Chengdu Timemaker Crystal Technology Co., Ltd

Chine

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        International 4
        États-Unis 2
Date
2025 (AACJ) 1
2024 1
2021 1
Avant 2020 3
Classe IPC
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz 3
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs 2
H03H 9/215 - Diapasons à cristal de quartz 2
H03H 9/21 - Diapasons à cristal 1
Statut
En Instance 1
Enregistré / En vigueur 5
Résultats pour  brevets

1.

Tuning fork quartz crystal oscillator and resonator

      
Numéro d'application 18947009
Statut En instance
Date de dépôt 2024-11-14
Date de la première publication 2025-05-15
Propriétaire Chengdu Timemaker Crystal Technology Co., Ltd. (Chine)
Inventeur(s)
  • Li, Hui
  • Chen, Rongguo
  • Ye, Zhuzhi

Abrégé

A tuning fork quartz crystal oscillator and a resonator are provided. The tuning fork quartz crystal oscillator includes a quartz crystal oscillator body, where an energy transfer path of the quartz crystal oscillator body is provided with outwardly protruding energy splitters. In the tuning fork quartz crystal oscillator, the outwardly protruding energy splitters are added to a fixed portion of the tuning fork, and the quartz crystal oscillator is packaged and fixed to a ceramic base. This design effectively limits the energy of prongs to the outwardly protruding energy splitters instead of a dispensing position of the fixed portion, avoiding energy transfer to the ceramic base and thus avoiding excessive overall impedance of the device due to vibration leakage.

Classes IPC  ?

2.

Tuning fork crystal oscillator plate and manufacturing method therefor, and piezoelectric device

      
Numéro d'application 18514751
Numéro de brevet 12160223
Statut Délivré - en vigueur
Date de dépôt 2023-11-20
Date de la première publication 2024-11-14
Date d'octroi 2024-12-03
Propriétaire CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY CO., LTD. (Chine)
Inventeur(s)
  • Li, Hui
  • Chen, Rongguo
  • Ye, Zhuzhi

Abrégé

The present invention provides a tuning fork crystal oscillator plate and a manufacturing method therefor, and a piezoelectric device. The tuning fork crystal oscillator plate has a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps; and outer surfaces of the step-shaped sinking groove are all plated with electrodes. The piezoelectric oscillator plate manufactured by the present invention has the advantages of low impedance, high frequency precision and low energy consumption.

Classes IPC  ?

  • H03H 9/21 - Diapasons à cristal
  • H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
  • H03H 9/215 - Diapasons à cristal de quartz

3.

POLISHED QUARTZ CRYSTAL FREQUENCY WAFER WITH BOSS STRUCTURE ON EDGE

      
Numéro d'application CN2019096069
Numéro de publication 2021/003755
Statut Délivré - en vigueur
Date de dépôt 2019-07-16
Date de publication 2021-01-14
Propriétaire CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY CO., LTD. (Chine)
Inventeur(s)
  • Li, Hui
  • Ye, Zhuzhi

Abrégé

Disclosed is a polished quartz crystal frequency wafer with a boss structure on an edge, the polished quartz crystal frequency wafer comprising an original wafer in the form of a rectangular block, with the boss structure being arranged on the original wafer, and the boss structure using any one of the following four kinds of structures: structure I: bosses connected to one another are arranged on the four side faces of the original wafer so as to form a rectangular quartz wafer (1); structure II: bosses are symmetrically arranged on two short side faces of the original wafer to form an H-steel-type short H-shaped quartz wafer; structure III: bosses are symmetrically arranged on two long side faces of the original wafer to form an H-steel-type long H-shaped quartz wafer; and structure IV: bosses are arranged mirrored on the upper bottom face and the lower bottom face of the original wafer to form a prism quartz wafer, wherein the prism quartz wafer comprises a plate wafer (7) with a length X, a width Y, and a height Z, the plate wafer (7) is the original wafer, bumps (8) in the form of a prism are arranged mirrored on the upper surface and the lower surface of the plate wafer (7), and the bumps (8) are located at the diagonal corners of the surface. The quartz crystal frequency wafer solves the problem of lamination.

Classes IPC  ?

  • H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz

4.

QUARTZ CRYSTAL RESONATOR HAVING CIRCULAR WAFER STRUCTURE AND METHOD FOR MANUFACTURING SAME

      
Numéro d'application CN2016074957
Numéro de publication 2017/107307
Statut Délivré - en vigueur
Date de dépôt 2016-02-29
Date de publication 2017-06-29
Propriétaire CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY CO., LTD (Chine)
Inventeur(s)
  • Ye, Zhuzhi
  • Lu, Wang
  • Lei, Han
  • Pu, Bo

Abrégé

A quartz crystal resonator having a circular wafer structure and a method for manufacturing same. The resonator is packaged by a quartz wafer (10), a packaging cover (20), and a packaging base (30). The quartz wafer (10) comprises a circular member (11), a connecting portion (12), and a protection frame (13). The circular member (11) can freely oscillate in a packaged cavity. An electrode region (14) is provided on the circular member (11). A metal layer A (15) is provided on the connecting portion (12) and the protection frame (13). A metal layer B (17) is provided in positioning holes (16) on the protection frame (13). Pins (31) are provided on the packaging base (30). The electrode region (14) is electrically connected to the pins (31) by means of the metal layer A (15) and the metal layer B (17). The method for manufacturing a resonator can be used in mass production of small resonators at low cost, and can enhance the energy trapping effect at the center of a quartz wafer and significantly improve product consistency.

Classes IPC  ?

  • H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz

5.

PIEZOELECTRIC QUARTZ WAFER WITH SINGLE CONVEX STRUCTURE

      
Numéro d'application CN2016074953
Numéro de publication 2017/012347
Statut Délivré - en vigueur
Date de dépôt 2016-02-29
Date de publication 2017-01-26
Propriétaire CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY CO., LTD (Chine)
Inventeur(s)
  • Ye, Zhuzhi
  • Lu, Wang
  • Lei, Han

Abrégé

A piezoelectric quartz wafer with a single convex structure comprises a central component (1), a protection frame (2), and a connection portion (3). A cavity is provided in the protecting frame (2), the central component (1) is disposed in the cavity, and a boss (4) is provided on the top surface of the central component (1). Through grooves A (5) are formed between the two long sides of the protecting frame (2) and the two long sides of the central component (1), and through grooves B (6) are formed between the two short sides of the protecting frame (2) and the two short sides of the central component (1). The through grooves A (5) are communicated with the through grooves B (6). The connection portion (3) is provided in any one of the through grooves B (6). The piezoelectric quartz wafer has the following beneficial effects: the piezoelectric quartz wafer can be used for batch production of small-sized quartz wafers and weaken parasitic vibration generated by the edge; meanwhile, the piezoelectric quartz wafer can strengthen the energy trapping effect of the centre of the quartz crystal wafer, improve working accuracy , and greatly improve product consistency.

Classes IPC  ?

  • H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz

6.

NOVEL PIEZOELECTRIC QUARTZ WAFER WITH DUAL-CONVEX STRUCTURE AND PROCESSING CRAFT THEREFOR

      
Numéro d'application CN2016074955
Numéro de publication 2017/012348
Statut Délivré - en vigueur
Date de dépôt 2016-02-29
Date de publication 2017-01-26
Propriétaire CHENGDU TIMEMAKER CRYSTAL TECHNOLOGY CO., LTD (Chine)
Inventeur(s)
  • Ye, Zhuzhi
  • Lu, Wang
  • Lei, Han

Abrégé

Disclosed is a novel piezoelectric quartz wafer with a dual-convex structure. The novel piezoelectric quartz wafer comprises a central component (1), a protection frame (2), and a connection portion (3). A cavity is provided in the protecting frame (2), a boss I (4) is provided on the top surface of the central component (1), and a boss II (5) is provided on the bottom surface of the central component (1). Through grooves A (6) are formed between the two long sides of the protecting frame (2) and the two long sides of the central component (1), and through grooves B (7) are formed between the two short sides of the protecting frame (2) and the two short sides of the central component (1). The through grooves A (6) are communicated with the through grooves B (7). The connection portion (3) is provided in any one of the through grooves B (7). The present invention has the following beneficial effects: the piezoelectric quartz wafer can be used for batch production of small-sized quartz wafers and weaken parasitic vibration generated by the edge; meanwhile, the piezoelectric quartz wafer can strengthen the energy trapping effect of the centre of the quartz crystal wafer, improve working accuracy , and greatly improve product consistency.

Classes IPC  ?

  • H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs