A pair of electrodes are disposed in a direction substantially perpendicular to an opposing direction of a pair of optical fibers. The pair of electrodes are disposed so as to oppose each other on a fusion part where tips of the optical fibers are butted and fused together, and a hollow core fiber is positioned between the electrodes. By applying a prescribed voltage across the electrodes, an arc is generated in a straight line connecting the tips of the pair of electrodes. At such time, the axial center connecting the tips of the pair of electrodes is offset relative to the axial center of the hollow core fiber held by an optical fiber holding part. In a state where the arc is formed by applying a voltage across the electrodes, a control unit can rotate a pair of holder mounting parts about the axis of the hollow core fiber and in the same direction at a predetermined speed.
A semiconductor optical device includes: a substrate expanding while intersecting with a first direction; a plurality of waveguide structures each of which includes a first cladding layer, a core layer, and a second cladding layer that are layered in the first direction, the plurality of waveguide structures extending in a second direction that intersects with the first direction and guiding lights in the second direction or opposite direction to the second direction, and being disposed away from each other in a third direction that intersects with the first direction and the second direction; and a first electrode disposed on an opposite side of the substrate with respect to the waveguide structures, and including a first portion and a second portion having a thickness thicker than a thickness of the first portion in the first direction.
A semiconductor optical device includes: a first layered portion including therein a first waveguide; a first top surface positioned at a first end portion of the first layered portion; a first end surface positioned at a second end portion of the first layered portion; a plurality of first end portions of the first waveguide, the plurality of first end portions being exposed at a plurality of positions on the first end surface; two first position identification marks provided on the first top surface; and a first orientation identification mark provided on the first top surface.
An optical device includes: a base including a first face facing in a first direction; an optical component having a second face that faces the first face and that is adhered to the first face with an adhesive; and an inhibitor that inhibits part of laser light an optical axis of which is out of alignment with the optical component from reaching the adhesive.
H01S 3/08 - Structure ou forme des résonateurs optiques ou de leurs composants
H01S 3/139 - Stabilisation de paramètres de sortie de laser, p. ex. fréquence ou amplitude par commande de la position relative ou des propriétés réfléchissantes des réflecteurs de la cavité
5.
SEMICONDUCTOR OPTICAL DEVICE AND SEMICONDUCTOR OPTICAL DEVICE MANUFACTURING METHOD
A semiconductor optical device includes: a substrate expanding while intersecting with a first direction; and a layering portion layered on the substrate in the first direction, the layering portion including a plurality of semiconductor layers including a core layer. The layering portion includes a first waveguide structure and a second waveguide structure that are separated from each other in a second direction intersecting with the first direction and that are different from each other, in between the first waveguide structure and the second waveguide structure, a slit is formed that extends from surface of the layering portion to the substrate, and in bottom portion of the slit, a protruding portion is formed that extends along the slit and protrudes in the first direction.
An optical semiconductor device includes: an n-type cladding layer; a p-type cladding layer; and an active layer interposed between the n-type cladding layer and the p-type cladding layer. The n-type cladding layer includes a base layer, and an electric field distribution adjusting structure configured by alternately and periodically layering multiple first layers and multiple second layers, the multiple first layers having same refractive index as the base layer, the multiple second layers having a higher refractive index than a refractive index of the first layers. The multiple second layers include a relaxation layer located at a position near at least one end from a center in a layering direction of the first layers and the second layers of the electric field distribution adjusting structure, the relaxation layer having a smaller thickness than a thickness of the other second layers.
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
A power system includes: power converters configured to acquire an electrical characteristic value of input power or power to output, control a power conversion characteristic of an output of power based on a reference function in which an electrical characteristic value of an output of power is defined according to an input value by using the acquired electrical characteristic value as an input value, and update a stored reference function to the acquired reference function; a controller configured to set a reference function and output the set reference function to the power converters; and a DC electric line to which the plurality of power converters is connected. The controller is configured to calculate a voltage drop in the electric line from a power target value of an output and a line impedance of the electric line, and set the reference function based on the calculated voltage drop.
An optical module includes: a base having a first surface facing a first direction, and a second surface that faces the first direction and that is away from the first surface in a second direction orthogonal to the first direction; an optical element provided on the first surface; an optical fiber fixing portion including a groove configured to at least partially accommodate a core wire obtained by removing a coating from an optical fiber; and an alignment mark provided either at a first position away from the groove in a direction opposite to the second direction or at a second position shifted from the first position in a direction opposite to a third direction orthogonal to both of the first direction and the second direction, as viewed in the direction opposite to the first direction.
This compound superconducting precursor wire includes: a compound superconducting precursor portion including a plurality of compound superconducting precursor filaments, and a first matrix precursor having the plurality of compound superconducting precursor filaments embedded therein and including a first stabilizing material; a reinforcing material portion disposed on an outer peripheral side of the compound superconducting precursor portion; and a stabilizing material portion which is disposed on at least one of an inner peripheral side and an outer peripheral side of the reinforcing material portion, and consisting of a second stabilizing material, in which a Vickers hardness (HV) of the stabilizing material portion is 90 or less, and a 0.2% tensile strength of the compound superconducting precursor wire is 200 MPa or more.
H01B 12/10 - Conducteurs, câbles ou lignes de transmission supraconducteurs ou hyperconducteurs caractérisés par leurs formes à plusieurs filaments enrobés dans des conducteurs normaux
H01B 12/08 - Conducteurs, câbles ou lignes de transmission supraconducteurs ou hyperconducteurs caractérisés par leurs formes à fils toronnés ou tressés
10.
Ag-COATED MATERIAL AND ELECTRICAL/ELECTRONIC COMPONENT
The present invention provides an Ag-coated material and an electrical/electronic component which are capable of suppressing a decrease in adhesion against fatigue and are also capable of suppressing an increase in contact resistance after heating. This Ag-coated material is obtained by superposing, on one surface or both surfaces of a conductive base material that is formed of an Fe-based alloy and has a Vickers hardness (HV) of 300 or more, an Ni-containing layer, a Cu-containing layer, and an Ag-containing layer in this order. The thickness of the Ni-containing layer is 0.05 μm or more and 2.00 μm or less, and the thickness of the Cu-containing layer is 0.05 μm or more and 1.00 μm or less. When a cross-section including the thickness direction of the Ag-coated material is observed, the average crystal grain size of a plurality of Ni crystal grains which are cut by a straight line that is perpendicular to the thickness direction of the Ag-coated material in the Ni-containing layer is 0.80 μm or less, and the average crystal grain size of a plurality of Cu crystal grains which are cut by the straight line in the Cu-containing layer is 0.80 μm or less.
An optical module includes: a housing; a light emitting device housed in the housing; a wavelength detecting unit configured to detect wavelength of a first light which is output in a first direction from the light emitting device housed in the housing; and an optical device housed in the housing and configured to receive input of a second light traveling substantially parallel to the first light. A first incident surface of the wavelength detecting unit, on which the first light falls, is positioned away from a second incident surface of the optical device, on which the second light falls, in an opposite direction of the first direction.
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
This waveguide device comprises a body part that is provided with a hollow flow path through which a fluid flows, has a reflection surface that surrounds the fluid and reflects irradiation light emitted to the fluid, and is provided with an optical waveguide including a hollow region, at least a part of the flow path and at least a part of the hollow region being shared. The body part may be tubular or plate-shaped. The body part is made of metal, and the reflection surface may be a surface of the metal.
Holder-side fitting portions are provided on both sides of a ferrule holder. Also, housing-side fitting portions are provided on inner surfaces of front sidewall portions of a housing. The housing-side fitting portions are grooves formed on the inner surfaces of both sidewalls of the housing. The groove-shaped housing-side fitting portions provided on the inner surfaces of the ferrule holder and the protrusion-shaped holder-side fitting portions provided on outer surfaces of the ferrule holder fit together so that the ferrule holder is disposed at a predetermined position in the housing. Here, a clearance is formed between the holder-side fitting portion and the housing-side fitting portion. Thus, when the ferrule holder is attached to the housing, the ferrule holder is movable with respect to the housing.
An optical fiber preform manufacturing method includes: a core portion formation step of forming a core portion; and a cladding portion formation step of forming a cladding portion on an outer periphery of the core portion. The core portion formation step includes: a placement step of placing a first member doped with an alkaline element and a second member not doped with the alkaline element such that no contact is made therebetween and one member encloses another member; and a heat treatment step of heating the first member and the second member in a mutually non-contacting state, and scattering the alkaline element from the first member onto the second member. In the cladding portion formation step, the second member that has been doped with the alkaline element during the heat treatment process is used as at least some part of the core portion.
This semiconductor laser module is provided with, for example: a plurality of semiconductor laser elements; an optical fiber; a first optical component that arranges light beams output from the plurality of semiconductor laser elements at intervals in the fast-axis direction; a reflection mirror that reflects a specific wavelength band component of the light beams output from the semiconductor laser elements and arranged at intervals in the fast-axis direction, and constitutes an external resonator with the plurality of semiconductor laser elements; an aperture that is provided in the external resonator and limits the width in the slow-axis direction of multimode laser light so as to remove a high-order mode component of the laser light from the light beams arranged at intervals in the fast-axis direction; and a condenser lens that couples laser light output from the external resonator to an output optical fiber.
Provided is a copper foil for an electromagnetic wave shield in which high corrosion resistance is obtained and in which surface wettability is controlled. A copper foil (50) for an electromagnetic wave shield according to one embodiment of the present invention comprises a copper foil base body (10) and a surface treatment layer (40) formed on one or both surfaces of the copper foil base body (10), wherein: the surface treatment layer (40) is provided with a nickel layer (20) containing nickel or a nickel-phosphorus alloy, and a hydrophilic rust prevention treatment layer (30) formed on the surface of the nickel layer (20) on the side opposite from the surface facing the copper foil base body (10); and when the surface roughness of a surface (40a) of the surface treatment layer (40) is measured in conformance with the method specified in ISO 25178, the developed surface area ratio Sdr is 0.01-20%, and the peak density Spd [1/μm2] of peaks is 0.5-10.
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
This optical waveguide type device comprises, for example: a first core that extends along a first direction and that guides light to an end portion in the first direction; cladding that has a lower refractive index than the first core and that surrounds the outer periphery of the first core; and a groove portion that extends along a second direction intersecting the first direction so as to include a region in which the end portion of the first core extends along the first direction, and that has a bottom surface which is located below a lower end of the first core. As a result, the present invention provides a novel improved optical waveguide type device that enables precise design of light emission characteristics, for example.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/125 - Courbures, branchements ou intersections
18.
ELECTRIC CABLE WINDING DEVICE, AND STEERING WHEEL POWER-SUPPLYING DEVICE AND SEAT POWER-SUPPLYING DEVICE USING ELECTRIC CABLE WINDING DEVICE
The purpose of the present invention is to provide an electric cable winding device making it possible to smoothly pull out or wind up a flat cable as a subject member moves, as well as a steering wheel power-supplying device and a seat power-supplying device using the electric cable winding device. A cable winding device 1a comprises: a cable 10 connected to a steering wheel 820 able to move along the axial direction Z; and an accommodation section 20 for retaining another side of the cable 10 and winding and accommodating part of the cable 10. The accommodation section 20 comprises: a retention section 50 arranged radially inward; a cylindrical outer cylinder section 60 arranged radially outward of the retention section 50; and a guide section 42 for guiding a first cable 11 to the exterior and the interior along the axial direction Z. Further provided is a synchronization mechanism 30 for synchronizing movement of the steering wheel 820 in the axial direction Z and rotation of the outer cylinder section 60.
H02G 11/02 - Installations de câbles ou de lignes électriques entre deux pièces en mouvement relatif utilisant une bobineuse ou tambour
B60R 16/027 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule entre des parties du véhicule mobiles l'une par rapport à l'autre, p. ex. entre le volant et la colonne de direction
B65H 75/48 - Dispositifs automatiques de restockage
H01R 35/04 - Connecteurs de ligne pouvant tourner d'un angle de rotation limité
A semiconductor processing tape including an adhesive tape composed of a base material film and an energy ray-curable adhesive layer formed on at least one surface side of the base material film, the adhesive tape having a 65°C maximum heat shrinkage stress (S1) of 20 mN/mm2 or more, wherein the relationship between S1 and a 80°C maximum heat shrinkage stress (S2) is S2 < S1.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
[Problem] A purpose of the present invention is to provide a film-like adhesive which has low transmittance and reflectance of light when formed into a cured film. Another purpose of the present invention is to provide: a film-like adhesive which is capable of simultaneously satisfying bonding properties before curing, low water absorption rate in a cured state, and adhesive force at high temperatures; a laminated lens which is provided with a cured film of the same; and a dope for a film-like adhesive. [Solution] Disclosed is a film-like adhesive which contains an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), an inorganic filler (D), and a coloring agent (E). The polymer component (C) contains a phenoxy resin, and the film-like adhesive contains a specific amount of the inorganic filler (D), a specific amount of the epoxy resin (A), a specific amount of the epoxy resin curing agent (B), and a specific amount of the coloring agent (E).
[Problem] The purpose of the present invention is to provide: a material for radome, the material comprising a laminated-structure resin foam having excellent radio wave transmissivity over a wide bandwidth and waterproofness as well as excellent impact resistance; a radome; a radome type antenna unit, and a method for transmitting and receiving radio waves. [Solution] A material for radome comprising a laminated-structure resin foam in which a first layer and a second layer are stacked, said material being characterized in that the first layer is a microcellular resin foam having an average bubble diameter of 0.1 to 30 μm and a water absorption rate of 2% or less, and the second layer is a resin foam having an average bubble diameter larger than 30 μm.
Provided is a dicing die bonding tape comprising a base material film, a pressure-sensitive adhesive layer, and an adhesive layer in contact with the pressure-sensitive adhesive layer laminated in this order. The dicing die bonding tape is characterized in that: the pressure-sensitive adhesive layer has a structure in which a base polymer is crosslinked by a curing agent containing a 1,2-polybutadiene skeleton and is of an ultraviolet-curable type; the curing agent component is contained in an amount of 3 to 25 parts by mass with respect to 100 parts by mass of the base polymer; and the adhesive layer has a surface free energy of 40 to 70 mN/m.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
The present invention pertains to a conductive adhesive film (10) for joining a semiconductor device and a member, the conductive adhesive film (10) comprising: a stress relaxation layer (1) that is composed of a soft high-thermal-conductivity metal having a Young's modulus of 110 GPa or less at 25°C, a thermal conductivity of 100 W/m•K or more at 25°C, and a volume resistivity of 100 μΩ•cm or less; a first adhesive layer (2) that is provided on the side of the stress relaxation layer (1) to which the semiconductor device is joined, the first adhesive layer containing copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide; and a second adhesive layer (3) that is provided on the side opposite the side of the stress relaxation layer (1) to which the semiconductor device is joined, the second adhesive layer containing copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide.
The present invention relates to a conductive adhesive film (10) for joining a semiconductor device and a member, the conductive adhesive film comprising: a stress relaxation layer (1) composed of a soft, highly thermally conductive metal having a 0.2%-proof stress at 25°C of 200 N/mm2 or less, a thermal conductivity at 25°C of 50 W/m·K or more, and a volume resistivity of 100 μΩ·cm or less; a first adhesive layer (2) that includes copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide, and that is provided on the side, of the stress relaxation layer (1), to which the semiconductor device is joined; and a second adhesive layer (3) that includes copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide, and that is provided on the side, of the stress relaxation layer (1), opposite to the side to which the semiconductor device is joined.
The present invention pertains to a conductive adhesive film (10) for joining a semiconductor device and a member, said conductive adhesive film (10) comprising: a stress relief layer (1) configured from a perforated metal foil in which a through-hole is provided on the main surface of a metal foil formed of at least one metal selected from the group consisting of copper (Cu), a copper (Cu) alloy, aluminum (Al), and an aluminum (Al) alloy; a first adhesive layer (2) containing copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide, sadi first adhesive layer (2) being provided on the side of the stress relief layer (1) to which the semiconductor device is joined; and a second adhesive layer (3) containing copper (Cu), tin (Sn), a bismaleimide resin, and an organic phosphine and/or an organic sulfide, said second adhesive layer (3) being provided on the side of the stress relief layer (1) facing the side to which the semiconductor device is joined.
A support part is disposed so as to be changeable in height with respect to a base, and supports a blade member. The support part is pressed, by an elastic member, upward relative to the base. A positioning member is fixed to the base, and thus the blade member fixed to the support part is pressed above the positioning member. When the support part is lowered by a support part lowering mechanism, contact between a tapered part of the blade member and the positioning member is released. Thus, friction between the blade member and a projection is removed, and the blade member can be rotated by a rotation mechanism.
A shaft part of a disk-shaped blade member has a support part that supports the blade member and a fixing screw that fixes the support part, and the blade member is arranged so as to be interposed between the fixing screw and the support part. A pin oriented in the direction perpendicular to the axial direction of the shaft part is formed in the support part (shaft part). A jig is a member used when attaching the blade member to a cutting device. A hole is formed in a substantially cylindrical body of the jig. The pin provided to the shaft part of the blade member is insertable in the hole. Through use of the jig, by mounting the jig on the pin and using the jig to attach the blade member to a blade member attachment part, it is possible to attach the blade member to the attachment part without touching the blade member.
B26D 7/26 - Moyens de montage ou de réglage de l'outil de coupeMoyens de réglage de la course de l'outil de coupe
B26D 1/15 - Coupe d'une pièce caractérisée par la nature ou par le mouvement de l'élément coupantAppareils ou machines à cet effetÉléments coupants à cet effet comportant un élément qui ne suit pas le mouvement de la pièce ayant un élément coupant se déplaçant autour d'un axe avec un élément circulaire, p. ex. un disque tournant autour d'un axe fixe l'élément coupant étant situé dans un plan vertical
G02B 6/25 - Préparation des extrémités des guides de lumière pour le couplage, p. ex. découpage
Provided are: a polyolefin resin composition that contains a base resin which includes 5-20 mass% a cyclic olefin resin and 3-20 mass% an ultra-high molecular weight polyethylene resin composition; and a wiring material that has a coating layer formed from said polyolefin resin composition on an outer circumferential surface of a conductor.
C08L 45/00 - Compositions contenant des homopolymères ou des copolymères de composés ne possédant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique ou hétérocycliqueCompositions contenant des dérivés de tels polymères
C08L 23/04 - Homopolymères ou copolymères de l'éthylène
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
An optical module (10) includes, for example: a housing (1) of a prescribed dimension; a first optical transmitting unit (2) and a second optical transmitting unit (3) which are accommodated in the housing (1); a control board (4) on which a drive circuit for driving the first optical transmitting unit (2) and the second optical transmitting unit (3) is mounted; a connection unit (6) which optically and electrically connects to an external device; a first optical fiber (7) which connects the first optical transmitting unit (2) and the connection unit (6); and a second optical fiber (8) which connects the second optical transmitting unit (3) and the connection unit (6). Thus, for example, an optical module is provided in which two transmitter optical sub-assemblies (TOSA) are mounted within a housing of a prescribed dimension.
Provided is a surface-treated copper foil with which it is possible to manufacture a printed wiring board, etc., in which there is exceptional adhesion between a resin base material and the surface-treated copper foil, transmission loss is low, and a gap is less likely to be produced at the interface between the resin base material and the surface-treated copper foil even upon receiving a heat history. This surface-treated copper foil has a roughened surface on which roughened particles are formed. In the surface-treated copper foil, property values measured with respect to the roughened surface satisfy the following: (A) when the surface-treated copper foil is cut to cause a cross-section orthogonal to the roughened surface to appear, and the cross-section is observed using a scanning electron microscope, the presence density X of protrusions of the roughened particles present on the roughened surface is 4 to 10 per 1-μm-long region of the roughened surface in the cross-section; (B) the average value AR of the aspect ratio calculated by dividing the particle height of the roughened particles by the particle diameter thereof is 1.5 to 3.0; and (C) the arithmetic-average height Sa measured in conformance with the optical measurement method stipulated in ISO 25178 is 0.04 μm to 0.10 μm.
The present invention pertains to: a film-like adhesive which comprises an epoxy resin (A), an epoxy resin curing agent (B), and a polymer component (C), and in which the polymer component (C) is a ring-opening polymer or an addition polymer obtained through a chain reaction, and has a cyclodextrin structure and an adamantyl group in a side chain; a composition for an adhesive; a dicing-die attachment film; a semiconductor package; and a method for manufacturing the semiconductor package.
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
32.
CATHETER VISUALIZATION DEVICE AND MEDICAL CATHETER SET
Provided are: a catheter visualization device capable of emitting light at a high output from a tip portion of an optical fiber; and a medical catheter set provided with the same. A catheter visualization device 2 makes it possible to visually recognize the tip position of a catheter 3 and is provided with: an optical fiber 10 that comprises a core 11 centrally positioned in the radial direction and a clad 12 positioned on the outer circumferential side of the core 11, and that has a base portion 10b and a tip portion 10t; and a light source 20 that causes light to enter the optical fiber 10 from the base portion 10b. Between the base portion 10b and the tip portion 10t, the optical fiber 10 is provided with a tapered portion 10T having a shape in which the core 11 is tapered toward a tip portion side t. A medical catheter set 1 is provided with said catheter visualization device 2 and the catheter 3.
Provided are: a catheter tip position confirmation device which makes it possible to ascertain the positional relationship between the tip portion of a catheter and a target object such as an inner wall of a visceral organ of a living body and the like; and a medical catheter set provided with the same. A catheter tip position confirmation device 2 has: an optical fiber 10 which has a base end portion 10b and a tip portion 10t and is disposed such that the tip portion 10t is positioned at or near the tip 3t of a catheter 3; a first light source 20 which allows measurement light to enter the optical fiber 10 from the base end portion 10b; a second light source 20 which allows visible light to enter the optical fiber 10 from the base end portion 10b; and an analyzer 30 which comprises a function of measuring the distance between the tip portion 10t of the optical fiber 10 and a target object 4 on the basis of signal information regarding the measurement light and signal information regarding return light resulting from reflection, on the target object 4, of the measurement light emitted from the tip portion 10t of the optical fiber 10, or a function of examining information regarding the state of the target object 4 and/or the tip 3t of the catheter 3. The visible light is emitted from the tip portion 10t of the optical fiber 10 and the proximity thereof.
A61B 5/06 - Dispositifs autres que ceux à radiation, pour détecter ou localiser les corps étrangers
A61B 10/00 - Instruments pour le prélèvement d'échantillons corporels à des fins de diagnostic Autres procédés ou instruments pour le diagnostic, p. ex. pour le diagnostic de vaccination ou la détermination du sexe ou de la période d'ovulationInstruments pour gratter la gorge
A61M 25/095 - Dispositions pour permettre la détection de la position interne du cathéter, p. ex. à l'aide d'une radiographie
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
Tape for electronic component processing characterized by comprising a resin layer A, a primer layer, a resin layer B, and an adhesive layer in this order, wherein the primer layer contains an antistatic agent.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A tape for protecting a semiconductor wafer surface that is characterized by including a substrate layer, a resin layer A, a resin layer B, and an adhesive layer in the order given, wherein the storage modulus of the resin layer A at 23°C is 1.0×103to 1.0×105 Pa, and the thickness of the resin layer A is 3 to 55 μm.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
This optical module includes, for example: a housing in which a through-hole is formed; a light transmission unit housed in the housing; a control board on which a drive circuit for driving the light transmission unit is mounted; a connection part that is optically and electrically connected to an external device; and an optical fiber that connects the light transmission unit and the connection part to each other. In the optical module, the housing may be constituted by a lower housing and an upper housing covering an opening of the lower housing. Due to this configuration, provided are, for example, an optical module and a light source device that are capable of dissipating the heat of a drive circuit for driving a TOSA.
An optical waveguide structure includes: a first waveguide that has a layered structure in which layering is performed in a first direction, includes a first core layer that extends in a second direction, and a first cladding layer that has an end surface in the second direction; and a second waveguide that has a layered structure in which layering is performed in the first direction, includes a second core layer that is adjacent to the first core layer in the second direction, that is optically connected to the first core layer, and that, at least in an end portion of the second waveguide in an opposite direction to the second direction, extends in the second direction, and a second cladding layer that sandwiches the second core layer in the first direction.
A power converter includes: a power conversion unit configured to convert power input from a bus, output the converted power to a power element, convert power input from the power element, and output the converted power to the bus; a measurement unit configured to measure an electrical characteristic value of power input to and from the power conversion unit; a storage unit configured to store a first reference function and a second reference function; a setting unit configured to set a power conversion characteristic of the power conversion unit based on an electrical characteristic value; and a management unit configured to manage a renewable energy charge amount and manage an amount of power derived from renewable energy supplied from the power element.
Provided is an optical transceiver, said optical transceiver comprising: a light-emitting element which outputs light; a light-receiving element which receives light and which outputs an electric signal corresponding to the light; a drive circuit which drives the light-emitting element; a processing circuit which processes the electric signal from the light-receiving element; a first substrate on which the light-emitting element, the light-receiving element, the drive circuit, and the processing circuit are mounted; a housing which houses the light-emitting element, the light-receiving element, the drive circuit, and the processing circuit; a control circuit which controls the drive circuit and the processing circuit; a second substrate which has a mounting part that the control circuit is mounted to and a connection part that is flexible; and an electric interface which is provided to the first substrate and which electrically connects the optical transceiver and an external device, wherein the second substrate is attached to a wall surface of the housing via the mounting part.
This mobile body moves along the surface of a wall of a ship while irradiating the surface with laser light to perform surface treatment, for example. The mobile body comprises: a moving mechanism including a plurality of rolling bodies that roll along the surface; a magnetic attraction mechanism that are provided separately from the rolling bodies, faces the surface at an interval, and presses the rolling bodies against the surface by generating a magnetic attraction force between the mechanism and the wall; and an optical head for irradiating the wall with laser light. In the mobile body, an opposing region of the surface facing the magnetic attraction mechanism may be positioned between a plurality of regions of contact with the rolling bodies on the surface. The mobile body may include: a support member that supports the moving mechanism and the magnetic attraction mechanism; and a position change mechanism that can change the position of the optical head with respect to the support member.
A multicore fiber includes: a plurality of core portions; a cladding portion surrounding outer peripheries of the plurality of core portions and having a refractive index lower than the plurality of core portions; and a plurality of deformation correction portions arranged inside the cladding portion. The plurality of core portions are arranged in a first radial direction in a cross-section perpendicular to a longitudinal direction of the multicore fiber, and the plurality of deformation correction portions are arranged in a second radial direction substantially orthogonal to the first radial direction, in the cross-section.
This optical transceiver includes: a plate-form first substrate; a first conversion unit that is provided to a first surface of the first substrate and converts an electric signal to an optical signal; a second conversion unit that is provided to the first surface of the first substrate and converts an optical signal to an electric signal; a cover that covers the first conversion unit and the second conversion unit; and a connection unit that is formed of a resin, incorporates a plurality of connection conductors electrically connected to wiring of the first substrate, and is fixed to a second surface of the first substrate, the optical transceiver being fixed to a second substrate. The first substrate and the connection unit are provided with: a through-hole into which a pin for positioning the first substrate and the connection unit with respect to the second substrate is inserted; and a fixing hole through which passes a fixing tool for pressing the cover, the first substrate, and the connection unit toward the second substrate.
The purpose of the present invention is to provide a harness housing structure and a harness housing body capable of housing a plurality of bundled wire harnesses in a housing space. A harness fixing protector 1 includes: a protector body 11 forming a housing space S for housing at least a part of a plurality of harnesses 910; and a fixing band 20 for winding the plurality of harnesses 910 and fixing in the housing space S. The protector body 11 is provided with a harness arrangement part 30 in which the harnesses 910 are arranged. The harness arrangement part 30 is provided with a recess 31 in which a left side WL is recessed so as to be a lower side HD than a right side WR, a first insertion part 32 is provided for inserting a fixing band 20 wound around harnesses 910 arranged in the harness arrangement part 30 and fixed to the harness arrangement part 30, and a convex part 40 protruding toward an upper side HU, which is a side of an opening in the recess 31, is provided in a side wall part 112 on the other side in a width direction W.
H02G 3/04 - Tubes ou conduits de protection, p. ex. échelles à câbles ou goulottes de câblage
F16L 3/10 - Supports pour tuyaux, pour câbles ou pour conduits de protection, p. ex. potences, pattes de fixation, attaches, brides, colliers entourant pratiquement le tuyau, le câble ou le conduit de protection fractionnés, c.-à-d. à deux éléments en prise avec le tuyau, le câble ou le conduit de protection
F16L 57/00 - Protection des tuyaux ou d'objets de forme similaire contre les dommages ou les usures internes ou externes
H02G 3/30 - Installations de câbles ou de lignes sur les murs, les sols ou les plafonds
The purpose of the present invention is to provide a cover structure and an electric connection box which make it possible to prevent a cover from being unintentionally detached by an external force acting in a direction for opening the cover when in an open state. A terminal cover structure 20 comprises: a terminal holder 30 that houses a relief terminal 10; and a terminal cover 40 that is pivotally attached to the terminal holder 30 and that protects the relief terminal 10 housed in the terminal holder 30. The terminal cover structure 20 further includes: a cylindrical protrusion 45 that is provided to the terminal cover 40 and that serves as a pivot shaft with respect to the terminal holder 30; and a circular groove 322 that is provided in the terminal holder 30, that attaches the cylindrical protrusion 45, and that pivotally supports the terminal cover 40. A restriction plate 362 is provided, which, in a state in which the pivoting of the terminal cover 40 is restricted by an upright body end section 363, makes abutting contact and thereby restricts the pivoting state of the columnar protrusion 45 and the circular groove 322 from being released by an external force acting in the opening direction.
BUNDLE STRUCTURE, OPTICAL CONNECTION STRUCTURE OF BUNDLE STRUCTURE AND MULTICORE FIBER, AND METHOD FOR OPTICALLY CONNECTING BUNDLE STRUCTURE TO MULTICORE FIBER
A bundle structure includes two optical fibers, a capillary, and so on. Each of the optical fibers is a single-core optical fiber having a core and a cladding covering the core. An outer shape of a cross section taken perpendicularly to an axial direction of each of the optical fibers is not circular, and a straight-line portion is formed at a part of an outer periphery portion. Also, the optical fibers are disposed so that the respective straight-line portions thereof face each other. That is, the optical fibers are in line contact with each other on the cross section. Each of the optical fibers is inserted into a cavity of the capillary.
A blade member is disposed above a cutting unit. The blade member is a substantially disc-shaped member, and the circumferential part serves as a blade tip. The blade member is stored in positioning members. When the positioning members are caused to counterpose and are then joined to each other, a slit is formed at the upper portion of the positioning members. A pair of projections projecting to the inner surface side are formed at one of the counterposing edges of the slit. The projections are formed at two positions with the center axis of the blade member therebetween. One surface of the blade member comes into surface-contact with the inner surface of the positioning member, and the blade member is pressed in the direction of the slit by an elastic member, whereby a tapered part on the other surface of the blade member comes into point-contact with the projections and is positioned therein.
B23D 47/08 - Machines à scier ou dispositifs de sciage travaillant au moyen de lames circulaires, caractérisés uniquement par la structure d'organes particuliers des dispositifs pour amener la lame circulaire au contact de la pièce à scier ou l'en retirer
[Problem] To provide crosslinked resin foam being excellent in terms of foam property and shape stability, while having suppressed amount of harmful gas, e.g., ammonia, generated. [Solution] This crosslinked resin foam is obtained by crosslinking and foaming a resin composition comprising (A) a thermoplastic olefin resin and (B) a blowing agent. The crosslinked resin foam has a gel content of 35-85% and satisfies the following (i) and/or (ii). (i) The crosslinked resin foam has a concentration of ammonium ions detected by ion chromatography of less than 1,000 μg per g of the crosslinked resin foam. (ii) The resin composition has an azodicarbonamide content of 0.01 mass% or less.
C08J 9/08 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent chimique de gonflage dégageant de l'anhydride carbonique
C08J 9/04 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable
48.
DEPOLARIZER, DEPOLARIZER ADJUSTMENT METHOD, AND DEPOLARIZER MANUFACTURING METHOD
A depolarizer includes: a splitter configured to branch an input light into at least a first light and a second light; a delay applying portion configured to apply a differential group delay with respect to the second light to the first light; a polarization converter configured to convert a polarization state of either the first light or the second light into an orthogonal polarization state; a coupler configured to either multiplex the first light, which has passed through the delay applying portion and the polarization converter, and the second light, or multiplex the first light which has passed through the delay applying portion and the second light which has passed through the polarization converter; and a connecting optical waveguide configured to optically connect the splitter and the coupler.
A buried optical waveguide structure includes: a waveguide including a first cladding layer, a core layer, and a second cladding layer that are layered in a first direction; and a burying layer that is adjacent to the waveguide in a direction intersecting with the first layer. The waveguide includes a first portion that has a first width in a second direction and that extends in a third direction, a second portion that is shifted from the first portion in the third direction, that is optically connected to the first portion, and that has a second width which is smaller than the first width in the second direction, and a third portion that is adjacent to the first portion in the third direction, and that is optically connected to the first portion.
Provided are: a liquid silane-grafted olefin composition containing 1-200 parts by mass of an inorganic filler and a liquid silane-grafted olefin obtained by grafting 10-150 parts by mass of a silane coupling agent with respect to 100 parts by mass of a liquid olefin polymer; a silane-crosslinked cured product thereof; and a production method comprising a specific step for grafting, at a temperature of 50-200°C, 10-150 parts by mass of a silane coupling agent to 100 parts by mass of a liquid olefin polymer in the presence of 0.2-5.0 parts by mass of an organic peroxide.
C08L 15/00 - Compositions contenant des dérivés du caoutchouc
C08C 19/25 - Incorporation d'atomes de silicium dans la molécule
C08F 8/00 - Modification chimique par post-traitement
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 23/26 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique
51.
PORTABLE LASER SURFACE PROCESSING DEVICE AND LASER SURFACE PROCESSING SYSTEM
A portable laser surface processing device includes: a casing configured to house an optical component; and a beam shaper serving as the optical component configured to divide laser light into a plurality of beams, wherein the portable laser surface processing device is configured to output the laser light divided into the plurality of beams by the beam shaper to a surface of an object to process the surface, and the portable laser surface processing device comprises a moving mechanism configured to move the beam shaper with respect to the casing such that spots of the plurality of beams move on the surface while the laser light is output.
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
An optical waveguide sensor includes: a plurality of first waveguides, each first waveguide including a core at least partially enclosed by a cladding and being configured to guide an examination light; and a contact surface with which an examination subject is in contact and from which leaks seeping component of the examination light guided by the first waveguides. The examination light guided by the plurality of first waveguides has mutually different amount of leakage from the contact surface.
G01N 21/31 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique
An optical fiber includes: a core portion; a cladding portion surrounding an outer periphery of the core portion and having a refractive index lower than a maximum refractive index of the core portion; and a covering layer surrounding an outer periphery of the cladding portion. The core portion includes a center core having a maximum mean refractive index in the optical fiber. A relative refractive-index difference Δ1 of a maximum refractive index of the center core in relation to a mean refractive index of the cladding portion is 0.30% or more and 0.45% or less. The cladding portion has an outer diameter of 95 μm or larger and 124 μm or smaller. The covering layer includes a primary layer surrounding the outer periphery of the core portion, and a secondary layer surrounding an outer periphery of the primary layer.
A circuit board (1) has a substrate (11) having one surface on which a pad (21) is disposed. The pad (21) includes a rectangular heat dissipation part (31) and a plurality of terminal parts (32). An exposed pad (7) on the bottom surface of an electronic component (5) is soldered to the heat dissipation part (31). The terminal parts (32) are arranged outside the heat dissipation part (31) along the rectangle of the heat dissipation part (31), and have terminal pads (6) of the electronic component (5) soldered thereto. First recessed sections (41) and second recessed sections (42) are formed in the heat dissipation part (31). The first recessed sections (41) and the second recessed sections (42) are disposed so as to correspond to a first segmentation line (51) and a second segmentation line (52) that are each parallel to a respective edge of two adjacent edges of the heat dissipation part (31). The portions of the heat dissipation part (31) that are adjacent to each other across the first segmentation line (51) are integrally connected to each other, and the portions thereof that are adjacent to each other across the second segmentation line (52) are integrally connected to each other.
The present invention relates to a heat sink (1) comprising: a base part (20) having a first surface (21) that has a first region (26) provided with a groove part (25) and a second region (27) different from the first region (26), and a second surface (22) facing opposite from the first surface (21), the base part (20) being such that a heat-generating body (100) is thermally connected to the second surface (22); a heat transport member (31) accommodated in the groove part (25) provided to the first region (26); a cover part (41) covering at least a portion of the heat transport member (31), the cover part (41) being disposed facing opposite from the first region (26) and being a separate member from the base part (20); first heat-dissipating fins (10-1) erected on the cover part (41); and second heat-dissipating fins (10-2) erected on the second region (27).
An optical semiconductor device outputting a predetermined wavelength of laser light includes a quantum well active layer positioned between a p-type cladding layer and an n-type cladding layer in thickness direction. The optical semiconductor device includes a separate confinement heterostructure layer positioned between the quantum well active layer and the n-type cladding layer. The optical semiconductor device further includes an electric-field-distribution-control layer positioned between the separate confinement heterostructure layer and the n-type cladding layer and configured by at least two semiconductor layers having band gap energy greater than band gap energy of a barrier layer constituting the quantum well active layer. The optical semiconductor device is applied to a ridge-stripe type laser.
H01S 5/32 - Structure ou forme de la région activeMatériaux pour la région active comprenant des jonctions PN, p. ex. hétérostructures ou doubles hétérostructures
B82Y 20/00 - Nano-optique, p. ex. optique quantique ou cristaux photoniques
H01S 3/04 - Dispositions pour la gestion thermique
H01S 3/094 - Procédés ou appareils pour l'excitation, p. ex. pompage utilisant le pompage optique par de la lumière cohérente
H01S 3/0941 - Procédés ou appareils pour l'excitation, p. ex. pompage utilisant le pompage optique par de la lumière cohérente produite par un laser à semi-conducteur, p. ex. par une diode laser
H01S 3/30 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet utilisant des effets de diffusion, p. ex. l'effet Brillouin ou Raman stimulé
H01S 5/34 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH]
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
A bonding method includes: upon arranging a first face that faces a first direction and that is included in a conductor provided on a circuit board and a bonded part of an electro-conductive portion in the first direction and upon interposing a bonding material having an electric conductivity and having a melting point lower than melting points of the conductor and of the electro-conductive portion between the first face and the bonded part, irradiating laser light having a wavelength of 550 nm or shorter on a site of the bonded part opposite to the bonding material to melt the bonding material by thermal conduction at the bonded part; and cooling the molten bonding material to solidify, thereby electrically connecting the conductor and the electro-conductive portion through the bonding material.
A multicore fiber includes: core portions; a cladding portion surrounding each core portion; a primary layer surrounding the cladding portion; and a secondary layer surrounding the primary layer. When Δ denotes a maximum relative refractive-index difference of the core portions from an average refractive index of the cladding portion, Δ is in a range of 0.2% to 0.5%, inclusive, a core diameter of each core portion is in a range of 4.0 μm to 15 μm, inclusive, a cladding diameter of the cladding portion is 125 μm or larger, a ratio of a thickness of the primary layer to a thickness of the secondary layer is 0.35 or smaller, a cut-off wavelength measured with a fiber length shorter than 2 meters is smaller than 1530 nm, and a cut-off wavelength measured with the fiber length is 1260 nm or larger.
The purpose of the present invention is to provide an electric cable winding device that can accommodate not only sliding motion but also rotational motion of a mounting target, while being compact in structure. A cable winding device 1 comprises: a cable 10 composed of a first cable 11 and a second cable 12; and a housing body 20 for housing the cable 10. The housing body 20 comprises a first housing portion 30 having a first housing space S1, and a second housing portion 40 having a second housing space S2. The first housing portion 30 is provided with a rotator 31 that rotates around an axial direction Z while holding one side of the first cable 11. The second housing portion 40 is provided with a lead-out portion 42 for guiding the second cable 12 drawn out from or wound into the second housing space S2. The first housing portion 30 and the second housing portion 40 are disposed along the axial direction Z.
H02G 11/02 - Installations de câbles ou de lignes électriques entre deux pièces en mouvement relatif utilisant une bobineuse ou tambour
B60R 16/027 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule entre des parties du véhicule mobiles l'une par rapport à l'autre, p. ex. entre le volant et la colonne de direction
B65H 75/48 - Dispositifs automatiques de restockage
H01R 35/04 - Connecteurs de ligne pouvant tourner d'un angle de rotation limité
60.
COPPER-BASED CONDUCTOR, STRANDED WIRE CONDUCTOR, AND ELECTRIC WIRE
The present invention provides a copper-based conductor which requires little force to bend and which has little springback after being bent. The present invention also provides a stranded wire conductor and an electric wire in each of which the copper-based conductor is used. Provided is a copper-based conductor wherein: when, in a view of a cross section thereof perpendicular to the direction in which the conductor extends, the contour shape of the cross section is assumed to be a first imaginary circle that has the same area as the area of the cross section and the contour shape of a crystal grain in the cross section is assumed to be a second imaginary circle that has the same area as the area of the crystal grain, the average diameter of the second imaginary circle is not less than 0.10 where the diameter of the first imaginary circle regarded as 1, and the average diameter of the second imaginary circle is more than 150 μm; and, in a crystal orientation analysis performed in a measurement region in the cross section by an electron backscatter diffraction (EBSD) method, the percent of the area of the measurement region accounted for by a region having a GOS value of less than 1° is not less than 80%.
The purpose of the present invention is to provide a copper-based conductor with which, when a terminal is joined to a copper-based conductor to form an electric wire with a terminal, it is possible to promote joining with the terminal and enhance tensile durability of the electric wire with a terminal. In the copper-based conductor, in a crystal orientation analysis by an electron backscatter diffraction method performed in a cross section perpendicular to an extension direction, in a first measurement area selected in the cross section, the total accumulation rate is 40% or more, the total accumulation rate being the ratio to the total area of crystal grains contained in the first measurement area of the average value of: a first total area obtained by adding the area of crystal grains having, with respect to a first direction, a <011> orientation group, which is a crystal orientation within a <011> orientation ± 8°, a <012> orientation group, which is a crystal orientation within a <012> orientation ± 8°, and a <123> orientation group, which is a crystal orientation within a <123> orientation ± 8°; and a second total area obtained by adding the area of the crystal grains having, with respect to a second direction orthogonal to the first direction, the <011> orientation group, the <012> orientation group, and the <123> orientation group.
C22C 9/02 - Alliages à base de cuivre avec l'étain comme second constituant majeur
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
H01B 5/08 - Pluralité de fils ou analogues toronnés en forme de corde
A wavelength detection device includes: waveguides configured to guide lights; a multiplexer unit configured to multiplex lights respectively guided through the waveguides and having wavelengths different from one another; a filter unit to which light output from the multiplexer unit is input, the filter unit having a property of having light transmittance that changes according to wavelength; and a detection unit configured to detect intensity of light output from the filter unit. The waveguides, the multiplexer unit, and the filter unit are included in a planar lightwave circuit.
Provided are: a water-soluble film for plasma treatment, the film being formed of a curable resin composition containing a water-soluble polymer A and a monomer B that has a (meth)acrylamide structure and does not have a ring structure containing amide nitrogen, wherein the film has a molecular weight of at most 200 and a content of components other than the monomer B of at most 10 mass%; a semiconductor processing tape comprising said water-soluble film; and a method for manufacturing a semiconductor chip using said semiconductor processing tape, the method comprising performing a grinding step, a water-soluble film curing step, a plasma treatment step, and a water washing step on a semiconductor wafer in which the water-soluble film of the semiconductor processing tape is bonded to a circuit surface without heating.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
TROUGH FIXING SUPPORT STRUCTURE, TROUGH LINE USING SAME, TROUGH STRUCTURE AND METHOD FOR SUPPORTING AND FIXING SAME, AND TROUGH FIXING SUPPORT MEMBER USED THEREIN
[Problem] The purpose of the present invention is to provide a trough fixing support structure that increases the freedom of installation of a trough fixing support member for supporting a trough and is easily attached, while also enabling stable trough structure installation. [Solution] It is possible to obtain a trough fixing support structure 100 wherein a support pillar structure 20, which uses a vertical direction support pillar 21 that comprises a fiber-reinforced resin member with a hollow structure having a substantially rectangular cross section, and a horizontal direction support pillar 22 and/or a diagonal direction support pillar 23, is further provided with a plurality of S-shaped trough fixing support members 25, the S-shaped trough fixing support members 25 are each configured from an upside-down-U-shaped first fixing section 25a and a right-side-up-U-shaped second fixing section 25b that are continuous with each other, the upside-down-U-shaped first fixing section 25a is engaged with and fixed to the horizontal direction support pillar 22 or the diagonal direction support pillar 23, and a trough 10 can be mounted on the right-side-up-U-shaped second fixing section 25b. It is further possible to provide a direction changing structure using the same, and various types of angle members.
H02G 9/04 - Installations de lignes ou de câbles électriques dans ou sur la terre ou sur l'eau dans des canaux en surfaceLeurs canaux ou couvertures
H02G 1/06 - Méthodes ou appareils spécialement adaptés à l'installation, entretien, réparation, ou démontage des câbles ou lignes électriques pour poser les câbles, p. ex. appareils de pose sur véhicule
xy(1-x-y)z(1-z)v(1-v)w(1-w)(1-w) (wherein 0 < v ≤ 1 and 0 ≤ w < 1). The energy at the lower end of a conduction band of the second layer is lower than the energy at the lower end of a conduction band of the first layer. The energy at the upper end of a valence band of the first layer is higher than the energy at the upper end of a valence band of the second layer. The first layer constitutes a quantum well layer for holes, and the second layer constitutes a quantum well layer for electrons.
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
The purpose of the present invention is to provide a cyclic olefin-based polymer resin foamed sheet with which the stability of mechanical properties or thermal properties is maintained and excellent light reflection characteristics, dielectric characteristics (low relative dielectric constant, low dielectric loss tangent), and surface quality are achieved. According to the present invention, a cyclic olefin-based polymer resin foamed sheet is obtained, which is characterized by comprising a cyclic olefin homo-polymer (A), a cyclic olefin copolymer (B), or a mixture of the cyclic olefin homo-polymer (A) and the cyclic olefin copolymer (B) and having an average foam diameter of 1-20 μm. Consequently, a cyclic olefin-based polymer resin foamed sheet having excellent light reflection characteristics, dielectric characteristics (low relative dielectric constant, low dielectric loss tangent), and surface quality can be obtained.
C08J 9/12 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent physique de gonflage
A light diffusion device comprises: an optical transmission cable which transmits a laser beam emitted from a laser oscillator and outputs the transmitted laser beam from an output surface at a leading end thereof; and a covering layer which has a function of absorbing the laser beam and/or a function of diffusing light and which covers the optical transmission cable. The covering layer has a leading end that protrudes in the output direction of light by a length required for cutting off the peripheral portion of said light.
An optical diffusion device for photoimmunotherapy or photodynamic therapy comprises: a light transmission cable which transmits light emitted from a laser oscillator and which outputs the transmitted light from an output surface of a tip end part; a reflection member which has a refraction surface that refracts light output from the output surface; and a resin tube-shaped member into which the light transmission cable and the reflection member are inserted. The refraction surface is disposed in the tube-shaped member at a position which is a prescribed distance from the output surface, is inclined with respect to the axial direction X of the light transmission cable, causes laser light output from the output surface to be inclined by a prescribed angle or greater with respect to the axial direction of the light transmission cable, and outputs the laser light.
A modified polyphenylene ether resin foamed sheet is obtained by foaming modified polyphenylene ether resin including a flame retardant. The modified polyphenylene ether resin foamed sheet has a relative permittivity of 1.10 to 2.00, and a dielectric loss tangent (tan δ) of 0.5×10−3 to 2.5×10−3. Also, a modified polyphenylene ether resin foamed sheet is obtained by foaming modified polyphenylene ether resin foamed resin including both a halogen-based flame retardant of a specified weight-average molecular weight and a phosphorus-based flame retardant, and an average bubble diameter and bubble number density of bubbles in the modified polyphenylene ether resin foamed sheet are within predetermined ranges.
This optical-waveguide-type sensor comprises, e.g.: a core that extends in a prescribed direction and guides inspection light; a cladding that has a lower refractive index than the core and surrounds at least a portion of the outer periphery of the core; and a groove portion that is positioned in a first direction relative to the core such that a seepage component of the inspection light guided by the core leaks out, an end surface of the groove portion being positioned further to a second-direction side than an end portion of the core, the second direction being orthogonal to the first direction. In the optical-waveguide-type sensor, the groove portion may have an inspection region in which the distance between the core and a surface positioned on the first-direction side of the core is equal to or less than a threshold value. This makes it possible to provide a novel and improved optical-waveguide-type sensor and a novel and improved spectroscopic analysis element with which it is possible to, e.g., further enhance manufacturing accuracy.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/126 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré utilisant des effets de polarisation
71.
SEMICONDUCTOR LASER ELEMENT, LASER DEVICE, AND METHOD FOR CONTROLLING SEMICONDUCTOR LASER ELEMENT
A semiconductor laser element according to an aspect of the present invention comprises: an optical resonator having a first reflection portion and a second reflection portion; a gain unit disposed in the optical resonator; and a loss amount control unit provided in the optical resonator and capable of switching between a first state in which an optical loss in the optical resonator is a first loss amount, and a second state in which the optical loss is a second loss amount greater than the first loss amount. In a state in which a predetermined drive current is being supplied to the gain unit, the semiconductor laser element performs laser oscillation when the loss amount control unit is in the first state, and may not perform laser oscillation when the loss amount control unit is in the second state.
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/062 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif en faisant varier le potentiel des électrodes
H01S 5/125 - Lasers à réflecteurs de Bragg répartis [lasers DBR]
72.
OPTICAL SEMICONDUCTOR ELEMENT, OPTICAL SEMICONDUCTOR ELEMENT ARRAY, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR ELEMENT
The present invention includes: a semiconductor substrate; a first semiconductor layer which is doped to have a first conductivity type; an active layer which performs light emission; a second semiconductor layer which is doped to have a second conductivity type; a passivation film which has electrical insulation properties; a first electrode pad and a second electrode pad, which are superposed on the upper surface of the passivation film, with the first electrode pad being electrically connected to the second semiconductor layer via an opening that is provided in the passivation film; and a waveguide which includes the active layer, has a light exit surface on one of end surfaces that surround the active layer, and extends from the light exit surface to an end surface that is opposite to the light exit surface. An electrode contact region that has a depth reaching the first semiconductor layer or the semiconductor substrate from the upper surface is provided. In the electrode contact region, the second electrode pad is connected to the first semiconductor layer or the semiconductor substrate by means of an electrode which is formed on a forward tapered surface having a height difference in a direction that is parallel to the waveguide.
This optical waveguide-type sensor comprises, for example, a core constituting a waveguide for guiding inspection light, a first cladding surrounding the periphery of the core, and a second cladding positioned on the opposite side of the core with respect to the first cladding or in contact with the core, having a refractive index different than the first cladding, and contacted by an inspection target object. In the optical waveguide-type sensor, the refractive index of the first cladding may be higher or lower than the refractive index of the second cladding. The refractive index of the inspection target object may be higher or lower than one of the refractive index of the first cladding and the refractive index of the second cladding. The second cladding may be capable of being adhered along the unevenness of the surface of the inspection target object.
This optical device comprises, for example: a base; a plurality of optical components fixed to the base; an etalon filter serving as an optical component; and an electric heating member integrated with the etalon filter and having a transparent base material which is optically in series with the etalon filter and which transmits light, and a transparent electric heating body which is provided on the surface of the transparent base material, which is optically in series with the etalon filter and the transparent base material, and which transmits light. In the optical device, the transparent electric heating body may be positioned on the side opposite to the etalon filter side with respect to the transparent base material or may be positioned between the transparent base material and the etalon filter.
An optical device (100) comprises, for example: a support member (30) that is integrated with a case (10) in a state of protruding from the case (10) and that is provided with a first opening (30b) through which an optical fiber (20) passes; a sealing material (40) interposed between the support member (30) and the optical fiber (20) within the first opening (30b) of the support member (30); a first coating member (50) surrounding the periphery of the optical fiber (20) in a state of contact with, or distanced from, at least a portion of the coating of the optical fiber (20) on the outside of the case (10) and the outside of the first opening (30b); a second coating member (60) surrounding the periphery of the first coating member (50) in a state of contact with the first coating member (50); and a fixing member (70) for integrating, by joining, the support member (30) and the first coating member (50). Provided along the optical fiber (20) are a first section (S1) in which only the first coating member (50) surrounds the periphery of the coating, and a second section (S2) which is adjacent to the first section (S1) on the side near the support member (30) and in which only the first coating member (50) and the second coating member (60) surround the periphery of the optical fiber (20).
This optical device comprises, for example: a base; a plurality of optical components fixed to the base; an etalon filter serving as an optical component; and a heater wiring layer that is provided in a position outside a light passage region on the surface of the etalon filter and that generates heat when energized. In the optical device, the heater wiring layer may be provided to an end surface constituting a surface and through which light passes, may be provided to a lateral surface constituting a surface and through which light does not pass, may have a bent portion on the surface, or may extend so as to at least partially surround the passage region.
Provided is an adhesive tape for wafer processing that, even after an adhesive used to bond a support member onto a wafer has been dissolved using a solvent to peel away the support member or wash off the adhesive remaining on the wafer, can appropriately retain the wafer and prevent a decrease in yield due to contamination of the wafer. The adhesive tape for wafer processing also makes it possible to, in a favorable manner, divide the wafer using laser light, inspect the state of a chip, or perform laser marking, through the adhesive tape. The present invention is an adhesive tape for wafer processing, comprising a substrate film and at least one adhesive layer formed on the substrate film, said adhesive tape being characterized in that: the adhesive layer is formed from an adhesive layer composition that includes an acrylic polymer or a polyester polymer as a base polymer; the glass transition temperature of the base polymer is −45°C or higher; and the parallel transmittance of light in the 1064 nm wavelength range that enters from the substrate film side is at least 90%.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 167/00 - Adhésifs à base de polyesters obtenus par des réactions créant une liaison ester carboxylique dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
Provided is an electronic component temporary fixing member capable of reducing residue of the electronic component temporary fixing member on a support when the support is released from the electronic component temporary fixing member. This electronic component temporary fixing member comprises: a core material; a release layer provided on a first surface of the core material; and an adhesive layer provided on a second surface facing the first surface of the core material. The release layer contains a filler. The electronic component temporary fixing member has a site where the area ratio of the filler in a cross-section in a vertical direction with respect to the first surface of the release layer is 8.0% to 92%.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
C09J 7/25 - Matières plastiquesMatières plastiques métallisées à base de composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A semiconductor optical element (100) comprises a substrate (1) having an insulating region (1b) on a main surface (1c), an n-type semiconductor part (2) positioned on the insulating region (1b), an active region (3) positioned on the insulating region (1b) so as to be adjacent to the n-type semiconductor part (2) in a first direction along the main surface (1c) and having a well layer (3a) and a barrier layer (3b) alternately arranged in the first direction, a p-type semiconductor part (4) positioned on the insulating region (1b) so as to be adjacent to the active region (3) on the reverse side from the n-type semiconductor part (2) in the first direction, an n-side electrode (6) electrically connected to the n-type semiconductor part (2), and a p-side electrode (7) electrically connected to the p-type semiconductor part (4).
Provided is an adhesive tape for wafer processing, wherein even when the adhesive tape is used in a wafer processing step using a support member, an adhesive that attached the support member to a wafer can be dissolved using a solvent, the wafer can be held properly even after the support member is released or the adhesive remaining on the wafer is cleaned off, and thus a decrease in yield due to wafer contamination can be prevented. This adhesive tape for wafer processing comprises at least a substrate film, a first adhesive layer, and a second adhesive layer laminated in this order, wherein the first adhesive layer is formed of an adhesive composition containing an acrylic polymer or a polyester-based polymer as a base polymer, and the glass transition temperature of the base polymer is -20°C or higher.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 167/00 - Adhésifs à base de polyesters obtenus par des réactions créant une liaison ester carboxylique dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
The present invention pertains to a busbar laminate (10) comprising: a first busbar structure (11) including at least one layer of a plate-like busbar having a predetermined width and extending in a lengthwise direction; and a second busbar structure (12) provided on the first busbar structure (11) and having a branch structure which extends in a direction different from the lengthwise direction via a branch part relative to the lengthwise direction of the first busbar structure (11). The second busbar structure (12) has an overlapped part (13) in which the first busbar structure (11) and the second busbar structure (12) overlap with each other in the thickness direction, and which has a predetermined width and extends parallel to the lengthwise direction of the first busbar structure (11). The overlapped part (13) has a welded part extending in the thickness direction such that the first busbar structure (11) and the second busbar structure (12) are welded to each other, and the branch part includes a part or the whole of the welded part.
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
An optical waveguide, which is to be optically connected to an optical connector to be connected, is disposed at a substantial center of a width direction of an optical connector. Also, magnets are disposed on both sides of the width direction of the optical connector with the optical waveguide in between. Polarities of the magnets disposed adjacent to each other in the one optical connector and in the other optical connector, which is adjacent to the one optical connector, are different from one another. When connecting the one optical connector to another optical connector, the magnets of the one optical connector and magnets of the other optical connector can attract each other to be connected, and it is also possible to cause the magnets of the other optical connector adjacent to the magnets of the one optical connector to repel the magnet of the other optical connector.
The present invention is a method for welding a bus bar (6), the method comprising: a step for preparing the bus bar (6), the bus bar (6) having a first flat surface part (2), a curved part (5), and a second flat surface part (1) in this order in the longitudinal direction; a step for bringing a joint surface (4) of a joined body (3) into contact with the first flat surface part (2) of the bus bar (6); and a step for joining the bus bar (6) and the joined body (3) by subjecting a groove part (7) to laser irradiation for butt welding, the groove part (7) being constituted by the joint surface (4) of the joined body (3) and the curved part (5) of the bus bar (6).
H01R 43/02 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour connexions soudées
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
84.
CATALYST FOR LIQUEFIED PETROLEUM GAS SYNTHESIS, AND METHOD FOR PRODUCING LIQUEFIED PETROLEUM GAS
This catalyst for liquefied petroleum gas synthesis includes a Cu—Zn based catalytic material and an MFI type zeolite catalytic material supporting Pt, the Cu—Zn based catalytic material containing copper oxide, zinc oxide, aluminium oxide, and zirconium oxide, a mass (M(ZrO2)) of zirconium oxide in the Cu—Zn based catalytic material being more than 0 mass % and 6.5 mass % or less based on a mass (M1) of the Cu—Zn based catalytic material, and the MFI type zeolite catalytic material containing more than 0 mass % and less than 4.5 mass % of P.
B01J 23/80 - Catalyseurs contenant des métaux, oxydes ou hydroxydes métalliques non prévus dans le groupe du cuivre ou des métaux du groupe du fer en combinaison avec des métaux, oxydes ou hydroxydes prévus dans les groupes avec du zinc, du cadmium ou du mercure
C07C 1/04 - Préparation d'hydrocarbures à partir d'un ou plusieurs composés, aucun d'eux n'étant un hydrocarbure à partir d'oxydes de carbone à partir de monoxyde de carbone avec de l'hydrogène
85.
OPTICAL FIBER PREFORM AND METHOD OF MANUFACTURING OPTICAL FIBER PREFORM
The present invention intends to suppress variation in characteristics in the longitudinal direction of the optical fiber preform. The method of manufacturing method of manufacturing an optical fiber preform including forming a core by blowing a first raw material gas from a core burner to a starting base material, and forming a first clad by blowing a second raw material gas from a clad burner to the core, after forming the first clad, forming a second clad by blowing a third raw material gas from the clad burner to an end portion of the core, forming a core rod by heating the first clad and the second clad, and forming a third clad on an outer periphery of the core rod.
This optical interferometer comprises: a broadband light source that outputs first light for which relative intensity noise (RIN) in a prescribed frequency domain has been suppressed; a wavelength divider that wavelength-divides the first light into a first component and a second component having a different center wavelength from the first component and outputs the components; a first optical path through which the first component output from the wavelength divider propagates; a second optical path through which the second component output from the wavelength divider propagates; and a wavelength combiner that combines the first component that has propagated through the first optical path with the second component that has propagated through the second optical path, and outputs the combined components as second light.
The present invention relates to a magnetic disk substrate and a magnetic disk having a flatness of 40 μm or less, in which the mid-frequency Wq (root mean square waviness) is 7 μm or less and the mid-frequency TIR (difference between maximum and minimum) is 10 μm or less.
09 - Appareils et instruments scientifiques et électriques
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Anchors of metal; keys of metal; stoppers of metal;
water-pipes of metal; boxes of common metal; metal junctions
for pipes; nuts of metal; copper foils; tin foils; ferrules
of metal for walking sticks; prefabricated building assembly
kits of metal; hardware of metal, small; bottle fasteners of
metal; iron and steel; metal safes; boards of metal for
shelves; hinges of metal; wire nets and gauzes; nonferrous
metals and their alloys; metal lids and caps for industrial
packaging containers; springs of metal, not machine
elements; metal flanges; wire rope; shutters of metal;
ceilings of metal; water tanks of metal for household
purposes; locks of metal; door nameplates of metal; spurs of
metal; metal materials for building or construction; ores of
metal; bolts of metal. Measuring or testing machines and instruments; batteries and
cells; computer hardware; light-emitting diodes [LED];
semi-conductors; integrated circuits; printed circuit
boards; disc memories; photodiodes; electronic components;
laboratory apparatus and instruments; resistance wires;
power distribution or control machines and apparatus; phase
modifiers; electric wire harnesses for automobiles;
processed optical glass, not for building purposes; magnetic
cores; optical machines and apparatus; electric wires and
cables; connectors for electric wire; optical-fiber cables;
telegraph wires; telephone wires; junction sleeves for
electric cables; terminal boxes; telecommunication cables;
bare electrical wires; power cables; optical-fiber
connectors; optical connectors; fiber optic cables for
optical connectors; rubber covered electrical wires; plastic
covered electric wires; electricity conduits; electric or
magnetic meters and testers; electrodes, other than welding
electrodes or medical electrodes; telecommunication machines
and apparatus; electronic controls for automobiles; LCD
panels; junction boxes [electricity]; DC/DC converters;
cooling apparatus for telecommunication apparatus; cooling
apparatus for computers; internal cooling fans for computers
and electronics; heat sinks for use in computers and
electronics; heat sinks for semiconductor devices; central
processing unit coolers; solar batteries; personal digital
assistants and their parts and fittings; recorded or
downloadable application software for smartphones, mobile
phones, personal digital assistants and computers; recorded
or downloadable computer software applications; computer
peripheral devices; dust masks; gas masks; welding masks;
fireproof garments; gloves for protection against accidents;
spectacles and their parts and fittings; downloadable audio,
music, images, videos and text files; data carriers recorded
with audio, music, images, videos and text; electronic
publications, downloadable; apparatus for supplying
electricity; lasers, not for medical purposes; measuring or
testing machines and instruments using lasers; ozonizers for
calibration purposes; electrolysers for laboratory use;
photographic machines and apparatus, and their parts and
fittings; cinematographic machines and apparatus, and their
parts and fittings; insulating rubber gloves for protection
against electrical shock. Aircraft and their parts and fittings; non-electric prime
movers for land vehicles, not including their parts;
mechanical elements for land vehicles; anti-theft alarms for
vehicles; two-wheeled motor vehicles and bicycles, and their
parts and fittings; vessels and their parts and fittings;
railway rolling stock and their parts and fittings;
automobiles and their parts and fittings; adhesive rubber
patches for repairing tubes or tires; AC motors or DC motors
for land vehicles, not including their parts; traction
engine; aerial ropeways for handling loads. Plastic film for agricultural purposes; threads of rubber,
other than for textile use; gaskets; ebonite; joint
packings; celluloids, semi-worked; electrical insulating
materials; rubber, raw or semi-worked; substitutes for
rubber; hard rubber; soundproofing materials of rock wool,
not for building purposes; industrial packaging containers
of rubber; rubber lids and caps for industrial packaging
containers; rubber tubes and pipes; gutta-percha; junctions
for pipes, not of metal; plastic semi-worked products; mica,
raw or partly processed; rubber stoppers.
The present invention relates to a disk blank for a magnetic disk, wherein F2-F1, which is the difference between flatness F1 before performing a heat treatment at 300°C for one hour and flatness F2 after performing the heat treatment at 300°C for one hour, satisfies -5 μm ≤ (F2-F1) ≤ 5 μm. The present invention also relates to a magnetic disk wherein F4-F3, which is the difference between flatness F3 before performing the heat treatment at 300°C for one hour and flatness F4 after performing the heat treatment at 300°C for one hour, satisfies -5 μm ≤ (F4-F3) ≤ 5 μm.
09 - Appareils et instruments scientifiques et électriques
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Anchors of metal; keys of metal; stoppers of metal;
water-pipes of metal; boxes of common metal; metal junctions
for pipes; nuts of metal; copper foils; tin foils; ferrules
of metal for walking sticks; prefabricated building assembly
kits of metal; hardware of metal, small; bottle fasteners of
metal; iron and steel; metal safes; boards of metal for
shelves; hinges of metal; wire nets and gauzes; nonferrous
metals and their alloys; metal lids and caps for industrial
packaging containers; springs of metal, not machine
elements; metal flanges; wire rope; shutters of metal;
ceilings of metal; water tanks of metal for household
purposes; locks of metal; door nameplates of metal; spurs of
metal; metal materials for building or construction; ores of
metal; bolts of metal. Measuring or testing machines and instruments; batteries and
cells; computer hardware; light-emitting diodes [LED];
semi-conductors; integrated circuits; printed circuit
boards; disc memories; photodiodes; electronic components;
laboratory apparatus and instruments; resistance wires;
power distribution or control machines and apparatus; phase
modifiers; electric wire harnesses for automobiles;
processed optical glass, not for building purposes; magnetic
cores; optical machines and apparatus; electric wires and
cables; connectors for electric wire; optical-fiber cables;
telegraph wires; telephone wires; junction sleeves for
electric cables; terminal boxes; telecommunication cables;
bare electrical wires; power cables; optical-fiber
connectors; optical connectors; fiber optic cables for
optical connectors; rubber covered electrical wires; plastic
covered electric wires; electricity conduits; electric or
magnetic meters and testers; electrodes, other than welding
electrodes or medical electrodes; telecommunication machines
and apparatus; electronic controls for automobiles; LCD
panels; junction boxes [electricity]; DC/DC converters;
cooling apparatus for telecommunication apparatus; cooling
apparatus for computers; internal cooling fans for computers
and electronics; heat sinks for use in computers and
electronics; heat sinks for semiconductor devices; central
processing unit coolers; solar batteries; personal digital
assistants and their parts and fittings; recorded or
downloadable application software for smartphones, mobile
phones, personal digital assistants and computers; recorded
or downloadable computer software applications; computer
peripheral devices; dust masks; gas masks; welding masks;
fireproof garments; gloves for protection against accidents;
spectacles and their parts and fittings; downloadable audio,
music, images, videos and text files; data carriers recorded
with audio, music, images, videos and text; electronic
publications, downloadable; apparatus for supplying
electricity; lasers, not for medical purposes; measuring or
testing machines and instruments using lasers; ozonizers for
calibration purposes; electrolysers for laboratory use;
photographic machines and apparatus, and their parts and
fittings; cinematographic machines and apparatus, and their
parts and fittings; insulating rubber gloves for protection
against electrical shock. Aircraft and their parts and fittings; non-electric prime
movers for land vehicles, not including their parts;
mechanical elements for land vehicles; anti-theft alarms for
vehicles; two-wheeled motor vehicles and bicycles, and their
parts and fittings; vessels and their parts and fittings;
railway rolling stock and their parts and fittings;
automobiles and their parts and fittings; adhesive rubber
patches for repairing tubes or tires; AC motors or DC motors
for land vehicles, not including their parts; traction
engine; aerial ropeways for handling loads. Plastic film for agricultural purposes; threads of rubber,
other than for textile use; gaskets; ebonite; joint
packings; celluloids, semi-worked; electrical insulating
materials; rubber, raw or semi-worked; substitutes for
rubber; hard rubber; soundproofing materials of rock wool,
not for building purposes; industrial packaging containers
of rubber; rubber lids and caps for industrial packaging
containers; rubber tubes and pipes; gutta-percha; electrical
insulating rubber gloves; junctions for pipes, not of metal;
plastic semi-worked products; mica, raw or partly processed;
rubber stoppers.
A metal foil laser cutting method includes: intermittently irradiating a metal foil that forms an electrode of a battery and that serves as a workpiece with a pulse of a laser light of which energy per pulse is 2 mJ or more and 100 mJ or less and of which rise time is 2 μs or shorter to laser cut the workpiece.
This insulating resin composition for electric power cable includes a component (a), a component (b), a component (c), and a component (d), in which the component (a) is polypropylene, the component (b) is an elastomer, the component (c) is at least one type of resin selected from a resin (c1) and a resin (c2), the resin (c1) being a resin in which at least one type of modified monomer selected from unsaturated organic acid and derivative thereof is grafted, and the resin (c2) being at least one type of ethylene-based copolymer selected from an ethylene-acrylate copolymer, ethylene-acrylic acid copolymer, and ethylene-vinyl acetate copolymer, and the component (d) is a water tree retardant.
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines vinyliquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
The present invention intends to provide a magnetic disk that is flat while being thin and hardly causes physical errors.
The present invention intends to provide a magnetic disk that is flat while being thin and hardly causes physical errors.
The present invention provides a magnetic disk having a hole in the center, a thickness of 0.60 mm or less, TIRs on circles having different radial distances r1 (mm) and r2 (mm) denoted by TIR1 (μm) and TIR2 (μm), and an amount of radial variation ΔTIR for TIRs of 0.50 μm/mm or less in an outer circumferential region of the magnetic disk with r/R=0.70 to 0.99, where “R” is a disk radius (mm), “r” is a radial distance (mm) measured from the disk center, and the ΔTIR is represented by an absolute value |(TIR1−TIR2)/(r1−r2)| of the ratio of the difference (TIR1−TIR2) between the TIR1 and the TIR2 to the difference (r1−r2) between r1 and r2 of the magnetic disk.
Provided are a copper alloy sheet material which has exceptional drawing workability and from which it is possible to obtain a drawn product having exceptional dimensional accuracy, a copper alloy sheet material for drawing, and a drawn product having exceptional dimensional accuracy. This copper alloy sheet material has an alloy composition containing 1.00-5.00 mass% of Ni, 0.02-1.50 mass% of Si, and a total of 0-1.00 mass% of at least one element selected from the group consisting of Sn, Zn, Mg, Fe, and Cr, the balance being Cu and unavoidable impurities. The area ratio of a crystal orientation region within 20° from a {111} <112> orientation obtained by measurement performed using an EBSD method on a surface of the copper alloy sheet material is 3.0% or greater.
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
C22C 9/10 - Alliages à base de cuivre avec le silicium comme second constituant majeur
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
95.
ANIMAL BEHAVIOR RECORDING DEVICE, ANIMAL BEHAVIOR RECORDING METHOD, AND PROGRAM
NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY (Japon)
Inventeur(s)
Nakai, Yukako
Odaka, Kunio
Kise, Tomofumi
Fukushima, Masayuki
Narui, Hirokazu
Ishii, Takayuki
Yamasaki, Miku
Ueda, Koichiro
Abrégé
This animal behavior recording device is provided with a processing unit which acquires animal behavior information, that is, information indicating the behavior of an animal, acquires animal position information, that is, information indicating the positions where the animal is present, estimates the behavior of the animal on the basis of the animal behavior information and the animal position information, and records the behavior in time series. Acceleration data acquired from an acceleration sensor disposed on the animal and/or angular velocity data acquired from an angular velocity sensor disposed on the animal can be used as the animal behavior information, and the processing unit is capable of estimating the behavior of the animal on the basis of one of the animal behavior information and the animal position information and correcting the estimated behavior by using the other information.
An animal appearance determination device comprises: an image data analysis unit which acquires a captured image including cattle being raised in a cattle barn and acquires, as first positional information, a position of an individual cattle in the cattle barn calculated on the basis of an image of the individual cattle in the captured image; a positional data analysis unit which acquires identification information obtained from a sensor device attached to the individual cattle and second positional information indicative of the position of the individual cattle in the cattle barn; and an individual recognition unit which, if the difference between the first positional information and the second positional information is determined to be not more than a predetermined threshold, records the first positional information and the identification information on the second positional information in association with the each other.
This optical fiber comprises: a core part (11, A11) to which an alkaline metal or an alkaline-earth metal is added in a distribution in a radial direction having a first peak (P1) in a center or near the center; and a cladding part (12, A12) which surrounds the outer periphery of the core part and has an average refractive index lower than the maximum refractive index of the core part, and to which an alkaline metal or alkaline-earth metal is added in a distribution in the radial direction having at least a second peak (P2) at any position in the radial direction. The maximum value of the inclination of the distribution curve of virtual temperature in the radial direction may be 4°C/μm or less.
This underwater power supply system comprises, for example: an output device having an output window through which laser light that is output into water is transmitted; and a light receiving device having an input window through which the laser light propagated underwater via the output window is transmitted, and a photoelectric conversion unit that converts the energy of the laser light transmitted through the input window into electric energy. The wavelength of the laser light propagated underwater may be 200 [nm] to 600 [nm] inclusive. The output device may be installed on a fixed body fixed to the bottom of water, and the light receiving device may be installed on a moving body that moves underwater or on water.
This laser device is accommodated in, for example, an immersion tank that accommodates a cooling liquid, and comprises a plurality of components that are thermally connected to the cooling liquid. The plurality of components include a plurality of semiconductor light sources that each output a laser beam, and an optical combiner that combines the laser beams output from the plurality of semiconductor light sources. The plurality of components may include an optical amplification fiber that is excited by the laser beam from the optical combiner, and may also include a drive circuit that drives the plurality of semiconductor light sources. The laser device may be configured to be attachable to and detachable from the immersion tank, and may be configured to be able to be taken in and out of the immersion tank from an upper opening of the immersion tank.
A data collection device comprises: a data acquisition unit that continuously acquires position information indicating an activity amount of a cow; an identification unit that analyzes the position information of a prescribed time zone and identifies a trend pertaining to changes over time in the activity amount; and a data acquisition amount adjustment unit that adjusts the amount of acquired position information on the basis of the identified trend pertaining to changes over time in the activity amount. The data acquisition unit acquires the position information in line with the acquisition amount adjusted by the data acquisition amount adjustment unit.
