de différentes pièces
H01R 13/66 - Association structurelle avec des composants électriques incorporés
A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes an amplifier including an amplifier input stage having an input, coupled to an output of the MEMS motor, the amplifier input stage having a negative input resistance, where a sum of a series resistance of the MEMS motor at the input and the negative input resistance is less than zero, and wherein application of a signal from the output of the MEMS motor to the input of the amplifier input stage produces a negative real part of input current. The electrical circuit still further includes a stabilization circuit having an output coupled to the input of the amplifier input stage, where the stabilization circuit injects a compensation current at the input of the amplifier input stage that offsets at least a portion of the negative real part of input current.
A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
A wearable loudspeaker includes a magnetic-flux-carrying housing that houses an acoustic sealing structure that separates an interior of the housing into a back volume and a front volume acoustically coupled to a sound port. A first coil is retained in the front volume and comprises a first winding about a corresponding first magnetic core. A second coil is retained in the back volume and comprises a second winding about a corresponding second magnetic core. Opposing surfaces of the first and second magnetic cores have opposite magnetic polarities and produce a magnetic field in a gap between the first and second coils. A magnetic-flux-carrying armature is movably located in the gap and fastened to the acoustic sealing structure. Sound is emitted from the sound port when the armature moves the acoustic sealing structure in the gap.
An ear-worn hearing device including an acoustic transducer and a physiological sensor located between an acoustic sealing flange and an inner end portion of the hearing device is disclosed. The flange can be integrated with the hearing device or be an integral part of a removable ear dome. The flange is configured to form at least a partial seal with the user's ear. The flange can also prevent light from entering into the user's ear canal. A removable ear dome can be located on the hearing device by a portion of the physiological sensor protruding from the housing.
An ear-worn hearing device and acoustic transducer subassemblies therefor are disclosed. The hearing device includes a hearing device housing with a sound passage terminating at a sound port on a portion of the hearing device housing configured to protrude toward or into a user's ear canal. Multiple transducers are arranged end-to-end along a lengthwise dimension, wherein a first transducer is located between the other transducers and the sound port of the hearing device housing. The transducers each include a sound outlet acoustically coupled to the sound port via the sound passage.
H04R 1/24 - Combinaisons structurelles de transducteurs séparés ou de parties du même transducteur et sensibles respectivement à plusieurs bandes de fréquences
A method of fabricating a die for a microelectromechanical systems (MEMS) microphone includes the steps of forming a diaphragm, etching a plurality of slots through the diaphragm to define a plurality of springs, releasing the diaphragm and the plurality of springs, wherein the plurality of springs relieves intrinsic stress of the diaphragm, and sealing the plurality of slots with sealing material, thereby disabling the springs.
An in-ear hearing device including an adjustable cable assembly is disclosed. The cable assembly includes a shape-configurable portion between an end portion connected an in-ear unit and a flexible end portion adjustably connected to a behind-the-ear (BTE) unit. The flexible end portion is retractably insertable into a housing of the BTE unit to adjust a length of the cable assembly between the in-ear unit and BTE unit. A cable-retention member of the BTE unit is engageable with the flexible end portion of the cable assembly to fix the cable assembly relative to the BTE unit.
An ear-worn hearing device comprises a housing comprising an end portion configured for at least partial insertion into a user's ear, the housing comprises an opening at the end portion. A removable acoustic transducer assembly is disposed in the opening at the end portion. The transducer assembly is configured for removal from the end portion of the ear-worn hearing device housing. The transducer assembly comprises an acoustic transducer, a support structure mechanically coupled to the acoustic transducer, the open portion of the acoustic transducer acoustically coupled with an opening of the support structure; and a releasable retention structure configured to removably retain the transducer assembly in a cavity of the ear-worn hearing device housing. In some implementations a vibration isolation structure isolates the acoustic transceiver from vibration. In certain implementations, the transducer assembly includes an extraction feature that allows extraction from the end portion of the ear-worn device.
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure defining a passage through which an armature is extendable. The close-ended wall structure includes a plurality of wall portions interconnecting a plurality of folded corner portions, wherein a thickness of the plurality of wall portions less than a thickness of the plurality of folded corner portions.
A balanced armature receiver can include a motor disposed in a case. The motor can include an armature having a first portion fixed to and extending from a yoke and a second portion extending through a coil tunnel. The second portion can have a free end-portion movably disposed in a magnet gap. The balanced armature receiver can include a damping compound-locating structure disposed on one or both of the armature and another portion of the receiver proximate the armature. The balanced armature receiver can include damping compound contacting the damping compound-locating structure and located between the armature and another portion of the receiver.
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A loudspeaker for hearing devices including a diaphragm arranged in a housing to form a back volume and a front volume acoustically coupled to a sound port is disclosed. A surface of a first magnet in the front volume faces an opposing surface of a second magnet in the back volume, and the opposing surfaces of the magnets are separated by a gap and have the same magnetic polarity. An electrical coil assembly coupled to the diaphragm has a radial difference dimension to thickness dimension ratio greater than 1, wherein the diaphragm and the electrical coil assembly are movable in the gap between the magnets in response to an electrical audio signal applied to the electrical coil assembly.
H04R 7/20 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie pour fixer une membrane ou un cône élastiquement à un support au moyen d'un matériau flexible, ressorts, fils ou cordes
H04R 9/02 - Transducteurs du type à bobine mobile, à lame mobile ou à fil mobile Détails
An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.
G01P 15/125 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure formed of a soft magnetic material having multiple folded corners defining an armature passage. A first magnet retaining wall portion of the yoke is arranged in parallel with, and opposite, a second magnet retaining wall portion, wherein at least a portion of the first magnet retaining wall portion has a reduced thickness relative to other wall portions of the close-ended wall structure. The armature is connected to the reduced thickness portion of the first magnet retaining wall portion, thereby reducing an overall z-axis dimension of the motor.
A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm, a geometric central region surrounding the geometric center of the diaphragm assembly, and a plurality of pillars connecting the first and second diaphragms, each of the plurality of pillars having a cross-sectional shape having a maximum radial dimension, A, and a maximum circumferential dimension, B, wherein at least a first subset of the plurality of pillars is disposed within the geometric central region and wherein A is greater than B for the at least first sub set.
Two coils are wrapped in one of numerous different implementations. In one implementation, the two coils are wrapped about a portion of a bobbin that has at least three flanges. The first coil is disposed about a first portion of the bobbin between the first flange and the second flange, and a second coil is disposed about a second portion of the bobbin between the second flange and the third flange.
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.
A microelectromechanical systems (MEMS) die comprises a first diaphragm having a first side and a second side, and a second diaphragm having a first side facing the first side of the first diaphragm. A first plurality of interconnect strips is disposed along at least the first side of the first diaphragm, a second plurality of interconnect strips is disposed along the first side of the first diaphragm, and a third plurality of interconnect strips is disposed along the first side of the second diaphragm. First, second, and third runner strips are disposed along the second side of the first diaphragm transverse to the first, second, and third plurality of interconnect strips, respectively. Each of the first, second, and third runner strips is electrically connected to at least a subset of the first, second, and third plurality of interconnect strips, respectively, via electrical connections disposed through the first diaphragm.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.
A microphone assembly includes a housing including a sound port and an external-device interface having a plurality of electrical contacts. An acoustic transducer, such as a MEMS microphone, is disposed in the housing and is in acoustic communication with the sound port. An electrical circuit is disposed in the housing that is electrically coupled to the acoustic transducer and to electrical contacts on the external-device interface. A magnetic transducer including an electrical coil disposed about a core, such as a telecoil or charging coil configuration, is fastened to the housing. The electrical coil having leads, at least one of the leads electrically terminated at a coil contact of the housing.
In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.
G01L 19/00 - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.
An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
A diaphragm for a balanced armature receiver and combinations thereof. The diaphragm includes a paddle having an area of concentrated mass located at or near a central portion of the paddle, the area of concentrated mass having an area density greater than an area density of other portions of the paddle, wherein the area of concentrated mass shifts a bending-mode frequency of the paddle to a lower frequency compared to a bending-mode frequency of the paddle in the absence of the area of concentrated mass.
H04R 7/20 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie pour fixer une membrane ou un cône élastiquement à un support au moyen d'un matériau flexible, ressorts, fils ou cordes
H04R 9/04 - Structure, montage ou centrage de bobine
40.
Balanced armature receiver with liquid-resistant pressure relief vent
A balanced armature receiver includes a gas permeable barrier located on a portion of the receiver defining a back volume to provide barometric relief. The barrier can be located in a wall portion or diaphragm of the receiver to vent the back volume to an exterior of the receiver directly, via a front volume, or via a nozzle. The gas permeable barrier is impermeable to liquid infiltration and can be configured to influence the low frequency response of the receiver.
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
Various embodiments of balanced armature receivers are disclosed, where the receiver includes a yoke which retains permanent magnets, a coil assembly having a coil tunnel, and an armature coupled to the yoke, with a movable portion extending through the coil tunnel and an end portion that is free to deflect between the magnets when an excitation signal is applied to the coil assembly. There are a stationary protrusion which extends from the stationary portion of the receiver toward the movable portion of the armature, and a movable protrusion which extends from the movable portion of the armature toward the stationary portion of the receiver. The stationary and movable protrusions are offset laterally.
A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
G01C 19/5755 - Details de structure ou topologie les dispositifs ayant une seule masse de détection
G01H 11/06 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores par détection des changements dans les propriétés électriques ou magnétiques par des moyens électriques
A sound-producing balanced armature receiver, as disclosed, includes a receiver housing with a first internal volume, a second internal volume, and a sound outlet. The receiver includes a first diaphragm separating the first internal volume into a first front volume and a first back volume and a second diaphragm separating the second internal volume into a second front volume and a second back volume. The receiver also includes a motor inside the first back volume of the housing such that the motor includes an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to the second diaphragm while providing acoustic separation between the first internal volume and the second internal volume, and a back-volume increasing structure attached externally to the housing and acoustically coupled with the second back volume to provide additional volume to the second back volume.
H04R 7/20 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie pour fixer une membrane ou un cône élastiquement à un support au moyen d'un matériau flexible, ressorts, fils ou cordes
A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.
An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.
A balanced armature (BA) receiver and specifically a nickel-iron (Ni—Fe) alloy armature having improved robustness and performance receivers, as well as motors and receivers including such armatures are disclosed. The Ni—Fe armature has a nickel content of 45% or less by weight, 5% or less additive and impurities by weight, and the balance Fe. The armature can be configured as a U-reed, an E-reed or in some other configuration.
H04R 1/34 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en utilisant un seul transducteur avec des moyens réfléchissant, diffractant, dirigeant ou guidant des sons
A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.
A PM signal generator can generate a variable PM signal based on a position of a movable element of a MEMS motor. A bias voltage generator can provide a bias voltage to the MEMS motor. The bias voltage generator can include a reference signal generator that can generate a reference signal that varies based on variation of pulses of the PM signal. The bias voltage can be based on the reference signal.
H02N 2/00 - Machines électriques en général utilisant l'effet piézo-électrique, l'électrostriction ou la magnétostriction
H02M 3/06 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension
49.
Microphone assembly with improved startup settling
The disclosure relates to a transducer assembly like a microphone including a bias circuit having a charge pump and a filter circuit coupled to a transducer. The filter circuit includes a voltage-controlled resistor located between an output of the charge pump and the transducer, and a capacitor coupled to the voltage-controlled resistor opposite the charge pump, wherein the bias circuit is configured with a larger bandwidth for faster settling during transient operation than during steady-state operation.
H04R 3/04 - Circuits pour transducteurs pour corriger la fréquence de réponse
H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
The present disclosure relates to a transducer assembly including a transducer having a movable member, and a servo-loop controller configured to compensate for effects of a disturbance on the transducer assembly by adjusting a bias voltage applied to the transducer. A servo-loop controller having a smaller bandwidth for out-of-band disturbances than for in-band disturbances and configured to control the bias voltage based on a feedback signal generated by a sensor that detects an effect of the disturbance on the transducer assembly. The transducer assembly can be implemented as a microphone or a speaker among other sensors and actuators.
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
H04R 3/04 - Circuits pour transducteurs pour corriger la fréquence de réponse
Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.
The present disclosure relates to dual-diaphragm moving-coil audio transducers for hearing devices. The transducer includes a magnetic circuit including an inner portion located between first and second coils coupled to corresponding diaphragms supported by a housing. An outer portion of the magnetic circuit is adjacent outer portions of the first and second coils. The transducer emits sound when the first diaphragm moves in a first direction and the second diaphragm moves in a second direction, opposite the first direction, in response to an electrical audio signal applied to the first and second coils.
A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.
A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.
A microelectromechanical system (MEMS) transducer includes a transducer substrate, a diaphragm, and a stiffening member. A first side of the diaphragm is coupled to the transducer substrate. A second side of the diaphragm is coupled to the stiffening member. The stiffening member includes a plurality of fingers extending inwards from a perimeter of an aperture defined by the transducer substrate.
A microphone device, an interface circuit and method are provided for managing a potential difference in sensitivity to a detected environmental stimulus associated with a sensor arrangement, where multiple electrical signals forming a differential signal can be produced, and the multiple electrical signals can be better balanced. Such an interface circuit, which can be used within a microphone device includes a bias voltage generator having one or more bias output voltage terminals, where a respective one of one or more DC bias voltages is produced at each of the bias output voltage terminals, for being coupled to a pair of transduction elements of a sensor. The interface circuit further includes an amplifier circuit having a first input terminal coupled to a first one of the pair of output terminals of the sensor and having a second input terminal coupled to a second one of the pair of output terminals of the sensor, the amplifier circuit producing a differential output signal. The interface circuit still further includes a compensation circuit coupled to the amplifier circuit for producing a balance signal based on an output signal being produced by the amplifier circuit, wherein the balance signal compensates for any difference in amplitude in the first and second electrical signals that are received by the amplifier circuit from the sensor.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
The present disclosure relates generally to digital microphone and other sensor assemblies including a transduction element and a successive-approximation (SA) quantizer configured to reuse a digital code generated for a prior sample period for a current sample period when a reuse condition is satisfied. The SA quantizer does not regenerate a new digital code for the current sample period when the digital code generated for the prior sample period is used thereby reducing power consumption.
A microelectromechanical systems (MEMS) device comprises a diaphragm assembly and a force feedback system. The diaphragm assembly includes a first diaphragm and a second diaphragm facing the first diaphragm, with a low pressure region being defined therebetween. The diaphragm assembly further includes a first plurality of electrodes, a second plurality of electrodes, and a third plurality of electrodes. A solid dielectric is spaced between the first and second diaphragms and includes a plurality of apertures. Each electrode of the first, second, and third pluralities of electrodes is disposed at least partially within an aperture of the plurality of apertures. The force feedback system receives output from the diaphragm assembly and produces a feedback voltage that is applied to the diaphragm assembly to produce an electrostatic force on the diaphragm assembly that counters a low-frequency pressure across the diaphragm assembly.
A digital microphone or other sensor assembly includes a transducer and an electrical circuit including a slew-rate controlled output buffer configured to reduce propagation delay and maintain output rise and fall time independent of PVT variation and load capacitance. In some embodiments, the portions of the output buffer are selectably disabled to reduce power consumption without adversely substantially increasing propagation delay.
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
A microelectromechanical systems (MEMS) device includes a MEMS die and an electrical circuit electrically connected to the MEMS die. The electrical circuit includes a first capacitor that produces a first output signal based on a signal received from the MEMS die, and a second capacitor that produces a second output signal based on a signal received from the MEMS die. The electrical circuit is configured to determine a nominal capacitance of the MEMS die based on a ratio of the first output signal to the second output signal and a ratio of the capacitances of the first and second capacitors.
A MEMS die includes a substrate having an opening formed therein, and a diaphragm attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm comprises first and second spaced apart layers. A backplate is disposed between the first and second spaced apart layers. One or more columnar supports are disposed through holes disposed through the backplate and connecting the first and second spaced apart layers. At least a partial vacuum exists between at least a portion of the first and second spaced apart layers. The first layer further comprises interior and exterior sub-layers at least proximate to each of the one or more columnar supports, wherein the interior sub-layers include one or more apertures disposed therethrough.
A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.
The disclosure relates to microphone and other sensor assemblies having a transduction element and an integrated circuit. The integrated circuit includes a switched-capacitor delta-sigma analog-to-digital converter (ADC) including a first integrator stage having a switched-capacitor circuit and a first plurality of parallel amplifiers. A logic circuit coupled to the integrator circuit is configured to selectably disable a subset of enabled amplifiers of the first integrator stage during a first phase of operation and to re-enable the subset of disabled amplifiers during a second phase.
A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.
A wearable audio device can include a microphone located to detect atmospheric sound including a user's voice. The device can include an acoustic vibration sensor located to detect sound including the user's voice conducted through the user's body. The device can include a body voice filter coupled to the acoustic vibration sensor. The device can include a filter parameter generator coupled to the acoustic vibration sensor and the body voice filter the filter parameter generator configured to generate parameters for the body voice filter based on a frequency characteristic of a signal obtained from the acoustic vibration sensor. The device can include a composite signal generator coupled to the body voice filter and the microphone and configured to generate a composite voice signal based on a low band signal obtained predominately from the body voice filter and based on a high band signal obtained predominately from the microphone.
3) in at least one direction and density selected to increase stiffness and reduce mass. In one implementation, at least the paddle includes a carbon fiber material. The resulting paddle has improved acoustic performance including improved frequency response and less resonance in the audio band, among other benefits.
H04R 7/20 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie pour fixer une membrane ou un cône élastiquement à un support au moyen d'un matériau flexible, ressorts, fils ou cordes
The present disclosure relates to a balanced armature receiver (100) including a housing having a diaphragm comprising a movable paddle (116) disposed in the housing and separating the housing into a back volume (112) and a front volume (110) defined partly by space between a ceiling of the housing and the diaphragm, wherein the paddle is oriented non-parallel to the ceiling. A sound port (142) in the housing acoustically couples the front volume to an exterior of the housing, wherein the sound port is located on an end wall between the diaphragm and the ceiling. A motor disposed in the back volume includes a coil magnetically coupled to an armature having an end portion movably disposed between magnets retained by a yoke and coupled to the paddle.
The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer, a delta-sigma analog-to-digital converter (ADC), a dynamic element matching (DELM) entity configured to compensate for nonlinearity resulting from variation among digital-to-analog conversion (DAC) elements of the ADC, and a control circuit configured to enable and disable the DELM based on a magnitude of a digital signal generated by the ADC.
The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.
Coil bobbins for balanced armature receivers are disclosed. The balanced armature receiver bobbin includes a coil support member, at least two flanges, and a shoulder. The coil support member has an armature passage extending between a first end and a second end thereof. The flanges extending radially from the coil support member such that the first flange extends from the coil support member proximate the first end and the second flange extends from the coil support member proximate the second end. The shoulder extends from the first flange, with the first flange located between the shoulder and the coil support member. The shoulder has a plurality of conductive coil pads disposed on a bottom portion thereof.
A balanced armature receiver including a diaphragm with an elastomer surround is disclosed. The surround is fastened to multiple surfaces of the diaphragm and can be a siloxane-based material. In one implementation, the diaphragm includes a paddle flexibly coupled to a frame and the surround covers a gap between the frame and the paddle.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a variable gain signal processing circuit (203) that processes an electrical signal from the transducer and a gain control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.
The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer and a delta-sigma analog-to-digital converter (ADC) with digital-to-analog converter (DAC) element mismatch shaping and more particularly to sensor assemblies and electrical circuits therefor including a dynamic element matching (DELM) entity configured to select DAC elements based on data weighted averaging (DWA) and a randomized non-negative shift.
A MEMS device can include a first support layer, a second support layer, and a solid dielectric suspended between the first support layer and the second support layer. The solid dielectric can move relative to the first support layer and the second support layer and can include a plurality of apertures. The MEMS device can include a first plurality of electrodes coupled to the first support layer and the second support layer and extending through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes coupled to the first support layer and extending partially into a second subset of the plurality of apertures. The MEMS device can include a third plurality of electrodes coupled to the second support layer and extending partially into a third subset of the plurality of apertures.
A MEMS can include a substrate including a first side and a second side on an opposite side of the substrate from the first side. The MEMS device can include an aperture running through the substrate from the first side to the second side. The substrate can have an edge surrounding the aperture on the first side. The MEMS device can include a diaphragm located over the aperture on the first side. The MEMS device can include a support structure that extends at least partially across the aperture from the edge.
A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.
The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.
A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.
The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.
A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.
A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
An integrated circuit connectable to a sensor includes a transconductance element and a current-input analog-to-digital converter (I-ADC). The transconductance element is connectable to the sensor and is configured to generate a current signal representative of an output of the sensor. The I-ADC is configured to sample and quantize the current signal to generate a corresponding digital sensor signal. The I-ADC includes a continuous-time (CT) integrator stage, a discrete-time (DT) integrator stage, and a feedback digital-to-analog converter (FB-DAC). The CT integrator stage is configured to receive the current output and the I-ADC is configured to generate the digital sensor signal based on an output of the CT integrator stage and an output of the DT integrator stage. The FB-DAC is configured to provide a feedback signal based on the digital sensor signal for adding to the current signal.
An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.
An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.
G01H 11/06 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores par détection des changements dans les propriétés électriques ou magnétiques par des moyens électriques
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
A wearable audio device, like a wireless earpiece, that generates a composite voice signal based on a low band signal and a high band signal is disclosed. The low band signal includes a component of the user's voice obtained from an acoustic vibration sensor that detect body conducted sounds and the high band signal includes a component of the user's voice obtained from a microphone that detects atmospheric sounds, wherein the low band signal is obtained predominately from the acoustic vibration sensor and the high band signal is obtained predominately from the microphone. The low and high band signals are based on one or more characteristics of the vibration sensor signal.
A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.
A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.
A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.
A sensor signal processing circuit including a delta-sigma analog-to-digital converter (ADC) and a control circuit is disclosed. The circuit is configured to adaptively activate one or more segments of current elements for sequential sampling periods based on a digital signal input to a DAC, wherein less than N current elements are allocated to each segment, each current element in an active segment is enabled and either contributes to a feedback signal of the DAC or does not contribute to the feedback signal, and current elements not in an active segment are disabled. The circuit can be integrated with an acoustic or other sensor as part of a sensor assembly.
The present disclosure relates to an integrated circuit connectable to a microelectromechanical system (MEMS) transducer. The MEMS transducer is configured to generate a transducer audio signal in response to sound. The integrated circuit comprises a digital scrambling circuit coupled to a data communication interface. The digital scrambling circuit is configured to convert a digital audio stream, representative of the transducer audio signal, into a corresponding scrambled data stream. The integrated circuit additionally comprises a data bus interface coupled to the digital scrambling circuit and configured to output the scrambled data stream.
An implementation of a MEMS device includes a constrained diaphragm comprising a surface, the diaphragm having a net compressive stress; and a backplate comprising a surface facing the surface of the diaphragm, the surface of the backplate having a center, and a post extending from the surface of the backplate, wherein the post is located at or near a center of the surface and limits a maximum deflection of the diaphragm.
A sensor assembly including a capacitive sensor, like a microelectromechanical (MEMS) microphone, and an electrical circuit therefor are disclosed. The electrical circuit includes a first transistor having an input gate connectable to the capacitive sensor, a second transistor having an input gate coupled to an output of the first transistor, a feedforward circuit interconnecting a back-gate of the second transistor and the output of the first transistor, and a filter circuit interconnecting the output of the first transistor and the input gate of the second transistor.
H03F 1/22 - Modifications des amplificateurs pour réduire l'influence défavorable de l'impédance interne des éléments amplificateurs par utilisation de couplage dit "cascode", c.-à-d. étage avec cathode ou émetteur à la masse suivi d'un étage avec grille ou base à la masse respectivement
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
H03F 1/26 - Modifications des amplificateurs pour réduire l'influence du bruit provoqué par les éléments amplificateurs
H03F 3/187 - Amplificateurs à basse fréquence, p. ex. préamplificateurs à fréquence musicale comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
H03F 3/21 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
H03F 3/213 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.
