Abrégé

The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.

Classes IPC  ?

• H05F 3/04 - Enlèvement des charges électrostatiques au moyen d'éclateurs ou d'autres dispositifs à décharge

Abrégé

An arrayed antenna module includes a first antenna group, a second antenna group, a front conductive connecting assembly and a rear conductive connecting assembly. The first antenna group includes a plurality of first antenna structures arranged in parallel thereon. The second antenna group includes a plurality of second antenna structures arranged in parallel thereon. The front conductive connecting assembly includes a first front conductive connecting element electrically connected to the first antenna group, and a second front conductive connecting element electrically connected to the second antenna group. The rear conductive connecting assembly includes a first rear conductive connecting element electrically connected to the first antenna group, and a second rear conductive connecting element electrically connected to the second antenna group. Therefore, the arrayed antenna module provided can be applied to a portable electronic device so as to receive or transmit signals.

Classes IPC  ?

• H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
• H01Q 1/12 - SupportsMoyens de montage
• H01Q 9/16 - Antennes résonnantes avec alimentation intermédiaire entre les extrémités de l'antenne, p. ex. dipôle alimenté par le centre
• H01Q 9/04 - Antennes résonnantes

Produits et services

Antennas; Diodes; Antennas for wireless communications apparatus; Filters for radio interference suppression; Receiving antennas for satellite broadcast; Structured semi-conductor wafers; Voltage surge protectors; Voltage surge suppressors; Car antennas; Electrical inductors; Electronic inductors; Low pass inductor filter used in high power electrical applications

Produits et services

Antennas; Diodes; Antennas for wireless communications apparatus; Filters for radio interference suppression; Receiving antennas for satellite broadcast; Structured semi-conductor wafers; Voltage surge protectors; Voltage surge suppressors; Car antennas; Electrical inductors; Electronic inductors; Low pass inductor filter used in high power electrical applications

Produits et services

Antennas; Diodes; Antennas for wireless communications apparatus; Filters for radio interference suppression; Receiving antennas for satellite broadcast; Structured semi-conductor wafers; Voltage surge protectors; Voltage surge suppressors; Car antennas; Electrical inductors; Electronic inductors; Low pass inductor filter used in high power electrical applications

Produits et services

Antennas; Diodes; Antennas for wireless communications apparatus; Filters for radio interference suppression; Receiving antennas for satellite broadcast; Structured semi-conductor wafers; Voltage surge protectors; Voltage surge suppressors; Car antennas; Electrical inductors; Electronic inductors; Low pass inductor filter used in high power electrical applications

Produits et services

Receiving antennas for satellite broadcast; Antennas for wireless communications apparatus; Car antennas; Antennas; Electrical inductors; Electronic inductors; Filters for radio interference suppression; Structured semi-conductor wafers; Voltage surge suppressors; Voltage surge protectors; Diodes; Low pass inductor filter used in high power electrical applications.

Produits et services

Receiving antennas for satellite broadcast; Antennas for wireless communications apparatus; Car antennas; Antennas; Electrical inductors; Electronic inductors; Filters for radio interference suppression; Structured semi-conductor wafers; Voltage surge suppressors; Voltage surge protectors; Diodes; Low pass inductor filter used in high power electrical applications.

Produits et services

Receiving antennas for satellite broadcast; Antennas for wireless communications apparatus; Car antennas; Antennas; Electrical inductors; Electronic inductors; Filters for radio interference suppression; Structured semi-conductor wafers; Voltage surge suppressors; Voltage surge protectors; Diodes; Low pass inductor filter used in high power electrical applications.

Produits et services

Receiving antennas for satellite broadcast; Antennas for wireless communications apparatus; Car antennas; Antennas; Electrical inductors; Electronic inductors; Filters for radio interference suppression; Structured semi-conductor wafers; Voltage surge suppressors; Voltage surge protectors; Diodes; Low pass inductor filter used in high power electrical applications.

Produits et services

Receiving antennas for satellite broadcast; Antennas for wireless communications apparatus; Car antennas; Antennas; Electrical inductors; Electronic inductors; Filters for radio interference suppression; Structured semi-conductor wafers; Voltage surge suppressors; Voltage surge protectors; Diodes; Low pass inductor filter used in high power electrical applications.

Abrégé

A co-construction antenna module includes a carrier, a first patch antenna group, a second patch antenna group, a first dipole antenna group, and a second dipole antenna group. The carrier includes a first surface, a second surface relative to the first surface, and a surround surrounding side connected between the first surface and the second surface. The first patch antenna group includes a plurality of first patch antennas disposed on the carrier, and the plurality of first patch antennas are disposed on at least one of the first surface and the second surface. The second patch antenna group includes a plurality of second patch antennas disposed on the carrier, and the plurality of second patch antennas are disposed on at least one of the first surface and the second surface. The first dipole antenna group and the second antenna are disposed in the carrier.

Classes IPC  ?

• H01Q 21/00 - Systèmes ou réseaux d'antennes
• H01Q 21/28 - Combinaisons d'unités ou systèmes d'antennes sensiblement indépendants et n’interagissant pas entre eux
• H01Q 5/40 - Structures imbriquées ou entrelacéesDispositions combinées ou présentant un couplage électromagnétique, p. ex. comprenant plusieurs éléments rayonnants alimentés sans connexion commune
• H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur

Abrégé

The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Classes IPC  ?

• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
• H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H04B 5/00 - Systèmes de transmission en champ proche, p. ex. systèmes à transmission capacitive ou inductive
• H04B 1/3888 - Dispositions pour le transport ou la protection d’émetteurs-récepteurs
• A45C 11/00 - Récipients pour articles non prévus dans les groupes

Abrégé

The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.

Classes IPC  ?

• H01Q 9/04 - Antennes résonnantes
• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H01Q 5/40 - Structures imbriquées ou entrelacéesDispositions combinées ou présentant un couplage électromagnétique, p. ex. comprenant plusieurs éléments rayonnants alimentés sans connexion commune
• H01Q 21/28 - Combinaisons d'unités ou systèmes d'antennes sensiblement indépendants et n’interagissant pas entre eux
• H01L 23/64 - Dispositions relatives à l'impédance
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 23/66 - Adaptations pour la haute fréquence
• H01Q 5/35 - Alimentation simultanée en plusieurs points

Abrégé

The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Classes IPC  ?

• H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
• H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H04B 5/00 - Systèmes de transmission en champ proche, p. ex. systèmes à transmission capacitive ou inductive
• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• A45C 11/00 - Récipients pour articles non prévus dans les groupes
• H04B 1/3888 - Dispositions pour le transport ou la protection d’émetteurs-récepteurs

Abrégé

The present disclosure provides a method for preparing a semiconductor package having a standard size from a die having a size smaller than the standard size. The method includes: providing a wafer; forming a die on the wafer, wherein the die has a size smaller than one-half of a standard size 0201; dicing the die from the wafer; encapsulating the die to form an encapsulated die; and singulating the encapsulated die to form a semiconductor package having a size equal to or larger than the standard size 0201.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Abrégé

The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second die pad, the first die pad coupled to a first portion of a metal layer, the second die pad coupled to a second portion of the metal layer, and the first portion of the metal layer and the second portion of the metal layer spaced apart by a second insulating layer. An associated semiconductor packaging method and another semiconductor package structure are also disclosed.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
• H01L 23/528 - Configuration de la structure d'interconnexion
• H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.

Classes IPC  ?

• H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
• H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
• H01Q 1/48 - Moyens de mise à la terreÉcrans de terreContrepoids
• H01Q 7/04 - Antennes blindées
• H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant

Abrégé

A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).

Classes IPC  ?

• H01F 27/02 - Enveloppes
• H01F 27/06 - Montages, supports ou suspensions de transformateurs, réactances ou bobines d'arrêt
• H01F 27/26 - Fixation des parties du noyau entre ellesFixation ou montage du noyau dans l'enveloppe ou sur un support
• H01F 27/28 - BobinesEnroulementsConnexions conductrices

Abrégé

An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

Classes IPC  ?

• H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
• H01Q 1/52 - Moyens pour réduire le couplage entre les antennesMoyens pour réduire le couplage entre une antenne et une autre structure
• H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant

Abrégé

A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral.

Classes IPC  ?

• H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
• H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns
• H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau

Abrégé

An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.

Classes IPC  ?

• H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension

Abrégé

A semiconductor package structure includes a chip unit, a package unit and an electrode unit. The chip unit includes at least one semiconductor chip. The semiconductor chip has an upper surface, a lower surface, and a surrounding peripheral surface connected between the upper and the lower surfaces, and the semiconductor chip has a first conductive pad and a second conductive pad disposed on the lower surface thereof. The package unit includes a package body covering the upper surface and the surrounding peripheral surface of the semiconductor chip. The package body has a first lateral portion and a second lateral portion respectively formed on two opposite lateral sides thereof. The electrode unit includes a first electrode structure covering the first lateral portion and a second electrode structure covering the second lateral portion. The first and the second electrode structures respectively electrically contact the first and the second conductive pads.

Classes IPC  ?

• H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand.

Classes IPC  ?

• H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
• H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns

Abrégé

An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

Classes IPC  ?

• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 7/00 - Détails de construction communs à différents types d'appareils électriques
• H01L 29/40 - Electrodes
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes. Each lateral electrode is electrically connected to the corresponding first conductive layer and the corresponding conductive contact portion.

Classes IPC  ?

• H01L 23/02 - ConteneursScellements
• H01L 23/62 - Protection contre l'excès de courant ou la surcharge, p. ex. fusibles, shunts
• H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou

Abrégé

A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.

Classes IPC  ?

• H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
• H01F 41/14 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour appliquer des pellicules magnétiques sur des substrats
• H01F 41/22 - Traitement thermiqueDécomposition thermiqueDépôt chimique à partir d'une vapeur
• H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
• H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns
• H01F 17/00 - Inductances fixes du type pour signaux
• H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau

Abrégé

Where fc (MHz) is the cutoff frequency of a differential-mode signal.

Classes IPC  ?

• H01F 5/00 - Bobines d'induction
• H01F 27/28 - BobinesEnroulementsConnexions conductrices

Abrégé

A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.

Classes IPC  ?

• H01F 3/00 - Noyaux, culasses ou induits
• H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants

Abrégé

A portable electronic device includes a casing unit, a first support unit, a second support unit, a first antenna unit, a second antenna unit, a first conducting unit and a second conducting unit. The casing unit includes a first outer casing and a second outer casing pivotally connected with the first outer casing. The first outer casing includes a hinge structure pivotally connected with the second outer casing. The first support unit includes a first support body disposed in the hinge structure, and the second support unit includes a second support body disposed in the hinge structure. The first antenna unit includes a first antenna structure disposed on the first support body and separated from the second outer casing. The second antenna unit includes a second antenna structure disposed on the second support body and separated from the second outer casing.

Classes IPC  ?

• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre

Abrégé

A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant

Abrégé

A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Classes IPC  ?

• H03H 7/09 - Filtres comportant une inductance mutuelle
• H01F 17/00 - Inductances fixes du type pour signaux
• H03H 7/42 - Réseaux permettant de transformer des signaux équilibrés en signaux non équilibrés et réciproquement, p. ex. baluns
• H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
• H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau

Abrégé

A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

Classes IPC  ?

• H01F 5/00 - Bobines d'induction
• H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
• H01L 27/08 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type
• H01F 17/00 - Inductances fixes du type pour signaux

Abrégé

A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

Classes IPC  ?

• H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication

Abrégé

A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

Classes IPC  ?

• H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication

Abrégé

A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.

Classes IPC  ?

• H01F 5/00 - Bobines d'induction
• H01F 27/28 - BobinesEnroulementsConnexions conductrices
• H03H 7/00 - Réseaux à plusieurs accès comportant comme composants uniquement des éléments électriques passifs

Abrégé

An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.

Classes IPC  ?

• H01Q 1/48 - Moyens de mise à la terreÉcrans de terreContrepoids

Abrégé

A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Classes IPC  ?

• H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre

Abrégé

A thin film type common mode noise filter and its fabrication method are disclosed. There are several electric insulation layers, coil lead layers and main coil layers are formed on an insulation substrate by means of processes of Lithography, Physical Vapor Deposition, etching or other chemical process. After that the structure is covered with an electric insulation gluing layer and a magnetic material layer so as to form a thin film type common mode noise filter with a low production cost but an improved filtering characteristic of the common mode noise.

Classes IPC  ?

• H01F 27/02 - Enveloppes

Abrégé

An insulation covering structure for a semiconductor element with a single die dimension includes: a semiconductor element with a single die dimension and an insulation covering layer. The semiconductor element has a front side surface, a rear side surface, a left side surface, a right side surface, a bottom surface, and a top surface. The top surface of the semiconductor element has two metal pads. The insulation covering layer covers the front side surface, the rear side surface, the left side surface, the right side surface, and the bottom surface of the semiconductor element. A manufacturing process for covering the semiconductor element with a single die dimension is also disclosed.

Classes IPC  ?

• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
• H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
• H01L 23/053 - ConteneursScellements caractérisés par la forme le conteneur étant une structure creuse ayant une base isolante qui sert de support pour le corps semi-conducteur
• H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
• H01L 29/40 - Electrodes

Abrégé

A laminated variable resistor comprises a main body, internal electrodes extending along two side edges of the main body into the main body, terminal electrodes disposed on the two ends of the main body. The mole percentage of the oxide in overlapping active regions between opposite internal electrodes is reduced and the reduced portion is replaced by a metal selected from gold (Au), silver (Ag), palladium (Pd), platinum (Pt), rhodium (Rh), or the alloy of any two of such metals.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants

Produits et services

Integrated protection devices, namely, multi-layer varistors, and Electro-Static Discharge (ESD) guard; a combination resistor/capacitor/inductor, namely, chip resistor array network, and chip multi-layer bead array; sensor, namely, current sensor, Negative Temperature Coefficient (NTC) thermistor sensors, and Polymeric Positive Temperature Coefficient (PPTC) reset table fuses; electro magnetic interference (EMI) prevention devices, namely, film type chip capacitor array, and multi-layer chip capacitor array, all sold to original equipment manufacturers.

Produits et services

Integrated protection devices, namely, multi-layer varistors, and Electro-Static Discharge (ESD) guard; a combination resistor/capacitor/inductor, namely, chip resistor array network, and chip multi-layer bead array; [ sensor, namely, current sensor, Negative Temperature Coefficient (NTC) thermistor sensors, and Polymeric Positive Temperature Coefficient (PPTC) reset table fuses; ] electro magnetic interference (EMI) prevention devices, namely, film type chip capacitor array, and multi-layer chip capacitor array, all sold to original equipment manufacturers