H01C 13/02 - Combinaisons structurelles de résistances
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H01C 17/242 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif par laser
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.
A chip resistor includes: an insulating substrate 10; first and second upper surface electrodes (11x, 11b) disposed at both ends in the longitudinal direction of an upper surface of the insulating substrate; and a resistor 12 in electric contact with the upper surface electrodes. The upper surface electrodes include cut-out portions 11a and protruding portions 11b on opposing inner sides, the cut-out portion of the first upper surface electrode extending from the side of at least one of the longitudinal sides of the insulating substrate toward the inside in a transverse direction of the insulating substrate. The cut-out portion of the second upper surface electrode is at a substantially point-symmetric position with respect to the cut-out portion of the first upper surface electrode and the insulating substrate center. The resistor includes contact portions 12b in contact with the protruding portions of the upper surface electrodes, and non-contact portions 12c not in contact with the upper surface electrodes at the cut-out portions, and has trimming grooves (53a, 53b) having a linear shape extending from a point on a non-contact portion end side as a starting end in the longitudinal direction of the insulating substrate.
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p. ex. sérigraphie
H01C 17/242 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif par laser
Provided are: a chip fuse improved such that the impact and steam produced at the time of a blowout can be released in a well-balanced manner; and a method for producing said chip fuse. This chip fuse comprises: a fuse main body including a pair of upper-side and lower-side ceramic substrates arranged facing one another, a fuse wire support body that is sandwiched between the ceramic substrates and has a vertical-direction through hole in the center, and a fuse wire that is laid across both ends of the fuse wire support body so as to bridge the through hole in between; and metal caps fitted to the respective ends of the fuse main body. The opposing surfaces of the upper-side ceramic substrate and the fuse wire support body, as well as the opposing surfaces of the lower-side ceramic substrate and the fuse wire support body, are bonded together so as to tightly seal the through hole, and a unbonded section is formed in a portion of the bonded surface(s).
In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
H05K 7/00 - Détails de construction communs à différents types d'appareils électriques
H01H 85/00 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif
H01H 85/046 - Fusibles sous forme de circuits imprimés
The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif Détails
H01H 37/76 - Élément de contact actionné par fusion d'une matière fusible, actionné par combustion d'une matière combustible ou par explosion d'une matière explosive
7.
Method and apparatus for manufacturing metal plate chip resistors
The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/245 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif par des moyens mécaniques, p. ex. jet de sable, sectionnement, traitement ultrasonore
8.
ELECTROSTATIC PROTECTIVE COMPONENT AND METHOD FOR MANUFACTURING SAME
The purpose of the present invention is to provide an electrostatic protective component and a method for manufacturing the same whereby it is possible to form at low cost a front electrode capable of withstanding electrostatic discharge tests (contact discharge tests) for 500 times or more and maintaining the electrostatic discharge suppression peak voltage below 500 V. For this purpose, an electrostatic protective component (100) is configured with front electrodes (2a, 2b) which are formed on a ceramic substrate (1) and are opposite each other via a gap (4a), glass films (21a, 21b) which are formed on the front electrodes so as to cover the upper surfaces (2a-3, 2b-3) and both side surfaces (2a-4, 2b-4) of the front electrodes and are opposite each other via a gap (4b) communicating with the gap (4a), and an electrostatic protective film (5) which has a center portion (5c) and two side portions (5a, 5b) such that the center portion (5c) is provided at the gaps (4a, 4b) and both side portions are overlapped onto the upper surfaces (21a-2, 21b-2) of the glass films, and the material of the front electrodes is a copper-nickel film or a copper-nickel-silver film.
The present invention includes: a step for readying a low-resistance metal plate (10) having a predetermined width and thickness; a step for applying a sand-blast treatment on the surface of the low-resistance metal plate (10); a step for forming, on each respective center section of the upper and lower surfaces of the low-resistance metal plate (10), a single insulating protective film (11a, 11b) along the length direction of the low-resistance metal plate (10) at a predetermined width; and a step for using electroplating to form, on the low-resistance metal plate (10) on both sides of the insulating protective films (11a, 11b), an electrode layer in which a front electrode (12a), a reverse electrode (12c), and an end-surface electrode (12b) are integrated. Therefore, minute unevenness is generated by the sand-blast treatment on the surface of the low-resistance metal plate (10); and as a result, there is an increase in the strength of adhesion, with respect to the surface of the metal plate (10), of the insulating protective films (11a, 11b) and the electrode layer (12a, 12c, and 12b) that are subsequently formed on the surface of the metal plate (10).
The purpose of the present invention is to provide a method for producing a metal plate low-resistance chip resistor for which a protective film can be formed easily without being affected by the width of the metal plate resistor at the stripe shaped parts and for which the protective film width can be adjusted according to the variations in thickness in the direction of the width of the metal plate resistor. The purpose is also for the metal plate low-resistance chip resistor to have increased freedom in adjustment of the width of the protective film. To do so, a protective film forming step (step S13) that forms a protective film on the front surface and back surface of a metal plate resistor is carried out first and a slit forming step (step S14) that forms a slit in the metal plate resistor and forms the metal plate resistor into a shape having the stripe shaped parts and connecting parts is carried out thereafter. In addition, a metal plate resistor thickness measurement step (step 12) that measures the thickness at various positions along the width of the metal plate resistor for which the protective film is formed is carried out before the protective film forming step (step S13), and in the protective film forming step (step S13), the width of the protective film is set according to the thickness at each position that has been measured along the width of the metal plate resistor.
The purpose of the present invention is to provide a method for producing a metal plate low-resistance chip resistor for which a protective film can be formed easily without being affected by the width of the metal plate resistor at the stripe shaped parts and for which the protective film width can be adjusted according to the variations in thickness in the direction of the width of the metal plate resistor. The purpose is also for the metal plate low-resistance chip resistor to have increased freedom in adjustment of the width of the protective film. To do so, a protective film forming step (step S13) that forms a protective film on the front surface and back surface of a metal plate resistor is carried out first and a slit forming step (step S14) that forms a slit in the metal plate resistor and forms the metal plate resistor into a shape having the stripe shaped parts and connecting parts is carried out thereafter. In addition, a metal plate resistor thickness measurement step (step 12) that measures the thickness at various positions along the width of the metal plate resistor for which the protective film is formed is carried out before the protective film forming step (step S13), and in the protective film forming step (step S13), the width of the protective film is set according to the thickness at each position that has been measured along the width of the metal plate resistor.
a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
Disclosed is an electrostatic protection component that can minimize decreases in insulation resistance following the application of ESD voltage, and can also minimize variations in the insulation resistance of each component. Also disclosed is a production method therefor. The structure of the electrostatic protection component (100) is provided with surface electrodes (2a, 2b) that are formed upon a ceramic substrate (1) and are mutually facing with a gap (4a) therebetween; glass membranes (21a, 21b) that are formed upon the surface electrodes (2a, 2b) and cover the top surface (2a-3, 2b-3) and both side surfaces (2a-4, 2a-5, 2b-4, 2b-5) of the surface electrodes (2a, 2b), and that are mutually facing with a gap (4b) therebetween that connects to the gap (4a); and an electrostatic protection membrane (5) that has a center portion (5c) and side portions (5a, 5b), wherein the center portion (5c) is disposed in the gaps (4a, 4b) and the side portions (5a, 5b) are stacked on the top surface (21a-2, 21b-2) of the glass membranes (21a, 21b).
Disclosed are: a paste for electrostatic protection, which can be obtained at low cost and is capable of suppressing variations in the capacitance; an electrostatic protection component which uses the paste for electrostatic protection; and a method for producing the electrostatic protection component. Specifically disclosed is a paste for electrostatic protection, which is used for the purpose of forming an electrostatic protection film. The paste for electrostatic protection is obtained by kneading only two kinds of particles, namely conductive particles and insulating particles, into a silicone resin that serves as a binder. The conductive particles and the insulating particles are not subjected to a special treatment. The conductive particles are composed of an aluminum powder, and the insulating particles are composed of a zinc oxide powder. Relative to 100 parts by weight of the silicone resin, the aluminum powder is contained in an amount of 60-200 parts by weight and the zinc oxide powder is contained in an amount of 60-160 parts by weight. When an electrostatic protection component is produced, an upper electrode is screen printed first, and then an electrostatic protection film is screen printed. In this connection, the screen printed upper electrode and electrostatic protection film are baked at the same time.
Provided are a low-resistance chip resistor having a simple structure in which self-independence is given and the mechanical strength is increased for durability, and an easier and faster method of manufacturing same. A low-resistance chip resistor characterized in that resistive layers are formed on both the front and back surfaces of an insulating substrate, or insulating substrates are formed on both the front and back surfaces of a resistive layer, that in the former, protective films are formed on the central portions of the resistive layers in the longitudinal direction and surface and back electrodes are formed on the resistive layers on both sides of the protective films, and in the latter, surface and back electrodes are formed on the resistive layers on both sides of the substrates, and that in both the former and latter, end surface electrodes are provided at both ends in the width direction.
Provided is a chip fuse which maintains the same level of fusing characteristics as conventional ones and is highly safe in that an increase in an internal resistance value can be sufficiently decreased. The chip fuse comprises an insulating substrate provided with a glaze layer, a fuse film provided with a narrow fusing portion provided on the glaze layer, surface electrodes formed at both end portions of the upper surface of the fuse film, a glass film provided on at least the upper surface of the fuse film, an overcoat film consisting of a resin layer which covers the glass film and the fuse film provided with the glass film, and end surface electrodes, and has a structure in which the glass film is provided in contact with the portion of the upper surface of the fuse film on which no surface electrode is formed and the overcoat film is provided in contact with the side surfaces of the fuse film.
A current detection metal plate resistor which has superior heat releasing properties able to minimize damage to a circuit due to overcurrent in an electronic device, and which is able to detect current with high precision, and a method of producing the same. The metal plate resistor (10) is provided with: a metal plate resistor body (11); a heat-resistant protective film (12) which is provided at the center of at least one surface of the metal plate resistor body; a pair of base electrode layers (14) which are provided on the one surface of the metal resistor body so as to cover both ends of the heat-resistant protective film provided at the center of the one surface of the metal resistor body; and a pair of end face electrode layers (15) which are provided at the two ends of the metal plate resistor body so as to cover the entire surfaces of the base electrode layers.
H01C 1/032 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
19.
METAL PLATE LOW RESISTANCE CHIP RESISTOR, AND PRODUCTION METHOD FOR THE SAME
Provided is a metal plate low resistance chip resistor which has a resistance value of about 15 to 50 mΩ, high reliability, and a lower back. Also provided is a production method that can produce the metal plate low resistance chip resistor with a high degree of accuracy and at a high yield using a relatively simple process. A metal plate low resistance chip resistor (10) includes a metal resistance plate (11), electrode films (12) formed on both ends of the metal resistance plate, and a protective film (13) formed between the electrode films. Both sides (11a) of the rectangular metal resistance plate are cut off at predetermined positions to form the shape of the metal resistance plate. On both edge sections (11d) of the metal resistance plate, the electrode films (12) are formed near one edge side and the other edge side, respectively. An area where there is no electrode film on the metal resistance plate is provided as a resistance section. In the resistance section, there is a portion both sides of which remains without being cut off, and the portion serves as a resistance value adjustment section (11f). There is a portion both sides of which are cut off, and the portion serves as a resistance value fixed section (11e). The surface of the metal resistance plate is covered with the protective film. The protective film extends over both sides of the resistance value fixed section. Therefore, the width of the protective layer is the same as that of both edge sections.
A method for manufacturing rectangular plate type chip resistors and a rectangular plate type chip resistor obtained by this method. The method includes the steps of (A) providing a resistive alloy plate strip of predetermined width and thickness, (B) forming an insulating protective film of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer composed of integrated surface, back, and end electrodes, along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).
A chip fuse that not restricted in the degree of freedom of fusing characteristics, realizes prevention of shortening of fusing time at large magnification with respect to rated current and attainment of shortening of fusing time at small magnification with respect to rated current. A chip fuse (10) has a first heat storage layer (12) of film material with low thermal conductivity superimposed on an insulating substrate (11) and has a fuse film (13) superimposed on the first heat storage layer (12) so as to avoid contact with the insulating substrate (11). The fuse film (13) has a fuse element part (13b) interposed between surface electrode parts (13a) disposed at both edges thereof. A second heat storage layer (15) of film material with low thermal conductivity is superimposed on the fuse element part (13b). The first heat storage layer (12) is thicker than the second heat storage layer (15). The first heat storage layer (12) and second heat storage layer (15) are those produced from a sheet material of B-stage state containing a photosensitive group.
H01H 85/045 - Construction ou structure générales de fusibles basse tension, c.-à-d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type cartouche
H01H 85/0445 - Construction ou structure générales de fusibles basse tension, c.-à-d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type rapide ou lent
H01H 85/046 - Fusibles sous forme de circuits imprimés
H01H 85/10 - Éléments fusibles caractérisés par la configuration ou la forme de l'élément fusible comportant un étranglement pour fusion localisée
H01H 85/17 - Enveloppes caractérisées par leur matériau
22.
PRODUCTION METHOD AND PRODUCTION DEVICE OF METAL PLATE CHIP RESISTOR
A production method and a production device for producing a metal plate chip resistor having a relatively low resistance with high precision and high yield by a simple process. It is achieved by a production device (10) of a metal plate chip resistor comprising a cutting die (21) for forming a chip product (16a) by cutting a belt-shaped intermediate product (14) in the short side direction, a unit (22) for measuring the resistance of the chip product (16a), a control section (23) having an operating means for calculating the cutting width of the belt-shaped intermediate product (14) in the short side direction such that a chip product having a desired resistance can be obtained using a resistance measured by the resistance measuring unit (22), and means (26, 27) for adjusting the cutting width such that the belt-shaped intermediate product (14) is cut in the short side direction with a cutting width obtained by the operating means.
H01C 17/06 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base
H01C 3/00 - Résistances métalliques fixes en fil ou en ruban, p. ex. bobinées, tressées ou en forme de grille
A chip fuse which is suppressed in temperature rise in steady operation in a high rated current region, has time lag type fusion characteristics, and has a high yield, and its manufacturing method, are provided. In the chip fuse, a heat storage layer (12) is formed on an insulation substrate (11), and a fuse film (13) is formed on the heat storage layer (12) so as not to be in contact with the insulation substrate (11). The fuse film (13) consists of front electrode portions (13a) disposed on both sides and a fuse element portion (13b) formed between the front electrode portions (13a). A protection layer (15) made of a material having a thermal conductivity higher than that of the heat storage layer (12) is formed between the front electrode portions (13a), covering the fuse element portion (13b). By forming the heat storage layer (12) in such a size not as to cover the whole area (11a) wherein the fuse element portion (13b) is to be formed, the protection layer (15) is partially brought into contact with the insulation substrate.
H01H 85/045 - Construction ou structure générales de fusibles basse tension, c.-à-d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type cartouche
H01H 85/0445 - Construction ou structure générales de fusibles basse tension, c.-à-d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type rapide ou lent
H01H 85/046 - Fusibles sous forme de circuits imprimés
H01H 85/10 - Éléments fusibles caractérisés par la configuration ou la forme de l'élément fusible comportant un étranglement pour fusion localisée
H01H 85/17 - Enveloppes caractérisées par leur matériau
24.
METHOD FOR MANUFACTURING RECTANGULAR PLATE TYPE CHIP RESISTOR AND RECTANGULAR PLATE TYPE CHIP RESISTOR
A method for manufacturing a rectangular plate type chip resistor being simple in controlling a resistance value and having a highly reliable electrode structure easily at a low cost. A rectangular plate type chip resistor obtained by that method, and especially exhibiting excellent characteristics at low resistance, is also provided. The manufacturing method comprises step (A) for providing a stripe-form alloy plate (10) for resistor having predetermined width and thickness, step (B) for forming, along the longitudinal direction of the stripe-form alloy plate, one each of insulating protective films (11a, 11b) with a predetermined width in the centers of the upper and lower surfaces of the alloy plate, respectively, step (C) for forming electrode layers (12) each provided integrally with a surface electrode (12a), a backside electrode (12c) and an end face electrode (12b) on the opposite sides of the protective film by electroplating, and step (D) for cutting the stripe-form alloy plate coated with the protective films and the electrode layer thus obtained to a predetermined length in the lateral direction, wherein a resistance is controlled to within a predetermined range by adjusting the thickness of the stripe-form alloy plate in step (A), the formation width of the protective film in step (B) and the cutting length in step (D).
