A system includes a multi-channel beam splitter arranged and configured to split an input optical signal into a plurality of split optical signals; a plurality of phase modulators, wherein each phase modulator of the plurality of phase modulators is operative to modify a phase of a corresponding split optical signal of the plurality of split optical signals in response to a control signal; a waveguide arranged at an optical output of the plurality of phase modulators, the waveguide configured to spatially-rearrange the split optical signals output from the plurality of phase modulators into a pattern, thereby producing an optical signal pattern; and an optical amplifier arranged at an optical output of the waveguide, wherein the optical amplifier is configured to amplify the optical signal pattern produced by the waveguide.
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
G02F 1/295 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion dans une structure de guide d'ondes optique
2.
FRAME AND EXTERIOR SHROUDING FOR LASER PROCESSING SYSTEM
A frame for a laser processing module can be characterized as including a platform, a sandwich panel comprising a first plate and a second plate, a plurality of exterior walls, and a core including stiffeners perforated by a plurality of first openings defining an interior of the sandwich panel configured to facilitate air flow in spaces between the first plate and the second plate. A plurality of second openings are formed in the exterior walls, and a plurality of third openings are formed in the first plate, so that the interior of the sandwich panel is in fluid communication with a region external to the sandwich panel such that air flows through the sandwich panel and exits the sandwich panel via the plurality of second openings. A plurality of base supports having a plurality of plates and a plurality of beams extend from the sandwich panel to the platform.
B23K 26/12 - Travail par rayon laser, p. ex. soudage, découpage ou perçage sous atmosphère particulière, p. ex. dans une enceinte
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
A system includes a first acousto-optic deflector (AOD) for diffracting an incident beam of laser energy to produce and output therefrom a first beam of laser energy and a second beam of laser light, a second AOD arranged to receive the first beam of laser energy and for diffracting the received first beam of laser energy to thereby produce and output therefrom a third beam of laser energy and a fourth beam of laser energy, at least one first beam trap arranged and configured to absorb the second beam of laser energy output from the first AOD, at least one second beam trap arranged and configured to absorb the fourth beam of laser energy output from the second AOD and a controller communicatively coupled to the first AOD and to the second AOD, wherein the controller is configured to operate of the first AOD while not operating the second AOD.
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
An optics purge device includes a purge device body with an optical port extending therethrough, a purge gas inlet, a primary distribution plenum in fluid communication with the purge gas inlet, a diffuser channel in fluid communication with the primary distribution plenum and extending around the optical port, and a diffuser accommodated within the diffuser channel. The purge device body, primary distribution plenum, diffuser channel, and diffuser are configured to distribute purge gas around the optical port to reduce accumulation of contaminants on optical surfaces.
In a system, a conditioning device includes a diffuser, a lens configured to focus a beam of laser energy onto the diffuser and an iris configured to transmit at least a portion of the beam of laser energy transmitted by the diffuser.
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
Numerous examples of a multi-axis beam positioner operative to deflect a beam path along which laser light along multiple axes are disclosed. The beam positioner includes a first AOD and a second AOD arranged optically in series with each other. The first and second AODs are arranged and configured to deflect the beam path along a different axes of the multi-axis beam positioner. In one example, AO cell of the first AOD and is formed from the same material as the AO cell of the second AOD but the first AOD is configured differently from the second AOD. In other example, the first AOD and the second AOD are longitudinal-mode AODs and no retarder is present between the first and second AODs. In other example, a heat exchanger is provided to cool the AO cell of the second AOD relative to the AO cell of the first AOD.
Embodiments of systems configured to optically relay a beam of laser energy propagating along a beam path to a scan lens are disclosed. In one embodiment, the system includes a first positioner configured to move the scan lens, and an optical relay system configured to relay the beam path to an entrance pupil of the scan lens. The optical relay system includes an optical relay having a first lens, a second lens, a first retroreflector configured to direct the beam path to the optical relay, and a second retroreflector and a third retroreflector positioned on opposing sides of the scan lens. The second retroreflector and the third retroreflector may be positioned between the first lens and the second lens. The first retroreflector may be movable relative to the second retroreflector and the third retroreflector, and the first positioner is configured to move the scan lens relative to the second retroreflector.
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G02B 17/00 - Systèmes avec surfaces réfléchissantes, avec ou sans éléments de réfraction
A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 μs.
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
B23K 103/00 - Matières à braser, souder ou découper
9.
SYSTEM AND METHOD FOR THERMALLY-STABLE OPERATION OF ACOUSTO-OPTIC DEFLECTOR WITH REDUCED ACOUSTIC TRANSIENTS
A system includes an acousto-optic deflector (AOD) scanning system for deflecting a beam path and controller for controlling the AOD scanning system. The controller can control an operation of one driver of the AOD scanning system to deflect the beam path from a first position to a second position, and can control an operation of another driver of the AOD scanning system to decrease a transmission of laser energy in the deflected beam path during a period of time, wherein the period of time ends when the operation of the one of the first driver or the second driver is controlled to deflect the beam path from the first position to the second position.
G02F 1/33 - Dispositifs de déflexion acousto-optique
H01S 3/10 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation
H01S 3/101 - Lasers munis de moyens pour changer l'origine ou la direction du rayonnement émis
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
10.
LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.
Numerous embodiments of a laser-processing apparatus are disclosed. In one embodiment, the laser-processing apparatus includes a laser source operative to generate a beam of laser energy, an acousto-optic deflector (AOD) arranged within a beam path, a controller coupled to the AOD, and a beam analysis system operative to measure characteristics of the beam, generate measurement data representative of the measured beam characteristics, and transmit the measurement data to a controller operative to control the operation of the AOD based on that measurement data. In another embodiment, the laser-processing apparatus includes a system for characterization of cross-axis wobble of a galvanometer mirror, comprising a reference laser source configured to emit a reference laser beam, a reflective surface formed on the galvanometer mirror and configured to reflect the reference laser beam to a sensor configured to output a signal representative of the position of the reference beam to a controller.
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
G02F 1/33 - Dispositifs de déflexion acousto-optique
12.
METHOD AND APPARATUS FOR COMPENSATING FOR THERMALLY-INDUCED BEAM POINTING ERRORS IN A LASER-PROCESSING SYSTEM
A laser-processing system for processing a workpiece is adapted to estimate a thermal response of at least one of many beam path components to a beam of laser energy during a predetermined processing period while the workpiece is to be processed, generate one or more commands based at least in part on the estimated thermal response, and output the one or more commands to one or more components of the system and outputting commands to one or more components of the system to processes the workpiece during the processing period.
Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a workpiece handling system having an unwind assembly including an unwind spindle operative to support an unwind material roll of a workpiece, and a rewind assembly including a rewind spindle operative to support a rewind material roll of the workpiece and receive the workpiece from the laser-processing apparatus. In another, a laser-processing apparatus includes a workpiece handling system having a web handling assembly attached to an upper structure configured to support an unwind spindle supporting a unwind material roll of a workpiece, wherein the web handling assembly is positioned within a space above the fixture. The laser-processing apparatus further includes a web tensioner assembly configured to apply a biasing force on the tensioning roller to maintain the workpiece in a desired state of tension.
A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
15.
ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS
A method includes receiving, during a period of time, a continuous wave laser beam at an acousto-optic deflector (AOD) having a first AOD and a second AOD. A plurality of laser pulses is generated from the received beam using the first acousto-optic deflector (AOD) to the laser beam along a first axis and using the second AOD to deflect the laser beam deflected by the first AOD along a second axis.
A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
An apparatus includes an acousto-optical deflector (AOD) system operative to deflect a beam of laser energy within a two-dimensional scan field. The AOD system includes a first AOD operative to deflect the beam of laser energy along a first axis of the two-dimensional scan field; a second AOD arranged optically downstream of the first AOD, wherein the second AOD is operative to deflect the beam of laser energy along a second axis of the two-dimensional scan field; and a controller operatively coupled to the AOD system. The controller is configured to drive each of the first AOD and the second AOD to deflect the beam of laser energy within the two-dimensional scan field and is further configured to drive the first AOD and the second AOD at at least substantially the same diffraction efficiency.
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
G02F 1/33 - Dispositifs de déflexion acousto-optique
18.
LASER PROCESSING APPARATUS INCLUDING LASER SENSOR SYSTEM AND METHODS OF MEASUREMENT OF BEAM CHARACTERISTICS
An optical apparatus is disclosed. In one embodiment, the apparatus includes a photodetector apparatus having a photodetector, a first optical component arranged to direct a first beam path along which a beam of laser energy is propagatable to a first optical train configured to direct the first beam path to the photodetector, and a second optical component arranged to direct a second beam path along which the beam of laser energy is propagatable to a second optical train configured to direct the second beam path to the photodetector. The first optical train and the second optical train include a partially-transmissive mirror and a curved mirror configured to allow a first portion of the beam of laser energy to propagate therethrough, thereby imaging an AOD pivot point at a location relative to the detector apparatus. The photodetector may be positioned in a detection port of an integrating sphere.
A multilayer ceramic capacitor (MLCC) tester includes a power supply source and a station. The station can include at least one test head having a first contact and a second contact arranged and configured to simultaneously electrically connect to a common MLCC transported to a test site, and arc suppression source circuitry. The arc suppression source circuitry can be electrically connected between an output of the power supply source and the first contact, wherein the arc suppression source circuitry is configured to introduce an impedance to the electrical connection between the MLCC and the power supply source.
G01R 31/01 - Passage successif d'articles similaires aux tests, p. ex. tests "tout ou rien" d'une production de sérieTest d'objets en certains points lorsqu'ils passent à travers un poste de test
G01R 27/02 - Mesure de résistances, de réactances, d'impédances réelles ou complexes, ou autres caractéristiques bipolaires qui en dérivent, p. ex. constante de temps
20.
OPTICAL RELAY SYSTEM AND METHODS OF USE AND MANUFACTURE
Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.
A beam positioner for deflecting a beam path, along which a diffracted beam of linearly polarized laser light is propagatable, within a two-dimensional scan field, the beam positioner includes a first acousto-optic deflectors (AOD) to deflect the beam path within a first one-dimensional scan field extending along a first axis of the two-dimensional scan field, a second AOD to deflect the beam path within a second one-dimensional scan field extending along a second axis of the two-dimensional scan field, a phase retarder arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD and a mirror arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 26/06 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la phase de la lumière
G02F 1/00 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
G02F 1/33 - Dispositifs de déflexion acousto-optique
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
A system includes a first acousto-optic deflector (AOD) for diffracting an incident beam of laser energy to produce and output therefrom a first beam of laser energy and a second beam of laser light, a second AOD arranged to receive the first beam of laser energy and for diffracting the received first beam of laser energy to thereby produce and output therefrom a third beam of laser energy and a fourth beam of laser energy, at least one first beam trap arranged and configured to absorb the second beam of laser energy output from the first AOD, at least one second beam trap arranged and configured to absorb the fourth beam of laser energy output from the second AOD and a controller communicatively coupled to the first AOD and to the second AOD, wherein the controller is configured to operate of the first AOD while not operating the second AOD.
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
H01S 3/08 - Structure ou forme des résonateurs optiques ou de leurs composants
H01S 3/04 - Dispositions pour la gestion thermique
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
23.
GERMANIUM AOD SYSTEM WITH PARALLEL AND PERPENDICULAR ORIENTATIONS
Numerous examples of a multi-axis beam positioner operative to deflect a beam path along which laser light along multiple axes are disclosed. The beam positioner includes a first AOD and a second AOD arranged optically in series with each other. The first and second AODs are arranged and configured to deflect the beam path along a different axes of the multi-axis beam positioner. In one example, AO cell of the first AOD and is formed from the same material as the AO cell of the second AOD but the first AOD is configured differently from the second AOD. In other example, the first AOD and the second AOD are longitudinal-mode AODs and no retarder is present between the first and second AODs. In other example, a heat exchanger is provided to cool the AO cell of the second AOD relative to the AO cell of the first AOD.
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
24.
CONDITIONING DEVICE FOR REDUCING POSITIONAL SENSITIVITY OF LASER BEAM ON PHOTODETECTOR AND METHOD OF USING THE SAME
In a system, a conditioning device includes a diffuser, a lens configured to focus a beam of laser energy onto the diffuser and an iris configured to transmit at least a portion of the beam of laser energy transmitted by the diffuser.
A laser-processing apparatus for forming features in a workpiece includes at least one sensor for generating process control data representing a) at least one characteristic of the apparatus either before, during or after the workpiece is processed to form a set of features, b) at least one characteristic of the workpiece either before, during or after the workpiece is processed to form a set of features, and/or c) at least one characteristic of an ambient environment in which the apparatus is located either before, during or after the workpiece is processed to form a set of features. A controller executes, or facilitate execution of, a candidate feature selection process whereby process control data is processed to estimate whether any of the features formed in the workpiece are defective and the location of any feature estimated to be defective is identified.
Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.
Numerous embodiments of a laser-processing apparatus are disclosed. In one embodiment, the laser-processing apparatus includes a laser source operative to generate a beam of laser energy, an acousto-optic deflector (AOD) arranged within a beam path, a controller coupled to the AOD, and a beam analysis system operative to measure characteristics of the beam, generate measurement data representative of the measured beam characteristics, and transmit the measurement data to a controller operative to control the operation of the AOD based on that measurement data. In another embodiment, the laser- processing apparatus includes a system for characterization of cross-axis wobble of a galvanometer mirror, comprising a reference laser source configured to emit a reference laser beam, a reflective surface formed on the galvanometer mirror and configured to reflect the reference laser beam to a sensor configured to output a signal representative of the position of the reference beam to a controller.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
H01S 3/10 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation
H01S 3/08 - Structure ou forme des résonateurs optiques ou de leurs composants
09 - Appareils et instruments scientifiques et électriques
Produits et services
Laser-based machines for processing workpieces including printed circuit boards, integrated circuits and integrated circuit packaging materials; precision drilling machines; precision machines for machining workpieces including printed circuit boards, integrated circuits and integrated circuit packaging materials. Laser equipment for non-medical purposes; laser equipment for industrial use; laser equipment designed for cutting and drilling; laser equipment designed for cutting and drilling printed circuit boards, integrated circuits, and integrated circuit packaging and associated materials.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Laser-based material processing systems in the nature of laser drilling, cutting, and etching machines for processing workpieces; Laser-based material processing systems in the nature of laser drilling, cutting, and etching machines for processing workpieces, namely, printed circuit boards, integrated circuits, and integrated circuit packaging and associated materials Laser equipment for non-medical purposes; laser equipment for industrial use; laser equipment, not for medical purposes, designed for cutting and drilling; laser equipment designed for cutting and drilling printed circuit boards, integrated circuits, and integrated circuit packaging and associated materials
30.
ROLLER CONTACT WITH REDUCED CONTACT RESISTANCE VARIATION
A roller contact assembly includes a contact wheel having a bore defined therein and a contact surface located radially outward from the bore, and an axle extending through the bore. The surface of the bore is formed of a first electrically conductive material and the contact surface is formed of a second electrically conductive material different from the first electrically conductive material. An exterior surface of the axle is formed of a third electrically conductive material different from the second electrically conductive material.
H01R 4/62 - Connexions entre des conducteurs constitués de matériaux différentsConnexions entre ou avec des conducteurs en aluminium avec ou sans âme en acier
H01R 43/16 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour la fabrication des pièces de contact, p. ex. par découpage et pliage
31.
LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a workpiece handling system having an unwind assembly including an unwind spindle operative to support an unwind material roll of a workpiece, and a rewind assembly including a rewind spindle operative to support a rewind material roll of the workpiece and receive the workpiece from the laser-processing apparatus. In another, a laser-processing apparatus includes a workpiece handling system having a web handling assembly attached to an upper structure configured to support an unwind spindle supporting a unwind material roll of a workpiece, wherein the web handling assembly is positioned within a space above the fixture. The laser- processing apparatus further includes a web tensioner assembly configured to apply a biasing force on the tensioning roller to maintain the workpiece in a desired state of tension.
A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
33.
LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
One embodiment can be characterized as a method that includes: forming a plurality of vias in a workpiece by directing a beam of laser energy to the workpiece, wherein forming the plurality of vias comprises: (a) forming a first via according to a first processing recipe at a first location within the workpiece, wherein the first processing recipe is characterized by a set of parameters; and (b) after forming the first via, forming a second via after according to a second processing recipe at a second location within the workpiece, wherein the second processing recipe is characterized by the set of parameters. A value for at least one parameter in the set of parameters for the second processing recipe is different from a value for the at least one parameter in the set of parameters for the first processing recipe in a manner that corresponds to the distance between the first location and the second location.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
An apparatus includes an acousto-optical deflector (AOD) system operative to deflect a beam of laser energy within a two-dimensional scan field. The AOD system includes a first AOD operative to deflect the beam of laser energy along a first axis of the two-dimensional scan field; a second AOD arranged optically downstream of the first AOD, wherein the second AOD is operative to deflect the beam of laser energy along a second axis of the two-dimensional scan field; and a controller operatively coupled to the AOD system. The controller is configured to drive each of the first AOD and the second AOD to deflect the beam of laser energy within the two-dimensional scan field and is further configured to drive the first AOD and the second AOD at at least substantially the same diffraction efficiency.
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
35.
LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
H01S 3/137 - Stabilisation de paramètres de sortie de laser, p. ex. fréquence ou amplitude par commande de dispositifs placés dans la cavité pour la stabilisation de la fréquence
Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
G02B 17/06 - Systèmes catoptriques, p. ex. systèmes redressant et renversant une image utilisant uniquement des miroirs
G02B 27/14 - Systèmes divisant ou combinant des faisceaux fonctionnant uniquement par réflexion
G02B 27/18 - Systèmes ou appareils optiques non prévus dans aucun des groupes , pour projection optique, p. ex. combinaison de miroir, de condensateur et d'objectif
37.
LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
G02F 1/33 - Dispositifs de déflexion acousto-optique
38.
LASER-PROCESSING APPARATUS WITH DEBRIS REMOVAL SYSTEM AND INTEGRATED BEAM DUMP AND METHODS OF OPERATING THE SAME
A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
39.
SYSTEMS AND METHODS FOR USE IN HANDLING COMPONENTS
A multilayer ceramic capacitor (MLCC) tester includes a power supply source and a station. The station can include at least one test head having a first contact and a second contact arranged and configured to simultaneously electrically connect to a common MLCC transported to a test site, and arc suppression source circuitry. The arc suppression source circuitry can be electrically connected between an output of the power supply source and the first contact, wherein the arc suppression source circuitry is configured to introduce an impedance to the electrical connection between the MLCC and the power supply source.
G01R 31/01 - Passage successif d'articles similaires aux tests, p. ex. tests "tout ou rien" d'une production de sérieTest d'objets en certains points lorsqu'ils passent à travers un poste de test
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
41.
Phased-array beam steering for materials processing
A system includes a multi-channel beam splitter arranged and configured to split an input optical signal into a plurality of split optical signals; a plurality of phase modulators, wherein each phase modulator of the plurality of phase modulators is operative to modify a phase of a corresponding split optical signal of the plurality of split optical signals in response to a control signal; a waveguide arranged at an optical output of the plurality of phase modulators, the waveguide configured to spatially-rearrange the split optical signals output from the plurality of phase modulators into a pattern, thereby producing an optical signal pattern; and an optical amplifier arranged at an optical output of the waveguide, wherein the optical amplifier is configured to amplify the optical signal pattern produced by the waveguide.
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
G02F 1/295 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion dans une structure de guide d'ondes optique
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
42.
Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.
A laser-processing apparatus for forming features in a workpiece includes at least one sensor for generating process control data representing a) at least one characteristic of the apparatus either before, during or after the workpiece is processed to form a set of features, b) at least one characteristic of the workpiece either before, during or after the workpiece is processed to form a set of features, and/or c) at least one characteristic of an ambient environment in which the apparatus is located either before, during or after the workpiece is processed to form a set of features. A controller executes, or facilitate execution of, a candidate feature selection process whereby process control data is processed to estimate whether any of the features formed in the workpiece are defective and the location of any feature estimated to be defective is identified.
A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.
B23K 26/12 - Travail par rayon laser, p. ex. soudage, découpage ou perçage sous atmosphère particulière, p. ex. dans une enceinte
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
B23K 37/00 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe
B23K 37/006 - Dispositifs de sécurité pour le soudage ou le découpage
45.
LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.
H01S 3/10 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation
47.
Systems and methods for drilling vias in transparent materials
A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
B23K 103/00 - Matières à braser, souder ou découper
48.
Acousto-optic system having phase-shifting reflector
A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02F 1/00 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
G02B 26/06 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la phase de la lumière
49.
Method and system for extending optics lifetime in laser processing apparatus
Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 101/36 - Dispositifs électriques ou électroniques
50.
REDUCED IMPEDANCE VARIATION IN A MODULAR 2-TERMINAL TERMINAL CONTACTING ELECTRICAL MEASUREMENT SYSTEM
An electrical measurement contacting system for use with a component testing system operable to convey devices includes: a first module including a test contact module having a test contact adapted to electrically contact devices conveyed by the component testing system, and a second module including circuitry electrically coupled to the test contact module and operative to perform an electrical measurement on devices conveyed to the test contact. The circuitry is connected, within the second module, to a first conductive path and a second conductive path. The first conductive path and the second conductive path extend into the first module. The first conductive path and the second conductive path are electrically connected to each other and to the test contact module in the first module.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01R 31/01 - Passage successif d'articles similaires aux tests, p. ex. tests "tout ou rien" d'une production de sérieTest d'objets en certains points lorsqu'ils passent à travers un poste de test
51.
LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.
A system includes a multi-channel beam splitter arranged and configured to split an input optical signal into a plurality of split optical signals; a plurality of phase modulators, wherein each phase modulator of the plurality of phase modulators is operative to modify a phase of a corresponding split optical signal of the plurality of split optical signals in response to a control signal; a waveguide arranged at an optical output of the plurality of phase modulators, the waveguide configured to spatially-rearrange the split optical signals output from the plurality of phase modulators into a pattern, thereby producing an optical signal pattern; and an optical amplifier arranged at an optical output of the waveguide, wherein the optical amplifier is configured to amplify the optical signal pattern produced by the waveguide.
H01S 3/10 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation
H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
53.
Multi-axis machine tool and methods of controlling the same
One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.
G05B 19/23 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par systèmes de commande de positionnement ou de commande de contournage, p. ex. pour commander la position à partir d'un point programmé vers un autre point ou pour commander un mouvement le long d'un parcours continu programmé utilisant un dispositif de mesure numérique différentielle pour commande point par point
B23Q 15/14 - Commande ou régulation de l'orientation de l'outil par rapport à la pièce
G05B 19/19 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par systèmes de commande de positionnement ou de commande de contournage, p. ex. pour commander la position à partir d'un point programmé vers un autre point ou pour commander un mouvement le long d'un parcours continu programmé
G05B 19/402 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour le positionnement, p. ex. centrage d'un outil par rapport à un trou dans la pièce à usiner, moyens de détection additionnels pour corriger la position
54.
LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zemike terms Z4 and Z9. Many more embodiments are disclosed.
A beam positioner includes a first acousto-optic (AO) deflector (AOD) comprising an AO cell and a transducer attached to the AO cell, and a wave plate optically contacted to the first AOD.
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
56.
Non-contact handler and method of handling workpieces using the same
A non-contact handler includes an upper body portion and a lower body portion movably coupled to the upper body portion. The lower body portion includes a non-contact puck configured to lift an object and a plurality of containment fences extending downward from the puck. The plurality of containment fences are arranged around a periphery of the object to be lifted.
An electrical component testing apparatus can include a vacuum plate including a first surface, a second surface opposite the first surface, and through-holes extending through the vacuum plate from the first surface to the second surface. The apparatus also includes a manifold arranged at the second surface of the vacuum plate. The manifold can include a manifold body and passageways extending within the manifold body, wherein each of the passageways includes a first end and a second end. The first end includes an opening that intersects an exterior of the manifold body at a first location corresponding to a location of a through-hole in the vacuum plate and the second end includes an opening that intersects an exterior of the manifold body at a second location. The apparatus can also include a source of pressurized air coupled to the opening of the second end.
G01R 31/01 - Passage successif d'articles similaires aux tests, p. ex. tests "tout ou rien" d'une production de sérieTest d'objets en certains points lorsqu'ils passent à travers un poste de test
58.
FRAME AND EXTERIOR SHROUDING FOR LASER PROCESSING SYSTEM
A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.
A method for forming a through- via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.
An acousto-optical device includes an acousto-optical medium, a transducer attached to the acousto-optical medium and a temperature sensor arranged and configured to sense a temperature of the transducer.
A system includes a laser source, a galvanometer mirror system, an f-theta scan lens and an acousto-optic deflector (AOD) system. The AOD system is operated to deflect a beam path along which a laser beam propagates in a manner that corrects for scan field distortion induced by one or both of the f-theta lens and galvanometer mirror system.
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23K 26/064 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/073 - Détermination de la configuration du spot laser
63.
LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.
A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
B23K 103/00 - Matières à braser, souder ou découper
A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
68.
NON-CONTACT HANDLER AND METHOD OF HANDLING WORKPIECES USING THE SAME
A non-contact handler includes an upper body portion and a lower body portion movably coupled to the upper body portion. The lower body portion includes a non-contact puck configured to lift an object and a plurality of containment fences extending downward from the puck. The plurality of containment fences are arranged around a periphery of the object to be lifted.
A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
A beam positioner includes a first acousto-optic (AO) deflector (AOD) comprising an AO cell and a transducer attached to the AO cell, and a wave plate optically contacted to the first AOD.
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/384 - Enlèvement de matière par perçage ou découpage par perçage de trous de forme spéciale
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/073 - Détermination de la configuration du spot laser
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
73.
LASER PROCESSING APPARATUS, METHODS OF USE AND RELATED ARRANGEMENTS
A laser processing system can include a laser source configured to generate a beam of laser pulses at an average power of greater than 10 W and a turn mirror disposed in a path of the beam. The turn mirror can include a mirror configured to reflect a first portion of light within the laser pulses and transmit a second portion of the light within the laser pulses, and a mirror mount coupled to the mirror. The mirror mount is configured so as to not be present behind the mirror at a location where the mirror is irradiated with the laser pulses.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B23K 26/38 - Enlèvement de matière par perçage ou découpage
A laser processing system is disclosed, which includes a system frame, a process frame movably supported by the system frame, an optics wall coupled to the process frame, a process shroud coupled to the system frame and extending over and alongside upper and lateral peripheral regions of the optics wall and an optics shroud coupled to the process shroud. The process frame is configured to support a laser source, a workpiece positioning system and a beam delivery system. The process frame is moveable relative to the process shroud and the process frame is moveable relative to the optics shroud. The process shroud, the optics wall and the process frame enclose a first space for laser processing of a workpiece. The optics shroud, the optics wall and the process frame enclose a second space for accommodating the laser source.
Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.
Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.
A microscope system includes a light source, a spatial light modulator, a lens and a beam splitter aligned along an illumination axis, and a camera and objective aligned along an imaging axis. The beam splitter is also aligned along the imaging axis. The spatial light modulator is configured to spatially modulate light emitted by the light source to produce an arrangement of light and dark areas.
A laser target on a transparent workpiece (100) can be positioned over a vacuum cavity (1104). The vacuum cavity may be supplied with a debris collection fluid, such as air, through an entrance conduit (1208) to establish a vortex (1204) beneath a feature (1100) intended to be machined. The vortex facilitates removal of laser-generated debris (1106) during pass-through bottom-to-top machining of the feature.
A method of processing a workpiece having a first surface and a second surface opposite the first surface includes: generating a first beam of laser pulses having a pulse duration less than 200 ps at a pulse repetition rate greater than 500 kHz, directing the first beam of laser pulses along a beam axis intersecting the workpiece, and scanning the beam axis along a processing trajectory. The beam axis is scanned such that consecutively-directed laser pulses impinge upon the workpiece at a non-zero bite size to form a feature at the first surface of the workpiece. One or more parameters such as bite size, pulse duration, pulse repetition rate, laser pulse spot size and laser pulse energy is selected to ensure that the feature has a processed workpiece surface with a mean surface roughness (Ra) of less than or equal to 1.0 μm.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 101/36 - Dispositifs électriques ou électroniques
80.
Phased array steering for laser beam positioning systems
A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.
H01S 3/10 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
An alignment system includes a substrate fixture configured to receive a substrate, a guide structure positionally fixed relative to a substrate fixture and at least one actuated clamp. The substrate fixture may be configured to receive a substrate. An actuated clamp may include a clamp, an actuator coupled to the clamp and positionally fixed relative to a substrate fixture that is configured to receive a substrate, and an encoder operative to generate and output encoder data indicative of the position of the clamp. The actuator may be operative to move the clamp relative to the substrate fixture. The guide structure and the actuated clamp can be arranged such that a substrate received by the substrate fixture is pressable between the clamp and the guide structure when the clamp is moved relative to the substrate fixture by the first actuator.
A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser- induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.
H01L 21/268 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée les radiations étant électromagnétiques, p. ex. des rayons laser
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
83.
LOCATION OF IMAGE PLANE IN A LASER PROCESSING SYSTEM
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
A laser processing system is disclosed, which includes a system frame, a process frame movably supported by the system frame, an optics wall coupled to the process frame, a process shroud coupled to the system frame and extending over and alongside upper and lateral peripheral regions of the optics wall and an optics shroud coupled to the process shroud. The process frame is configured to support a laser source, a workpiece positioning system and a beam delivery system. The process frame is moveable relative to the process shroud and the process frame is moveable relative to the optics shroud. The process shroud, the optics wall and the process frame enclose a first space for laser processing of a workpiece. The optics shroud, the optics wall and the process frame enclose a second space for accommodating the laser source.
H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
H01S 3/101 - Lasers munis de moyens pour changer l'origine ou la direction du rayonnement émis
A manufacturing system for performing an operation on a workpiece includes: a stationary workpiece support configured to support a workpiece; a rigid mechanical inspection element support partially encircling the workpiece support with a first device for performing an operation from a first side of the workpiece and a second device for performing an operation from a second side of the workpiece; and a motion system coupled to the inspection element support, wherein the motion system is configured to move said inspection element support in at least one axis relative to the workpiece support.
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.
Employing laser scanning directions (20) that are oblique to and against a predominant gas flow direction (25) equalize the quality and waviness characteristics of orthogonal scribe lines (26) made by the laser scans. Positioning and sequence of multiple scan passes to form a feature wider than the width of a scribe line (26) can be controlled to enhance quality and waviness characteristics of the edges of the feature.
B23K 26/38 - Enlèvement de matière par perçage ou découpage
B23K 26/10 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce avec un support fixe
B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/361 - Enlèvement de matière pour l'ébarbage ou l'ébavurage mécanique
B23K 103/00 - Matières à braser, souder ou découper
88.
LASER SCAN SEQUENCING AND DIRECTION WITH RESPECT TO GAS FLOW
Employing laser scanning directions (20) that are oblique to and against a predominant gas flow direction (25) equalize the quality and waviness characteristics of orthogonal scribe lines (26) made by the laser scans. Positioning and sequence of multiple scan passes to form a feature wider than the width of a scribe line (26) can be controlled to enhance quality and waviness characteristics of the edges of the feature.
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
G01N 1/22 - Dispositifs pour prélever des échantillons à l'état gazeux
G01N 11/02 - Recherche des propriétés d'écoulement des matériaux, p. ex. la viscosité, la plasticitéAnalyse des matériaux en déterminant les propriétés d'écoulement en mesurant l'écoulement du matériau
89.
MULTI-AXIS MACHINE TOOL AND METHODS OF CONTROLLING THE SAME
One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.
One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
G05B 19/18 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique
B23Q 15/14 - Commande ou régulation de l'orientation de l'outil par rapport à la pièce
G05B 19/402 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour le positionnement, p. ex. centrage d'un outil par rapport à un trou dans la pièce à usiner, moyens de détection additionnels pour corriger la position
91.
METHODS AND APPARATUS FOR PROCESSING TRANSPARENT MATERIALS
ASSOCIATION ALPHANOV, CENTRE TECHNOLOGIQUE OPTIQUE ET LASER (France)
Inventeur(s)
Lott, Geoffrey
Falletto, Nicolas
Kling, Rainer
Abrégé
A method for forming features in a substrate includes irradiating a substrate with a beam of laser pulses, wherein the laser pulses have a wavelength selected such that the beam of laser pulses is transmitted into an interior of the substrate through a first surface of the substrate. The beam of laser pulses is focused to form a beam waist at or near a second surface of the substrate, wherein the second surface is spaced apart from the first surface along a z-axis direction, and the beam waist is translated in a spiral pattern extending from the second surface of the substrate toward the first surface of the substrate. The beam of laser pulses is characterized by a pulse repetition rate in a range from 20kHz to 3MHz, a pulse duration, a pulse overlap, and a z-axis translation speed.
H01S 5/062 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes
H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
92.
LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS
Numerous embodiments concerning methods and apparatus for processing a workpiece are disclosed. In one embodiment, an electronic display device having a plurality of viewing elements is provided, wherein a viewing element includes a color element and at least one viewing element exhibits a bright pixel defect. The color element of the viewing element exhibiting the bright pixel defect can be darkened by irradiating the color element with at least one laser pulse having a pulse duration in a range from 1 ps to 40 ps.
G09G 3/3258 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED] organiques, p. ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander la tension aux bornes de l'élément électroluminescent
93.
LASER SYSTEMS AND METHODS FOR LARGE AREA MODIFICATION
A laser system (112, 1300) modifies a large area on an article (100) by employing a beamlet generator (1404) to provide a plurality of beamlets (1408) to a beamlet selection device (2350) whose operation is synchronized with movement of a beam steering system (1370) to variably select a number and spatial arrangement of beamlets (1408) to propagate a variable pattern of spot areas (302) to the article (100).
A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
95.
FAST BEAM MANIPULATION FOR CROSS-AXIS MICROMACHINING
A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non- overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.
H01S 3/106 - Commande de l'intensité, de la fréquence, de la phase, de la polarisation ou de la direction du rayonnement, p. ex. commutation, ouverture de porte, modulation ou démodulation par commande de dispositifs placés dans la cavité
Alignment features (60) associated with a support fixture (36) provide side scan data and top scan data reference points. Side scan displacement sensors (112) obtain side scan data of workpiece edge segments (23), and one or more cameras (130) obtain top scan data to provide a machining reference for the side scan data. The side scan data can be transformed into a top- view coordinate system usable by the laser machining system (140).
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01R 31/00 - Dispositions pour tester les propriétés électriquesDispositions pour la localisation des pannes électriquesDispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
G01R 31/01 - Passage successif d'articles similaires aux tests, p. ex. tests "tout ou rien" d'une production de sérieTest d'objets en certains points lorsqu'ils passent à travers un poste de test
97.
Adaptive part profile creation via independent side measurement with alignment features
Alignment features (60) associated with a support fixture (36) provide side scan data and top scan data reference points. Side scan displacement sensors (112) obtain side scan data of workpiece edge segments (23), and one or more cameras (130) obtain top scan data to provide a machining reference for the side scan data. The side scan data can be transformed into a top-view coordinate system usable by the laser machining system (140).
G05B 19/25 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par systèmes de commande de positionnement ou de commande de contournage, p. ex. pour commander la position à partir d'un point programmé vers un autre point ou pour commander un mouvement le long d'un parcours continu programmé utilisant un dispositif de mesure numérique différentielle pour commande continue de parcours
G05B 15/02 - Systèmes commandés par un calculateur électriques
G05B 19/401 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour la mesure, p. ex. étalonnage et initialisation, mesure de la pièce à usiner à des fins d'usinage
An inspection system that is effective to collect images of a part under inspection. This inspection system includes (a) a three axis linear motion stage; (b) a rotary fourth axis stage configured to hold and rotate an object to be inspected. This rotary fourth axis stage is mounted on the three axis linear stage; (c) a fifth axis camera and optical system mounted to one of the axes of the three axis linear motion stage. This fifth axis camera has an optical axis substantially parallel to the axis of linear motion; (d) a 45 degree mirror configured to bend the optical axis of the fifth axis camera by 90° to point towards the object; and (e) a motor configured to rotate the mirror over a range of angles to obtain a fifth axis of viewing orientation.
An inspection system that is effective to collect images of a part (7) under inspection. This inspection system includes (a) a three axis linear motion stage (10); (b) a rotary fourth axis stage (11) configured to hold and rotate an object (7) to be inspected. This rotary fourth axis stage (11) is mounted on the three axis linear stage (10); (c) a fifth axis camera (1) and optical system (4) mounted to one of the axes of the three axis linear motion stage (10). This fifth axis camera (1) has an optical axis substantially parallel to the axis of linear motion; (d) a 45 degree mirror (6) configured to bend the optical axis of the fifth axis camera (1) by 90° to point towards the object (7); and (e) a motor (3) configured to rotate the mirror (6) over a range of angles to obtain a fifth axis of viewing orientation.
G01B 11/30 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la rugosité ou l'irrégularité des surfaces
G01N 21/01 - Dispositions ou appareils pour faciliter la recherche optique
G01N 21/952 - Inspection de la surface extérieure de corps cylindriques ou de fils
Each data point within a two-dimensional code can be represented by a distribution of spots (32). Each spot (32) can be made small enough to be invisible to the human eye so that the two-dimensional code can be invisible on or within transparent or nontransparent materials. The spots (32) can be spaced at a large distance (s) to increase the signal-to-noise ratio for an optical code reader. A code reader can be adapted to read the spots (32) and determine the data points.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
