A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).
In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09D 133/10 - Homopolymères ou copolymères d'esters de l'acide méthacrylique
C09D 7/48 - Stabilisants contre la dégradation par l’oxygène, la chaleur ou la lumière
C09D 7/63 - Adjuvants non macromoléculaires organiques
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).
A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).
In Formula (B-1), the definition of X1 to X3 and Z4 to Z6 are the same as defined in the detailed description.
A polyimide precursor, a preparation method thereof, a photosensitive resin composition and a cured product are provided. The polyimide precursor is obtained from a tetracarboxylic dianhydride (A), a diamine (B), and a hydroxyl-containing alkyl (meth)acrylate (C) through ring-opening substitution, and polymerization. The polyimide precursor does not include fluorine. The tetracarboxylic dianhydride (A) and the diamine (B) form a main chain. The hydroxyl-containing alkyl (meth)acrylate (C) is grafted to the main chain to form a branch. A molar ratio of the tetracarboxylic dianhydride (A) to the diamine (B) if from 1:0.95 to 1:1.10.
C08F 283/04 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polycarbonamides, des polyesteramides ou des polyimides
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08G 73/12 - Précurseurs de polyimides non saturés
C08F 220/20 - Esters des alcools polyhydriques ou des phénols polyhydriques
A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).
C09D 125/18 - Homopolymères ou copolymères de monomères aromatiques contenant des éléments autres que le carbone et l'hydrogène
C09D 161/06 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes avec des phénols
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
An ink composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), a first resin (B1), a second resin (B2), an ethylenically unsaturated monomer (C), an initiator (D) and a solvent (E). The first resin (B1) is an alkali-insoluble resin, and the second resin (B2) is an alkali-soluble resin. The first resin (B1) includes a compound represented by the following Formula (1):
In Formula (1), n is an integer from 1 to 10, X is benzene, toluene or naphthalene, and Y is toluene, methylnaphthalene, tetrahydrodicyclopentadiene, or 4,4′-dimethyl-1,1′-biphenyl.
C09D 11/30 - Encres pour l'impression à jet d'encre
C09D 11/033 - Encres d’imprimerie caractérisées par des particularités autres que la nature chimique du liant caractérisées par le solvant
C09D 11/037 - Encres d’imprimerie caractérisées par des particularités autres que la nature chimique du liant caractérisées par le pigment
C09D 11/102 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09K 11/88 - Substances luminescentes, p. ex. électroluminescentes, chimiluminescentes contenant des substances inorganiques luminescentes contenant du sélénium, du tellure ou des chalcogènes non spécifiés
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
A resin composition and a cured film are provided. The resin composition includes a monomer mixture (A), a siloxane compound (B), a curing agent (C), and inorganic particles (D). The monomer mixture (A) includes a bisphenol fluorene compound (A-1) represented by Formula (I-1). The siloxane compound (B) has a group represented by Formula (II-a).
A resin composition and a cured film are provided. The resin composition includes a monomer mixture (A), a siloxane compound (B), a curing agent (C), and inorganic particles (D). The monomer mixture (A) includes a bisphenol fluorene compound (A-1) represented by Formula (I-1). The siloxane compound (B) has a group represented by Formula (II-a).
A photosensitive resin composition, an optical film and a method of producing the same are provided. The photosensitive resin composition includes a thiol compound (A) having two or more groups represented by formula (I-a), a polyether-modified polysiloxane (B), an ethylenically unsaturated group-containing compound (C) having one or two aromatic rings, a bisphenol fluorene oligomer (D) having one or two (meth)acryloyl groups, and a photoinitiator (E).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
8.
BLACK LIGHT-SHIELDING PHOTOSENSITIVE RESIN COMPOSITION, BLACK MATRIX, BLACK LIGHT-SHIELDING FILM, FRAME AND FILLING MATERIAL FOR SPLICING AREA
A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.
B65D 8/02 - Aménagements des ouvertures de remplissage ou de vidage
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
F16L 37/56 - Accouplements du type à action rapide pour tuyaux à double-paroi ou à canaux multiples
10.
PHOTORESIST COMPOSITION, OPTICAL FILM THEREOF, AND PREPARING METHOD OF THE OPTICAL FILM
The present disclosure provides a photoresist composition comprising an alkali soluble resin, a photopolymerizable compound, a photoinitiator, a thermal initiator, a black colorant, and a solvent, wherein the photopolymerizable compound contains at least one ethylenically unsaturated monomer and at least one epoxy compound. The present disclosure also provides an optical film and a preparing method of the optical film.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
11.
Polyimide resin composition, polyimide resin adhesive layer, laminate, and manufacturing method of electronic component
A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.
A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound with quinonediazide group, a mixed solvent and at least one additive. The mixed solvent includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to a volatilization rate of butyl acetate of 100, and the second solvent has a boiling point between 150° C. and 200° C. The at least one additive has a molecular weight of 500-5000 and a structural unit as Formula (I), wherein R1 is selected from a group consisting of hydrogen, hydroxyl group, C1-C5 alkyl group, phenyl group, halogen atoms and cyano group, R2 is selected from a group consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof and aromatic heterocycles, and n is 10-80. It is also provided a method for preparing a photoresist film
A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound with quinonediazide group, a mixed solvent and at least one additive. The mixed solvent includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to a volatilization rate of butyl acetate of 100, and the second solvent has a boiling point between 150° C. and 200° C. The at least one additive has a molecular weight of 500-5000 and a structural unit as Formula (I), wherein R1 is selected from a group consisting of hydrogen, hydroxyl group, C1-C5 alkyl group, phenyl group, halogen atoms and cyano group, R2 is selected from a group consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof and aromatic heterocycles, and n is 10-80. It is also provided a method for preparing a photoresist film
A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
G03F 7/035 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyuréthanes
14.
Black resin composition, cured film, and black filter
A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
G02B 5/00 - Éléments optiques autres que les lentilles
15.
White photosensitive resin composition, white spacer, light conversion layer, and light-emitting device
A white photosensitive resin composition, a white spacer, a light conversion layer, and a light-emitting device are provided. The white photosensitive resin composition includes a polymerizable compound (A), an alkali-soluble resin (B), a photopolymerization initiator (C), a solvent (D), and a white pigment (E). The polymerizable compound (A) includes an ethylenically-unsaturated monomer (A-1) represented by formula (I-1) and a thiol compound (A-2) having two or more thiol groups in one molecule, wherein based on 100 mass % of the polymerizable compound (A), a total content of the ethylenically-unsaturated monomer (A-1) and the thiol compound (A-2) is 10 mass % to 98 mass %.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes uniquement des atomes de carbone aliphatiques
C08G 63/688 - Polyesters contenant des atomes autres que le carbone, l'hydrogène et l'oxygène contenant du soufre
F21V 9/40 - Éléments modifiant les caractéristiques spectrales, la polarisation ou l’intensité de la lumière émise, p. ex. filtres avec des dispositions pour commander les propriétés spectrales, p. ex. la couleur, ou l’intensité
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
16.
Photosensitive resin composition, spacer, light conversion layer, and light-emitting device
The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali- soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).
An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).
A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight.
4, Y, Z, m, n and p are the same as defined in the detailed description.
A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 283/08 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polyéthers, des polyoxyméthylènes ou des polyacétals sur des polyoxyphénylènes
A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08G 73/26 - Copolymères d'un composé organique fluoronitrosé et d'un autre composé organique fluoré, p. ex. caoutchoucs nitrosés du trifluoronitrosométhane avec une fluoro-oléfine
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides
G03F 7/34 - Dépouillement selon l'image par transfert sélectif, p. ex. par arrachement
G03F 7/42 - Élimination des réserves ou agents à cet effet
The present invention provides a method for forming a patterned polyimide layer with the use of a positive photoresist composition. The composition comprises a cresol-type novolac resin, a diazonaphthoquinone-based sensitizer and an organic solvent; based on the cresol-type novolac resin with a total amount of 100 parts by weight, the amount of the diazonaphthoquinone-based sensitizer ranges from 40 parts to 60 parts by weight, the amount of the free cresol in the cresol-type novolac resin is lower than 2 parts by weight, and the alkaline dissolution rate (ADR) of the cresol-type novolac resin in an aqueous solution of 3.5 wt % to 7 wt % tetramethylammonium hydroxide is lower than 285 Å/s. The positive photoresist composition has excellent chemical resistance to the polyimide stripper, and can specifically improve the protective ability of the photoresist layer to the low-dielectric polyimide layer, thereby optimizing the manufacturing process and quality of the patterned polyimide layer.
A photosensitive resin composition, an optical film, and a method of producing an optical film are provided. The photosensitive resin composition includes an ethylenically unsaturated group-containing compound (A) having one or two aromatic rings; a bisphenol fluorene oligomer (B) having one or two (meth)acryloyl groups; and a photoinitiator (C), wherein the weight ratio of the ethylenically unsaturated group-containing compound (A) to the bisphenol fluorene oligomer (B) is from 0.50 to 0.95.
C08F 20/30 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle contenant des cycles aromatiques dans la partie alcool
C08F 20/32 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle contenant des radicaux époxyde
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
23.
Flexible encapsulating material, process for preparing the same and encapsulating method using the same
A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.
C08G 59/42 - Acides polycarboxyliquesLeurs anhydrides, halogénures ou esters à bas poids moléculaire
H01L 51/52 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED) - Détails des dispositifs
H01L 51/00 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
24.
Photosensitive composition, color filter and method for forming the color filter
A photosensitive composition, a color filter prepared by using the photosensitive composition and a method for preparing the color filter. The photosensitive composition includes an alkali-soluble resin (A); an ethylenically unsaturated monomer (B); a photopolymerization initiator (C); a solvent (D); and a colorant (E), wherein the content of the photopolymerization initiator (C) is from 32 parts by weight to 70 parts by weight based on 100 parts by weight of the ethylenically unsaturated monomer(B).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
25.
Photosensitive polyimide composition and photoresist film made thereof
The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator.
1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.
A composition, a method fabricating the infrared ray transmitting filter, and an infrared ray sensor are provided. When the composition forms a film with a thickness of 1 μm, transmittance of the film in a wavelength in a range from 400 nm to 700 nm is less than 4%, and transmittance of the film in a wavelength in a range from 900 nm to 1300 nm is more than 90%. The composition comprises an alkali-soluble resin at least containing an acrylic group, a carboxyl group, and a fluorene ring, a photoinitiator, an unsaturated monomer, a pigment mixture, and a solvent. The pigment mixture is formed by mixing a colorant dispersion and a pigment in a weight ratio from 60:40 to 70:30.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
G03F 7/16 - Procédés de couchageAppareillages à cet effet
The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.
The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ≧3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
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