A semiconductor vertical cavity surface emitting laser (VCSEL), the VCSEL comprising a first mirror region forming a lower distributed Bragg reflector and a second mirror region forming an upper distributed Bragg reflector, the upper distributed Bragg reflector and the lower distributed Bragg reflector defining a vertical resonant cavity comprising an inner region and an outer region. The VCSEL further comprises a resistive structure comprising a resistive portion in the outer region and an etched portion located in the inner region of the vertical resonant cavity, such that a conducting channel is formed in the inner region.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
An optical element for beam-shaping applications is disclosed. The disclosed optical element includes a plurality of structures formed on a substrate, wherein in a cross-section orthogonal to a plane defined by the substrate, an upper portion of a surface of each structure has a greater tilt-angle relative to an optical axis orthogonal to the substrate than a lower portion of the surface, the lower portion being closer to the substrate than the upper portion. Each structure may be arranged on the substrate such that radiation entering each structure through the substrate, in a direction substantially parallel to the optical axis and undergoing internal reflection within each structure, exits the surface of each structure along a path that does not intersect a directly adjacent structure of the plurality of structures.
A method of making an optical device. The method comprises providing a semiconductor wafer, providing an array of emitters located on a first side of the wafer and providing one or more optical components on a second, opposite side of the wafer, wherein the or each optical component is arranged to split light from an associated emitter of the array of emitters. The method further comprises emitting light with the associated emitter, receiving light emitted by the associated emitter and transmitted through the optical component on the second side of the wafer, and determining an alignment between the one or more optical components and the array of emitters from the received light.
A LIDAR transmitter system comprising an array of laser energy sources, the laser energy sources being arranged on a first curved surface and being configured to emit laser energy towards a LIDAR target. The LIDAR transmitter system further comprising at least a first lens arranged in the optical path between the array of laser energy sources and the LIDAR target, wherein the first curved surface is positioned at an image plane of the first lens. Further, a method of manufacturing the LIDAR transmitter system comprises the steps of: measuring a field curvature of a first lens; arranging a plurality of laser energy sources as an array on a flat surface; heating the flat surface to increase malleability of the flat surface; applying a pressure to predetermined regions of the flat surface to convert the flat surface to a curved surface, the curvature of the curved surface following the field curvature of the first lens; cooling the curved surface; and positioning the curved surface at an image plane of the first lens.
There is provided an array of light emitting elements integrated with meta-surfaces. The meta-surfaces are constructed from a semiconductor alloy comprising at least two different semiconductors. The composition of the semiconductor can be varied so as to provide different refractive indices. A method of manufacture of such an array is also provided.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
6.
VIDEO USER INTERFACE AND METHOD FOR USE IN DETERMINING DEPTH INFORMATION RELATING TO A SCENE
A video user interface for an electronic device may help in determining depth information relating to a scene. comprises a display, a spatial filter defining a coded aperture, an image sensor and a lens. The scene is disposed in front of the display. The image sensor and the lens are both disposed behind the display. The spatial filter is defined by, or disposed behind, the display. The spatial filter, the image sensor, and the lens are arranged to allow the image sensor to capture an image of the scene through the coded aperture and the lens. The video user interface may be used to determine depth information relating to the scene. The video user interface may use the determined depth information to recognize one or more features in the scene, such as one or more features of a user of the electronic device in the scene, for example one or more facial features of a user of the electronic device in the scene. The video user interface may unlock the electronic device in response to recognizing one or more features in the scene.
H04N 23/95 - Systèmes de photographie numérique, p. ex. systèmes d'imagerie par champ lumineux
G06T 7/521 - Récupération de la profondeur ou de la forme à partir de la télémétrie laser, p. ex. par interférométrieRécupération de la profondeur ou de la forme à partir de la projection de lumière structurée
G06T 7/80 - Analyse des images capturées pour déterminer les paramètres de caméra intrinsèques ou extrinsèques, c.-à-d. étalonnage de caméra
H04N 23/53 - Détails de structure de viseurs électroniques, p. ex. rotatifs ou détachables
A semiconductor vertical cavity surface emitting laser (VCSEL), the VCSEL comprising a first mirror region forming a lower distributed Bragg reflector and a second mirror region forming an upper distributed Bragg reflector, the upper distributed Bragg reflector and the lower distributed Bragg reflector defining a vertical resonant cavity comprising an inner region and an outer region. The VCSEL further comprises a resistive structure comprising a resistive portion in the outer region and an etched portion located in the inner region of the vertical resonant cavity, such that a conducting channel is formed in the inner region.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
A system (100) for producing structured light, the system comprising an emitter (102) configured to provide a beam of light, and a first reflecting element (104). The emitter (102) and the first reflecting element (104) are separated from one another in a direction that is generally perpendicular to beams of light that are emitted from the system when in use. The first reflecting element (102) comprises a plurality of reflective surfaces oriented in different directions.
An optical emitter arrangement comprises a housing, an electrical interconnection member, and an optical emitter device mounted on the electrical interconnection member, wherein the electrical interconnection member is attached to the housing such that the optical emitter device is located within the housing. The optical emitter arrangement further comprises an optical system including an optical element for transmitting light emitted by the optical emitter device, the optical system being attached to the housing so that the optical element can receive light emitted by the optical emitter device and transmit the received light out of the housing, and the optical system further including a sensed element. The optical emitter arrangement also comprises a proximity sensor mounted on the electrical interconnection member for sensing a proximity of the sensed element. The optical emitter arrangement may enable a method of operating the optical emitter arrangement wherein the emission of light from the optical emitter arrangement is prevented in the event of a mechanical malfunction or failure of the optical emitter arrangement. The optical emitter arrangement may be used, in particular though not exclusively, in flood illuminators or projectors.
G01S 17/04 - Systèmes de détermination de la présence d'une cible
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
H01L 31/167 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour le dispositif à semi-conducteur sensible au rayonnement étant commandé par la ou les sources lumineuses les sources lumineuses et les dispositifs sensibles au rayonnement étant tous des dispositifs semi-conducteurs caractérisés par au moins une barrière de potentiel ou de surface
H01S 5/068 - Stabilisation des paramètres de sortie du laser
H01S 5/0239 - Combinaisons d’éléments électriques ou optiques
A self-calibrating driver circuit (100, 300, 400, 500, 700) for a laser diode is disclosed. The circuit comprises a configurable current source (105, 305, 405, 505), a current mirror (115, 315, 415) configured to mirror a current from the configurable current source to a first transistor (120, 320, 420, 520, 720) and to a second transistor (125, 325, 425, 725), and a control circuit (140, 340, 440). The control circuit is configured to monitor a current through the first transistor at a first time, and to configure the current source based on the current through the first transistor to provide a desired current to the second transistor for driving the laser diode at a subsequent second time. A radiation-emitting device comprising one or more of the self-calibrating driver circuits and at least one radiation-emitting element is also disclosed.
An optical element (600, 1100, 1200, 1300) for beam-shaping applications is disclosed. The disclosed optical element comprises a plurality of structures (505, 605, 805, 1105, 1205, 1305) formed on a substrate (515), wherein in a cross-section orthogonal to a plane defined by the substrate, an upper portion (520) of a surface of each structure comprises a greater tilt-angle relative to an optical axis (525) orthogonal to the substrate than a lower portion (530) of the surface, the lower portion being closer to the substrate than the upper portion. In embodiments, each structure is arranged on the substrate such that radiation (535) entering each structure through the substrate, in a direction substantially parallel to the optical axis and undergoing internal reflection within each structure, exits the surface of each structure along a path that does not intersect a directly adjacent structure of the plurality of structures.
A method of making an optical device (1). The method comprises providing a semiconductor wafer (3), providing an array of emitters (4) located on a first side (5) of the wafer (3) and providing one or more optical components (6) on a second, opposite side (7) of the wafer (3), wherein the or each optical component (6) is arranged to split light (9) from an associated emitter (4) of the array of emitters (4). The method further comprises emitting light with the associated emitter (4), receiving light (9) emitted by the associated emitter and transmitted through the optical component (6) on the second side (7) of the wafer (3), and determining an alignment between the one or more optical components (6) and the array of emitters (4) from the received light (9).
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
Sensing Method and Sensor System A sensing method comprises using a vertical cavity surface emitting laser (VCSEL) to oscillate and emit a laser beam. A diaphragm is used to reflect a portion of the laser beam back into the VCSEL. This method can be referred as self mixing interferometry. A current or voltage at the VCSEL is monitored, and is used to sense movement of the diaphragm. This allows a property external to the VCSEL to be sensed without using a photo-detector.
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
G01D 5/26 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c.-à-d. utilisant de la lumière infrarouge, visible ou ultraviolette
G01H 9/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores en utilisant des moyens sensibles aux radiations, p. ex. des moyens optiques
H04R 29/00 - Dispositifs de contrôleDispositifs de tests
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
A light detection and ranging, LIDAR, system. The system comprises a set of long range channels and a set of short range channels Each channel comprises an illumination source. The illumination sources of the short range channels are each configured to illuminate a respective spatial region defined by a first solid angle from the respective illumination source. The illumination sources of the long range channels are each configured to illuminate a respective spatial region defined by a second solid angle from the respective illumination source. The first solid angle is larger than the second solid angle and an intensity of each illumination source of the long range channels is greater than an intensity of each illumination source of the short range channels. The set of short range channels are configured to detect objects within a first field of view, and the set of long range channels are configured to detect objects within a second field of view.
A support structure for mounting an optical assembly above an optoelectronic device, the optical assembly comprising an electrically conductive structure, the support structure comprising: a first surface for supporting an optical assembly; and an electrically conductive lead, wherein said electrically conductive lead comprises: a first electrical interface portion adjacent to the first surface for forming an electrical contact with an electrically conductive structure of an optical assembly supported by the first surface; a second electrical interface portion on a side opposing the first surface, and wherein the electrically conductive lead extends from the first electrical interface portion to the second electrical interface portion so as to maintain an optical assembly supported on the first surface and the second electrical interface portion in electrical contact.
H01S 5/02257 - Découplage de lumière utilisant des fenêtres optiques, p. ex. spécialement adaptées pour réfléchir de la lumière sur un détecteur à l’intérieur du boîtier
H01S 5/02253 - Découplage de lumière utilisant des lentilles
H01S 5/0239 - Combinaisons d’éléments électriques ou optiques
H01S 5/0236 - Fixation des puces laser sur des supports en utilisant un adhésif
A method of time of flight sensing. The method comprises using an emitter to emit pulses of radiation and using an array of photo-detectors to detect radiation reflected from an object. For a given group of photo-detectors of the array, the method determines based upon measured times of flight of the radiation, whether to use a first mode of operation in which outputs from individual photo-detectors of the group are combined together or to use a second mode of operation in which outputs from individual photo-detectors are processed separately. The array of photo-detectors comprises a plurality of groups of photo-detectors. One or more groups of photo-detectors operate in the first mode whilst in parallel one or more groups of photo-detectors operate in the second mode.
G01S 7/4865 - Mesure du temps de retard, p. ex. mesure du temps de vol ou de l'heure d'arrivée ou détermination de la position exacte d'un pic
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 7/4863 - Réseaux des détecteurs, p. ex. portes de transfert de charge
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
G01S 17/04 - Systèmes de détermination de la présence d'une cible
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G01B 11/22 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la profondeur
A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier. The method further comprises depositing a molding material onto a plurality of molds of a second carrier to form a plurality of said passive optical components, aligning said first and second carriers such that the plurality of passive optical components contact respective zones of the plurality of integrated circuit devices, injecting a polymer compound into a space between said first and second carriers and curing said polymer compound, removing said second carrier to leave the plurality of optical components fixed to the integrated circuit devices by said polymer compound, and dissolving said soluble adhesive to remove the integrated circuit devices, polymer compound and passive optical components from the first carrier to provide a wafer package.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A LIDAR transmitter system comprising an array of laser energy sources, each laser energy source comprising a corresponding photodetector. The laser energy sources are configured to emit laser energy towards a LIDAR target. Each respective photodetector is configured to detect the laser energy emitted by a corresponding energy source of the array.
Packaged light emitter module can provide improved safety features to facilitate sensing the presence of moisture or a mechanical defect such as a crack in a transmissive cover (22) that may result in a safety hazard caused by the emitted light (24) if the defect or other situation is not addressed in a timely manner. Different electrically conductive structures, such as different electrically conductive traces (20, 22), allow monitoring and detection of mechanical defects to be decoupled from monitoring and detection of problems arising from the presence of moisture. The decoupling can allow the respective configuration for each of the electrically conductive structures to be optimized for detection of particular situations that may lead to a safety hazard.
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
A vertical cavity surface emitting laser (VCSEL) device comprises an interior light generating region, an exterior light emitting surface, and a spatial modulation region monolithically integrated with the interior light generating region so that the spatial modulation region is located between the interior light generating region and the exterior light emitting surface. The spatial modulation region is configured to shape the light generated by the interior light generating region before the generated light is emitted from the exterior light emitting surface. The VCSEL device may be configured to emit a beam of light along a predetermined direction, to emit a beam of light having a predetermined beam divergence, and/or to emit a beam of light having a predetermined shape or structure transverse to a direction of propagation so that the beam of light forms a predetermined spot or pattern of light when projected onto a surface. A plurality of VCSEL devices and a method for use in manufacturing a VCSEL device are also disclosed.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
There is provided an array of light emitting elements (300) integrated with meta-surfaces (302). The meta-surfaces are constructed from a semiconductor alloy comprising at least two different semiconductors. The composition of the semiconductor can be varied to provide different refractive indices. A method of manufacture (900,1000,1100) of such an array is also provided.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
22.
LIGHT EMITTING MODULE COMBINING ENHANCED SAFETY FEATURES AND THERMAL MANAGEMENT
An optical module (200) comprises an emitter (214) configured to emit electromagnetic radiation and a first substrate (212) configured to support the emitter (214). The optical module (200) further comprises a driver (220) configured to control the emitter (214) and a second substrate (216) configured to support the driver (220). The first substrate (212) has a greater thermal conductivity than the second substrate (216).
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
G06V 10/145 - Éclairage spécialement adapté à la reconnaissance de formes, p. ex. utilisant des réseaux
We disclose a method of measuring a distance to or from a target, the method comprising: operating an emitter to generate a first pulsed signal and a second pulsed signal in a field of view of the emitter in which a target may be present, the first pulsed signal having a first pulse frequency and the second pulsed signal having a second pulse frequency, the first pulse frequency being different from the second pulse frequency; operating a detector to detect signals for a pre-determined duration after said first pulsed signal is generated and for a pre-determined duration after said second pulsed signal is generated; storing said detected signals in a memory spanning a period of the first pulsed signal and a period of the second pulsed signal, respectively; using the detected signals to identify a portion of the first pulsed signal reflected by the target and a portion of the second pulsed signal reflected by the target; determining a first virtual distance based on a difference between a reference signal and the detection of the portion of the first pulsed signal reflected by the target; determining a second virtual distance based on a difference between the reference signal and the detection of the portion of the second pulsed signal reflected by the target; and determining the distance to the target based on a virtual difference corresponding to a difference between the first virtual distance and the second virtual distance.
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
2=2LD/N and N is an integer, and wherein a size of the second light sources (10) is greater than a size of the first light sources (9), such that the light sources of the first array (18) produce structured light and the light sources of the second array (19) produce a continuous area of light.
A video user interface for an electronic device for use in determining depth information relating to a scene, comprises a display, a spatial filter defining a coded aperture, an image sensor and a lens. The scene is disposed in front of the display. The image sensor and the lens are both disposed behind the display. The spatial filter is defined by, or disposed behind, the display. The spatial filter, the image sensor, and the lens are arranged to allow the image sensor to capture an image of the scene through the coded aperture and the lens. The video user interface may be used to determine depth information relating to the scene. The video user interface may use the determined depth information to recognize one or more features in the scene, such as one or more features of a user of the electronic device in the scene, for example one or more facial features of a user of the electronic device in the scene. The video user interface may unlock the electronic device in response to recognizing one or more features in the scene.
H04N 13/271 - Générateurs de signaux d’images où les signaux d’images générés comprennent des cartes de profondeur ou de disparité
H04N 13/239 - Générateurs de signaux d’images utilisant des caméras à images stéréoscopiques utilisant deux capteurs d’images 2D dont la position relative est égale ou en correspondance à l’intervalle oculaire
A system (100) for producing structured light, the system comprising an emitter (102) configured to provide a beam of light, and a first reflecting element (104). The emitter (102) and the first reflecting element (104) are separated from one another in a direction that is generally perpendicular to beams of light that are emitted from the system when in use. The first reflecting element (102) comprises a plurality of reflective surfaces oriented in different directions.
A device comprising: an illumination device for emitting an illumination beam, the illumination device comprising: an emitter array comprising multiple light emitters; and a meta-structure or micro-prism array comprising multiple transmission areas, the meta-structure of micro-prisms being positioned to receive light emitted from the emitter array, in which light from the meta-structure of micro-prism forms the illumination beam, in which a first one of said multiple transmission areas is arranged to emit light in a different direction than a second one of said multiple transmission areas.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
A self-calibrating driver circuit (100, 300, 400, 500, 700) for a laser diode is disclosed. The circuit comprises a configurable current source (105, 305, 405, 505), a current mirror (115, 315, 415) configured to mirror a current from the configurable current source to a first transistor (120, 320, 420, 520, 720) and to a second transistor (125, 325, 425, 725), and a control circuit (140, 340, 440). The control circuit is configured to monitor a current through the first transistor at a first time, and to configure the current source based on the current through the first transistor to provide a desired current to the second transistor for driving the laser diode at a subsequent second time. A radiation-emitting device comprising one or more of the self-calibrating driver circuits and at least one radiation-emitting element is also disclosed.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
30.
Producing illumination beams using micro-lens arrays
A device includes an illumination device for emitting an illumination beam. The illumination device includes an emitter array including multiple light emitters; and a micro-lens array (MLA) including multiple micro-lenses. The MLA is positioned to receive light emitted from the emitter array. Light from the MLA forms the illumination beam. A first region of the MLA is offset from the emitter array by a first offset amount, and a second region of the MLA is offset from the emitter array by a second offset amount different than the first offset amount.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
An optical emitter arrangement comprises a housing, an electrical interconnection member, and an optical emitter device mounted on the electrical interconnection member, wherein the electrical interconnection member is attached to the housing such that the optical emitter device is located within the housing. The optical emitter arrangement further comprises an optical system including an optical element for transmitting light emitted by the optical emitter device, the optical system being attached to the housing so that the optical element can receive light emitted by the optical emitter device and transmit the received light out of the housing, and the optical system further including a sensed element. The optical emitter arrangement also comprises a proximity sensor mounted on the electrical interconnection member for sensing a proximity of the sensed element. The optical emitter arrangement may enable a method of operating the optical emitter arrangement wherein the emission of light from the optical emitter arrangement is prevented in the event of a mechanical malfunction or failure of the optical emitter arrangement. The optical emitter arrangement may be used, in particular though not exclusively, in flood illuminators or projectors.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
Manufacturing an Optical Structure A method of manufacturing an optical structure, the method comprising: providing a base structure, the base structure comprising a substrate having an optical element extending from a first side of the substrate, dispensing liquid photoresist onto the base structure; using a tool to form a layer of said liquid photoresist, wherein the height of said layer is controlled by lowering the tool to a height above said substrate; and forming a spacer from the liquid photoresist by exposing a portion of the liquid photoresist to ultraviolet light, wherein the spacer comprises a central aperture above the optical element.
An apparatus includes a light source operable to produce light having a wavelength, an optical component disposed over the light source so as to intersect a path of light produced by the light source, and at least one electrically conductive trace on a surface of the optical component. A drive controller is operable to regulate optical output power of the light source. The at least one electrically conductive trace is coupled electrically to the drive controller, which is operable to monitor an electrical characteristic of the at least one electrically conductive trace, and to reduce the optical output power of the light source if a value of the electrical characteristic is indicative of a possible eye-safety hazard.
H01S 5/02257 - Découplage de lumière utilisant des fenêtres optiques, p. ex. spécialement adaptées pour réfléchir de la lumière sur un détecteur à l’intérieur du boîtier
H01S 5/068 - Stabilisation des paramètres de sortie du laser
H01S 5/42 - Réseaux de lasers à émission de surface
A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier. The method further comprises depositing a molding material onto a plurality of molds of a second carrier to form a plurality of said passive optical components, aligning said first and second carriers such that the plurality of passive optical components contact respective zones of the plurality of integrated circuit devices, injecting a polymer compound into a space between said first and second carriers and curing said polymer compound, removing said second carrier to leave the plurality of optical components fixed to the integrated circuit devices by said polymer compound, and dissolving said soluble adhesive to remove the integrated circuit devices, polymer compound and passive optical components from the first carrier to provide a wafer package.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
The present disclosure describes various linear VCSEL arrays, as well as VCSEL array chips incorporating such linear VCSEL arrays, and modules, host devices and other apparatus into which one or more of the linear VCSEL arrays are integrated. Implementations can include, for example, varying the aperture size of the VCSELs, tapering the shape of the transmission line, and/or changing the density of the VCSELs.
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
36.
Structured light projector including an integrated metalens and diffractive optical element
An apparatus that includes a structured light projector which includes a light source, a metalens, and a diffractive optical element (DOE) multiplier. Each of the metalens and the DOE multiplier is integrated onto the light source. The structured light projector is operable such that light beams produced by the light source pass through the metalens and the DOE multiplier.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
37.
Low divergence vertical cavity surface emitting lasers, and modules and host devices incorporating the same
The disclosure describes VCSELs operable to produce very narrow divergent light beams. The narrow divergent beam can be obtained, in part, by incorporating an additional epitaxial layer so as to increase the cavity length of the VCSEL. The increased cavity length can result in higher power in fewer larger diameter transverse modes, which can significantly reduce the output beam divergence. The additional epitaxial layer can be incorporated, for example, into a top-emitting VCSEL or bottom-emitting VCSEL.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/08 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement
H01S 5/34 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH]
H01S 5/42 - Réseaux de lasers à émission de surface
38.
PACKAGE INCLUDING PORTIONS OF A LEAD FRAME AS ELECTRICALLY CONDUCTIVE LEADS
The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.
Polarized light is produced using a VCSEL light source, wherein at least some of the polarized light is reflected or scattered by an object. At least some of the reflected or scattered polarized light is received in a sensor that is operable selectively to detect received light having a same polarization as the light produced by the VCSEL light source. In some instances, signals from the sensor are processed to obtain a three-dimensional distance image of the object or are processed using a time-of-flight technique to determine a distance to the object.
G01S 7/499 - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe utilisant des effets de polarisation
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
G01S 17/894 - Imagerie 3D avec mesure simultanée du temps de vol sur une matrice 2D de pixels récepteurs, p. ex. caméras à temps de vol ou lidar flash
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/34 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH]
: Sensing Method and Sensor System A sensing method comprises using a vertical cavity surface emitting laser (VCSEL) to oscillate and emit a laser beam. A diaphragm is used to reflect a portion of the laser beam back into the VCSEL. This method can be referred as self mixing interferometry. A current or voltage at the VCSEL is monitored, and is used to sense movement of the diaphragm. This allows a property external to the VCSEL to be sensed without using a photo-detector.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
41.
A METHOD OF MANUFACTURING A PLURALITY OF OPTOELECTRONIC MODULES
We disclose a method (200) of manufacturing a plurality of optoelectronic modules (228) for mounting on a circuit substrate, the method comprising arranging a plurality of optoelectronic devices (212) between a first supporting member (216) and a second supporting member (218) such that the plurality of optoelectronic devices are spaced from one another, laterally enclosing each optoelectronic device with a curable material (222a) to form an intermediate module portion (224), removing the intermediate module portion from at least one of the first supporting member and the second supporting member, and singulating the intermediate module portion so as to form a plurality of optoelectronic modules (228), each optoelectronic module comprising at least one optoelectronic device (212).
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 31/173 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour le dispositif à semi-conducteur sensible au rayonnement étant commandé par la ou les sources lumineuses les sources lumineuses et les dispositifs sensibles au rayonnement étant tous des dispositifs semi-conducteurs caractérisés par au moins une barrière de potentiel ou de surface formés dans, ou sur un substrat commun
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A VCSEL device includes a substrate and a laser cavity that includes a gain section disposed between first and second reflectors. The VCSEL device is operable to emit light through a first end of the VCSEL device. The VCSEL device includes an anode surface mount contact and a cathode surface mount contact, each which is disposed at a second end of the VCSEL device opposite the first end of the VCSEL device.
H01S 5/0234 - Montage à orientation inversée, p. ex. puce retournée [flip-chip], montage à côté épitaxial au-dessous ou montage à jonction au-dessous
H01S 5/0237 - Fixation des puces laser sur des supports par soudage
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
43.
VCSELS INCLUDING A SUB-WAVELENGTH GRATING FOR WAVELENGTH LOCKING
A VCSEL includes a substrate, and an epitaxial VSCEL structure on the substrate. The epitaxial VSCEL structure includes a resonant cavity, including a gain region, disposed between a first reflector and a partially reflecting second reflector. At least one of the first or second reflectors includes a first sub-wavelength grating to provide spectral control for optical emission from the VCSEL. The first sub-wavelength grating can be operable to lock a wavelength of an optical beam for emission from the VCSEL substantially to a wavelength defined by the grating.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
A light detection and ranging, LIDAR, system. The system comprises a plurality of illumination sources, at least one detector, and a controller. Each illumination source is configured to illuminate a respective spatial volume. The or each detector is configured to receive light emitted by the plurality of illumination sources and reflected by one or more objects within one or more of the respective spatial volumes. The controller is configured to determine the distance of the one or more objects within each spatial volume from the LIDAR system on the basis of readings from the at least one detector; and to adjust an intensity of each illumination source on the basis of the distance of an object within the respective spatial volume.
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
G01S 17/87 - Combinaisons de systèmes utilisant des ondes électromagnétiques autres que les ondes radio
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G01S 17/931 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour prévenir les collisions de véhicules terrestres
G06T 7/521 - Récupération de la profondeur ou de la forme à partir de la télémétrie laser, p. ex. par interférométrieRécupération de la profondeur ou de la forme à partir de la projection de lumière structurée
A light detection and ranging, LIDAR, system. The system comprises a set of long range channels and a set of short range channels. Each channel comprises an illumination source. The illumination sources of the short range channels are each configured to illuminate a respective spatial region defined by a first solid angle from the respective illumination source. The illumination sources of the long range channels are each configured to illuminate a respective spatial region defined by a second solid angle from the respective illumination source. The first solid angle is larger than the second solid angle and an intensity of each illumination source of the long range channels is greater than an intensity of each illumination source of the short range channels. The set of short range channels are configured to detect objects within a first field of view, and the set of long range channels are configured to detect objects within a second field of view.
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
G01S 17/87 - Combinaisons de systèmes utilisant des ondes électromagnétiques autres que les ondes radio
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G01S 17/931 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour prévenir les collisions de véhicules terrestres
G06T 7/521 - Récupération de la profondeur ou de la forme à partir de la télémétrie laser, p. ex. par interférométrieRécupération de la profondeur ou de la forme à partir de la projection de lumière structurée
A LIDAR transmitter system comprising an array of laser energy sources, the laser energy sources arranged in a plurality of spatially separated regions; and a plurality of diffusers. Each diffuser is respectively arranged to cover one of said plurality of spatially separated regions. The respective laser energy sources of each spatially separated region are arranged to emit laser energy through a corresponding diffuser of the plurality of diffusers towards a LIDAR target.
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/02257 - Découplage de lumière utilisant des fenêtres optiques, p. ex. spécialement adaptées pour réfléchir de la lumière sur un détecteur à l’intérieur du boîtier
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 7/52 - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
A support structure for mounting an optical assembly above an optoelectronic device, the optical assembly comprising an electrically conductive structure, the support structure comprising: a first surface for supporting an optical assembly; and an electrically conductive lead, wherein said electrically conductive lead comprises: a first electrical interface portion adjacent to the first surface for forming an electrical contact with an electrically conductive structure of an optical assembly supported by the first surface; a second electrical interface portion on a side opposing the first surface, and wherein the electrically conductive lead extends from the first electrical interface portion to the second electrical interface portion so as to maintain an optical assembly supported on the first surface and the second electrical interface portion in electrical contact.
A LIDAR transmitter system comprising an array of laser energy sources, each laser energy source comprising a corresponding photodetector. The laser energy sources are configured to emit laser energy towards a LIDAR target. Each respective photodetector is configured to detect the laser energy emitted by a corresponding energy source of the array.
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/42 - Réseaux de lasers à émission de surface
G01S 7/08 - Affichage par tubes à rayons cathodiques avec un vernier d'indication de distance, p. ex. utilisant deux tubes à rayons cathodiques
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/068 - Stabilisation des paramètres de sortie du laser
H01S 5/0683 - Stabilisation des paramètres de sortie du laser en surveillant les paramètres optiques de sortie
49.
LIDAR TRANSMITTER AND LIDAR SYSTEM WITH CURVED LASER ARRANGEMENT AND MANUFACTURING METHOD OF THE SAME
A LIDAR transmitter system comprising an array of laser energy sources, the laser energy sources being arranged on a first curved surface and being configured to emit laser energy towards a LIDAR target. The LIDAR transmitter system further comprising at least a first lens arranged in the optical path between the array of laser energy sources and the LIDAR target, wherein the first curved surface is positioned at an image plane of the first lens. Further, a method of manufacturing the LIDAR transmitter system comprises the steps of: measuring a field curvature of a first lens; arranging a plurality of laser energy sources as an array on a flat surface; heating the flat surface to increase malleability of the flat surface; applying a pressure to predetermined regions of the flat surface to convert the flat surface to a curved surface, the curvature of the curved surface following the field curvature of the first lens; cooling the curved surface; and positioning the curved surface at an image plane of the first lens.
We disclose a method of measuring a distance to or from a target, the method comprising: operating an emitter to generate a first pulsed signal and a second pulsed signal in a field of view of the emitter in which a target may be present, the first pulsed signal having a first pulse frequency fl and the second pulsed signal having a second pulse frequency f2, the first pulse frequency fl being different from the second pulse frequency f2; operating a detector to detect signals for a pre-determined duration after said first pulsed signal is generated and for a pre-determined duration after said second pulsed signal is generated; storing said detected signals in a memory spanning a period of the first pulsed signal and a period of the second pulsed signal, respectively; using the detected signals to identify a portion of the first pulsed signal (RP1) reflected by the target and a portion (RP2) of the second pulsed signal reflected by the target; determining a first virtual distance based on a difference between a reference signal (RS1, RS2) and the detection of the portion (RP1) of the first pulsed signal reflected by the target; determining a second virtual distance based on a difference between the reference signal (RS1, RS2) and the detection of the portion (RP2) of the second pulsed signal reflected by the target; and determining the distance to the target based on a virtual difference corresponding to a difference between the first virtual distance and the second virtual distance. The first and second virtual distances comprise distances that are determined within a period of the first and second pulsed signals, respectively, when the reflected portion is folded back into the recorded period, labelled as Period 1 and Period 2, respectively. Thereby, a maximum unambiguous range is extended and memory size requirements are reduced.
G01S 17/26 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues dans lesquels les impulsions transmises utilisent une onde porteuse modulée en fréquence ou en phase, p. ex. pour la compression d'impulsion des signaux reçus
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
51.
LIGHT EMITTING MODULE INCLUDING ENHANCED SAFETY FEATURES
Packaged light emitter module can provide improved safety features to facilitate sensing the presence of moisture or a mechanical defect such as a crack in a transmissive cover (22) that may result in a safety hazard caused by the emitted light (24) if the defect or other situation is not addressed in a timely manner. Different electrically conductive structures, such as different electrically conductive traces (20, 22), allow monitoring and detection of mechanical defects to be decoupled from monitoring and detection of problems arising from the presence of moisture. The decoupling can allow the respective configuration for each of the electrically conductive structures to be optimized for detection of particular situations that may lead to a safety hazard.
H01S 5/068 - Stabilisation des paramètres de sortie du laser
F21V 25/02 - Dispositifs de sécurité associés structuralement avec les dispositifs d'éclairage entrant en action quand le dispositif d'éclairage est dérangé, démonté ou cassé
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
52.
LIGHT EMITTING MODULE COMBINING ENHANCED SAFETY FEATURES AND THERMAL MANAGEMENT
An optical module (200) comprises an emitter (214) configured to emit electromagnetic radiation and a first substrate (212) configured to support the emitter (214). The optical module (200) further comprises a driver (220) configured to control the emitter (214) and a second substrate (216) configured to support the driver (220). The first substrate (212) has a greater thermal conductivity than the second substrate (216).
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
H01L 31/167 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour le dispositif à semi-conducteur sensible au rayonnement étant commandé par la ou les sources lumineuses les sources lumineuses et les dispositifs sensibles au rayonnement étant tous des dispositifs semi-conducteurs caractérisés par au moins une barrière de potentiel ou de surface
H01S 5/068 - Stabilisation des paramètres de sortie du laser
53.
PROJECTING A STRUCTURED LIGHT PATTERN FROM AN APPARATUS HAVING AN OLED DISPLAY SCREEN
An apparatus includes a display screen that includes OLED pixels disposed at a particular pitch in a first plane. A light projector includes light emitting elements disposed in a second plane parallel to the first plane. The light emitting elements are disposed at the same pitch as the OLED pixels or at an integer multiple of the pitch of the plurality of OLED pixels. The light emitting elements are operable to produce light at a wavelength for transmission through the display screen, and the first and second planes are separated from one another by a distance D such that d2 =2 * (λ) * (D)/(N), where d is the pitch of the OLED pixels, λ is the wavelength, and N is a positive integer.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
P 22=2LD/N=2LD/N and N is an integer, and wherein a size of the second light sources (10) is greater than a size of the first light sources (9), such that the light sources of the first array (18) produce structured light and the light sources of the second array (19) produce a continuous area of light.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
G06K 9/46 - Extraction d'éléments ou de caractéristiques de l'image
F21Y 105/10 - Sources lumineuses planes comprenant un réseau bidimensionnel d’éléments générateurs de lumière ponctuelle
F21Y 105/12 - Sources lumineuses planes comprenant un réseau bidimensionnel d’éléments générateurs de lumière ponctuelle caractérisées par la disposition géométrique des éléments générateurs de lumière, p. ex. par la disposition des éléments générateurs de lumière en différents schémas ou densités
A vertical cavity surface emitting laser (VCSEL) device comprises an interior light generating region, an exterior light emitting surface, and a spatial modulation region monolithically integrated with the interior light generating region so that the spatial modulation region is located between the interior light generating region and the exterior light emitting surface. The spatial modulation region is configured to shape the light generated by the interior light generating region before the generated light is emitted from the exterior light emitting surface. The VCSEL device may be configured to emit a beam of light along a predetermined direction, to emit a beam of light having a predetermined beam divergence, and/or to emit a beam of light having a predetermined shape or structure transverse to a direction of propagation so that the beam of light forms a predetermined spot or pattern of light when projected onto a surface. A plurality of VCSEL devices and a method for use in manufacturing a VCSEL device are also disclosed.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/02 - Détails ou composants structurels non essentiels au fonctionnement laser
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
56.
LIGHT EMITTING MODULE INCLUDING ENHANCED EYE-SAFETY FEATURE
An apparatus includes a light source operable to produce light having a wavelength, an optical component disposed over the light source so as to intersect a path of light produced by the light source, and at least one electrically conductive trace on a surface of the optical component. A drive controller is operable to regulate optical output power of the light source. The at least one electrically conductive trace is coupled electrically to the drive controller, which is operable to monitor an electrical characteristic of the at least one electrically conductive trace, and to reduce the optical output power of the light source if a value of the electrical characteristic is indicative of a possible eye-safety hazard.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
An illumination device includes an emission layer including a semiconductor-based light emitter; and an optical layer disposed on the emission layer. The optical layer includes an optical element, such as a lens, at least partially aligned with the semiconductor-based light emitter. The optical layer is formed of a material having a negative coefficient of thermal expansion (CTE). For instance, the semiconductor-based light emitter is configured to emit light at a wavelength λ, and in which a pitch p of the MLA, a thickness z of the optical layer, and the wavelength λ satisfy a predefined relationship.
A device includes an illumination device for emitting an illumination beam. The illumination device includes an emitter array including multiple light emitters; and a micro-lens array (MLA) including multiple micro-lenses. The MLA is positioned to receive light emitted from the emitter array. Light from the MLA forms the illumination beam. A first region of the MLA is offset from the emitter array by a first offset amount, and a second region of the MLA is offset from the emitter array by a second offset amount different than the first offset amount.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/42 - Réseaux de lasers à émission de surface
A device comprising: an illumination device for emitting an illumination beam, the illumination device comprising: an emitter array comprising multiple light emitters; and a meta-structure or micro-prism array comprising multiple transmission areas, the meta-structure of micro-prisms being positioned to receive light emitted from the emitter array, in which light from the meta-structure of micro-prism forms the illumination beam, in which a first one of said multiple transmission areas is arranged to emit light in a different direction than a second one of said multiple transmission areas.
The present disclosure describes various linear VCSEL arrays, as well as VCSEL array chips incorporating such linear VCSEL arrays, and modules, host devices and other apparatus into which one or more of the linear VCSEL arrays are integrated. Implementations can include, for example, varying the aperture size of the VCSELs, tapering the shape of the transmission line, and/or changing the density of the VCSELs.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
H01S 5/42 - Réseaux de lasers à émission de surface
H01S 5/062 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes
61.
VCSELS INCLUDING A SUB-WAVELENGTH GRATING FOR WAVELENGTH LOCKING
A VCSEL includes a substrate, and an epitaxial VSCEL structure on the substrate. The epitaxial VSCEL structure includes a resonant cavity, including a gain region, disposed between a first reflector and a partially reflecting second reflector. At least one of the first or second reflectors includes a first sub-wavelength grating to provide spectral control for optical emission from the VCSEL. The first sub-wavelength grating can be operable to lock a wavelength of an optical beam for emission from the VCSEL substantially to a wavelength defined by the grating.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/30 - Structure ou forme de la région activeMatériaux pour la région active
62.
LOW DIVERGENCE VERTICAL CAVITY SURFACE EMITTING LASERS, AND MODULES AND HOST DEVICES INCORPORATING THE SAME
The disclosure describes VCSELs operable to produce very narrow divergent light beams. The narrow divergent beam can be obtained, in part, by incorporating an additional epitaxial layer so as to increase the cavity length of the VCSEL. The increased cavity length can result in higher power in fewer larger diameter transverse modes, which can significantly reduce the output beam divergence. The additional epitaxial layer can be incorporated, for example, into a top-emitting VCSEL or bottom-emitting VCSEL.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
63.
PACKAGE INCLUDING PORTIONS OF A LEAD FRAME AS ELECTRICALLY CONDUCTIVE LEADS
The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.
An apparatus that includes a structured light projector which includes a light source, a metalens, and a diffractive optical element (DOE) multiplier. Each of the metalens and the DOE multiplier is integrated onto the light source. The structured light projector is operable such that light beams produced by the light source pass through the metalens and the DOE multiplier.
A VCSEL device includes a substrate and a laser cavity that includes a gain section disposed between first and second reflectors. The VCSEL device is operable to emit light through a first end of the VCSEL device. The VCSEL device includes an anode surface mount contact and a cathode surface mount contact, each which is disposed at a second end of the VCSEL device opposite the first end of the VCSEL device.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
Polarized light is produced using a VCSEL light source, wherein at least some of the polarized light is reflected or scattered by an object. At least some of the reflected or scattered polarized light is received in a sensor that is operable selectively to detect received light having a same polarization as the light produced by the VCSEL light source. In some instances, signals from the sensor are processed to obtain a three-dimensional distance image of the object or are processed using a time-of-flight technique to determine a distance to the object.
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