An electronic load device and an operating method thereof are provided. The operating method for the electronic load device includes operating a power module to control a load current drawn from a device under test as a first current signal according to a resistance parameter and an output voltage signal detected from the device under test, where the initial phase of the first current signal is the same as the initial phase of the output voltage signal; inputting the output voltage signal to a phase lock loop model for the signal locking; and generating a first pulse width modulation signal according to the received current parameter when the signal locking is completed, so that a switching load of the power module controls the load current to switch from the first current signal to a second current signal according to the first pulse width modulation signal.
A power busbar device includes two output contacts, a plurality of insulation layers, a plurality of trace layers, a plurality of power supply contact groups, and a plurality of switching contact groups. The trace layers and the insulation layers are arranged in an interleaved stack. Each of the switching contact groups includes a first switching contact, a second switching contact, and a switch. The first switching contact, the second switching contact, and the power supply contact groups extend through the insulation layers and the trace layers. The switch enables connection or disconnection between the first switching contact and the second switching contact based on a switching state thereof. Each of the trace layers distributes traces connected to the output contacts, the switching contact groups and the power supply contact groups, to connect the power supply contact groups in series or in parallel based on the switching state of the switch.
A wafer inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.
A wafer testing apparatus includes a base, a chuck, a first lift device and a bridge assembly. The base is movable in a first axis direction. The chuck carries a component under test. The first lift device lifts or lowers the chuck relative to the base in the first axis direction, so as to correspondingly come into contact with or move away from the component under test. The bridge assembly includes an electrical connection device and a second lift device. The electrical connection device includes first and second connection modules electrically connected to each other. The second lift device lifts or lowers the electrical connection device relative to the base in the first axis direction, such that the first connection module correspondingly comes into contact with or moves away from a probe card, and the second connection module correspondingly comes into contact with or moves away from the chuck. Thus, integrity and continuity of test signals are ensured, and compatibility of existing apparatuses is also enhanced.
A constant power adaptive current limiting protection circuit includes a switching power supply circuit, a detecting circuit, and a controlling circuit. The switching power supply circuit has at least one power switch assembly and an output terminal. The detecting circuit is coupled to the output terminal of the switching power supply circuit to detect an output voltage and an output current of the power signal. The controlling circuit is coupled to the switching power supply circuit and the detecting circuit. The controlling circuit is configured to output the PWM signal, calculate a current limiting threshold based on a protection power and the output voltage, and selectively execute a protecting action based on comparison between the output current and the current limiting threshold. The protecting action is adjusting the PWM signal, so as to limit the output power of the switching power supply circuit to below the protection power.
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H02H 1/00 - Détails de circuits de protection de sécurité
H02H 7/12 - Circuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour convertisseursCircuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour redresseurs pour convertisseurs ou redresseurs statiques
6.
ANTI-CONDENSATION LOW-TEMPERATURE TESTING MODULE AND CHIP TESTING APPARATUS HAVING THE SAME
An anti-condensation low-temperature testing module and a chip testing apparatus having the same are provided. The low-temperature testing module includes a low-temperature dry-gas supplying device, a low-temperature chamber, a low-temperature generating device, and a communicating pipe. The low-temperature dry-gas supplying device is configured to provide a low-temperature dry-gas to a chip socket of a testing base. The low-temperature generating device is arranged in the low-temperature chamber and coupled to the testing base. The low-temperature generating device is configured to cool down the testing base. One of two ends of the communicating pipe is in communication with the chip socket of the testing base, and the other end of the communicating pipe is in communication with the low-temperature chamber.
A position fine-tuning structure includes a first plate, a second plate and a guide slider. A top surface of the first plate is recessed with a first linear groove. A bottom surface of the second plate is recessed with a second linear groove. The bottom surface of the second plate directly covers the top surface of the first plate, so that the second linear groove is orthogonal to and in communication with to the first linear groove. The guide slider includes a first pillar and a second pillar which are overlapped with and orthogonal to each other. The first pillar is parallel to the first linear groove and slidably located within the first linear groove, and the second pillar is parallel to the second linear groove and slidably located within the second linear groove.
A chip cooling module and a chip testing apparatus having the same are provided. The chip cooling module includes a socket and a fluid supply device. The socket includes a chip slot and at least one fluid channel, and the chip slot is configured to accommodate a chip. The fluid supply device is in communication with the at least one fluid channel of the socket. The at least one fluid channel includes a divergent opening, and the divergent opening is provided on a sidewall of the socket and faces the chip slot. In response to the fluid supply device supplying a cooling fluid to the at least one fluid channel, the cooling fluid forms a jet stream toward the chip slot through the divergent opening.
A pressurizing apparatus for a battery tray is provided. The pressurizing apparatus includes a base, a compressive force generation module, a fixing module, and a controller. The compressive force generation module and the fixing module are arranged on the base. The controller is electrically connected to the compressive force generation module and the fixing module. The controller is configured to control the fixing module to be coupled between the compressive force generation module and the battery tray. The controller is configured to control the compressive force generation module to apply a compressive force to a pressure-bearing plate of the battery tray, so that the pressure-bearing plate pressurizes a pressurizing plate of the battery tray, thereby forming a containment on the batteries on a plurality of partition plates of the battery tray.
A high-precision measurement system is disclosed. The high-precision measurement system includes a data collection circuit, a machine learning circuit, and an output circuit. The data collection circuit is configured to obtain several first output data corresponding to several first setting data. The machine learning circuit is configured to create a machine learning model according to the several first setting data, the several first output data, and several first correction parameters between the several first setting data and the several first output data, and the machine learning circuit is configured to generate a second correction parameter corresponding to a second setting data according to the machine learning model. The output circuit is configured to correct a second output data corresponding to the second setting data to generate a corrected output data according to the second correction parameter.
A power protection component is used for being assembled on a host. The power protection component includes a protective housing and an iron core. The protective housing is fixed on the outside of the host. The protective housing comprises an accommodating chamber, a first opening and a second opening. The accommodating chamber is located within the protective housing, and the first opening and the second opening are respectively formed on different sides of the protective housing. The iron core is fixed within the accommodating chamber, and the iron core comprises a perforating hole. After the power cord passes through the second opening and the perforating hole, the power cord is plugged into the plug-in position and forms an inductor with the iron core. The inductor can be used to suppress electromagnetic interference.
A flow guiding cover assembly is adapted to be disposed in a cabinet, and between an air conditioning device and a carrier tray. The carrier tray carries at least one battery pack. The flow guiding cover assembly includes an air intake cover and at least one air outlet cover. The air intake cover is adapted to be disposed at one side of the air conditioning device, and is provided for a cooling airflow outputted by the air conditioning device to flow therethrough. The at least one air outlet cover is connected to the air intake cover and is adapted for discharging the cooling airflow to a top portion of the at least one battery pack.
H01M 10/6566 - Moyens dans l'écoulement du gaz pour guider l'écoulement autour d'un ou plusieurs éléments, p. ex. collecteurs, chicanes ou autres barrières
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/627 - Installations fixes, p. ex. ensemble de production d’énergie tampon ou de production d’énergie de secours
H01M 10/6563 - Gaz avec circulation forcée, p. ex. par des soufflantes
H01M 10/663 - Relations d'échange de chaleur entre les éléments et d'autres systèmes, p. ex. chauffage central ou piles à combustibles le système étant un climatiseur ou un moteur
13.
DETECTION SYSTEM, COMPENSATION METHOD, AND COMPUTER READABLE MEDIUM FOR SEMICONDUCTOR SURFACE MORPHOLOGY
Provided are a detection system, compensation method and computer-readable recording medium applicable to semiconductor surface morphology to provide feature information corresponding to spectral signals to a neural network model and provide feature information corresponding to spectral signals, a detected height, and an actual height actually measured to another neural network model. The combinational neural network models thus trained and built can generate a compensation value for a to-correct height corresponding to a to-correct spectral signal having variability. The compensation value provides required compensation for height information to not only enhance the precision of the detection of semiconductor surface morphology but also enhance the reliability of the detection system.
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
A method, measurement system and computer-readable medium for measuring a hole depth using phase extraction information from a reflectance spectrum. The method includes a step of acquiring a reflectance spectrum, a step of obtaining the correlation between the intensity and a wave number of a reflected light, a step of phase extraction and a step of determining a hole depth. By converting first distribution data between the intensity and the wave number of the reflected light into second distribution data between a phase and the wave number, information of the hole depth of a hole structure is obtained by calculating a slope value. Thus, a measurement resolution can be increased and the accuracy can be enhanced.
A system and a method for calibration of optical measurement devices are described. In one embodiment, the optical measurement device comprises an imaging lens, and the calibration system includes a projection light source, a lens module, and a projection element. The light emitted from the projection light source passes through the projection element and is projected by the lens module, and then captured by the imaging lens of the optical measurement device. The exit pupil of the lens module in the calibration system is coincident with the entrance pupil of the imaging lens of the optical measurement device, providing a compact and highly efficient optical calibration mechanism.
The present invention provides a two-way AC power conversion device configured to input or output a first AC power. The two-way AC power conversion device comprises a digital control module and a power conversion module. The digital control module generates a control signal. The power conversion module sets the first AC power to be input or output according to the control signal. Wherein when the digital control module determines a real-time voltage signal of the first AC power is abnormal, the power conversion module switches to provide a ground voltage according to the control signal.
H02M 5/293 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant alternatif, p. ex. pour changement de la tension, pour changement de la fréquence, pour changement du nombre de phases sans transformation intermédiaire en courant continu par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/32 - Moyens pour protéger les convertisseurs autrement que par mise hors circuit automatique
H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
17.
PHASE-CHANGE TEMPERATURE REGULATING SYSTEM AND ELECTRONIC COMPONENT TESTING APPARATUS AND METHOD
A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.
An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.
An adapter bracket includes a holder and a fixing element. The holder includes a first strip-shaped body and a second strip-shaped body. The first strip-shaped body is formed with a plurality of first notches linearly arranged on a first coupling surface of the first strip-shaped body. The second strip-shaped body is formed with a plurality of second notches linearly arranged on a second coupling surface of the second strip-shaped body. The fixing element detachably couples the first strip-shaped body and the second strip-shaped body together, so that the first coupling surface and the second coupling surface are in contact with each other, and the first notches and the second notches are jointly combined into a plurality of fastening holes arranged linearly, and each of the fastening holes can hold an object therein.
An automated optical measurement system and method for a near eye display are provided. A controller first controls the near eye display to display a specific pattern, then controls a displacement generation module to drive an image sensing module toward or away from an imaging module, and controls the image sensing module to capture the specific pattern to obtain focus images; and the controller performs focusing according to the focus images. Finally, the controller measures an optical characteristic of the near eye display. Accordingly, the focusing method used is to capture the specific pattern displayed by the near eye display while moving the image sensing module, and perform automatic focusing by comparing the capture results.
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
G01J 3/50 - Mesure de couleurDispositifs de mesure de couleur, p. ex. colorimètres en utilisant des détecteurs électriques de radiations
G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques
H04N 23/67 - Commande de la mise au point basée sur les signaux électroniques du capteur d'image
21.
PRE-INTERCEPTION DEVICE AND FILTERING SYSTEM OF ELECTRONIC APPARATUS USING THE SAME
A pre-interception device includes an input portion for a fluid to flow in, an output portion for the fluid to flow out, a plurality of diversion flow channels and a plurality of interception portions. Each diversion flow channel is in communication with the output portion and the input portion, is configured to provide turning guidance for flow of the fluid, and has a fluid lift section. The interception portions are configured to form a turbulent flow field in the fluid. The turbulent flow field can have foreign objects flowing through the diversion flow channel be captured. Accordingly, a filtering effect is achieved based on physical properties of the foreign objects. When the pre-interception device is additionally combined with a filter net to form a filtering system, the burden on the filter net is further alleviated, hence extending a service life of the filter net and reducing costs.
B01D 50/20 - Combinaisons de dispositifs couverts par les groupes et
B01D 45/06 - Séparation de particules dispersées dans des gaz ou des vapeurs par gravité, inertie ou force centrifuge par inertie par inversion du sens de l'écoulement
B01D 46/10 - Séparateurs de particules utilisant des plaques, des feuilles ou des tampons filtrants à surface plane, p. ex. appareils de précipitation de poussières
H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques Détails
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application software for testing of Power Supply Test and Measurement equipment, namely, AC to DC power supply, rectifier, adapter, converter, inverter, electrical power supply unit; Downloadable computer application software for automatic test apparatuses for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing of Power Supply Test and Measurement equipment, namely, AC source, DC source, Power meter, E-Load, Oscilloscope, electrical power sources, AC Load equipment, DC Load equipment, and power meters; Downloadable computer application software for testing optoelectronic component apparatus and automated optical inspection apparatus; Downloadable vector database software application, namely, downloadable computer application software for managing and storing vector data
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application software for testing of Power Supply Test and Measurement equipment, namely, AC to DC power supply, rectifier, adapter, converter, inverter, electrical power supply unit; Downloadable computer application software for automatic test apparatuses for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing of Power Supply Test and Measurement equipment, namely, AC source, DC source, Power meter, E-Load, Oscilloscope, electrical power sources, AC Load equipment, DC Load equipment, and power meters; Downloadable computer application software for testing optoelectronic component apparatus and automated optical inspection apparatus; Downloadable vector database software application, namely, downloadable computer application software for managing and storing vector data.
An anti-overturning device for cabinet and its cabinet structure is disclosed in the present invention. The anti-overturning device comprises a first fixing member, a second fixing component and a connecting part. The first fixing component is used for arranging detachably on the outside of the cabinet bottom. The second fixing component includes at least a second opening, and the second opening is used for fixing on the auxiliary wheel or on the ground. The anti-overturning devices are provided evenly on the periphery of the cabinet bottom. The anti-overturning devices change the horizontal position of the original overturning pivot of the cabinet and enlarge the overturning angle to prevent from overturning the cabinet.
A source measure device includes a current sampling circuit, a voltage sampling circuit, an overvoltage detecting circuit, and a comparing circuit. The current sampling circuit is configured to sample a current of a device under test. The voltage sampling circuit is configured to sample a voltage of the device under test. The overvoltage detecting circuit is coupled to the current sampling circuit and the voltage sampling circuit, and receives a first operation voltage of the current sampling circuit and a second operation voltage of the voltage sampling circuit so as to generate a detection voltage. The comparing circuit is coupled to the overvoltage detecting circuit, and determines whether the detection voltage is within a voltage range. If the detection voltage is not within the voltage range, the comparing circuit generates an abnormal signal.
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and disposed on its bottom surface. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window for the detection portion to extend out and a first ring piece extending from a periphery of the first window. The surround separating unit includes a conductive wraparound body surrounding and laterally enclosing the detection portion and a wafer to be inspected during probing. The probe card, first metal kit, carrier device, and conductive wraparound body jointly define an space range, shielding the detection portion and wafer from external noise or interference sources, thereby improving inspection accuracy.
A full-open and full-angle stall device for a motor test system is disclosed. The stall device is used to provide a stall function to a motor under test and includes a base, a driving source connection module and a brake module. The driving source connection module includes a coupling and a first disc and a second disc that are detachably joined together. The first disc and the second disc are fixed on the coupling. The coupling is defined with a mounting hole for connecting a transmission shaft so as to receive a driving source from the motor under test. The brake module is disposed on the base and is configured at an edge of the driving source connection module, and is controlled to generate a clamping force on the driving source connection module, wherein the clamping force is selectively applied to any edge of the first disc and the second disc so as to brake the driving source connection module.
A composite calibration plate includes a control board, a light detection board, a diffusion board, a light-emitting sheet, and a fluorescent sheet. The control board has a first setting surface and a second setting surface. The light detection board is stacked on the first setting surface. The diffusion board is stacked on the light detection board. The light-emitting sheet is stacked on the second setting surface and includes a plurality of self-luminous sources. The fluorescent sheet is optionally stacked on the light-emitting sheet or the diffusion board, and has a plurality of fluorescent chips. When calibrating the lighting device, the fluorescent sheet is disposed on the light-emitting sheet; and, when calibrating the imaging device, the fluorescent sheet is disposed on the light-emitting sheet, such that the fluorescent sheet is located at a focus position of an optical imaging path.
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
C12Q 1/6848 - Réactions d’amplification d’acides nucléiques caracterisées par les moyens d’empêcher la contamination ou d’augmenter la spécificité ou la sensibilité d’une réaction d’amplification
29.
Multiphase thermal interface component, method of forming the same and electronic device testing apparatus provided with the same
A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G05D 23/20 - Commande de la température caractérisée par l'utilisation de moyens électriques avec un élément sensible présentant une variation de ses propriétés électriques ou magnétiques avec les changements de température
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
A containment apparatus for battery tray rack includes a pressing module, a securing module, and a controller. In response to that the containment apparatus is to form the containment on the battery tray rack, the controller controls the pressing module to apply a compressive force, so that the battery tray rack withstands a clamping pressure, and the controller controls the securing module to lock the battery tray rack to maintain the clamping pressure. In response to that the containment apparatus is to release the containment from the battery tray rack, the controller controls the pressing module to apply the compressive force, and the controller controls the securing module to unlock the battery tray rack, and then the controller controls the pressing module to cancel the compressive force.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Power analyzers, namely, electronic monitors and monitor modules for monitoring electric current and electrical signals; Color analyzer automated optical inspection apparatus; Semiconductor automatic test system comprised of electrical testing apparatus for testing semiconductor wafers, packaged integrated circuits, System on a Chip (SoC), and logic circuits; high potential (hipot) electrical apparatus for testing the electrical conductivity of insulation; switcher analyzers in the nature of automatic electronic testing apparatus for use in testing power supplies and performing computer system administration in research and development evaluation of measurement and test field, and for used in electronic object function tests, quality assurance verification, and mass production quality tests, and monitoring of manufacturing activities; Inductance Capacitance Resistance (LCR) meters; Electric vehicle testing system consisting of electronic hardware, namely, Direct Current (DC) power supplies, DC electronic loads, timing analyzers, and Inductance Capacitance Resistance (LCR) meters for use in research and development evaluations of measurement and test field, quality assurance verification, and production quality testing; Battery testing and safety system consisting of electronic hardware, namely, DC power supplies, DC electronic loads, timing analyzers, and Inductance Capacitance Resistance (LCR) meters for use in research and development evaluations of measurement and test field, quality assurance verification and productions testing; DC power supplies; power quality analyzers; frequency response analyzers (FRA); High Voltage Direct Current (HV DC) power supplies; hipot testers being electrical apparatus for testing the electrical conductivity of insulation; electronic video test pattern generators; Liquid Crystal Display (LCD) color analyzers; Liquid Crystal Module Automatic Test Systems (LCM ATS) consisting of electronic hardware, namely, direct current power supplies, AC/DC electronic loads, timing analyzers, and LCR meters for use in research and development, quality evaluation, quality assurance, quality verification and production quality testing; LCD driver integrated circuit test apparatus for use in testing LCD driver integrated circuits and consumer integrated circuits in a single platform; Integrated circuit test handlers, namely, machines for testing integrated circuits; modular instrumentation, namely, PCI Extensions for Instrumentation (PXI) consisting of peripheral component interface (PCI) hardware; Alternating Current (AC) power supplies; electrical safety analyzers for testing the safety of electrical devices; programmable electronic video test pattern generators (VPG); electronic apparatus for testing the quality of Liquid Crystal Modules (LCMs)
32.
MOTION SYNCHRONIZED MULTI-TIER PALLET RACK AND BATTERY FORMATION APPARATUS HAVING THE SAME
A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.
A power transceiver device includes a housing, a circuit module and an electrical connector. The circuit module is located within the housing. The electrical connector includes a terminal base and two conductive terminals. The terminal base is fixed on one side surface of the housing. Each of the conductive terminals includes a sheet, an extending portion and an opening. One end of the sheet extends through a front face of the terminal base, another end thereof is electrically connected to the circuit module. The extending portion extends transversely from the end of the sheet, the opening is firmed on the extending portion, and a virtual axis of the opening passes through the front lateral face of the terminal base. The conductive terminals are switchably electrically connected to each other.
The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.
The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.
An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.
The present invention discloses a detection device and a probe module thereof, wherein an electrical connection path between a battery detection frame and a battery under test is provided via the probe module. The probe module includes a base, a first polarity plate, a second polarity plate, a first upper connection group, a second upper connection group, a first lower connection member and a second lower connection member. Via the first polarity plate, the first upper connection group is correspondingly coupled to the battery detection frame, and the first lower connection member is correspondingly coupled to the battery under test. Via the second polarity plate, the second upper connection group is correspondingly coupled to the battery detection frame, and the second lower connection member is correspondingly coupled to the battery under test. Thus, it is not necessary to process a cable having been fixed on the battery detection frame when the probe module is replaced. Moreover, since each polarity has dedicated coupling elements respectively corresponding to the battery detection frame and the battery under test, reliability is enhanced.
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
38.
TEMPERATURE CONTROL SYSTEM AND METHOD FOR ELECTRONIC DEVICE-TESTING APPARATUS
The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.
A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; Downloadable computer application for automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; downloadable computer application for testing optoelectronic compoment apparatus and automated optical inspection apparatus; Downloadable computer application for testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; Downloadable computer application for DNA and RNA testing for medical purpose; Downloadable vector database software application
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; Downloadable computer application for automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; downloadable computer application for testing optoelectronic compoment apparatus and automated optical inspection apparatus; Downloadable computer application for testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; Downloadable computer application for DNA and RNA testing for medical purpose; Downloadable vector database software application
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; Downloadable computer application for automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing equipment, namely, Electrical power source, AC Load, DC Load, electrical power supplies and power meter; downloadable computer application for testing optoelectronic compoment apparatus and automated optical inspection apparatus; Downloadable computer application for testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; Downloadable computer application for DNA and RNA testing for medical purpose; Downloadable vector database software application
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer application for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power weter; Downloadable computer application for automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields; Recorded computer firmware for testing equipment, namely, electrical power source, AC Load, DC Load, electrical power supplies and power meter; downloadable computer application for testing optoelectronic compoment apparatus and automated optical inspection apparatus; Downloadable computer application for testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; Downloadable computer application for DNA and RNA testing for medical purpose; Downloadable vector database software application
44.
Aging test system and aging test method for thermal interface material and electronic device testing apparatus having the system
The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.
The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.
The present invention provides a battery probing module, for testing a battery defined with a contact surface having a first electrode area and a second electrode area with different polarities. The battery probing module comprises a frame and a plurality of probe units. The frame has a top plate and a bottom plate opposite to the top plate. Each of the plurality of probe units comprises a base, a first probe, and a plurality of second probes. The base is defined with a top surface and a bottom surface deflectably fixed to the top surface by a fixing unit. The first probe and the plurality of second probes protrude from the bottom surface for contacting the first electrode area and the second electrode area respectively. Wherein the first probe is within a periphery surrounded by the plurality of second probes in a vertical direction of the bottom surface.
The present invention provides an output voltage compensation method, for a DC voltage source having a constant voltage circuit and a constant current circuit connected in series, and the DC voltage source provides an output voltage to a device under test (DUT), and the output voltage compensation method comprising: generating a voltage compensation value according to a load current and a gain parameter of the DUT; generating a virtual current setting value according to a voltage setting value and the voltage compensation value; generating a duty cycle command according to the virtual current setting value and a load current measurement value of the load current; and generating the output voltage conforming to the voltage setting value according to the duty cycle command. Wherein the gain parameter is related to a multiplier parameter of the constant voltage circuit.
09 - Appareils et instruments scientifiques et électriques
35 - Publicité; Affaires commerciales
Produits et services
Power analyzers, namely, electronic monitor and monitor modules for monitoring electric current and electrical signals; Color Analyzer; Automated Optical Inspection apparatus; Semiconductor automatic test system ,namely, electrical testing apparatus for wafers, packaged integrated circuits, SoC, Logic IC; high potential (hipot) testers to test insulation; switcher analyzers automatic test apparatus for use in testing power supplies and performing computer system administration in research and development evaluation of measurement and test field, and for used in object function tests, Quality Assurance (QA) verification, and mass production tests and monitoring manufacturing activities; Inductance Capacitance Resistance (LCR) meters; Electric Vehicle Test Tests System (ATS) consisting of hardware, namely, Direct Current (DC) sources, electronic loads, timing analyzers and Inductance Capacitance Resistance (LCR) meters for use in research and development evaluations of measurement and test field, Quality Assurance (QA) verification and productions testing; Battery Test/Formation/Safety System consisting of hardware, namely, Direct Current (DC) sources, electronic loads, timing analyzers and Inductance Capacitance Resistance (LCR) meters for use in research and development evaluations of measurement and test field, Quality Assurance (QA) verification and productions testing; Direct Current (DC) electronic load modules; Direct Current (DC) power supplies; power analyzers; frequency response analyzers; High Voltage Direct Current (HV DC) power supplies; hipot testers; video pattern generators; Liquid Crystal Display (LCD) color analyzers; Liquid Crystal Module Automatic Test Systems (LCM ATS) consisting of hardware, namely, direct current sources, electronic loads, timing analyzers and inductance, capacitance, and resistance meters for use in research and development, evaluation, quality assurance, verification and productions testing; Liquid Crystal Display (LCD) driver Integrated Circuit (IC) test apparatus for use in testing Liquid Crystal Display (LCD) driver Integrated Circuits (ICs) and consumer Integrated Circuits (ICs) in a single platform; Integrated Circuit (IC) test handlers; modular instrumentation, namely, PCI Extensions for Instrumentation (PXI); Alternating Current (AC) power source; electrical safety analyzers; programmable Video Pattern Generator (VPG); Liquid Crystal Module (LCM) testers. presentation of goods on communication media, for retail purposes; marketing; internet marketing; lead generation services; advertising services to create brand identity for others; Distribution of products of domestic or foreign manufacturers for advertising purposes; retailing and wholesaling of precision instruments.
49.
Heat exchange device and cooling system having the same
A heat exchange device and a cooling system are provided. The heat exchange device includes a low-pressure chamber and a high-pressure chamber disposed in the low-pressure chamber. The low-pressure chamber has a first wall for enabling heat exchange and an output portion in communication with the outside to output the low-pressure fluid. The high-pressure chamber has an input portion in communication with the outside to admit the high-pressure fluid and nozzles in communication with the low-pressure chamber. The fluid discharged from the nozzles undergoes a pressure drop and undergoes heat exchange through the first wall. Cooling capability is developed in the heat exchange device and works in the heat exchange device to thereby dispense with a pipeline which must be otherwise provided to link an expansion process and an evaporation process of the fluid and may otherwise cause cooling capability loss, so as to greatly enhance heat exchange capability and cooling efficiency.
F28C 3/08 - Autres appareils échangeurs de chaleur à contact direct les sources de potentiel calorifique étant un liquide et un gaz ou une vapeur avec changement d'état, p. ex. absorption, évaporation, condensation
50.
Modular AC/DC power conversion module for power sources and loads and method of driving the same
A modular AC/DC power conversion module for power sources and loads and a method of driving the same is provided. When an AC/DC converter is electrically coupled to an external power source, a microprocessor is electrically energized by a buck auxiliary circuit, under control of the microprocessor, a DC/DC converter is activated for a certain time period, and then, the AC/DC converter is activated. Thereafter, an output voltage of the AC/DC converter is boosted, and an output voltage of the DC/DC converter is boosted accordingly. Power elements in the downstream side DC/DC converter are activated first, and then power elements in the upstream side AC/DC converter are activated, thereby an inrush current is suppressed. Once the external power source is connected, the buck auxiliary circuit will automatically reduce a voltage of the power input to activate the module. It realizes that the module will autonomously operate after being electrically energized.
H02M 3/157 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation avec commande numérique
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/139 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type thyratron ou thyristor exigeant des moyens d'extinction utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation avec commande numérique
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
51.
Integrated power system capable of switching between power supply mode and electronic load mode and switching method thereof
Systems and methods for switching between a power supply mode and an electronic load mode are disclosed. For switching from the power supply mode to the electronic load mode, the method comprises the steps of: deactivating a power element; activating a current control module and a phase-locked loop to obtain a voltage phase of a device under test; calculating a turn-on amount of the power element according to a current setting value and the voltage phase; and causing the power element to generate a load current for the device under test. For switching from the electronic load mode to the power supply mode, the method comprises the steps of: deactivating the power element; activating a voltage control module; calculating the turn-on amount of the power element according to a voltage setting value; and causing the power element to input a corresponding voltage to the device under test.
H02M 5/44 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant alternatif, p. ex. pour changement de la tension, pour changement de la fréquence, pour changement du nombre de phases avec transformation intermédiaire en courant continu par convertisseurs statiques utilisant des tubes à décharge ou des dispositifs à semi-conducteurs pour transformer le courant continu intermédiaire en courant alternatif
H02M 1/00 - Détails d'appareils pour transformation
An inlet module is adapted to be disposed on a housing of an electronic device, and includes an insert board and at least one adjusting plate. The insert board has a plurality of first air passages, at least one second air passage, and at least one positioning unit. The second air passage is located between two of the first air passages, and has an area larger than that of each first air passage. The adjusting plate has an opening having an area smaller than that of the second air passage. The adjusting plate is operable to be positioned at a position where the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.
An optical lens assembly is adapted for receiving a light beam that is emitted by an object, and includes a lens unit and a sleeve unit. The lens unit includes a casing that has a light-incident side adapted for receiving the light beam. The sleeve unit surrounds the light-incident side of the casing, and defines a light-receiving space that is adapted for the light beam to pass through so that propagation of the light beam is unaffected by disturbance caused by movement of air. An optical measurement method includes steps of: a) providing a lens unit, a sleeve unit, and an object that is for emitting a light beam; and b) operating the lens unit so that the light beam is received by the lens unit.
A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.
A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.
A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.
A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.
G05B 19/401 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par des dispositions de commande pour la mesure, p. ex. étalonnage et initialisation, mesure de la pièce à usiner à des fins d'usinage
G01B 21/04 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la longueur, la largeur ou l'épaisseur en mesurant les coordonnées de points
The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.
Blood testing apparatus; Medical instrument for monitoring blood properties and respiratory events; Apparatus for use in medical analysis, namely, medical diagnostic instruments for the analysis of body fluids; Testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; Apparatus for DNA and RNA testing for medical purposes; Blood analyzer, namely, blood oxygen monitors; Immunoassay devices for medical use, namely, apparatus used in implementing diagnosis tests designed to detect the abnormal prion protein; Automated extraction instruments, namely, surgical instruments; Diagnostic apparatus for medical purposes for testing DNA and blood sugar levels; Medical devices, namely, analyzers for bacterial identification for medical purposes; Analyzers for pathogen identification for medical purposes
Blood testing apparatus; medical instruments; apparatus for use in medical analysis; testing apparatus for medical purposes; apparatus for DNA and RNA testing for medical purposes; blood analyzers; immunoassay devices for medical use; automated extraction Instruments for nucleic acid isolation; Diagnostic apparatus for medical purposes; Medical device; Analyzers for bacterial identification for medical purposes; Analyzers for pathogen identification for medical purposes.
65.
Optical measurement device including a light splitting module comprising light splitters and a light inspecting module comprising a plurality of inspecting cameras
The invention provides an optical measurement device for measuring light to be inspected. The optical measurement device comprises a light receiving module, a light splitting module, and a plurality of color filters. The light receiving module is used for converting the light to be inspected into a first parallel light. The light splitting module is used for splitting the first parallel light into a plurality of parallel lights to be inspected. Each color filter receives at least one of the plurality of parallel lights to be inspected. The plurality of parallel lights to be inspected filtered by the plurality of color filters are used to calculate tristimulus values in the CIE color space.
G02B 27/10 - Systèmes divisant ou combinant des faisceaux
G01N 21/25 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes
G02B 27/14 - Systèmes divisant ou combinant des faisceaux fonctionnant uniquement par réflexion
G01N 21/27 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en utilisant la détection photo-électrique
66.
Motor controller, motor control method and computer program product for vehicle assist control
The present application discloses a motor controller, a motor control method and a computer program product for vehicle assist control. An assist torque command for a motor device to perform vehicle assist control is generated according to an execution command of a vehicle assist determination unit and a rotor position signal and a rotor speed signal of a motor device. An original position signal of the motor device and the rotor position signal are calculated, and a position ratio calculation is performed to generate a front-order torque command. A torque damping command is generated according to the speed ratio calculation based on the rotor speed signal, and is calculated with the front-order torque command to generate an assist torque command. Thus, position information of the rotor of the motor device can be directly used in the calculation and speed information is at the same time used for an assist calculation, thereby preventing an error and solving the issue of sliding during parking.
The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
The present invention provides a voltage control method for controlling a power supply. The voltage control method comprises the following steps: obtaining a present output voltage value associated with a present gain value; obtaining a predetermined output voltage value associated with a predetermined duty ratio; calculating a target gain value, corresponding to the predetermined duty ratio, according to a gain value formula; performing a weight calculation on the present gain value and the target gain value for generating a buffer gain value; and setting an output voltage command according to the buffer gain value. Wherein the buffer gain value is between the present gain value and the target gain value.
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
69.
Optical inspection apparatus in semiconductor process system
The present invention discloses an optical detection apparatus for defining a detection surface on a carrier unit for a wafer in a semiconductor manufacturing process so as to obtain a corresponding detection image, wherein a vertical movement path for another device to move is defined above the carrier unit. The optical detection apparatus includes a support, and an imaging device disposed on the support and configured to be non-interfering with the movement path. The imaging device includes a lens group, an image capturing portion and a moving base. With the moving base, the photosensitive element of the image capturing portion is allowed to move horizontally relative to the lens group, and the imaging position can be adjusted, preventing image deformation or a reduced resolution easily caused by capturing at an oblique angle. Thus, the optical detection apparatus resolves complications of additionally mounting an optical detection apparatus in an optical detection environment within a narrow space.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H04N 23/695 - Commande de la direction de la caméra pour modifier le champ de vision, p. ex. par un panoramique, une inclinaison ou en fonction du suivi des objets
The present invention provides a surge protection module which comprises a carrier board and a probe set. The carrier board is used to carry an electronic component. The probe set is disposed on the carrier board and has a plurality of probes and a short-circuit unit. Each probe is used for contacting the electronic component, and the short-circuit unit is selectively moved to a first position or a second position. When the short-circuit unit is moved to the first position, the short-circuit unit simultaneously contacts and shorts the plurality of probes. When the short-circuit unit is moved to the second position, the short-circuit unit is away from at least one of the plurality of probes.
The present disclosure relates to an electronic load apparatus. An embodiment of the present disclosure includes an electronic load apparatus including: a measurement resistor, a reference circuit, a transistor, and a feedback circuit. The measurement resistor includes a first contact, a second contact, a third contact, and a fourth contact. The first contact and the second contact are located at a first end of the measurement resistor. The third contact and the fourth contact are located at a second end of the measurement resistor. A reference power (or a reference voltage) electrically connects to the reference circuit. The reference circuit and the first contact of the measurement resistor are electrically connected. The transistor includes a drain, a gate, and a source. The reference circuit and the gate of the transistor are electrically connected. One of the source and the drain of the transistor electrically connects to the second contact of the measurement resistor. The other one of the drain and the source of the transistor electrically connects to an output terminal of a unit under test. The feedback circuit and the fourth contact of the measurement resistor are electrically connected. The feedback circuit and the reference circuit are electrically connected.
G01R 19/10 - Mesure d'une somme, d'une différence, ou d'un rapport
G01R 1/20 - Modifications des éléments électriques fondamentaux en vue de leur utilisation dans des appareils de mesures électriquesCombinaisons structurelles de ces éléments avec ces appareils
73.
Laser diode testing system and laser diode testing method
The present invention relates to a laser diode testing system and a laser diode testing method. The method comprises the steps of moving a laser bar or a plurality of laser diodes to a first test station by means of a first transfer device; then, electrically contacting each laser diode by a first probe module in sequence; measuring electrical and optical characteristics of the laser diodes electrically contacted by the first probe module sequentially by means of a first measuring device; moving the laser bar or the plurality of laser diodes out of the first test station by means of the first transfer device, wherein a magnetic field generated by an electromagnetic generating unit of an electromagnetic slide interacts with a magnetic field of a permanent magnet of the first transfer device, so that the first transfer device is driven and moved.
The present invention relates to a low-thermal resistance pressing device for a socket, which mainly comprises a housing, an inner collar, a heat conductive pressing block, a bearing collar and a locking member. The locking member on the housing is used to lock the socket. The inner collar is threadedly engaged with the housing. The bearing collar is located between the inner collar and the heat conductive pressing block. In the case of rotating the inner collar in the housing, the bearing collar drives the heat conductive pressing block to move axially so as to exert an axial force to a device to be tested. Because the heat conductive pressing block protrudes from the upper and lower surfaces of the housing, one end thereof can be in contact with a temperature control module, and the other end thereof can be in contact with the device to be tested.
The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.
The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.
The present invention relates to a pitch-variable battery fixture and a battery cell formation apparatus having the same. A pitch of clamping plates of a plurality of clamping blocks is increased by a slide actuator of the pitch-variable battery fixture, and then the clamping plates are inserted into a plurality of compartments of a battery tray. The clamping plates are urged to clamp batteries by the slide actuator. The battery tray is provided for placement of the batteries, and a compressing force is exerted for shaping the batteries during a battery cell formation. The pitch-variable battery fixture is provided for clamping batteries having different thicknesses. According to the actual thickness of each battery, the thickness of the formed battery can be shaped.
The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
79.
FIRE EXTINGUISHING SYSTEM AND METHOD FOR ELECTRONIC COMPONENTS
Herein disclosed is a fire extinguishing system and a fire extinguishing method for electronic components. The fire extinguishing system comprises a fire extinguishing device, a control device, and a crane device. The fire extinguishing device comprises a camera module and a frame. The camera module captures a scene image related to a storage location in a machine. The frame has a fire tank for receiving an electronic component in the storage location. The control device receives the scene image and selectively sends a fetch instruction according to a status of the storage location. The crane device fetches the electronic component from the storage location to the fire tank according to the fetch instruction. Wherein the frame is fireproof.
A62C 3/16 - Prévention, limitation ou extinction des incendies spécialement adaptées pour des objets ou des endroits particuliers dans les installations électriques, p. ex. chemins de câbles
A62C 2/24 - Mécanismes de commande ou d'actionnement
A62C 37/14 - Moyens de déchargement, p. ex. déchargés électriquement thermosensibles à récipients susceptibles de se briser
A fluorescence detection system is provided and adapted to provide a selectable excitation beam to an optical transmission path for irradiation of a device under test, including a driving module, a lighting module, a first optical module and a second optical module. The driving module includes a first shaft and a second shaft parallel thereto. The lighting module is fixed to the first shaft. The first optical module and the second optical module are fixed to the second shaft. A driving operation enables the driving module to rotate the lighting module, the first optical module and the second optical module simultaneously, determining quickly a combination of one light source, one filter and one spectroscopic module on the optical transmission path, with the combination corresponding in position to the device under test, so as to reduce the volume and cost the fluorescence detection system.
Herein disclosed is a voltage isolation circuit coupled to power supplies. The voltage isolation circuit comprises a series switch group controlled by a first control signal, a parallel switch group controlled by a second control signal, and a first high impedance element. The series switch group comprises a transistor arranged in a first current loop and having two channels connected to one of the power supplies respectively. The first high impedance element, coupled to the transistor in parallel, has a measurement terminal and two ends, connected to one of the power supplies respectively. When the series switch group is conducted, the power supplies are coupled in series in the first current loop. When the parallel switch group is conducted, the power supplies are coupled in parallel in a second current loop. Impedance values measured from the measurement terminal to each end of the first high impedance element are identical.
H03K 17/56 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs
Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
G01R 1/00 - Détails ou dispositions des appareils des types couverts par les groupes ou
G01R 1/04 - BoîtiersOrganes de supportAgencements des bornes
G01R 31/00 - Dispositions pour tester les propriétés électriquesDispositions pour la localisation des pannes électriquesDispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
83.
Wafer inspection system and wafer inspection equipment thereof
A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.
Herein disclosed are a surface topography measuring system and a method thereof. The method comprises the following steps: dividing a test beam into a first sub-beam, entering a reflecting mirror along a first axis, and a second sub-beam, entering an object surface along a second axis; moving the reflecting mirror for reflecting the first sub-beam at different positions on the first axis to generate N reflected beams; generating an object reflected beam, related to the second sub-beam, reflected from the object surface; generating N images, related to the N reflected beams and the object reflected beam, and each of the N images having a plurality of interference fringes; analyzing the interference fringes in each of the N images to calculate N curve formulas; calculating a surface topography of the object surface from the N curve formulas.
G01B 11/30 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la rugosité ou l'irrégularité des surfaces
Herein disclosed is an error warning module, installed in an electronic device, comprising a detection unit and a processing unit. The detection unit detects a current or a voltage being transmitted by the electronic device to generate a current detection signal or a voltage detection signal. The processing unit, electrically connected to the detection unit, determines whether a current detection value indicated by the current detection signal exceeds a current setting range, or whether a voltage detection value indicated by the voltage detection signal exceeds a voltage setting range. When the current detection value exceeds the current setting range or the voltage detection value exceeds the voltage setting range, the processing unit generates a warning signal.
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
G01R 19/30 - Mesure de la valeur maximale ou minimale d'un courant ou d'une tension atteinte dans un intervalle de temps
86.
Electronic component testing system and time certification method
Herein disclosed are an electronic component testing system and a time certification method. The electronic component testing system comprising a testing device and an interface device. The testing device comprises a backboard, and the backboard electrically connected to at least one test board and comprising a time certification component. The interface device, electrically connected to the testing device, provides a test instruction. Wherein the time certification component stores an authorization start time and an authorization end time. Wherein the testing device starts a test procedure according to the test instruction, the time certification component updates the authorization start time to a first stop time of the test procedure after the test procedure is completed.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Direct Current (DC) electronic load, namely, DC power converters; power analyzers, namely, electronic monitors and monitor modules for monitoring electric current and electrical signals; autotransformer test apparatus for use in large Direct Current (DC) current testing, and measuring heat effect and analyzing iron core characteristics in inductors for quality inspection and product feature analysis; passive component Automatic Tests System (ATS) consisting of electrical testing hardware, namely, Direct Current (DC) sources, electronic loads, timing analyzers and Inductance Capacitance Resistance (LCR) meters for use in measuring and testing during research and development evaluations, Quality Assurance (QA) verification and productions testing; high potential (hipot) testers to test insulation; switcher analyzers, namely, supply and measurement Voltage/Current of DUT (device under test) for analyzing electrical currents; automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields, object function tests on electronic appliances, power supplies, chargers, motors, transformers, and production line monitoring; Inductance Capacitance Resistance (LCR) meters; electrical safety analyzers for use in electronic elements, namely, electronic monitors and monitor modules for monitoring electric current and electrical signals; programmable Video Pattern Generator (VPG), namely, transmitters and receivers for audio and video signals for transmission over twisted pair cables; front projector Automatic Test Systems (ATS) for use in identifying performance of front projectors by measuring the optical properties consisting of electrical testing hardware, namely, direct current sources, electronic loads, timing analyzers and inductance, capacitance, and resistance meters for use in research and development, evaluation, quality assurance, verification and productions testing; Liquid Crystal Module (LCM) performance testers; Recorded computer Firmware for testing equipment, namely, Electrical power source, AC Load, DC Load, Electrical power supplies and Power Meter; Downloadable computer application for testing equipment, namely, Electrical power source, AC Load, DC Load, Electrical power supplies and Power Meter
09 - Appareils et instruments scientifiques et électriques
Produits et services
Direct Current (DC) electronic load; power analyzers; frequency response analyzers; autotransformer test apparatus for use in large Direct Current (DC) current testing, and measuring heat effect and analyzing iron core characteristics in inductors for quality inspection and product feature analysis; passive component Automatic Tests System (ATS) consisting of hardware, namely, Direct Current (DC) sources, electronic loads, timing analyzers and Inductance Capacitance Resistance (LCR) meters for use in measuring and testing during research and development evaluations, Quality Assurance (QA) verification and productions testing; high potential (hipot) testers to test insulation; switcher analyzers, namely, supply and measurement Voltage/Current of DUT (device under test); automatic test apparatus for use in functional testing of power supplies and performing computer system administration in the nature of testing computer components used in research and development evaluation of measurement and test fields, object function tests on electronic appliances, power supplies, chargers, motors, transformers, and production line monitoring; Inductance Capacitance Resistance (LCR) meters; electrical safety analyzers for use in electronic elements; programmable Video Pattern Generator (VPG); front projector Automatic Test Systems (ATS) for use in identifying performance of front projectors by measuring the optical properties consisting of hardware, namely, direct current sources, electronic loads, timing analyzers and inductance, capacitance, and resistance meters for use in research and development, evaluation, quality assurance, verification and productions testing; Liquid Crystal Module (LCM) testers; Computer Firmware for testing equipment; Downloadable computer application for testing equipment.
89.
Locking mechanism for a press head and electronic device testing apparatus comprising the same
The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.
A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.
An electronic load apparatus is provided and adapted to allow an enhanced driving circuit to be disposed between a voltage-dividing circuit and power components to ensure the driving capability of the power components not coupled to a control circuit to thereby adjust a response voltage quickly, shorten a response time period and thus increase overall response speed, suppress transient voltage variation and thus preclude a signal delay otherwise arising from a load circuit, allow the power components series-connected in an electronic load apparatus to be driven quickly, reduce the risk of damaging the power components, and enhance the stability and reliability of the electronic load apparatus.
G05F 1/46 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
G01R 1/20 - Modifications des éléments électriques fondamentaux en vue de leur utilisation dans des appareils de mesures électriquesCombinaisons structurelles de ces éléments avec ces appareils
Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement
93.
Electronic load device and heat-dissipating load module
An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.
H01R 12/57 - Connexions fixes pour circuits imprimés rigides ou structures similaires caractérisées par les bornes bornes pour le montage en surface
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
H01L 23/40 - Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
Blood testing apparatus; medical instrument for monitoring blood properties and respiratory events; apparatus for use in medical analysis, namely, medical diagnostic instruments for the analysis of body fluids; testing apparatus for medical purposes, namely, immunochemical testing apparatus for medical use; apparatus for DNA and RNA testing for medical purposes; blood analyzer, namely, blood oxygen monitors; immunoassay devices for medical use, namely, apparatus used in implementing diagnosis tests designed to detect the abnormal prion protein; automated extraction instruments, namely, surgical instruments
The present invention discloses a method for controlling power supplies, each of M power supply has a first end and a second end, the first end of the ith power supply is connected to the second end of the (i−1)th power supply. The method comprises the following steps. A testing procedure is performed by each of the M power supplies for determining whether the first end and the second end are connected or not. A first connection status code is set when the testing procedure determines that the first end is connected, and the second end is not connected. A second connection status code is set when the testing procedure determines that the first end and the second end are both connected. A third connection status code is set when the testing procedure determines that the second end is connected, and the first end is not connected.
An automatic mounting and demounting device and system for a motor testing platform, adapted to enable a control host to control automatic mounting and demounting between an axle of a motor under test and an axle of a testing apparatus, includes a mobile platform and a positional information sensing member. The control host controls the mobile platform according to positional information generated by the positional information sensing member, such that a carrier for carrying the motor under test is automatically driven to a corresponding position to thereby effect alignment and connection or separation of the axle of the motor under test and the axle of the testing apparatus. Therefore, preparation for the motor dynamics testing is automatically carried out effectively and correctly, thereby reducing the time and manpower required for testing-related preparation.
The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.
Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.
Herein disclosed is a device for testing batteries as subjects and a method thereof. The battery testing device comprises a power supply module and a short-circuit sensing module. The power supply module is configured to provide a first testing voltage or a first testing current. The short-circuit sensing module, coupled with the power supply module, is configured to integrate the first testing voltage or current during a first testing period, thereby calculating a first output energy provided by the power supply module. The short-circuit sensing module also determines whether the first output energy exceeds a predetermined energy range; when the range is exceeded, the same module generates an error signal. Wherein the short-circuit sensing module generates an error count by calculating during a second testing period the number of times the short-circuit sensing module generates the error signal.
G01R 31/3842 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge combinant des mesures de tension et de courant
G01R 31/392 - Détermination du vieillissement ou de la dégradation de la batterie, p. ex. état de santé
G01R 31/52 - Test pour déceler la présence de courts-circuits, de fuites de courant ou de défauts à la terre
G01R 31/3828 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge utilisant l’intégration du courant
100.
Fixture assembly for testing surface emitting laser diodes and testing apparatus having the same
A fixture assembly for testing a surface emitting laser diode and a testing apparatus having the same are provided. The fixture assembly comprises a base, an upper cover and a latch mechanism. The base includes at least one pocket, and at least one electrical contact interface disposed in the pocket. The upper cover includes a body, an abutting block and a pressing member disposed in the body. The abutting block is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the base and the upper cover, and is configured to selectively connect or disconnect the base to or from the upper cover. When the latch mechanism is operated to connect the base to the upper cover, the pocket and an opening of the abutting block form into a through cavity through which the laser diode emits the laser beam.
H01S 5/183 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p. ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/024 - Dispositions pour la gestion thermique
