The invention relates to a method for reductive extraction of elemental noble metal from an acidic aqueous solution containing noble metal, the method comprising the addition of non-noble metal including zinc and/or tin to the acidic aqueous solution containing noble metal to form a reaction mixture, wherein the dissolved noble metal includes iridium, rhodium and/or ruthenium, wherein the non-noble metal is added in a leaner-than-stoichiometric amount, and wherein the pH of the acidic aqueous solution containing noble metal prior to the addition of the non-noble metal is in the range of +0.8 to +3.0 and is also kept in this range in the reaction mixture.
C22B 3/46 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques par substitution, p. ex. par cémentation
2.
METHOD FOR PRODUCING GLASS FIBER NOZZLES, AND GLASS FIBER NOZZLE
A method for producing glass fiber nozzles, comprising the steps of:
A) providing or producing a base plate comprising a first material, being chemically resistant to the glass melt and dispersion strengthened,
B) printing at least one tube made of a second material being chemically resistant to the glass melt onto one side of the base plate, wherein the at least one tube each comprise at least one feedthrough,
C) generating at least one passage in the base plate, the passage is connected to at least one of the at least one feedthrough in such a way that each of the at least one passage through the base plate forms a common line permeable to the glass melt, with at least one of the at least one feedthrough of an associated tube leads through the base plate and through the associated tube.
A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises at least one silver salt of the formula CnH2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.
B22F 7/06 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 7/04 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de couches successives avec une ou plusieurs couches non réalisées à partir de poudre, p. ex. à partir de tôles
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
4.
PROCESS FOR PRODUCING A NOBLE METAL-MODIFIED GRAPHITIZED CARBON MATERIAL AND SUPPORTED CATALYST
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated, graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt. % and nickel at a weight percentage of 0-5 wt. %. The method comprises: providing a reaction mixture comprising—lignin, —the catalyst and —a solvent; and heating the reaction mixture so as to obtain a mixture comprising—a product mix, —the catalyst and —the solvent.
B01J 23/89 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer combinés à des métaux nobles
C08J 11/24 - Récupération ou traitement des résidus des polymères par coupure des chaînes moléculaires des polymères ou rupture des liaisons de réticulation par voie chimique, p. ex. dévulcanisation par traitement avec une substance organique par traitement avec des composés organiques contenant de l'oxygène contenant des groupes hydroxyle
A strip-shaped sandwich composite material for producing probe needles, wherein an inner core layer is arranged between two outer cover layers, wherein the inner core layer consists of a palladium alloy comprising at least 30 wt. % palladium or of a platinum alloy comprising at least 30 wt. % platinum, and wherein the two outer cover layers consist of a precipitation-hardened and/or dispersion-hardened copper alloy comprising at least 90 wt. % copper and/or silver alloy comprising at least 70 wt. % silver. The invention also relates to a probe needle, a bonding strip, a probe needle array and a method for producing a composite material.
The present invention relates to a coated membrane containing:
a membrane with a front and a rear face,
a catalyst-containing coating which is provided on the front face of the membrane,
the catalyst containing
a support material which has a BET surface area of maximally 80 m2/g,
an iridium-containing coating which is provided on the support material and contains an iridium oxide, an iridium hydroxide or an iridium hydroxide oxide or a mixture of at least two of these iridium compounds,
wherein the catalyst contains iridium in a quantity of maximally 60 wt. %, and
the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium/cm2.
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 11/075 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’un seul élément catalytique ou composé catalytique
C25B 11/054 - Électrodes comportant des électro-catalyseurs sur un support
C25B 13/08 - DiaphragmesÉléments d'espacement caractérisés par le matériau à base de matériaux organiques
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
8.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: —a support material, —an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2)×BET)/(1+0.0176 (g/m2)×BET)≤Ir-G≤(4.012 (g/m2)×BET)/(1+0.0468 (g/m2)×BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt. %, of the catalyst.
The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.
A method for recovering noble metal from a heterogeneous catalyst comprising a solid carrier material and palladium, platinum or rhodium, present at least partially in elemental form, said method comprising the steps of converting the noble metal to an oxidation state>0 by treating the heterogeneous catalyst with an oxidizing agent in the presence of hydrochloric acid so as to form a two-phase system A comprising a hydrochloric aqueous phase A1 and a solid phase comprising the carrier material which is insoluble therein, optionally, at least partially separating the hydrochloric aqueous phase A1 from the two-phase system A and adding a further aqueous phase to the remaining residue of the two-phase system A so as to form a two-phase system B comprising a hydrochloric aqueous phase and a solid phase comprising the carrier material insoluble therein.
The present invention relates to a process for coupling a heterocyclic aromatic ring AR1 and a carbocyclic or heterocyclic aromatic ring AR2 to each other by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein
a reaction medium is provided by mixing a first reactant, a second reactant and a catalyst composition, wherein the catalyst composition comprises
(i) a palladium compound which is a palladium salt or a palladium complex or a mixture thereof, and
(ii) a polycyclic compound of Formula (I), (II) or (III):
The present invention relates to a process for coupling a heterocyclic aromatic ring AR1 and a carbocyclic or heterocyclic aromatic ring AR2 to each other by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein
a reaction medium is provided by mixing a first reactant, a second reactant and a catalyst composition, wherein the catalyst composition comprises
(i) a palladium compound which is a palladium salt or a palladium complex or a mixture thereof, and
(ii) a polycyclic compound of Formula (I), (II) or (III):
the reaction medium is irradiated by an external light source, thereby coupling the heterocyclic aromatic ring AR1 of the first reactant to the aromatic ring AR2 of the second reactant by a decarboxylative carbon-carbon cross-coupling reaction.
B01J 31/02 - Catalyseurs contenant des hydrures, des complexes de coordination ou des composés organiques contenant des composés organiques ou des hydrures métalliques
12.
CATALYST COMPOSITION FOR BIARYL SYNTHESIS BY DECARBOXYLATIVE CROSS-COUPLING
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
a compound of Formula (II)
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
a compound of Formula (II)
an iridium complex comprising ligands L1, L2 and L3, wherein the ligands L1, L2 and L3 are selected, independently from each other, from a phenylpyridine and a bipyridine.
B01J 31/12 - Catalyseurs contenant des hydrures, des complexes de coordination ou des composés organiques contenant des composés organiques ou des hydrures métalliques contenant des composés organométalliques ou des hydrures métalliques
13.
METHOD FOR PRODUCING A PARTICULATE CARRIER MATERIAL PROVIDED WITH ELEMENTARY SILVER AND ELEMENTARY RUTHENIUM
The invention relates to a method for producing a particulate carrier material provided with silver and ruthenium, comprising the following steps: a) providing a water-insoluble particulate carrier material and aqueously dissolved silver and ruthenium precursors, b) bringing the particulate carrier material into contact with the aqueous solution of the precursors to form an intermediate, c) bringing the intermediate into contact with an aqueous hydrazine solution having a pH of >7 to 14 to form a mass comprising silver and ruthenium, d) optionally washing the obtained mass, and e) removing water and other possible volatile components from the mass.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
B22F 1/18 - Particules non métalliques revêtues de métal
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
Methods of making dispersion-hardened platinum compositions include A) producing a melt having at least 70 wt. % platinum, up to 29.95 wt. % of one or more of rhodium, gold, iridium and palladium, between 0.05 wt. % and 1 wt. % of oxidizable non-precious metals in the form of zirconium, yttrium and scandium, and, as the remainder, platinum including impurities, wherein the ratio of zirconium to yttrium in the melt is in a range of from 5.9:1 to 4.3:1 and the ratio of zirconium to scandium in the melt is at least 17.5:1, B) hardening the melt to form a solid body, C) processing the solid body to form a volume body, and D) oxidizing the non-precious metals contained in the volume body by a heat treatment in an oxidizing medium over a time period of at least 48 hours at a temperature of at least 750° C.
B01J 23/62 - Métaux du groupe du platine avec du gallium, de l'indium, du thallium, du germanium, de l'étain ou du plomb
B01J 35/00 - Catalyseurs caractérisés par leur forme ou leurs propriétés physiques, en général
B01J 35/10 - Catalyseurs caractérisés par leur forme ou leurs propriétés physiques, en général solides caractérisés par leurs propriétés de surface ou leur porosité
B01J 37/00 - Procédés de préparation des catalyseurs, en généralProcédés d'activation des catalyseurs, en général
B01J 37/02 - Imprégnation, revêtement ou précipitation
The invention relates to a strip-like connector made of metal, wherein the length and width of the strip-like connector are greater than the thickness of the strip-like connector, the strip-like connector comprising a first metal material (41) and a second metal material (42), wherein the first material (41) and the second material (42) are directly and interlockingly connected to one another and joined together by way of a connecting surface (50), wherein the connecting surface (50) has, lying opposite one another at least in some regions, interlocking and interengaging serrations (43, 52) of the first material (41) and the second material (42) along the width of the strip-like connector. The invention also relates to the use of such a strip-like connector for connecting galvanic cells, to a galvanic element comprising multiple galvanic cells, wherein the galvanic cells are connected and electrically contacted by at least one such strip-like connector, and to a method for producing a connecting strip and for producing strip-like connectors from the connecting strip.
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
B23K 20/04 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage au moyen d'un laminoir
17.
CATALYST SYSTEM FOR A FLOW REACTOR, AND METHOD FOR THE CATALYTIC OXIDATION OF AMMONIA
The invention relates to a catalyst system for flow reactors, said catalyst system being characterized by the order of the noble metal-containing alloys used in the catalyst gauze which forms the catalyst system. By using a ternary platinum alloy for a second catalyst gauze group and a palladium alloy for a third catalyst gauze group, the platinum and rhodium content of the catalyst system can be kept relatively low overall while having a high degree of efficiency. The invention additionally relates to a method for catalytically combusting ammonia, in which a fresh gas which contains at least ammonia is conducted through a catalyst system.
The present invention relates to a catalyst network comprising at least one noble metal wire that contains at least one dispersion-strengthened noble metal alloy. The invention also relates to a catalyst system containing at least one catalyst network according to the invention, and to a method for the catalytic oxidation of ammonia in which a catalyst network according to the invention is used.
The present invention relates to a catalyst system for flow reactors which is characterized by the sequence of the noble metal-containing alloys used of the catalyst networks forming the catalyst system. By using palladium alloys for a second and third catalyst network group, the platinum content of the catalyst system can be kept relatively low overall. In addition, the invention relates to a method for catalytic combustion of ammonia, in which a fresh gas containing at least ammonia is conducted through a catalyst system.
C07D 235/12 - Radicaux substitués par des atomes d'oxygène
C07D 235/16 - Radicaux substitués par des atomes de carbone comportant trois liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. radicaux ester ou nitrile
The invention relates to a particulate inorganic material equipped with elemental silver and elemental ruthenium, said inorganic material having an average particle size (d50) in the range of 50 nm to 40 μm and a BET surface area in the range of 1 to 1600 m2/g. The inorganic material as such is selected from the group consisting of aluminum nitride, titanium nitride, silicon nitride, corundum, titanium dioxide in the form of anatase, titanium dioxide in the form of rutile, pyrogenic silica, precipitated silica, sodium aluminum silicate, zirconium silicate, zeolite, hydrotalcite and gamma-aluminum oxide hydroxide.
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c.-à-d. non caractérisé par le procédé de revêtement
22.
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FORM OF WEDGE-WEDGE-BONDED STRUCTURES NOT CONSISTING OF SOLID METAL MATERIAL
An electronic module comprising one or more arrangements each composed of a first electronic component having a first contact surface with, wedge-bonded on this first contact surface, a first terminus of an originally free structure not consisting of solid metal material and a second electronic component having a second contact surface with, wedge-bonded on this second contact surface, a second terminus of the originally free structure not consisting of solid metal material, wherein the originally free structure not consisting of solid metal material is a structure (i) in ribbon form composed of knitted, woven or braided fine metal wire and having a cross-sectional area in the range of 25,000 to 800,000 µm2or (ii) in cable form composed of stranded fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2or (iii) in tube form composed of circular-knitted fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2.
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
The invention relates to a hydraulically curable inorganic cement composition comprising at least one compound with a water solubility of >10 g/L (at 20°C), selected from the group consisting of 5-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heterocyclic atoms and 6-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heteroatoms, and at least one water-dispersible EVA copolymer.
C04B 28/02 - Compositions pour mortiers, béton ou pierre artificielle, contenant des liants inorganiques ou contenant le produit de réaction d'un liant inorganique et d'un liant organique, p. ex. contenant des ciments de polycarboxylates contenant des ciments hydrauliques autres que ceux de sulfate de calcium
C04B 28/10 - Ciments de chaux ou ciments d'oxyde de magnésium
C04B 28/34 - Compositions pour mortiers, béton ou pierre artificielle, contenant des liants inorganiques ou contenant le produit de réaction d'un liant inorganique et d'un liant organique, p. ex. contenant des ciments de polycarboxylates contenant des liants phosphate froids
C04B 40/00 - Procédés, en général, pour influencer ou modifier les propriétés des compositions pour mortiers, béton ou pierre artificielle, p. ex. leur aptitude à prendre ou à durcir
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
24.
CERAMIC-COATED METAL FOIL AS A FRICTION-ENHANCING ELEMENT
The invention relates to a joint element for increasing the frictional force in force-fitting connections, comprising a metal substrate having two opposing planar surfaces, wherein at least one of said surfaces has a ceramic layer, said ceramic layer preferably having been applied by aerosol deposition. The joint element is preferably free of phosphorus and does not contain diamonds.
A palladium-copper-silver alloy consisting of 40 to 58% by weight of palladium, 25 to 42% by weight of copper, 6 to 20% by weight of silver, optionally up to 6% by weight of at least one element from the group ruthenium, rhodium, and rhenium, and up to 1% by weight of impurities, wherein the palladium-copper-silver alloy contains a crystalline phase with a B2 crystal structure and has 0% by volume to 10% by volume of precipitates of silver, palladium, and binary silver-palladium compounds. The invention also relates to a molded body, a wire, a strip, or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for electrical contacting or for the production of a sliding contact. The invention also relates to a method for producing a palladium-copper-silver alloy.
C22C 5/04 - Alliages à base d'un métal du groupe du platine
C22C 1/02 - Fabrication des alliages non ferreux par fusion
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/14 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des métaux nobles ou de leurs alliages
27.
PARTICULATE CARBON MATERIAL PROVIDED WITH ELEMENTAL SILVER AND ELEMENTAL RUTHENIUM
A particulate carbon material that is provided with elemental silver and elemental ruthenium and has an average particle size (d50) in the range of 0.5 to 500 µm, a pore volume in the range of 0.5 to 10 mL/g and a BET surface in the range of 200 to 2000 m²/g.
B01J 35/02 - Catalyseurs caractérisés par leur forme ou leurs propriétés physiques, en général solides
B01J 35/10 - Catalyseurs caractérisés par leur forme ou leurs propriétés physiques, en général solides caractérisés par leurs propriétés de surface ou leur porosité
The invention relates to a noble metal complex comprising diolefin and C6-C18 monocarboxylate ligands of the type [LPd[O(CO)R1]X]n, [LRh[O(CO)R1]]m or [LIr[O(CO)R1]]m, in which L represents a compound acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, in each case with the exception of a phenylacetic acid residue, and wherein n is an integer ≥1 and m is an integer ≥2.
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
A preparation containing:
(A) 30 to 90 wt. % of at least one organic solvent,
(B) 10 to 70 wt. % of at least one noble metal complex comprising diolefin and C6-C18 monocarboxylate ligands selected from the group consisting of noble metal complexes of the type [LPd[O(CO)R1]X]n, [LRh[O(CO)R1]]m, and [LIr[O(CO)R1]]m, wherein L represents a compound acting as diolefin ligand, wherein X is selected among bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, and wherein n is an integral number 1, and m is an integral number 2, and
(C) 0 to 10 wt. % of at least one additive.
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
30.
METHOD FOR PRODUCING NOBLE METAL MESHES ON FLATBED KNITTING MACHINES
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle beds, these two parts being at least in part connected at their two abutting edges by connecting stitches.
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle bed, and a supporting mesh is knitted on the first and second needle bed using a supporting thread. An abutting edge of the supporting mesh is connected to the two layers of the noble metal mesh via connecting stitches and knitted via both needle beds in the knitting rows containing the connection.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
06 - Métaux communs et minerais; objets en métal
07 - Machines et machines-outils
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Chemical products for industrial, scientific purposes;
coating compositions [chemicals], other than paints; ceramic
materials in the form of powders for industrial purposes. Powder coatings in the form of inorganic coatings;
anti-corrosive products for metals; preparations for use as
preservatives against atmospheric oxidation; corrosion
inhibitors in the nature of a coating; preparations for
coating surface to protect against corrosion. Base metals and their alloys; metals in powder form. Machine tools; powder handling apparatus [machines]; coating
machines; spray guns for powder coatings. Treatment and coating of metal surfaces; coating of steel;
applying wear-resistant coatings to machine components;
application of wear-resistant coating agents on metal and
plastics; powder coating; treatment of metal parts to
prevent corrosion by means of powder coating; treatment of
metal parts for corrosion protection. Scientific and technological services and research;
development of coatings for non-metals; development of
coatings for metals.
The invention relates to a method for separating rhodium from an aqueous hydrochloric solution which contains at least one chloro complex of rhodium and at least one chloro complex of iridium and/or at least one chloro complex of ruthenium. The invention is characterized in that the rhodium is precipitated out of the aqueous hydrochloric solution with a redox potential of ≥950 to 1050 mV using an aliphatic polyamine as a poorly soluble rhodium chloro complex salt while explicitly dispensing with a previously carried out joint separation together with the iridium and/or the ruthenium.
Particulate material Z composed of 15% to 50% by weight of particles X consisting of water-insoluble support material T provided with elemental silver and elemental ruthenium and 50% to 85% by weight of solid Y at least partially disposed on the particles X, wherein the solid Y is selected from the group consisting of aluminum oxide, aluminum hydroxide, aluminum oxyhydroxide, magnesium oxide, magnesium hydroxide, magnesium oxyhydroxide, calcium oxide, calcium hydroxide, calcium oxyhydroxide, silicon dioxide, silica, zinc oxide, zinc hydroxide, zinc oxyhydroxide, zirconium dioxide, zirconium(IV) oxyhydrates, titanium dioxide, titanium(IV) oxyhydrates and combinations thereof.
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
B22F 9/24 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec réduction de mélanges métalliques à partir de mélanges métalliques liquides, p. ex. de solutions
C22C 1/04 - Fabrication des alliages non ferreux par métallurgie des poudres
35.
METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
36.
CYCLIC BIARYL PHOSPHINES AS LIGANDS FOR PALLADIUM-CONTAINING CATALYSTS IN CROSS-COUPLING REACTIONS
The present invention relates to a phosphine of the formula (1), wherein - Q is SiR3R4, GeR3R4, SnR3R4, AsR31-41-4 alkyl; or two groups R that bind to the same carbon atom together with the carbon atom form a 4- to 7-membered ring; or, under the proviso that m + n ≥ 2, two groups R that bind to different carbon atoms together with these carbon atoms form a 4- to 7-membered ring; - Ar1is aryl; - Ar2is aryl; - R3and R41-45-75-7 cycloalkyl or an aryl; or R3and R4 together with the Si, Ge or Sn atom form a 4- to 7-membered ring.
C07F 9/6596 - Composés hétérocycliques, p. ex. contenant du phosphore comme hétéro-atome du cycle comportant des atomes autres que l'oxygène, le soufre, le sélénium, le tellure, l'azote ou le phosphore, comme hétéro-atomes du cycle
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
C07D 401/04 - Composés hétérocycliques contenant plusieurs hétérocycles comportant des atomes d'azote comme uniques hétéro-atomes du cycle, au moins un cycle étant un cycle à six chaînons avec un unique atome d'azote contenant deux hétérocycles liés par une liaison directe de chaînon cyclique à chaînon cyclique
C07D 403/04 - Composés hétérocycliques contenant plusieurs hétérocycles, comportant des atomes d'azote comme uniques hétéro-atomes du cycle, non prévus par le groupe contenant deux hétérocycles liés par une liaison directe de chaînon cyclique à chaînon cyclique
C07D 413/04 - Composés hétérocycliques contenant plusieurs hétérocycles, au moins un cycle comportant des atomes d'azote et d'oxygène comme uniques hétéro-atomes du cycle contenant deux hétérocycles liés par une liaison directe de chaînon cyclique à chaînon cyclique
The invention relates to a method for producing a metal film comprising the steps of applying a metal layer onto a substrate by means of aerosol deposition of a powder and at least partially or completely removing the substrate to obtain a film. The method is particularly suitable for processing brittle metals such as for example tungsten to metal films.
B22F 3/18 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet en utilisant des rouleaux presseurs
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD FOR PRINTING A FUNCTIONAL LAYER ON A SURFACE OF A THREE-DIMENSIONAL ELECTRONIC DEVICE
The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
39.
PROCESS FOR PRODUCING POLYMER CAPACITORS FOR HIGH RELIABILITY APPLICATIONS
The present invention relates to a process for manufacturing a capacitor, compris ing the process steps: a) provision of a porous electrode body (1) made of an electrode material (2), wherein a dielectric (3) at least partially covers a surface of this electrode material (2); b) introduction of a liquid composition which comprises an electrically con ductive polymer and a dispersing agent into at least a part of the porous electrode body (1) provided in process step a), wherein a conductive layer made from the liquid composition has a conductivity of less than 100 S/cm; c) at least partial removal of the dispersing agent from the porous electrode body (1) obtained in process step b) for the formation of a solid electrolyte layer (4) that at least partially covers a surface of the dielectric (3); d) filling at least a part of the pores (5) of the porous electrode body (1) ob tained in process step c) with an impregnation solution comprising at least one impregnation solvent, wherein the at least one impregnation solvent has a boiling point (determined at 1013 hPa) of at least 150°C; e) at least partial removal of the impregnation solvent from the porous elec trode body (1) obtained in process step d); f) encapsulation of the porous electrode body (1) obtained in process step e). The invention also relates to capacitor manufactured with this process, to a capaci tor characterized by a certain a decrease of the relative capacitance upon perfor mance of a surge test, to the use of an electrolytic capacitor and to electronic cir cuits.
The present invention relates to a process for producing a liquid composition comprising a functionalized π-conjugated polythiophenes, comprising the process steps of i) providing a liquid phase comprising a functionalized π-conjugated polythiophene that is dissolved or dispersed in a solvent, wherein the functionalized π-conjugated polythiophene comprises repeating units of the general formula (I) wherein X,Y are identical or different and are O, S, or NR1, wherein R1 is hydrogen or an aliphatic or aromatic residue having 1 to 18 carbon atoms; A is an organic residue carrying an anionic functional group; and wherein the liquid phase has a pH-value of less than 2.5; ii) adjusting the pH-value of the liquid phase provided in process step i) to a value in the range from 2.5 to 10 by the addition of a base. The present invention also relates to a liquid composition obtainable by this process, to a liquid composition comprising a functionalized π-conjugated polythiophene, wherein the composition, after is has been dried, is characterized by a certain weight loss at a given minimum temperature, to a process for the preparation of a layered body in which these liquid compositions are used for the formation of a conductive layer, to a layered body obtainable by this process and to the use of the liquid compositions for the preparation of a conductive layer in an electronic device.
The present invention relates to a printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a hybrid layer between the primer layer and the metal conductive layer, wherein the hybrid layer comprises materials from the primer layer and the metal conductive layer. In addition, the present invention further relates to a method for preparing the printed product and an electronic device comprising the printed product. The metal conductive layer in the printed product of the present invention has excellent uniformity in thickness; good adhesion between the primer layer and the conductive layer; and the printed product of the present invention has excellent EMI shielding effects, such that the printed product can be used in high frequency applications such as 5G applications.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
A composition consisting of: (A) 20% to 30% by weight of one or more thermoplastic polymers, (B) 45% to 69% by weight of organic solvent, (C) 2% to 15% by weight of silica particles, (D) 0.5% to 10% by weight of organic thickener, (C) 1% to 10% by weight of particulate inorganic filler having a Mohs hardness in the range from 1 to 8, and (F) 0% to 1% by weight of one or more constituents other than constituents (A) to (E).
C09J 133/06 - Homopolymères ou copolymères d'esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'atome d'oxygène faisant uniquement partie du radical carboxyle
The present invention relates to a composition comprising i) at least one polythiophene selected from the group consisting of - a polythiophene comprising monomer units of structure (I) in which * indicates the bond to the neighboring monomer units, x, z represent O or S, R1-R4independently from each other represent a hydrogen atom or an organic residue R, with the proviso that at least one of residues R1to R4 represents an organic residue R; a polythiophene which is characterized by its compatibility in PGME (1-methoxypropan-2-ol), demonstrated by an RF-value of at least 0.8; iii) at least one ethylenically unsaturated compound; iv) at least one organic solvent; v) at least one radical initiator. The present invention also relates to a process for preparing a layer structure, to a layer structure obtainable by this process, to a layer structure, to an electronic component and to the use of composition according to the present invention.
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C09K 11/06 - Substances luminescentes, p. ex. électroluminescentes, chimiluminescentes contenant des substances organiques luminescentes
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01L 51/00 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
45.
Method for producing a catalyst system for gas reactions
A method for producing a catalyst system for gas reactions comprising at least one planar structure of noble metal having gas-permeable openings, comprising the steps of:
(1) providing at least one noble metal powder consisting of at least substantially spherical noble metal particles, and
(2) repeatedly applying the noble metal powder or powders provided in step (1) in layers to a substrate in a build chamber, respectively followed by an at least partial melting of the respective noble metal powder applied as a layer with high-energy radiation, and allowing the melted noble metal powder to solidify within the scope of additive manufacturing.
B01J 23/89 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer combinés à des métaux nobles
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
The invention relates to a method for depositing an aluminum oxide layer on the surface of a metal body, the metal of the metal body containing aluminum in an amount of 0.3-6 wt.%. The deposition is carried out by spraying an aerosol onto the surface of the metal body using the aerosol deposition method while an aluminum oxide layer is deposited. The aluminum oxide layer can serve as an anti-corrosion layer. The invention also relates to a metal body comprising an aluminum oxide layer which is produced according to the method.
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
48.
HIGH-STABILITY CATALYST FOR AN ELECTROCHEMICAL CELL
The present invention relates to a method for producing a catalyst for an electrochemical cell, wherein:
a graphited porous carbon material is treated with an oxygen-containing plasma or an aqueous medium containing an oxidising agent,
at least one noble metal compound is deposited on the treated carbon material,
the impregnated carbon material is brought into contact with a reducing agent such that the noble metal compound is reduced to a metallic noble metal.
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
Alloy comprising 90 to 96.8 wt.% of tin; 0.1 to 2.0 wt.% of silver; 2.0 to 4.0 wt.% of bismuth; 1.0 to 2.0 wt.% of antimony; 0.1 to 1.0 wt.% of copper; and 0.01 to 1 wt.% of germanium.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
Platinum complex of the type [L1L2Pt[O(CO)R1]X]n, wherein L1 and L2 are the same or different monoolefin ligands or together represent a compound L1L2 acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 are the same or different C6-C18 or C8-C18 non-aromatic monocarboxylic acid groups with the exception of a phenylacetic acid group, or together represent a C8-C18 non-aromatic dicarboxylic acid group —O(CO)R1R2(CO)O—, wherein it is a mononuclear platinum complex where n=1, or wherein, in the event of the presence of L1L2 and/or of —O(CO)R1R2(CO)O—, it may be a polynuclear platinum complex with a whole number n>1.
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
The invention relates to a process of manufacturing a composite comprising a layer of a polyimide and a substrate, comprising at least these steps: i. Providing a first composition comprising an acid compound; and a second composition comprising a diamine compound; ii. Forming a first layer on the substrate, and iii. Forming a second layer on the first layer, wherein if the first layer is formed by applying the first composition, the second layer is formed by applying the second composition, and vice versa; wherein the first and the second layer overlap at least in part thereby forming a pattern on the substrate; iv. Conducting a thermal treatment on the pattern wherein the polyimide layer is formed. The invention further relates to such a composite, a kit comprising a first composition comprising an acid compound and a second composition comprising a diamine compound as well as a use of the kit.
C09D 11/102 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p. ex. réticulation par UV qui suit l’impression
C09D 11/30 - Encres pour l'impression à jet d'encre
C09D 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
53.
SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
B22F 1/145 - Traitement chimique, p. ex. passivation ou décarburation
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 7/04 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de couches successives avec une ou plusieurs couches non réalisées à partir de poudre, p. ex. à partir de tôles
B22F 7/06 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
54.
PROCESS FOR PRODUCING A NOBLE METAL-MODIFIED GRAPHITIZED CARBON MATERIAL AND SUPPORTED CATALYST
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt.% and nickel at a weight percentage of 0-5 wt.%. The method comprises: providing a reaction mixture comprising - lignin, - the catalyst and - a solvent; and heating the reaction mixture so as to obtain a mixture comprising - a product mix, - the catalyst and - the solvent.
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt.% and nickel at a weight percentage of 0-5 wt.%. The method comprises: providing a reaction mixture comprising - lignin, - the catalyst and - a solvent; and heating the reaction mixture so as to obtain a mixture comprising - a product mix, - the catalyst and - the solvent.
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The invention relates to a method for preparing a catalyst composition, wherein in an aqueous medium containing an iridium compound, at a pH 9, an iridium-containing solid is deposited on a support material, and the support material loaded with the iridium-containing solid is separated from the aqueous medium and dried, wherein, in the method, the support material loaded with the iridium-containing solid is not subjected to a thermal treatment at a temperature of more than 250° C. for a period of time of longer than 1 hour.
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
C25B 11/075 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’un seul élément catalytique ou composé catalytique
H01M 4/90 - Emploi de matériau catalytique spécifié
The invention relates to a method for reductive extraction of elemental noble metals from an acidic aqueous solution containing noble metal, the method comprising the addition of non-noble metal including zinc and/or tin to the acidic aqueous solution containing noble metal to form a reaction mixture, wherein the dissolved noble metal includes iridium, rhodium and/or ruthenium, wherein the non-noble metal is added in a leaner-than-stoichiometric amount, and wherein the pH of the acidic aqueous solution containing noble metal prior to the addition of the non-noble metal is in the range of +0.8 to +3.0 and is also kept in this range in the reaction mixture.
C22B 3/46 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques par substitution, p. ex. par cémentation
The present invention relates to a method for producing a membrane for a fuel cell or electrolytic cell, in which (i) a liquid coating composition, which contains a supported catalyst containing precious metal and also contains an ionomer, is applied to a polymer electrolyte membrane which contains an ionomer, the ionomer of the liquid coating composition and the ionomer of the polymer electrolyte membrane each being a copolymer which contains as monomer a fluoroethylene and a fluorovinyl ether containing a sulfonic acid group, (ii) the coated polymer electrolyte membrane is heated to a temperature in the range from 178° C. to 250° C.
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤ 40 wt.-ppm.
B23K 35/40 - Fabrication de fils ou de barres pour le brasage ou le soudage
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c.-à-d. non caractérisé par le procédé de revêtement
C23C 28/02 - Revêtements uniquement de matériaux métalliques
62.
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL-CERAMIC SUBSTRATE
The invention relates to a method for structuring metal-ceramic substrates and to a structured metal-ceramic substrate which can be used in particular in power electronics. In the method, a first metal-ceramic substrate and a second metal-ceramic substrate are etched, wherein, while being contacted with an etching solution that is capable of removing active metal from the connecting layer of the metal-ceramic substrates, the first metal-ceramic substrate and the second metal-ceramic substrate are positioned such that an orthogonal projection of the first metal-ceramic substrate onto a projection plane parallel to the metal layer of the first metal-ceramic substrate shades no more than 60% of the metal layer of the second metal-ceramic substrate.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).
The invention relates to a coated membrane containing - a membrane with a front and a rear face, - a catalyst-containing coating which is provided on the front face of the membrane, - said catalyst containing - a support material which has a BET surface area of maximally 80 m2/g, and - an iridium-containing coating which is provided on the support material and which contains an iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide or a mixture of at least two of said iridium compounds, wherein - the catalyst contains iridium in a quantity of maximally 60 wt.%, and - the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium / cm2.
C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 11/054 - Électrodes comportant des électro-catalyseurs sur un support
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
C25B 11/091 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’au moins un élément catalytique et d’au moins un composé catalytiqueÉlectrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé de plusieurs éléments catalytiques ou composés catalytiques
The invention relates to a coated membrane containing - a membrane with a front and a rear face, - a catalyst-containing coating which is provided on the front face of the membrane, - said catalyst containing - a support material which has a BET surface area of maximally 80 m2/g, and - an iridium-containing coating which is provided on the support material and which contains an iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide or a mixture of at least two of said iridium compounds, wherein - the catalyst contains iridium in a quantity of maximally 60 wt.%, and - the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium /cm2.
C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 11/054 - Électrodes comportant des électro-catalyseurs sur un support
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
C25B 11/091 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’au moins un élément catalytique et d’au moins un composé catalytiqueÉlectrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé de plusieurs éléments catalytiques ou composés catalytiques
66.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: - a support material, - an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2) x BET) / (1+ 0.0176 (g/m2) x BET) Ir-G (4.012 (g/m2) x BET) / (1+ 0.0468 (g/m2) x BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, inwt.%, of the catalyst.
C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 11/054 - Électrodes comportant des électro-catalyseurs sur un support
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
C25B 11/091 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’au moins un élément catalytique et d’au moins un composé catalytiqueÉlectrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé de plusieurs éléments catalytiques ou composés catalytiques
67.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: - a support material, - an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2) x BET) / (1 + 0.0176 (g/m2) x BET) ≤ Ir-G ≤ (4.012 (g/m2) x BET) / (1 + 0.0468 (g/m2) x BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt.%, of the catalyst.
C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 11/054 - Électrodes comportant des électro-catalyseurs sur un support
C25B 11/067 - Composé inorganique, p. ex. oxyde d'indium-étain, silice ou oxydes de titane
C25B 11/091 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’au moins un élément catalytique et d’au moins un composé catalytiqueÉlectrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé de plusieurs éléments catalytiques ou composés catalytiques
68.
SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt.% of silver flakes with an average particle size ranging from 1 to 20 µm, (B) 8 to 20 wt.% of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt.% of silver(I) oxide particles, (D) 12 to 20 wt.% of at least one organic solvent, (E) 0 to 1 wt.% of at least one polymer binder, and (F) 0 to 0.5 wt.% of at least one additive differing from the components (A) to (E).
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 7/06 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
B23K 101/36 - Dispositifs électriques ou électroniques
09 - Appareils et instruments scientifiques et électriques
Produits et services
Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; scientific research and laboratory apparatus, educational apparatus and simulators; apparatus, instruments and cables for electricity; scientific and laboratory devices for treatment using electricity; chemistry apparatus and instruments; chemical reactors; laboratory apparatus and instruments; laboratory mixers; crucibles [laboratory]; scientific apparatus and instruments; measuring devices; temperature measuring instruments; testing and quality control devices; material testing apparatus; meter testing apparatus; testing apparatus and instruments.
The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p. ex. dépôt électrolytique
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
C22B 11/02 - Obtention des métaux nobles par voie sèche
C22B 7/00 - Mise en œuvre de matériaux autres que des minerais, p. ex. des rognures, pour produire des métaux non ferreux ou leurs composés
C22B 9/10 - Procédés généraux d'affinage ou de refusion des métauxAppareils pour la refusion des métaux sous laitier électroconducteur ou à l'arc avec des agents d'affinage ou fondantsEmploi de substances pour ces procédés
The present invention relates a process for the production of a layer composition (9), comprising the process steps: a) provision of a substrate (10) with a substrate surface (11); b) formation of a stabilized electrically conductive polymer layer (12) on at least a part of the substrate surface (11), the formation of the stabilized electrically conductive polymer layer (12) comprising the process steps: b1) formation of an electrically conductive polymer layer (13) comprising an electrically conductive polymer on at least a part of the substrate surface (11); b2) application of a liquid stabilizer phase, comprising at least one stabilizer (7) and at least one solvent or dispersant, onto the electrically conductive polymer layer (13) obtained in process step b1) for the formation of a stabilizer layer (14), wherein the at least one stabilizer (7) is a flavonoid. The present invention also relates to a layer composition and to the use of a layer composition.
A method for breaking down a mixture, which is present in the form of solid particles, consisting of: (A) 0 to 99% by weight of metallic ruthenium, (B) 0 to 50% by weight of at least one element other than ruthenium, which is present in elementary form, selected from the group of elements of the atomic numbers 13, 21-30, 39-42, 45-52, and 72-83, (C) 0 to 99% by weight of ruthenium oxide, (D) 0 to 70% by weight of at least one solid element oxide other than ruthenium, (E) 0 to 30% by weight of at least one inorganic substance other than (A) to (D), and (F) 0 to 3% by weight of at least one organic substance, wherein the sum of the % by weight of the compounds (A) to (F) is 100% by weight and the ruthenium content of the mixture is 2 to 99% by weight, and wherein the method comprises the steps of: (1) optionally mixing said mixture with alkali carbonate by forming a blend, (2) alkaline oxidizing breakdown of the mixture or of the blend, respectively, formed in optional step (1) into molten potassium hydroxide using a gaseous oxidizing agent selected from the group consisting of air, oxygen, and air/oxygen mixtures, and without use of nitrate, and (3) cooling down the breakdown material formed in step (2) to a temperature below its solidification temperature, wherein the gaseous oxidizing agent is introduced into the melt in step (2).
The invention relates to a method for recovering noble metal from a heterogeneous catalytic converter comprising a solid supporting material and palladium, platinum or rhodium, present at least partially in elemental form, said method comprising the steps of: (a) converting the noble metal to an oxidation level > 0 by treating the heterogeneous catalytic converter with an oxidizing agent in the presence of hydrochloric acid so as to form a two-phase system A comprising a hydrochloric aqueous phase A1 and a solid phase comprising the supporting material which is insoluble therein, (b) optionally, at least partially separating the hydrochloric aqueous phase A1 from the two-phase system A and adding a further aqueous phase to the remaining residue of the two-phase system A so as to form a two-phase system B comprising a hydrochloric aqueous phase B1 and a solid phase comprising the supporting material insoluble therein, and (c) cathodic electro-deposition of the at least one noble metal from the hydrochloric aqueous phase of the two-phase system.
C22B 3/22 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés physiques, p. ex. par filtration, par des moyens magnétiques
C22B 3/44 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques
The invention relates to a wire for electrically contacting temperature sensors, the wire consisting of at least 50 wt % of a platinum composition, the platinum composition containing between 2 wt % and 3.5 wt % tungsten, up to 47.95 wt % of at least one precious metal selected from the group consisting of rhodium, gold, iridium and palladium and mixtures thereof, between 0.05 wt % and 1 wt % oxides of at least one non-precious metal selected from the group consisting of (i) zirconium, (ii) aluminum and (iii) zirconium and at least one element selected from aluminum, yttrium and scandium, and, as the remainder, at least 50 wt % platinum including impurities. The invention also relates to a temperature sensor having such a wire, and to a method for producing such a wire and such a temperature sensor.
C22C 5/04 - Alliages à base d'un métal du groupe du platine
B21C 1/02 - Étirage des fils métalliques ou d'un matériau flexible analogue au moyen de machines ou d'appareils à étirer dans lesquels l'étirage est effectué par des tambours
C22F 1/14 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des métaux nobles ou de leurs alliages
G01K 7/18 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance linéaire, p. ex. un thermomètre à résistance de platine
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
09 - Appareils et instruments scientifiques et électriques
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
Produits et services
Semiconductor testing apparatus; material testing apparatus;
probes for testing semiconductors; contacts, electric;
conductors, electric. Precious metals and their alloys; precious metal alloys for
use in electronic technology; palladium alloys; precious
metal alloys [other than for use in dentistry].
77.
CATALYST SYSTEM AND METHOD FOR THE CATALYTIC COMBUSTION OF AMMONIA TO FORM NITROGEN OXIDES IN A MEDIUM-PRESSURE SYSTEM
Known catalyst systems for the catalytic combustion of ammonia to form nitrogen oxides consist of a plurality of single- or multilayer catalyst gauzes warp-knitted, weft-knitted or woven from platinum-based noble metal wire, which, when arranged one behind the other in a fresh gas flow direction, form a front group of gauze layers and at least one downstream group of gauze layers arranged after the front group. To provide from this starting point a catalyst system for use in a medium-pressure plant for ammonia oxidation, with which a high service life and a high yield of the main product NO can be achieved, it is proposed that the front group comprises a gauze layer or a plurality of gauze layers made of a first, rhodium-rich noble metal wire, wherein the gauze layer or one of the gauze layers made of the rhodium-rich noble metal wire is a front gauze layer facing the fresh gas, and that the downstream group comprises gauze layers made of a second, rhodium-poor noble metal wire, wherein the rhodium content in the rhodium-rich noble metal wire is at least 7 wt. % and no more than 9 wt. % and is at least 1 percentage point higher than the rhodium content in the rhodium-poor noble metal wire
D04B 21/20 - Procédés de tricotage chaîne pour la production de tricots ou articles qui ne dépendent pas de l'emploi de machines particulièresTricots ou articles définis par de tels procédés spécialement conçus pour le tricotage d'articles à configuration particulière
D04B 1/22 - Procédés de tricotage trame pour la production de tricots ou d'articles ne dépendant pas de l'emploi de machines spécialesTricots ou articles définis par de tels procédés spécialement conçus pour le tricotage d'articles de configuration particulière
D03D 1/00 - Tissus conçus pour faire des articles particuliers
78.
PRODUCTION OF SURFACE-MODIFIED CU RIBBONS FOR LASER BONDING
The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally molding the wire precursor in the process; and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt.% of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.
B21B 1/16 - Méthodes de laminage ou laminoirs pour la fabrication des produits semi-finis de section pleine ou de profilésSéquence des opérations dans les trains de laminoirsInstallation d'une usine de laminage, p. ex. groupement de cagesSuccession des passes ou des alternances de passes pour laminer du fil métallique ou un matériau semblable de petite section
B21H 8/00 - Laminage du métal en longueurs indéfinies spécialement approprié à la fabrication en série d'objets particuliers
B21J 5/12 - Formage de profilés sur des surfaces internes ou externes
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
79.
Catalyst system and method for the catalytic combustion of ammonia to form nitrogen oxides in a medium-pressure system
The invention relates to a dispersion-hardened platinum composition comprising at least 70 wt. % platinum, the platinum composition containing up to 29.95 wt. % of one of the metals rhodium, gold, iridium and palladium, between 0.05 wt. % and 1 wt. % oxides of the non-precious metals zirconium, yttrium and scandium, and, as the remainder, the platinum including impurities, wherein between 7.0 mol. % and 11.0 mol. % of the oxides of the non-precious metals is yttrium oxide, between 0.1 mol. % and 5.0 mol. % of the oxides is scandium oxide, and the remainder of the oxides is zirconia, including oxide impurities. The invention also relates to a crucible for crystal growing, a semi-finished product, a tool, a tube, a stirrer, a fiberglass nozzle or a component for producing or processing glass made of a platinum composition of this kind and to a method for the production of a platinum composition.
C23C 8/12 - Oxydation au moyen de l'ozone ou de l'oxygène
C22C 1/02 - Fabrication des alliages non ferreux par fusion
C22C 5/04 - Alliages à base d'un métal du groupe du platine
C30B 35/00 - Appareillages non prévus ailleurs, spécialement adaptés à la croissance, à la production ou au post-traitement de monocristaux ou de matériaux polycristallins homogènes de structure déterminée
The invention relates to a layered composite comprising two outwardly facing metal layers and, located therebetween, an alternating layer sequence of n layers of a hydraulically hardened inorganic cement composition and n - 1 metal layers with n = 1, 2 or 3.
B32B 13/02 - Produits stratifiés composés essentiellement d'une substance à prise hydraulique, p. ex. du béton, du plâtre, du ciment, ou d'autres matériaux entrant dans la construction avec des fibres ou particules enrobées dans ces substances ou liées à ces substances
B32B 13/06 - Produits stratifiés composés essentiellement d'une substance à prise hydraulique, p. ex. du béton, du plâtre, du ciment, ou d'autres matériaux entrant dans la construction comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique de métal
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
82.
LAMINATE FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE
The laminate for an image display device of the present invention at least comprises: an adhesive layer formed of an adhesive composition comprising an adhesive polymer (A), a conductive polymer (B) comprising a conjugated polymer and a polyanion, and a crosslinking agent (C), an image display element located on one of two surfaces of the adhesive layer, and a polarizing film located on the other surface of the adhesive layer, wherein with respect to a test material comprising the adhesive layer having the polarizing film on one surface and a protective material, which has a release layer and which comprises polyethylene terephthalate (PET), on the other surface of the adhesive layer, with the adhesive layer and the release layer being located so as to be adjacent to each other, when the protective material is peeled off from the test material in an environment of a temperature of 23C and a relative humidity of 50%, a surface resistivity of the adhesive layer is 1 x 1012Ω/□ or less, a haze value of the test material from which the protective material has been peeled off is 2% or less, and the following formula (1) is satisfied. y/x < 10 ・・・ (1) (wherein x represents a surface resistivity of the adhesive layer when the protective material is peeled off from the test material in an environment of a temperature of 23°C and a relative humidity of 50%, and y represents a surface resistivity of the adhesive layer when the protective material is peeled off from the test material in an environment of a temperature of 23°C and a relative humidity of 50%, provided that the test material has been maintained in an environment of a temperature of 60°C and a relative humidity of 90% for 500 hours and dried at 80°C for 1 hour.)
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
H01L 51/50 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED)
The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact.
nmmm, wherein L means a compound functioning as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 mean identical or different non-aromatic C6-C18-monocarboxylic acid residues, and wherein n is a whole number ≥ 1 and m is a whole number ≥ 2, and (C) 0 to 10 wt% of at least one additive.
C23C 18/12 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt sur des matériaux inorganiques, autres que des matériaux métalliques
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
85.
NOBLE METAL COMPLEXES COMPRISING DIOLEFIN AND C6-C18 MONOCARBOXYLATE LIGANDS FOR SURFACE COATING
nmmm, in which L represents a compound acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, in each case with the exception of a phenylacetic acid residue, and wherein n is an integer ≥ 1 and m is an integer ≥ 2.
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
C23C 18/08 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt d'un matériau métallique
86.
Additive printing method for printing a functional print pattern on a surface of a three-dimensional object, associated computer program and computer-readable medium
An additive printing method depositing a functional print pattern on a surface of a 3D object, an associated computer program, and a computer-readable medium storing the program. The method comprises as steps (i) providing the object on a planar surface; (ii) providing a print head having print nozzles defining a plane non-parallel to the planar surface; (iii) generating 3D geometrical surface data of an exposed surface of the object on the planar surface; (iv) generating 2D geometrical surface data of the exposed surface on the basis of the 3D geometrical surface data; (v) determining an amount of printing fluid to be discharged at a discharge time from each of the print nozzles; (vi) generating a relative movement between the object and the print head; and (vii) printing a print pattern on at least one portion of the exposed surface during the relative movement. A step of correcting data is included.
B33Y 50/02 - Acquisition ou traitement de données pour la fabrication additive pour la commande ou la régulation de procédés de fabrication additive
B29C 64/112 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des gouttelettes individuelles, p. ex. de buses de jet
Additive manufacturing method for producing moldings comprising or consisting of an element selected from the group of refractory metals, wherein refractory metal powder having an oxygen content of at least 500 mol ppm is used for the additive manufacturing method.
B22F 10/28 - Fusion sur lit de poudre, p. ex. fusion sélective par laser [FSL] ou fusion par faisceau d’électrons [EBM]
B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
B22F 5/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques caractérisée par la forme particulière du produit à réaliser
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
B22F 9/16 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
06 - Métaux communs et minerais; objets en métal
09 - Appareils et instruments scientifiques et électriques
Produits et services
Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)
89.
PROCESS FOR PRODUCING POLYMER CAPACITORS FOR HIGH RELIABILITY APPLICATIONS
The present invention relates to a method for manufacturing a capacitor, comprising the meth- od steps: a) provision of a porous electrode body (1) made of an electrode material (2), wherein a dielectric (3) at least partially covers a surface of this electrode material (2); b) introduction of a liquid composition which comprises an electrically conductive polymer, at least one high-boiling solvent having a boiling point (determined at 1013.25 hPa) of at least 150°C and of not more than 275°C and optionally a dispersing agent into at least a part of the porous electrode body (1) provided in process step a) and at least partial removal of the high-boiling solvent and, if present, of the dispersing agent for the formation of a solid electrolyte (4) that at least partially covers a surface of the dielectric (3); c) filling at least a part of the pores of the porous electrode body (1) obtained in process step b) with an impregnation solution (6) comprising at least one impregnation solvent, wherein the at least one impregnation solvent comprises at least one hydroxy group and has a molecular weight in the range from 70 to 180 g/mol; d) encapsulation of the porous electrode body (1) obtained in process step c). The invention also relates to capacitor manufactured with this method, the use of an electrolytic capacitor and electronic circuits.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
H01G 9/028 - Électrolytes organiques semi-conducteurs, p. ex. TCNQ
H01G 9/035 - Électrolytes liquides, p. ex. matériaux d'imprégnation
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD FOR PRINTING A FUNCTIONAL LAYER ON A SURFACE OF A THREE-DIMENSIONAL ELECTRONIC DEVICE
The present invention relates to an assembly to be used in an inkjet printer (1), an inkjet printer (1) and a method for printing. The assembly comprises (i) a first fixture (3a) configured to hold a first print head (200); and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section (20) in which a functional layer is printed on a surface of an electronic device (1000), a sintering section (40) spaced apart from the first printing section (20) and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section (20) to the sintering section (40). The first fixture 3a is movable from one processing line A, B, C, D to another processing line A, B, C, D.
B41J 3/407 - Machines à écrire ou mécanismes d'impression ou de marquage sélectif caractérisés par le but dans lequel ils sont construits pour le marquage sur des matériaux particuliers
B41J 11/00 - Dispositifs ou agencements pour supporter ou manipuler un matériau de copie en feuilles ou en bandes
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
91.
METHOD FOR PRODUCING GLASS-FIBRE NOZZLES, AND GLASS-FIBRE NOZZLE
The invention relates to a method for producing glass-fibre nozzles, comprising the following steps: A) providing or producing a base plate (81) comprising a first material, wherein the first material is chemically resistant to the glass melt and is dispersion hardened; B) pressing at least one tube (82, 92), made of a second material, onto a face of the base plate (81), wherein the at least one tube (82, 92) comprises in each case at least one feedthrough (84, 94) and wherein the second material is chemically resistant to the glass melt; C) producing at least one passage (80) in the base plate (81), wherein the at least one passage (80) through the base plate (81) is connected to at least one of the at least one feedthrough (84, 94) of in each case one of the at least one tube (82, 92) such that each of the at least one passage (80) through the base plate (81) forms, together with at least one of the at least one feedthrough (84, 94) of an associated tube (82, 92) of the at least one tube (82, 92), a common line through which the glass melt can pass, which line leads through the base plate (81) and through the associated tube (82, 92), and wherein the base plate (181) is produced using a different method than the at least one tube (82, 92). The invention also relates to a glass-fibre nozzle for producing glass fibres and to a method for producing glass fibres.
The invention relates to a wire (1) or strip for production of test needles or slide contacts, the wire (1) or strip including a material or consisting of a material, the material having a matrix composed of copper, palladium, rhodium, or of a copper-base alloy, palladium-base alloy or rhodium-base alloy, including impurities associated therewith, wherein the matrix forms a coherent, metallically conductive structure in the material, wherein the boron nitride nanotubes are present in the matrix, wherein the boron nitride nanotubes form a fixed structure with the matrix. The invention also relates to a process for producing a wire (1) or tape and a test needle, a slide wire, a slide contact and a test needle array having at least one fragment of such a wire (1) or strip.
B22F 5/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques caractérisée par la forme particulière du produit à réaliser
B22F 5/12 - Fabrication de pièces ou d'objets à partir de poudres métalliques caractérisée par la forme particulière du produit à réaliser de tubes ou de fils
C22C 32/00 - Alliages non ferreux contenant entre 5 et 50% en poids d'oxydes, de carbures, de borures, de nitrures, de siliciures ou d'autres composés métalliques, p. ex. oxynitrures, sulfures, qu'ils soient soient ajoutés comme tels ou formés in situ
C22C 47/08 - Fabrication d'alliages contenant des fibres ou des filaments métalliques ou non métalliques par mise en contact des fibres ou des filaments avec un métal fondu, p. ex. en imprégnant les fibres ou les filaments placés dans un moule
C22C 49/02 - Alliages contenant des fibres ou des filaments métalliques ou non métalliques caractérisés par le matériau de la matrice
C22C 49/14 - Alliages contenant des fibres ou des filaments métalliques ou non métalliques caractérisés par les fibres ou les filaments
C22C 47/14 - Fabrication d'alliages contenant des fibres ou des filaments métalliques ou non métalliques par métallurgie des poudres, c.-à-d. par traitement de mélanges de poudre métallique et de fibres ou de filaments
93.
METHOD FOR PRODUCING A PRECIOUS METAL-CONTAINING COLLECTOR ALLOY OR PURE SILVER
The invention relates to a method for producing a collector alloy which comprises a total of 25 to 100 wt.% of precious metal, comprising 0 to <97 wt.% of the precious metal silver, 0 to 75 wt.% of at least one precious metal selected from gold, platinum, rhodium, and palladium, and 0 to 75 wt.% of at least one non-precious metal selected from copper, iron, tin, and nickel or for producing pure silver, having the steps of: (1) providing precious metal waste comprising a total of 4 to 30 wt.% of precious metal, comprising 0 to 30 wt.% of the precious metal silver, 0 to 10 wt.% of at least one precious metal selected from gold, platinum, rhodium, and palladium, 0 to 10 wt.% of at least one non-precious metal selected from copper, iron, tin, and nickel, and 70 to 96 wt.% of at least one refractory inorganic material, (2) providing a fluxing agent which, when melted together with the refractory inorganic material from the precious metal waste provided in step (1), is capable of forming a molten slag consisting of >35 to 45 wt.% of calcium oxide, 35 to 45 wt.% of silicon dioxide, 15 to <20 wt.% of aluminum oxide, and 0 to <15 wt.% of one or more refractory inorganic compounds differing from calcium oxide, silicon dioxide, and aluminum oxide, (3) melting together the materials provided in steps (1) and (2) at a temperature ranging from 1300 to 1600 °C, thereby forming a melt comprising at least two phases of different densities, said phases lying one over the other, and (4) separating the upper phase and the lower phase, wherein the upper phase comprises a slag phase consisting of >35 to 45 wt.% of calcium oxide, 35 to 45 wt.% of silicon dioxide, 15 to <20 wt.% of aluminum oxide, and 0 to <15 wt.% of one or more refractory inorganic compounds differing from calcium oxide, silicon dioxide, and aluminum oxide, and the lower phase comprises the collector alloy or pure silver. None of the materials used in the method comprise copper oxide apart from the copper oxide optionally used as the outer copper oxide layer provided on metallic copper.
A clad wire for producing test needles or sliding contacts is provided herein, the clad wire having a wire core made of rhodium or a rhodium-based alloy, an inner cladding made of copper or silver or aluminum or a copper-based alloy or a silver-based alloy or an aluminum-based alloy, wherein the inner cladding covers or completely encloses the wire core on at least two opposite sides, an adhesion-promoting layer made of gold or a gold-based alloy, which is arranged between the wire core and the inner cladding, and an outer cladding made of a metal or a metal alloy having a greater hardness than the inner cladding, wherein the outer cladding encloses the inner cladding. A method for producing a clad wire and to a test needle having at least one clad wire or produced from a clad wire and a test needle array is also provided herein.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
The invention relates to a composition containing at least the two following components: a) a silver carboxylate, and b) a terpene, an ink for ink jet printing and a paste for printing with a screen printing method, wherein the ink or the paste, respectively, each contains the composition according to the invention. The invention also relates to a method for producing a pattern on a substrate, at least comprising the following steps: A) providing a substrate and a composition containing at least one silver carboxylate and one terpene; B) applying the composition to the substrate while preserving a precursor with the pattern; C) treating the precursor with the pattern according to a treatment step that is selected from the group consisting of: a) at a temperature of more than 200° C. for at least 10 minutes, wherein the treatment is preferably carried out in an atmosphere of air; b) a photonic sintering process; c) a combination of a) and b), wherein the substrate to which the pattern is applied is preserved. The invention further relates to a printer, an item that is coated at least in part, and a use of the composition according to the invention for applying a pattern.
C09D 11/03 - Encres d’imprimerie caractérisées par des particularités autres que la nature chimique du liant
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
Solder paste consisting of 85% to 92% by weight of a tin-based solder and 8% to 15% by weight of a flux, wherein the flux comprises i) 30% to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5% to 20% by weight, based on its total weight, of at least one low-molecular weight carboxylic acid; and iii) 0.4% to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molar mass distribution of 45 to 70 area% in the molar mass range of 150 to 550 and of 30 to 55 area% in the molar mass range of >550 to 10 000 in the combined GPC.
B23K 35/00 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/38 - Emploi d'environnements spécifiés, p. ex. d'atmosphères particulières entourant la zone de travail
B23K 35/365 - Emploi de compositions non métalliques spécifiées comme enrobages, soit seules, soit liées à l'emploi de matériaux spécifiés pour le brasage ou le soudage
B23K 35/368 - Emploi de compositions non métalliques spécifiées pour fil fourré, soit seules, soit liées à l'emploi de matériaux spécifiés pour le brasage ou le soudage
A process for recovering precious metal from an acidic aqueous solution containing dissolved precious metal and free chlorine, comprising the sequential steps: (1) a salt of a non-precious metal at a low oxidation stage and in the form of a solid or an aqueous solution and the acidic aqueous solution are added together, resulting in the consumption of the free chlorine and the formation of an acidic aqueous mixture, and (2) a non-precious metal is added to the acidic aqueous mixture formed in step (1), leading to the precipitation of elementary precious metal.
C22B 3/46 - Traitement ou purification de solutions, p. ex. de solutions obtenues par lixiviation par des procédés chimiques par substitution, p. ex. par cémentation
C22B 3/00 - Extraction de composés métalliques par voie humide à partir de minerais ou de concentrés
C22B 11/06 - Obtention des métaux nobles chloruration
nn, wherein L1 and L2 represent identical or different monoolefin ligands or together represent a compound L1L2 which functions as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 represent identical or different nonaromatic C6-C18 monocarboxylic acid radicals or together represent a nonaromatic C8-C18 dicarboxylic acid radical -O(CO)R1R2(CO)O-, wherein the complexes are mononuclear platinum complexes with n = 1 or wherein in case of the presence of L1L2 and/or of -O(CO)R1R2(CO)O- the complexes may be polynuclear platinum complexes with integer n > 1, and (C) 0% to 10% by weight of at least one additive.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 du tableau périodique
The present invention relates to a method for producing a catalyst for an electrochemical cell, wherein: - a graphited porous carbon material having an oxygen-containing plasma or an aqueous medium containing an oxidising agent is treated, - at least one noble metal compound is deposited on the treated carbon material, - the impregnated carbon material is brought into contact with a reducing agent such that the noble metal compound is reduced to a metallic noble metal.
The invention relates to a method for producing a particulate carrier material provided with silver and ruthenium, comprising the following steps: a) providing a water-insoluble particulate carrier material and aqueously dissolved silver and ruthenium precursors, b) bringing the particulate carrier material into contact with the aqueous solution of the precursors to form an intermediate, c) bringing the intermediate into contact with an aqueous hydrazine solution having a pH value of >7 to 14 to form a mass comprising silver and ruthenium, d) optionally washing the obtained mass, and e) removing water and other possible volatile components from the mass.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/44 - Revêtement avec des métaux nobles en utilisant des agents réducteurs
B22F 1/02 - Traitement particulier des poudres métalliques, p.ex. en vue de faciliter leur mise en œuvre, d'améliorer leurs propriétés; Poudres métalliques en soi, p.ex. mélanges de particules de compositions différentes comportant un enrobage des particules
B22F 9/24 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec réduction de mélanges métalliques à partir de mélanges métalliques liquides, p. ex. de solutions
