The present invention addresses: a first problem of providing a steel sheet laminate production method with which it is possible to produce a steel sheet laminate having excellent adhesive strength, in which the curing speed of an adhesive is sufficiently quick and the time necessary for completing adhesion and forming the steel sheet laminate is short, and which provides good workability; and a second problem of producing a steel sheet laminate having excellent adhesive strength. As a solution to the problems, provided is a steel sheet laminate production method that involves adhering steel sheets having applied thereto a primer containing a copper compound, by using a radically polymerizable adhesive composition containing (A) a radically polymerizable compound, (B) an organic peroxide, and (C) a phosphate ester compound having a radically polymerizable group. In the method, the amount of the phosphate ester compound (C) having a radically polymerizable group is not less than 0.055 parts by mass but less than 1 part by mass with respect to 100 parts by mass of the radically polymerizable compound (A).
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C09J 5/02 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un traitement préalable des surfaces à joindre
2.
METHOD FOR JOINING STEEL MATERIAL, JOINT MEMBER, AND JOINT STRUCTURE
[Problem] To propose a simple on-site construction method excellent in temporary fixing properties for joining steel materials using an adhesive. [Solution] Provided is a joining method that provides temporary fixation using a neodymium magnet when joining steel materials by adhering a steel material (B) to a steel material (A) using an adhesive.
The purpose of the present invention is to: (1) provide a composition for balance weights which includes a moisture-curable adhesive that is solid at ordinary temperature and a balance weight obtained from the composition; and/or (2) provide a composition for balance weights and a balance weight obtained from the composition, wherein the production and application of the composition for balance weights are easy to automate, the composition has a high solidification rate and is excellent in terms of rapid curing and rapid bonding, the composition, even when a balance measurement is made immediately after application thereof, can be inhibited from suffering sagging or positional shifting to make the next step possible, and the composition has excellent workability. This composition for balance weights: comprises (A) a moisture-curable adhesive which is solid at ordinary temperature and (B) a tungsten-based powder; is solid at ordinary temperature; and has a specific gravity less than 8.5.
The present invention addresses the problem of providing a moisture curable composition which is excellent in terms of transparency, adhesiveness, and weather resistance and/or a moisture curable composition which is capable of forming a cured product that is excellent in terms of transparency, adhesiveness, and weather resistance. The present invention provides, as a solution, a moisture curable composition which contains: a crosslinkable silyl group-containing polyoxyalkylene-based organic polymer (A) that has an average of 1.3 or more crosslinkable silyl groups in each molecule and a number average molecular weight of 20,000 or more; a crosslinkable silyl group-containing vinyl-based organic polymer (B); and silica (C).
C08L 71/00 - Compositions contenant des polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 33/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
[Problem] To easily adjust the application thickness of a structural adhesive. [Solution] Provided is a thickness adjustment method characterized by using a magnet as a spacer when adherends (A), at least one of which has the property of being attracted to the magnet, are bonded together using a structural adhesive.
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
B05D 7/14 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers à du métal, p. ex. à des carrosseries de voiture
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
The present invention addresses the problem of providing an adhesive composition which ensures low-temperature curability and has excellent adhesiveness to greasy surfaces. The adhesive composition comprises (A) a ligninsulfonic acid salt, (B) a toughness improver, (C) an epoxy resin, and (D) an epoxy resin hardener.
The present invention addresses the problem of providing a radical polymerizable adhesive that exhibits an excellent hot tensile shear adhesive strength and also an excellent tensile shear adhesive strength after heat treatment. Provided as the solution is a radical polymerizable adhesive comprising (A) a radical polymerizable compound, (B) an organic peroxide, (C) a phosphate ester compound having a radical polymerizable group, and (D) a non-radical polymerizable polymer having a molecular weight of at least 1,000. For this radical polymerizable adhesive, the hot tensile shear adhesive strength retention ratio Rais at least 13% and the retention ratio Rbfor the thermal aging resistance by the tensile shear adhesive strength is at least 50%. The hot tensile shear adhesive strength retention ratio Rais calculated using formula (i) where A in formula (i) is the tensile shear adhesive strength (N/mm2) for bonding at 23°C and B is the 150°C hot tensile shear adhesive strength (N/mm2). The retention ratio Rbfor the thermal aging resistance by the tensile shear adhesive strength is calculated using formula (ii) where A in formula (ii) is the tensile shear adhesive strength (N/mm2) for bonding at 23°C and C is the tensile shear adhesive strength (N/mm2) after heating at 200°C for 2 hours and then cooling to 23°C.
The present invention addresses the problem of providing a composition which has good storage stability and exhibits excellent adhesiveness even after an alkali hot water treatment without using an epoxy resin. As a means for solving the problem, the present invention provides a composition which contains (A) an organic polymer that has a crosslinkable silicon group, (B) a compound that has two or more crosslinkable silicon groups and a secondary amino group, and (C) a compound that has a glycidyl group and a crosslinkable silicon group.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08K 5/544 - Composés contenant du silicium contenant de l'azote
C08K 5/5435 - Composés contenant du silicium contenant de l'oxygène contenant de l'oxygène dans un cycle
The present invention addresses the problem of: providing a curable resin composition which can be cured at a low curing temperature and in a short time, the reaction conditions for curing of which are less restricted, the glass transition temperature of a cured product obtained by curing of which is high, and which makes it possible to obtain a cured product having excellent heat resistance; and providing a novel compound which has an ethynyl group, in which the ethynyl group exhibits high reactivity, which can be cured at a low curing temperature and in a short time, the reaction conditions for curing of which are less restricted, the glass transition temperature of a cured product obtained by curing of which is high, and which makes it possible to obtain a cured product having excellent heat resistance. The problem is solved by providing a curable composition comprising a compound which has an ethynyl group represented by formula (A1).
C08F 38/00 - Homopolymères ou copolymères de composés contenant une ou plusieurs liaisons triples carbone-carbone
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
C09J 149/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant une ou plusieurs liaisons triples carbone-carboneAdhésifs à base de dérivés de tels polymères
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
10.
METHOD FOR PRODUCING AUTOMOBILE STRUCTURAL BODY AND CURABLE COMPOSITION
Provided are a method of producing an automobile structure, which can suppress appearance failure of the automobile structure, and a curable composition that has enhanced thixotropy, an improved thread-forming property and excellent oily surface adhesion, and is suitably used in production of the automobile structure. The method of producing an automobile structure is a method of producing an automobile structure, including a step of applying a curable composition for production of an automobile structure to an adherend, the curable composition containing: (A) a liquid epoxy resin containing dispersed rubber particles; (B) a latent curing agent; (C) surface-treated fumed silica; (D) a block urethane resin; and (E) polyethylene powder, the curable composition having a ratio of a viscosity at a shear rate of 0.5/s to a viscosity at a shear rate of 1,000/s at 50° C. of 50 or more.
[Problem] The present invention addresses the problem of solving the problems in the prior art, that is, of providing a basket for a wind turbine that is partially joined by surface bonding and not joined solely by bolts between structural members, and a wind turbine using same. [Solution] A basket for a wind turbine according to the present invention is a basket constituting a wind turbine, the basket comprising a top plate made of a thin plate material, a bottom plate also made of a thin plate material, and a blade plate made of a thin plate material. In an upper joint section, the blade plate, which is arranged approximately perpendicular to the top plate, is both bolt-joined and adhesively bonded to the top plate via an angled material. In a lower joint section, the blade plate, which is arranged approximately perpendicular to the bottom plate, is both bolt-joined and adhesively bonded to the bottom plate via an angled material.
The present invention addresses the problem of providing an adhesive composition having excellent tensile lap-shear strength and T-peel strength, and being capable of maintaining adhesion performance even when lap length is increased, while having high adhesive strength at joints. As a solution, provided is an adhesive composition characterized in that the fracture energy per unit area is 0.035 J/mm2 or more in a tensile lap-shear adhesion test when the fracture region is an adhesive layer.
The objective of the present invention is to provide an acrylic adhesive composition having a polytetramethylene glycol-based urethane (meth)acrylate compound as an essential component, having low viscosity and excellent workability, and exhibiting high peel strength and shear strength. As a solution, the present invention provides an acrylic adhesive composition having, as essential components: (A) a polytetramethylene glycol-based urethane (meth)acrylate compound including a (meth)acrylate group on an end thereof and obtained by reacting (c) a terminal (meth)acrylating agent with a polytetramethylene glycol-based prepolymer obtained by reacting (a) a polyol compound and (b) a polyisocyanate compound with each other at a component (b)/component (a) molar ratio in a range of 0-0.5; (B) a polymerizable vinyl monomer; (C) an organic peroxide; and (D) a reducing agent.
The present invention addresses the problem of providing: (a) a (meth)acrylate group-containing polymer which is free from the risk of an increase in the viscosity of the polymer or the risk of solidification of the polymer even in cases where the molecular weight is increased or the amount of urethane bonds in the polymer skeleton is increased; and (b) a polytetramethylene glycol-based (meth)acrylate compound which has a (meth)acrylate group at an end, the polytetramethylene glycol-based (meth)acrylate compound which has a (meth)acrylate group at an end being obtained by reacting at least (a) a polyol compound, (b) a chain extender, and (c) a (meth)acrylate terminating agent, wherein the polyol compound (a) comprises a polytetramethylene glycol, the (meth)acrylate terminating agent (c) comprises a (meth)acrylate compound having a functional group that is capable of reacting with a functional group in the chain extender or a (meth)acrylate compound having a functional group that is capable of reacting with a hydroxyl group, and the viscosity at 25°C is 10 Pa∙S to 300 Pa∙S inclusive. The present invention provides, as a solution for the problem, a polytetramethylene glycol-based (meth)acrylate compound which has a (meth)acrylate group at an end, the polytetramethylene glycol-based (meth)acrylate compound which has a (meth)acrylate group at an end being obtained by reacting at least (a) a polyol compound, (b) a chain extender, and (c) a (meth)acrylate terminating agent, wherein the polyol compound (a) comprises a polytetramethylene glycol, the (meth)acrylate terminating agent (c) comprises a (meth)acrylate compound having a functional group that is capable of reacting with a functional group in the chain extender or a (meth)acrylate compound having a functional group that is capable of reacting with a hydroxyl group, and the viscosity at 25°C is 10 Pa∙S to 300 Pa∙S inclusive.
C08G 18/10 - Procédés mettant en œuvre un prépolymère impliquant la réaction d'isocyanates ou d'isothiocyanates avec des composés contenant des hydrogènes actifs, dans une première étape réactionnelle
C08G 18/81 - Isocyanates ou isothiocyanates non saturés
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Adhesives for tiles; adhesives for interior tiles; adhesives for exterior tiles; adhesives for floor, ceiling, and wall tiles; adhesives for ceramic tiles
An object of the present invention is to provide an acrylic adhesive having excellent high-temperature adhesive strength and excellent cured product elongation. Accordingly, provided is a two-part acrylic adhesive composition including, as essential components, (A) a urethane (meth)acrylate having a backbone including a low-crystallinity polytetramethylene glycol, (B) a polymerizable vinyl monomer, (C) an organic peroxide, and (D) a reducing agent.
C09J 139/04 - Homopolymères ou copolymères de monomères contenant des hétérocycles possédant de l'azote dans le cycle
C09J 4/06 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.
Provided is a method for producing an automobile structural body, by which it is possible to suppress appearance defects in the automobile structural body. Also provided is a curable composition which is suitably used in the production of automobile structural bodies, has improved thixotropy, ameliorated stringiness, and is excellent in oil surface adhesion. Provided is a method for producing an automobile structure body, the method comprising a step for coating, on an adherend, a curable composition for automobile structural bodies, that contains (A) a liquid epoxy resin having rubber particles dispersed therein, (B) a latent curing agent, (C) surface-treated fumed silica, (D) a block urethane resin, and (E) polyethylene powder, wherein the ratio of the viscosity of the curable composition at 50°C at a shear velocity of 0.5/sec. with respect to the viscosity at a shear velocity of 1000/sec. is 50 or more.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
The purpose of the present invention is to provide an acrylic adhesive which has excellent adhesion strength at high temperatures and gives cured objects having excellent elongation. The provided acrylic adhesive is a two-pack mixing type acrylic adhesive composition which comprises (A) a urethane (meth)acrylate including a lowly crystalline poly(tetramethylene glycol) as a backbone skeleton, (B) a polymerizable vinyl monomer, (C) an organic peroxide, and (D) a reducing agent as essential components.
3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes uniquement des atomes de carbone aliphatiques
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
The present invention addresses the problem of obtaining an adhesive that has excellent adhesion strength (storage elasticity) after curing, that has an excellent elongation rate after curing, and that does not readily peel due to heat history. As solution (1), there is provided (1) a two-component adhesive having agent A containing an epoxy resin and agent B containing an epoxy resin curing agent and a polymer having a crosslinkable silicon group, core-shell-type rubber particles being contained in agent A and/or agent B, and a condensation catalyst for the crosslinkable silicon group being contained in agent A and/or agent B. As solution (2), there is provided (2) an adhesive that contains an epoxy resin, core-shell-type rubber particles, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst of the crosslinkable silicon group, and in which an adhesive cured product after being cured by heating for 30 minutes at 80°C and then aged for 7 days in a 23°C, 50% RH environment, has a rupture strength (tensile strength at break) of 5 MPa or above and elongation at rupture (elongation at break) of 30% or above when measured according to JIS K 6251, and the storage elasticity in tension mode, 1Hz, measured according to JIS K 7198 (abolished and replaced with JIS K 7244-4) after being cured by heating for 30 minutes at 80°C and then aged for 7 days in a 23°C, 50% RH environment is 100-1000 MPa at 20°C and 50-1000 MPa at 80°C.
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
Provided is a moisture-curable hot-melt adhesive capable of combining satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane prepolymer (A) which is represented by general formula (a). general formula (a) In (a): Y represents a residue in which –O–C(=O) –NH–A–NCO has been removed from an isocyanate group terminal urethane prepolymer (a1), which is a reactant between a polyisocyanate (i) and a polyol (ii); A represents a residue after two isocyanate groups have been removed from a divalent diisocyanate; W represents a residue in which an active hydrogen group has been removed from a compound (a2), which includes an alkoxysilyl group and an active hydrogen group; X represents O, S or NR1; and R1 is a linear or branched monovalent hydrocarbon group having a hydrogen atom or 1-20 carbon atoms.
C09J 175/06 - Polyuréthanes à partir de polyesters
C09J 175/08 - Polyuréthanes à partir de polyéthers
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
Provided is a moisture-curable hot-melt adhesive capable of combining a satisfactory initial bonding strength with a sufficiently long working time. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane prepolymer (A) which is represented by general formula (a). general formula (a) In (a): A represents a residue after two isocyanate groups have been removed from a divalent diisocyanate; Y represents a residue in which –O–C(=O) –NH–A–NCO has been removed from an isocyanate group terminal urethane prepolymer (a1), which is a reactant between a polyisocyanate (i) and a polyol (ii); n represents a value of 1 to 3; X represents S or NR1; and W represents a residue in which an active hydrogen group of a compound (a2), which includes an alkoxysilyl group and an active hydrogen group, has been removed.
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
B62D 65/02 - Assemblage de sous-ensembles ou de composants avec la caisse ou entre eux, ou positionnement de sous-ensembles ou de composants par rapport à la caisse ou à d'autres sous-ensembles ou d'autres composants
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08L 33/06 - Homopolymères ou copolymères des esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'oxygène, faisant uniquement partie du radical carboxyle
The present invention provides a primer composition which has excellent barrier properties, while exhibiting excellent jointing properties if applied to a previously placed sealing material. This primer composition contains (A) a film forming component which contains at least one compound that is selected from the group consisting of polyisocyanate compounds having three or more isocyanate groups, polyesters, polyester polyurethanes, epoxy compounds and chlorinated polymers, and (B) an alkoxysilyl group-containing methyl methacrylate polymer which has a weight average molecular weight of less than 15,000.
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08K 5/544 - Composés contenant du silicium contenant de l'azote
C08L 43/04 - Homopolymères ou copolymères de monomères contenant du silicium
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C09D 133/10 - Homopolymères ou copolymères d'esters de l'acide méthacrylique
C09D 143/04 - Homopolymères ou copolymères de monomères contenant du silicium
Provided is a moisture-curable hot-melt adhesive capable of combining satisfactory initial bonding strength with a satisfactorily long pot-life. The moisture-curable hot-melt adhesive includes an alkoxysilyl-group-containing urethane prepolymer (A) which is a product of reaction between the following ingredients (a-1) and (a-2). Ingredient (a-1): a hydroxyl-group-terminated urethane prepolymer which is a product of reaction between the following ingredients (i) and (ii) Ingredient (i): an isocyanate-group-terminated urethane prepolymer having a polyether skeleton Ingredient (ii): a polyol including a crystalline aliphatic polyester polyol (ii-1) Ingredient (a-2): an isocyanatosilane
The present invention provides a primer composition which does not easily permeate into a porous building material if applied to the porous building material, and which is capable of exhibiting high film forming performance, while having strong film strength after the application. This primer composition enables good bonding of a sealing material to a porous building material, while exhibiting excellent jointing ability in cases where this primer composition is applied to a previously placed sealing material. A primer composition according to the present invention contains (A) a methyl methacrylate polymer which has a weight average molecular weight of 60,000 or more, and in which the ratio of methyl methacrylate contained in the resin is 80% by weight or more, and (B) an alkoxysilyl group-containing methyl methacrylate polymer in which the ratio of methyl methacrylate contained in the resin is less than 80% by weight.
C09D 133/12 - Homopolymères ou copolymères du méthacrylate de méthyle
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09D 7/63 - Adjuvants non macromoléculaires organiques
C09D 143/04 - Homopolymères ou copolymères de monomères contenant du silicium
C09D 163/00 - Compositions de revêtement à base de résines époxyCompositions de revêtement à base de dérivés des résines époxy
Provided are an adhesion method and an adhesive agent, which are capable of ensuring transportability in a short period of time and a low elastic modulus immediately after being heat-cured, and which are capable of reducing thermal distortion. This adhesion method is for attaching an adherend and another adherend different from said adherend together by using an adhesive agent containing a polyoxyalkylene polymer having a crosslinkable silicon group, a (meth)acrylic polymer having a crosslinkable silicon group, and an epoxy resin, the method comprising: an application step for applying the adhesive agent on the adherend and/or the other adherend; an attachment step for attaching the adherend to the other adherend via the adhesive agent to form a structural body; and a heating step for heating the structural body to cure the adhesive agent. When the structural body is matured at room temperature after the heating step, the storage modulus of the adhesive agent increases as maturation time passes.
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
Provided are: a building having a wall structure employing precast reinforced concrete walls, the building employing a sealing material which is not a silicone sealing material, is excellent in terms of elongation property and restoring property, has excellent adhesiveness to concretes, and does not soil concretes; and a method for producing the wall structure. In the building having a wall structure and the production method, the wall structure employs precast reinforced concrete walls and a sealing material used in the joints between the walls. The sealing material is a one-pack type sealing material comprising (A) an oxyalkylene-based polymer having crosslinkable silicon groups, (B) an alkoxysilane compound which reacts with water to yield an amine compound having an alkoxysilyl group, (C) a compound of tetravalent tin, and (D) a (meth)acrylic ester polymer plasticizer.
Provided are a method for forming a flame-resistant structure formed using a non-flammable material (or flame-retardant material) and a single-component, ambient-temperature-and-humidity-curable reactive hot melt that cures (hardens) immediately after being applied and is subsequently cured by water in the air, and has heat resistance and flame resistance; and a flame-resistant, single-component, ambient-temperature-and-humidity-curable reactive hot melt composition having sufficient pot life. The formation method is a method for forming a flame-resistant structure by using a flame-resistant, single-component, ambient-temperature-and-humidity-curable reactive hot melt composition to form a flame-resistant structure, wherein the single-component, ambient-temperature-and-humidity-curable reactive hot melt composition retains the shape thereof at less than 80°C after humidity curing, the humidity-cured single-component, ambient-temperature-and-humidity-curable reactive hot melt composition is used at a temperature of 50°C or higher, and the single-component, ambient-temperature-and-humidity-curable reactive hot melt composition is brought to a temperature of 180°C or higher to effect a heat-curing reaction, an insulating-layer-forming reaction, and a flame-retarding reaction in the single-component, ambient-temperature-and-humidity-curable reactive hot melt composition to form a flame-resistant structure.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08K 5/544 - Composés contenant du silicium contenant de l'azote
C08L 33/04 - Homopolymères ou copolymères des esters
E04B 1/682 - Étanchéités des joints, p. ex. des joints d'expansion formés sur place
E04B 1/94 - Protection contre d'autres agents indésirables ou dangers contre le feu
Provided is a novel curable composition that is a two-pack type curable composition that includes an epoxy resin and a crosslinkable silicon group-containing organic polymer, excels in storage stability, and does not experience curing delays, an increase in viscosity of the base material, or the deterioration of the base material such as gelation or the deposition of insoluble material. Also provided is a novel curable composition that excels in storage stability even when water is added to improve deep portion curability. A two-pack type epoxy composition according to the present invention contains: a base material that includes (A) an epoxy resin, (B) a compound having an Si—F bond, and (C) an alkoxysilane not having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a mercapto group; and a curing agent that includes (D) a crosslinkable silicon group-containing organic polymer, and (E) a tertiary amine compound.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 65/336 - Polymères modifiés par post-traitement chimique avec des composés organiques contenant du silicium
B01J 21/06 - Silicium, titane, zirconium ou hafniumLeurs oxydes ou hydroxydes
C08G 65/337 - Polymères modifiés par post-traitement chimique avec des composés organiques contenant d'autres éléments
C08G 77/38 - Polysiloxanes modifiés par post-traitement chimique
C08G 77/385 - Polysiloxanes modifiés par post-traitement chimique contenant des atomes autres que le carbone, l'hydrogène, l'oxygène ou le silicium contenant des halogènes
The purpose of the present invention is to provide a mounting body that can ensure a reliable electrical connection between an element and conductive members electrically connected to the element, even when an external force to bend a substrate is applied, The present invention is provided with: an insulation substrate 10; an element 20 mounted on the insulation substrate 10 via conductive members 30; and covering parts 40 which cover at least a portion of side surfaces of the conductive members 30 and a side surface of the element 20, that is, at least a portion of the boundaries between the conductive members 30 and the element 20, which is provided in contact with an outer surface 10a of the insulation substrate 10, and which has an elastic modulus of 0.1 MPa to 500 MPa inclusive.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
The present invention provides: a wiring board which has a cured product of a conductive curable composition that is capable of ensuring electric conduction even in the case where a laminated substrate, regardless of the type thereof, gets deformed when a through-hole formed in the substrate is filled up; a wiring board manufacturing method; and a conductive curable composition. A wiring board 1 is provided with: a substrate 10; a first conductive part 20 provided to one surface of the substrate 10; a second conductive part 22 provided to the other surface of the substrate 10, and a connection part 30 which establishes electrical connection between the first conductive part 20 and the second conductive part 22 via a through-hole 15. The connection part 30 comprises (A) an elastomer component having a storage elastic modulus falling within a range of 0.1-100 MPa at 23°C when measured by dynamic viscoelastic measurement at 1 Hz, and (B) a conductive filler. The conductive filler (B) contains, in an amount of 50-85 mass% of the total content, a cured product of a conductive curable composition.
A photocurable adhesive composition containing a urethane oligomer having a specific group at the terminal is provided in which photopolymerization proceeds rapidly even in the presence of oxygen in the air, etc., and for which prolonged optical radiation and oxygen blocking equipment are unnecessary; a bonding method is also provided. This photocurable adhesive composition contains (A) a urethane oligomer having at the terminal a 3-(meth)acryloyloxy-2-hydroxypropyl group linked over a urethane bond represented by general formula (1), and (C) a photoinitiator. (In general formula (1), R1is ahydrogen atom or a methyl group.)
C09J 175/14 - Polyuréthanes comportant des liaisons non saturées carbone-carbone
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
A bonding method is provided in which, when bonding multiple adherends using a photocurable adhesive composition containing a prescribed monoacrylate, photopolymerization proceeds rapidly even in the presence of oxygen, and prolonged optical radiation and oxygen blocking equipment are unnecessary; a photocurable adhesive composition is also provided. This bonding method for bonding multiple adherends involves: a coating step in which at least one adherend is coated with a photocurable adhesive composition which exhibits adhesion when irradiated with light and which contains (A) a monoacrylate represented by general formula (1) or general formula (2), (B) a radical polymerizable oligomer, and (C) a photoinitiator; an optical radiation step for irradiating the photocurable adhesive composition coated on one of the adherends in the presence of oxygen with light emitted from an LED; and a step for bonding an other adherend (the other adherend cannot be a protective sheet on the adhesive surface) onto the photocurable adhesive composition coated onto the one adherend and irradiated with light. (In general formula (1) and general formula (2), R1indicates -H or33, and R2m2mnnR3m2mnnR3group, m is an integer from 2 to 4, and n is an integer from 1 to 30, and R3 is H- or an unsubstituted or substituted alkyl group.)
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition contains a shape retention agent, while exhibiting fluidity when coated; and if a cured product that is obtained by curing this curable composition is fired in the air at 600°C for 30 minutes, the cured product after firing has shape retainability.
C08G 59/08 - Polycondensats contenant plusieurs groupes époxyde par molécule de composés polyhydroxylés avec l'épihalohydrine ou ses précurseurs de polyphénols à partir de condensats de phénolaldéhyde
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
E04B 1/94 - Protection contre d'autres agents indésirables ou dangers contre le feu
Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
41.
LOW-TEMPERATURE HEAT-CURABLE ADHESIVE COMPOSITION FOR STRUCTURE
Provided are: a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects caused by open-state standing, and is excellent in terms of rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures comprises (A) an epoxy resin, (B) a microencapsulated hardener, (C) a moisture absorbent, (D) a viscosity modifier, and (E) a stabilizer. The moisture absorbent (C) is calcium oxide, which preferably comprises both a surface-treated grade and a non-surface-treated grade.
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
B62D 65/00 - Tracé, fabrication, p. ex. assemblage, mesures pour faciliter le désassemblage, ou modification de la structure des véhicules à moteurs ou des remorques, non prévus ailleurs
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
An attachment which, attached to an attached body, has sufficient strength to suspend an article, and a detachment method which allows easy detachment of the attachment from the attached body without the use of tools are provided. An attached body 40 comprises an attachment surface where the attachment 1 is attached. At least part of one surface of the attachment 1 and the attachment surface are attached through an adhesive member 30. Setting the center of gravity of the adhesive member 30 as the fulcrum point and at least part of the attachment 1 as the force point, by swaying or rotating the force point around the fulcrum point, the force from the swaying or rotating acts on at least part of the outer periphery of the adhesive member 30, detaching the attachment 1 from the attached body 40.
Provided is a one-part water-based adhesive composition which suffers no yellowing and is excellent in adhesiveness and durability. The one-part water-based adhesive composition includes (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100° C.
14 is an alkyl group, and b is 0 or 1.)
Provided is a pressure-sensitive adhesive which comprises silicone release paper and a pressure-sensitive adhesive layer of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average molecular weight of 3,000 or higher and having a crosslinkable silicon-containing group, (B) a tackifier resin, (C) a silicon compound having an Si-F bond, and (D) a photobase generator, the pressure-sensitive adhesive layer having excellent separability from the silicone release paper. The pressure-sensitive adhesive comprises silicone release paper and, superposed thereon, a pressure-sensitive adhesive layer constituted of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average molecular weight of 3,000 or higher and having a crosslinkable silicon-containing group, (B) a tackifier resin, (C) a silicon compound having an Si-F bond, (D) a photobase generator, and (E) a compound having a number-average molecular weight less than 3,000 and having a hydrolyzable silicon-containing group.
C09J 183/00 - Adhésifs à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carboneAdhésifs à base de dérivés de tels polymères
Provided are: a curable composition which contains an organic polymer that enables the progression of an adequate curing reaction by considerably suppressing polymerization inhibition by oxygen even if used in air, while being capable of ensuring a degree of freedom of design of the composition; and a product. This curable composition contains (A) an organic polymer that has a group represented by general formula (1), and at least one initiator selected from the group consisting of (B1) a photoinitiator and (B2) a thermal initiator. (In general formula (1), R1 represents -H or -CH3; and X represents a linking group, which is a substituted or unsubstituted alkylene group, a substituted or unsubstituted arylene group, a polar linking group (a (thio)ether linking group, an -O-CO- linking group, an -O-CO-NH- linking group, an -NR2- linking group (wherein R2 represents a hydrogen group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a heterocyclic structure-containing group or a group having a plurality of rings)), or a direct bond.)
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
Provided are: a curable composition which is able to undergo an adequate polymerization reaction by considerably suppressing polymerization inhibition by oxygen even if used in air, while being capable of ensuring a degree of freedom of design of the composition; and a product. This curable composition contains (A) a monoacrylate compound that is represented by general formula (1), general formula (2) or general formula (3) and at least one initiator selected from the group consisting of (B1) a photoinitiator, (B2) a thermal initiator and (B3) a redox initiator. (In general formula (1), general formula (2) and general formula (3), R1 represents -H or -CH3. In general formula (1), R2 represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a heterocyclic ring structure-containing group, a group having a plurality of rings or -(CmH2mO)nR5 (wherein m represents an integer of 2-4, n represents an integer of 1-30, and R5 represents -H, a substituted or unsubstituted alkyl group or a substituted or unsubstituted phenyl group). In general formula (2), each of R3 and R4 represents -H, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a heterocyclic ring structure-containing group, -(CmH2mO)nR5 (wherein m represents an integer of 2-4, n represents an integer of 1-30, and R5 represents -H, a substituted or unsubstituted alkyl group or a substituted or unsubstituted phenyl group), or a group having a plurality of rings; or alternatively, R3 and R4 may combine with each other and form a cyclic structure or a heterocyclic structure together with carbon atoms to which R3 and R4 are bonded. In general formula (3), each of R' and R'' represents an organic group or a hydrogen atom.)
Provided are: a structure adhesive composition which changes color when heat-cured; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition which changes color when heat-cured and contains (A) an epoxy resin, (B) an epoxy resin latent curing agent, and (C) a monoazo pigment, wherein the proportion of the monoazo pigment incorporated into the structure adhesive composition constitutes 0.01-10 mass%. It is preferable for the structure adhesive composition to also contain (D) a curing accelerator.
Provided are: a structure adhesive composition which exhibits favorable thread breakage and improved shower resistance, and prevents stringiness when stitch-coating; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition which does not contain a liquid rubber component, and does contain (A) an epoxy resin in which rubber particles are dispersed as primary particles, and (B) an epoxy resin latent curing agent, wherein the proportion which the rubber particles constitute in the structure adhesive composition is 10-45 mass%, and the viscosity of the structure adhesive composition at 50°C is 190-380 (Pa·s) at a shearing velocity of 5 (sec-1) and 1-30 (Pa·s) at a shearing velocity of 200 (sec-1).
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
B65D 65/00 - Enveloppes ou emballages souplesMatériaux d'emballage de forme ou de type particulier
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
Provided is a novel curable composition which is a two-pack type curable composition using an epoxy resin and an organic polymer having a crosslinkable silicon group, and which is free from curing delay or free from viscosity increase of the base material and deterioration of the base material such as gelation or precipitation of insoluble material, thereby exhibiting excellent storage stability. Also provided is a novel curable composition which exhibits excellent storage stability even if water is added thereto for the purpose of improving curability in a deep portion. A two-pack type epoxy resin composition according to the present invention is configured such that: the base material contains (A) an epoxy resin, (B) a compound having an Si-F bond and (C) an alkoxysilane that does not have at least one group selected from the group consisting of a primary amino group, a secondary amino group and a mercapto group; and a curing agent contains (D) an organic polymer having a crosslinkable silicon group and (E) a tertiary amine compound.
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
The purpose of the present invention is to provide: an electrically conductive composition having high elasticity, and having high durability under repeated expansion and contraction; and a conductive circuit and an element mounting method in which said electrically conductive composition is used. This electrically conductive composition contains (A) an elastomer component for which the storage elastic modulus at 23°C in a dynamic viscoelasticity measurement at 1 Hz is within the range of 1-100 MPa, (B) silver nanowires having an aspect ratio of 20-10,000, and (C) an electrically conductive material having a 50% average grain diameter of 0.1 µm or greater.
C08L 21/00 - Compositions contenant des caoutchoucs non spécifiés
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
51.
FIRE PREVENTION STRUCTURE FOR STRUCTURES, CURABLE COMPOSITION, REFRACTORY MATERIAL, AND METHOD FOR FORMING FIRE PREVENTION STRUCTURES
Provided are a fire prevention structure for structures that uses a cured product that is suitably fluid before curing and that exhibits excellent fire resistance after curing, a curable composition, refractory material, and a method for forming fire prevention structures. A fire prevention structure for structures comprises a structure, and a curable composition cured product that is provided on at least a portion of the surface of the structure. The curable composition is fluid at normal temperature, and the cured product, in compliance with JIS K6253-3, has a durometer type A hardness of 40 or greater, and when combusted in air for 20 minutes in an atmosphere of 400°C, the volume of the cured product after combustion is twenty times or greater than the volume of the cured product before combustion and the cured product after combustion retains shape.
C08L 33/06 - Homopolymères ou copolymères des esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'oxygène, faisant uniquement partie du radical carboxyle
E04B 1/94 - Protection contre d'autres agents indésirables ou dangers contre le feu
Provided are: a photocurable composition which has excellent storage stability and which rapidly cures when used for bonding opaque materials, etc.; and a product. The photocurable composition comprises (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of the following general formulae (1), (2), and (3), and (C) a sensitizer. In general formulae (1), (2), and (3), R1 to R3 are each independently a substituent comprising at least one group selected from the group consisting of a nitro, cyano, hydroxy, acetyl, carbonyl, (un)substituted allyl, (un)substituted alkyl, (un)substituted alkoxy, (un)substituted aryl, and (un)substituted aryloxy groups, a group containing a heteroring structure, and a group comprising two or more rings. At least two groups selected from the group consisting of R1 to R3 may have been bonded to each other to form a cyclic structure in cooperation with the carbon atom(s) to which those groups have been bonded.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 11/06 - Additifs non macromoléculaires organiques
Provided are: a photocurable adhesive which is able to be applied to objects to be bonded having various shapes, while having excellent surface curability and quickly exhibiting adhesiveness after light irradiation; a product which contains this adhesive; a bonding method; and a method for producing this product. This photocurable adhesive contains: (A) a monoacrylate which is represented by general formula (1) and suppresses oxygen inhibition; an organic compound which is selected from the group consisting of (B1) monofunctional (meth)acrylates and (B2) liquid organic polymers; and (C) a photoinitiator. (In general formula (1), R1 represents a hydrogen atom or a methyl group; and each of R2 to R6 independently represents a hydrogen atom or a substituent.)
C09J 4/06 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09J 11/06 - Additifs non macromoléculaires organiques
Provided is a method for treating a surface of a molded resin object or molded rubber object, the method necessitating no installation of large equipment, not requiring much labor for the surface treatment, being capable of attaining energy saving, and being easy to use in combination with other steps. The method for treating a surface of a molded resin object or molded rubber object comprises an irradiation step in which the molded resin object or molded rubber object is irradiated with deep ultraviolet light from a light-emitting diode that emits deep ultraviolet light.
C08J 7/00 - Traitement chimique ou revêtement d'objets façonnés faits de substances macromoléculaires
C09J 5/02 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un traitement préalable des surfaces à joindre
56.
ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, ELECTRICALLY CONDUCTIVE STRUCTURE, AND ELECTRONIC PART
Provided are: an electrically conductive adhesive agent which does not undergo the deterioration in electric conductivity and the fluctuations in resistivity; an electrically conductive structure; and an electronic part. The electrically conductive adhesive agent comprises (A) an organic polymer having a crosslinkable silicon group, (B) an electrically conductive filler and (C) a reducing agent.
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes uniquement des atomes de carbone aliphatiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 4/06 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09J 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C09J 183/12 - Copolymères séquencés ou greffés contenant des séquences de polysiloxanes contenant des séquences de polyéthers
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08G 63/00 - Composés macromoléculaires obtenus par des réactions créant une liaison ester carboxylique dans la chaîne principale de la macromolécule
C08G 18/28 - Polymérisats d'isocyanates ou d'isothiocyanates avec des composés contenant des hydrogènes actifs caractérisés par l'emploi de composés spécifiés contenant un hydrogène actif
C08G 65/336 - Polymères modifiés par post-traitement chimique avec des composés organiques contenant du silicium
C08L 43/04 - Homopolymères ou copolymères de monomères contenant du silicium
C08L 75/00 - Compositions contenant des polyurées ou des polyuréthanesCompositions contenant des dérivés de tels polymères
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08G 77/26 - Polysiloxanes contenant du silicium lié à des groupes organiques contenant des atomes autres que le carbone, l'hydrogène et l'oxygène groupes contenant de l'azote
C08G 77/46 - Polymères séquencés ou greffés contenant des segments de polysiloxanes contenant des segments de polyéthers
Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pressure-sensitive adhesive layer, wherein the curing of the curable composition cannot proceed even by heating the curable composition in the production of the pressure-sensitive adhesive, in other words, the curable composition can exhibit excellent stability during the heating and the crosslinking reaction of the curable composition can proceed by some sort of trigger. In the pressure-sensitive adhesive, a cured product of a curable composition comprising (A) an organic polymer having a crosslinkable silicon group, (B) an adhesiveness-imparting resin, (C) a silicon compound having an Si-F bond and (D) a photo base generator is provided as a pressure-sensitive adhesive layer.
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 7/00 - Adhésifs sous forme de films ou de pellicules
C09J 11/06 - Additifs non macromoléculaires organiques
Provided is a one-pack type water-based adhesive composition which suffers no yellowing and is excellent in terms of adhesiveness and durability. The one-pack type water-based adhesive composition comprises (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following formula (2), the amount of the epoxysilane compound being in the range of 1.5-10 mol per mol of the aminosilane compound, at a reaction temperature of 40-100ºC. (In formula (2), R7 to R12 are each a hydrogen atom or an alkyl group, R13 is a monovalent hydrocarbon group, R14 is an alkyl group, and b is 0 or 1.)
To provide a curable composition which contains a radically polymerizable unsaturated compound, a coupling agent and a condensation reaction promoting catalyst, and which produces a cured product having improved adhesion to a base. A curable composition which is characterized by containing (A) a polymer having a (meth)acryloyl group, (B) a silane coupling agent having a (meth)acryloyl group, (C) (C1) a silicon compound having an Si-F bond and/or (C2) one or more fluorine-based compounds selected from the group consisting of boron trifluoride, complexes of boron trifluoride, fluorinating agents and alkali metal salts of polyvalent fluoro compounds, and (D) a radical initiator.
C08F 290/02 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux sur des polymères modifiés par introduction de groupes non saturés terminaux
C08L 23/26 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
61.
ELECTROCONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Provided are an electroconductive structure with which it is possible to ensure a degree of freedom of shape design and to maintain a desired flexibility even under repeated use. Also provided is a method for manufacturing said structure. An electroconductive structure having recovering properties is obtained by curing in a prescribed shape an electroconductive composition containing a polymerizable oligomer, an electroconductive filler, and an initiator for starting a polymerization reaction of the polymerizable oligomer.
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 292/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des substances inorganiques
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
62.
JOINING STRUCTURE USED IN VISCOUS-LIQUID DISCHARGE DEVICE, AND VISCOUS-LIQUID DISCHARGE DEVICE USING SAME
Provided are: a joining structure which is used in a viscous-liquid discharge device, is capable of improving sealing-attachment-structure following properties of a joining part for joining a liquid feed pipe means and a long flow path member, and is capable of completely inhibiting air infiltration into a joined section; and a viscous-liquid discharge device using said joining structure. The joining structure is used in a viscous-liquid discharge device in which only a plastic container can be exchanged after a discharge operation of the viscous liquid. In the joining structure, a sealing attachment means is provided with a flexible cylindrical insertion part. The flexible cylindrical insertion part is inserted into an inner through hole of the long flow path member from the upper end, and as a result the flexible cylindrical insertion part engages with the long flow path member.
A long flow path member, a plastic container, and a viscous-liquid discharge device are provided, with which sealing-attachment-structure following properties of a joining part for joining a liquid feed pipe means and the long flow path member can be improved, and air infiltration into a joined section can be completely inhibited. The long flow path member is used in a viscous-liquid discharge device configured such that a viscous liquid inside a plastic container is discharged from the long flow path member by pressurization, and only the plastic container can be exchanged after a discharge operation of the viscous liquid. The long flow path member is configured so as to be provided with: a long flow path part which is integrally attached to an upper-end attachment part so as to extend inside a main body of the plastic container, forms a flow path for the viscous liquid when the viscous liquid is pressurized and discharged, and forms the flow path from at least the side surface; and a discontinuous flow path part which is formed in at least one section of the outer periphery of the long flow path part, and which is capable of bending.
Provided is a dual-curing photocurable composition that utilizes moisture curing and photocuring, wherein said composition: allows sufficient work time to be taken during which curing does not proceed before being irradiated with light; generates a cured product having excellent temporary fixing properties immediately after being irradiated with light; ensures sufficient time for bonding after being irradiated with light, while completely curing comparatively quickly; and does not produce a corrosive acid. The photocurable composition contains: (A) an organic polymer containing a crosslinking silicon group; (B) a photobase generator; (C1) a silicon compound having an Si-F bond; (C2) a fluorine-based compound comprising at least one compound selected from the group consisting of boron trifluoride, a boron trifluoride complex, a fluorinating agent, and an alkali metal salt of a polyvalent fluoro compound; and (D) a polyfunctional compound having more than one (meth)acryloyl group in a molecule.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 183/12 - Copolymères séquencés ou greffés contenant des séquences de polysiloxanes contenant des séquences de polyéthers
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
Provided is a photocurable composition containing: (A) a crosslinkable silicon group-containing organic polymer; (B) a photobase generator; (C1) a silicon compound having an Si-F bond, and/or (C2) one or more fluorine-based compound(s) selected from the group consisting of boron trifluoride, a complex of boron trifluoride, a fluorinating agent, and an alkali metal salt of a polyvalent fluoro compound; and (D) a compound having one photo radical polymerizable vinyl group.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 291/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des composés macromoléculaires prévus par plus d'un des groupes
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09D 201/10 - Compositions de revêtement à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
66.
PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES
Provided is a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equal to those when aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one kind of animo group selected from the group consisting of a primary amino group and a secondary amino group. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one kind selected from the group consisting of a crosslinkable silicon group-containing polyoxyalkylene polymer and a crosslinkable silicon group-containing (meth)acrylic polymer.
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
16 - Papier, carton et produits en ces matières
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
Produits et services
chemicals for industrial purposes; industrial adhesives; priming putty; cements for fixing floor and ceiling tiles. primers; paints; anti-rust preparations; anti-rust greases. pastes and other adhesives for stationery or household purposes; stationery; printed matter. Adhesive tapes other than stationery and not for medical or household purposes; seals; caulking materials; caulking putty; insulating refractory materials; synthetic resin joint sealing materials (building materials). Asphalt joint sealing materials; building materials of plastics material; synthetic building materials; asphalt; pitch and bitumen; asphalt for building purposes; rubber building or construction materials; plaster for use in building; limestone building materials; cement for building; cement mixes; cement slabs.
Provided is a rapid-curing photocurable composition having excellent processability and being capable of photocuring in a short period of time even with low cumulative luminous energy. The composition contains (A) a cross-linking silicon group-containing organic polymer, (B) a photobase-generating agent, and (C1) a silicon compound having a Si-F bond and/or (C2) one or more fluoride compounds selected from the group consisting of boron trifluoride, a boron trifluoride complex, and an alkali metal salt of a fluorinating agent and a multivalent fluoro compound. The (B) photobase-generating agent is preferably a photolatent tertiary amine.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C09D 183/00 - Compositions de revêtement à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carboneCompositions de revêtement à base de dérivés de tels polymères
C09J 183/00 - Adhésifs à base de composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carboneAdhésifs à base de dérivés de tels polymères
69.
PRODUCTION METHOD FOR ELECTRICALLY CONDUCTIVE CURED ARTICLE, ELECTRICALLY CONDUCTIVE CURED ARTICLE, CURING METHOD FOR PULSED LIGHT CURING COMPOSITION, AND PULSED LIGHT CURING COMPOSITION
Provided are a production method for an electrically conductive cured article, an electrically conductive cured article, a curing method for a pulsed light curing composition, and a pulsed pulsed light curing composition, with which rapid curing can be achieved, and which are useable with substrates that are susceptible to heat. This electrically conductive cured article is formed by irradiating, with pulsed light, a composition containing (A) one or more moisture-curing resins selected from the group consisting of silicon-containing crosslinking organic polymers and moisture-curing type urethane-based organic polymers, (B) an electrically conductive filler, and (C) a condensation catalyst.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08K 3/00 - Emploi de substances inorganiques en tant qu'adjuvants
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
Provided are a two-component curable composition which is highly safe, can facilitate rapid curing and exhibits excellent storage stability, and a cured product obtained by curing this curable composition. The two-component curable composition comprises an agent (A) that contains an epoxy resin and a liquid tin-based curing catalyst, and an agent (B) that contains a crosslinkable silicon group-containing organic polymer and a curing agent for an epoxy resin. The liquid tin-based curing catalyst is a reaction product obtained by reacting a specific alkoxysilane compound with one or more tin compounds selected from among the group consisting of dioctyl tin oxide and dioctyl tin carboxylate, and relative to 100 parts by mass of the crosslinkable silicon group-containing organic polymer, the blending quantity of the epoxy resin is 10-200 parts by mass, the blending quantity of the liquid tin-based curing catalyst is 0.1-20 parts by mass, and the blending quantity of the curing catalyst for an epoxy resin is 1-60 parts by mass.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
It is possible to repeatedly adhere an adherent and peel it from the cured product of a composition. The composition of the present invention comprises (A) 100 parts by mass of an organic polymer having intramolecular silicon groups that are crosslinkable, (B) 10 to 400 parts by weight of an adhesion-imparting agent, (C) 10 to 200 parts by weight of a plasticizer, and (D) 0.1 to 20 parts by weight of a curing catalyst. The composition functions as a liquid adhesive and when used via a step for coating an adherent A with the liquid adhesive and a step for curing the liquid adhesive and then adhering an adherent B that will not be peeled to the surface of the cured product, the peeling strength of the cured product in terms of adherent A after adherent B has been adhered can be increased over the peeling strength of the cured product in terms of the adherent B.
Disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, an ultraviolet ray absorbing agent having a triazine skeleton and a hindered amine based light stabilizer. The composition exhibits improved weather resistance in a thin layer and thick layer portion. Further, disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, a (meth)acrylic polymer containing an epoxy group, a divalent tin organic carboxylate and an organic amine compound. The composition exhibits excellent properties. Also, disclosed is a curable composition and sealing material including a reactive organic polymer containing at least one crosslinkable silyl group in one molecule thereof, a reactive organic polymer containing less than one crosslinkable silyl group in one molecule thereof, and thermally expandable hollow spheres. The composition has good physical properties. Also, disclosed is a fire-resistant structure forming method.
C08L 83/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du silicium, avec ou sans soufre, azote, oxygène ou carboneCompositions contenant des dérivés de tels polymères
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adhesive comprises (A) an organic polymer which contains, as the backbone skeleton, one or more polymers selected from the group consisting of polyoxyalkylene polymers, saturated hydrocarbon polymers and (meth)acrylate polymers and which has a crosslinking silicon group, (B) a silver powder which comprises (b1) a first silver powder having a specific surface area of 0.5 to less than 2m2/g and a tap density of 2.5 to 6.0g/cm3 and (b2) a second silver powder having a specific surface area of 2 to 7m2/g and a tap density of 1.0 to 3.0g/cm3 at a prescribed mixing ratio, and (C) an at least one kind of silica selected from the group consisting of hydrophobic silica hydrophobized with a specific surface treatment and hydrophilic silica.
C09J 201/10 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés contenant des groupes silanes hydrolysables
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 123/00 - Adhésifs à base d'homopolymères ou de copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
Provided is a curable composition which exhibits excellent curability, adhesiveness and storage stability and which does not necessitate an organotin-type catalyst and is therefore highly safe. A curable composition comprising (A) an organic polymer which contains on average 0.8 or more crosslinking silicon group in one molecule and in which the main chain is not a polysiloxane, (B) a silane compound obtained by reacting a specific epoxysilane compound with a specific aminosilane compound at a ratio such that the amount of the epoxysilane compound is 1.5 to 10mol relative to one mol of the aminosilane compound, and (C) a specific titanium catalyst, with the amounts of the silane compound (B) and the titanium catalyst (C) being 0.1 to 40 parts by mass and 0.1 to 40 parts by mass respectively relative to 100 parts by mass of the organic polymer (A).
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08K 5/5435 - Composés contenant du silicium contenant de l'oxygène contenant de l'oxygène dans un cycle
C08K 5/544 - Composés contenant du silicium contenant de l'azote
C08L 33/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
Provided are: a curable composition which exhibits excellent curability, adhesiveness and storage stability and which does not necessitate an organotin-type catalyst and is therefore highly safe; and a process for manufacturing the curable composition. A curable composition comprising (A) an organic polymer that contains on average 0.8 or more crosslinking silicon group in one molecule and (B) an aged curing catalyst, wherein the aged curing catalyst (B) is a catalyst obtained by mixing (C) a silane compound obtained by reacting a specific epoxysilane compound with a specific aminosilane compound with (D) a specific titanium catalyst at a mixing ratio such that the amount of the silane compound (C) is 0.1 to 30mol relative to one mol of the titanium catalyst (D) and then aging the resulting mixture at a reaction temperature of 30 to 100°C.
C08L 101/10 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des groupes silane hydrolysables
C08K 5/5435 - Composés contenant du silicium contenant de l'oxygène contenant de l'oxygène dans un cycle
C08K 5/544 - Composés contenant du silicium contenant de l'azote
C08L 33/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
Provided is a curable composition which realizes compatibility between curability and toughness, shows rapid curability and excellent storage stability, and does not require any tin catalyst. The curable composition comprises: (A) a vinyl-based resin obtained by causing a compound (I) represented by the following general formula (1) and a compound (II) represented by the following general formula (2) to react with each other; (B) a urethane-based resin obtained by causing a hydroxyl group-containing organic polymer, a polyisocyanate compound, a compound (III) represented by the following general formula (3), and an amine compound to react with one another; and (C) a curing catalyst.
C08G 18/10 - Procédés mettant en œuvre un prépolymère impliquant la réaction d'isocyanates ou d'isothiocyanates avec des composés contenant des hydrogènes actifs, dans une première étape réactionnelle
C08G 18/75 - Polyisocyanates ou polyisothiocyanates cycliques cycloaliphatiques
C08G 18/76 - Polyisocyanates ou polyisothiocyanates cycliques aromatiques
C08L 33/04 - Homopolymères ou copolymères des esters
C08L 43/04 - Homopolymères ou copolymères de monomères contenant du silicium
C08L 75/08 - Polyuréthanes à partir des polyéthers
C09J 143/04 - Homopolymères ou copolymères de monomères contenant du silicium
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
Provided is a curable composition which has both curability and toughness and also has rapid curability and excellent storage stability and does not require a tin catalyst. The curable composition comprises (A) a vinyl resin obtained by reacting a compound (I) represented by general formula (1) and a compound (II) represented by general formula (2), (B) a urethane resin obtained by reacting a hydroxy group-containing organic polymer, a polyisocyanate compound, a compound (III) represented by general formula (3), and an amine compound, and (C) a curing catalyst.
Provided is a one-part moisture-curable adhesive composition for a polycarbonate resin having excellent heat resistance, adhesiveness to polycarbonate, and workability. The adhesive composition for a polycarbonate resin to be used for bonding polycarbonate resins to each other, comprises (A) a urethane prepolymer having an isocyanate group at a terminal thereof obtained by reacting a polyisocyanate with at least one polyol selected from a group consisting of polytetramethylene glycols, modified polytetramethylene glycols, and polycarbonate polyols, and (B) at least one curing catalyst selected from a group consisting of tertiary amine catalysts and tin catalysts.
A tile bonding strength inspection device and a tile bonding strength inspection method using the device. The tile bonding strength inspection device has a simple structure, can be easily transported, can inspect tile bonding strength at a construction site, and can inspect tile bonding strength in a shear direction without destroying tiles. The tile bonding strength inspection device includes a pair of plate-like members arranged facing each other, insertion parts to be inserted into joint spaces, and biasing means. The insertion parts are respectively formed at the front ends of the pair of plate-like members, each have a smaller width than a joint space, and are adapted so that they can be biased inward or outward relative to each other. The biasing means biases the insertion parts of the pair of plate-like members inward or outward relative to each other.
Disclosed is a vinyl monomer grafted alkoxysilane modified oxyalkylene resin which is useful as a raw material for modified silicone elastic adhesives and excellent in storage stability, adhesion and moisture curability. This vinyl monomer grafted alkoxysilane modified oxyalkylene resin has short moisture curing time. Also disclosed are a method for producing such a resin and a curable composition containing such a resin. Specifically disclosed is a vinyl monomer grafted alkoxysilane modified oxyalkylene resin which is produced by a process comprising grafting of a vinyl monomer by using an oxyalkylene polymer as a raw material. The vinyl monomer is one containing one or more (meth)acrylic monomers in an amount of not less than 50% by weight, and the vinyl monomer is grafted by using an alkyl peroxide as a radical reaction initiator.
C08F 283/06 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polyéthers, des polyoxyméthylènes ou des polyacétals
C09J 151/08 - Adhésifs à base de polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneAdhésifs à base de dérivés de tels polymères greffés sur des composés macromoléculaires obtenus autrement que par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
