Provided are an ultrasonic fingerprint recognition module (100) and a method for preparing same, and an electronic device. The ultrasonic fingerprint recognition module (100) comprises: a substrate (110); and a piezoelectric composite layer (130) arranged on the substrate (110), wherein the piezoelectric composite layer (130) comprises a polymer thin film layer (131) arranged on the substrate (110) and piezoelectric ceramic powder particles (133) dispersed in the polymer thin film layer (131). In the ultrasonic fingerprint recognition module (100), the piezoelectric constant of the piezoelectric composite layer (130) can be increased without reducing the flexibility of the piezoelectric composite layer (130), and thus, the signal-to-noise ratio of the ultrasonic fingerprint recognition module (100) and the recognition performance of the ultrasonic fingerprint recognition module (100) can be improved without changing the thickness of the piezoelectric composite layer (130).
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 41/18 - Emploi de matériaux spécifiés pour des éléments piézo-électriques ou électrostrictifs
H01L 41/257 - Traitement de dispositifs ou de leurs parties constitutives afin de modifier une propriété piézo-électrique ou électrostrictive, p.ex. les caractéristiques de polarisation, de vibration ou par réglage du mode par polarisation
The present application provides a display screen assembly and an electronic device. The display screen assembly of the present application comprises an infrared light source, a backlight module, a display screen, and an infrared receiver. The backlight module comprises a frame. The frame is provided with an accommodation chamber and a light outlet communicating with the accommodation chamber. The light outlet is in alignment with the display screen. The backlight module provides visible light to the display screen. The infrared light source is disposed in the accommodation chamber, and is used to emit infrared light. The infrared receiver is disposed in the display screen, and is used to receive infrared light reflected back by a living body at a side of the display screen facing away from the backlight module. The display screen assembly of the present application has a compact structure, occupies a small space, and enables full-screen display.
A microlens array (100), comprising at least one basic lens (10) and at least one anamorphic lens (20). The basic lens (10) is constructed as a rectangular lens, and a plurality of anamorphic lenses (20) each perform zoom-in or zoom-out in proportion to the basic lens (10). The basic lens (10) and the anamorphic lens (20) are arranged in a non-periodic manner to form the microlens array (100) having a rectangular contour. The microlens array (100) is convenient to arrange and simple to manufacture, can effectively solve the problem of ghosting, and has a good optical effect.
An optical module (100) and under-screen fingerprint identification apparatus (10) and terminal (1), which belong to the technical field of optics. The optical module (100) comprises an optical sensor (110) and a substrate (120), provided on one side of a photosensitive surface (111) of the optical sensor (110); the substrate (120) has a first surface (121) facing away from the optical sensor (110) and a second surface (122) facing the optical sensor (110); the first surface (121) has multiple micro lenses (1211); the second surface (122) has a light-shielding layer (1221); the light-shielding layer (1221) has multiple light-passing holes (1222), and the light-passing holes (1222) correspond one-to-one to the micro lenses (1211). The maximum diameter of the orthographic projection of each micro lens (1211) on the first surface (121) is less than 20μm, and the aperture of each light-passing holes (1222) is less than 10 μm. The present design can make the light reaching the optical sensor (110) converge by means of the micro lens (1211), and can filter out stray light, and thus the image quality is good. The total thickness of the optical module (100) can reach 0.1 mm, and thus, while ensuring good image quality, the optical module (100) can be made lighter and thinner.
The present application relates to an anti-interference modulation method and apparatus for a TOF module, a computer device, and a storage medium. The method comprises: receiving a modulation instruction, extracting, from a preset database, modulation data corresponding to the modulation instruction, and burning the modulation data to a TOF module to be modulated, so as to modulate said TOF module to obtain a modulated TOF module; controlling a transmitting module of the modulated TOF module to transmit a modulation optical signal corresponding to the modulation data to a target object; a receiving module of the modulated TOF module receiving a reflected optical signal from the target object, and acquiring data information of the reflected optical signal; determining whether the data information of the reflected optical signal and the extracted modulation data comply with a preset error condition; when the data information of the reflected optical signal and the extracted modulation data comply with the preset error condition, outputting an anti-interference modulation success prompt; and when the data information of the reflected optical signal and the extracted modulation data do not comply with the preset error condition, repeatedly executing the steps.
A TOF camera (100) and an electronic device. The TOF camera (100) comprises a light emission module (10), a lens module (20), a reflection piece (30), a rotating module (40) and an image processing module (50). The rotating module (40) drives the reflection piece (30) to rotate. The image processing module (50) receives images collected by the lens module (20) to perform splicing processing, so as to acquire a complete image of a photographed object (60). The minimum distance between a region boundary of a reflection surface (31) of the reflection piece (30) within a field of view range of the lens module (20) and a circumferential edge of the reflection surface (31) is not less than 0.2 mm. The reflection piece (30) reflects natural light and modulated light into the lens module (20) multiple times, and no further processing is performed on the image, such that the number of pixels of a single partial image of the photographed object is higher; in addition, the distance between the region boundary of the reflection surface (31) within the field of view range of the lens module (20) and the edge of the reflection surface (31) is not less than 0.2 mm, which ensures that the reflection piece (30) fully reflects the natural light and modulated light, thereby guaranteeing the quality of the image formed by the lens module (20).
H04N 13/204 - Générateurs de signaux d’images utilisant des caméras à images stéréoscopiques
H04N 13/218 - Générateurs de signaux d’images utilisant des caméras à images stéréoscopiques utilisant un seul capteur d’images 2D utilisant le multiplexage spatial
Disclosed are a fingerprint module (20) and an electronic device (100). The fingerprint module (20) comprises a circuit board (21), an adhesive (23) and a sensing chip (22), wherein the circuit board (21) is provided with a chip mounting area (211) and an accommodating portion (212) arranged around the chip mounting area (211), the sensing chip (22) is arranged in the chip mounting area (211), and the adhesive (23) is arranged on the accommodating portion (212) and is connected to the periphery of the sensing chip (22). The fingerprint module (20) avoids the problems of the complex structure and high production cost of an existing fingerprint module.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
A fingerprint module and an electronic device. A fingerprint module comprises a lens (100), a support frame (110), a fingerprint recognition chip (120), wherein the lens (100) is carried on the support frame (110), a support frame (110) is carried on the fingerprint recognition chip (120), the support frame (110) comprises a cover plate (111) and a first peripheral side wall (112) bent and extended from the periphery of the cover plate (111), wherein the first peripheral side wall (112) comprises a side wall body (112a) and a connecting portion (112b) bent and connected to the side wall body (112a), one end, away from the cover plate (111), of the connecting portion (112b) abuts against the surface, close to the cover plate (111), of the fingerprint recognition chip (120), and forms an accommodating space (121) with at least one of the connecting portion (112b) and the fingerprint recognition chip (120), wherein the accommodating space (121) is used for arranging an adhesive member (130), and the connecting portion (112b) and the fingerprint recognition chip (120) are connected by the adhesive member (130). In the fingerprint module, the connecting portion (112b) abuts against the fingerprint recognition chip (120), meanwhile, the fixed connecting portion (112b) and the fingerprint recognition chip (120) are bonded by the adhesive member (130) in the accommodation space (121), thereby reducing influence parameters when adjusting the distance from the center of the lens (100) to the surface of the fingerprint recognition chip (120) to reach a desired distance value, and improving the controllability of the desired distance value.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
9.
PRECISION MEASUREMENT METHOD FOR TOF MODULE, APPARATUS, AND DEVICE
The present application relates to a precision measurement method for a TOF module, an apparatus, and a device. The method comprises the steps of: controlling a transmitting unit of a TOF module to transmit light to an incidence fiber; obtaining a sample image captured by a receiving unit of the TOF module by using light reflected from each branch fiber, and obtaining a depth distance value in the sample image; comparing the depth distance value with the optical path length of each branch fiber to obtain a comparison result; and obtaining a precision value of the TOF module according to the comparison result.
A microlens array element, a diffuser and an electronic device. The microlens array element comprises: a substrate, a side surface of the substrate being provided with a microlens array composed of a plurality of microlenses, the microlenses being aspheric microlenses, and the curved surfaces of the aspheric microlenses facing away from the substrate being circularly symmetrical curved surfaces. Thus, by reasonably setting parameters of the curved surfaces of the microlenses, the illumination distribution of the microlenses can be more uniform, thereby guaranteeing the imaging quality of an electronic element provided with the microlens array element.
G02B 3/04 - Lentilles simples ou composées à surfaces non sphériques à surfaces continues engendrées par une rotation autour d'un axe, mais s'écartant d'une véritable sphère
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
11.
LIGHT EMITTING MODULE, DEPTH CAMERA AND ELECTRONIC DEVICE
A light emitting module (100), a depth camera (1000) and an electronic device. The light emitting module (100) comprises a vertical-cavity surface-emitting laser (10) and a light homogenizer (20). The vertical-cavity surface-emitting laser (10) is used for emitting first rays (91) to the light homogenizer (20). The light homogenizer (20) is used for diffusing the first rays (91) and uniformly emitting second rays (92) to a target object (200). The vertical-cavity surface-emitting laser (10) comprises a plurality of light emitting units (11). The light homogenizer (20) is provided with a plurality of micro-lenses (21). The plurality of light emitting units (11) and/or the plurality of micro-lenses (21) are randomly arranged. By reasonably configuring the structures of the vertical-cavity surface-emitting laser (10) and the light homogenizer (20), the light emitting module (100) can emit the second rays (92) capable of collecting information of the target object (200), and the random arrangement of the plurality of light emitting units (11) and/or the plurality of micro-lenses (21) avoids resonance to improve and eliminate stripes of projected light spots, thereby improving the precision of the obtained depth information and the overall uniformity of images. The method can be applied to TOF high-precision application scenarios.
G01C 11/14 - Restitution des photos par comparaison de plusieurs photos de la même zone les photos étant placées dans la même position relative qu'au moment où elles ont été prises avec projection optique
G01B 11/22 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la profondeur
12.
ULTRASONIC FINGERPRINT MODULE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
An ultrasonic fingerprint module (100), a manufacturing method therefor, and an electronic device. The ultrasonic fingerprint module (100) comprises an ultrasonic detection layer (10) and a reflection layer (20). The ultrasonic detection layer (10) has an ultrasonic receiving surface (11). The reflection layer (20) is provided on one surface of the ultrasonic detection layer (10) located away from the ultrasonic receiving surface (11). The reflection layer (20) is used to reflect ultrasonic waves emitted from the ultrasonic detection layer (10). The reflection layer (20) comprises a defoamer used to remove bubbles in the reflection layer (20) during manufacturing, and remove bubbles in the finally formed reflection layer (20). The defoamer removes the bubbles in the reflection layer (20) so as to reduce a surface roughness of the reflection layer (20), thereby ensuring that the reflection layer (20) reflects an ultrasonic signal uniformly, and improving fingerprint recognition efficiency of the ultrasonic fingerprint module (100).
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
13.
ULTRASONIC FINGERPRINT MODULE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
An ultrasonic fingerprint module (100), a manufacturing method therefor, and an electronic device. The ultrasonic fingerprint module (100) comprises an ultrasonic detection layer (10) and a reflective layer (20); the ultrasonic detection layer (10) has an ultrasonic receiving surface (11), and the reflective layer (20) is disposed on a surface of the ultrasonic detection layer (10) away from the ultrasonic receiving surface (11). The reflective layer (20) is used to reflect ultrasonic waves emitted from the ultrasonic detection layer (10), and the reflective layer (20) comprises a leveling agent. The leveling agent is used to improve surface leveling in the manufacturing process of the reflective layer (20), and improve the levelness of a surface of a finally formed reflective layer (20). The reflective layer (20) can be used to reflect ultrasonic waves emitted from the ultrasonic detection layer (10) toward a fingerprint to be detected so that an ultrasonic signal received by the fingerprint to be detected is strengthened, thus the strength of an ultrasonic signal emitted by the ultrasonic fingerprint module (100) toward the fingerprint to be detected is increased, and fingerprint recognition efficiency is improved.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
14.
SUPPORT STRUCTURE AND FLEXIBLE PRINTED CIRCUIT BOARD
The present application relates to an electronic device and a camera module therefor. The camera module comprises a lens as well as a photosensitive element and a reflective prism provided on opposite sides of the lens, and also comprises a first direction anti-shake structure and a second direction anti-shake structure respectively configured to drive the photosensitive element to rotate about a first axis and to drive the photosensitive element to translate along a second axis perpendicular to the first axis, as well as a third direction anti-shake structure configured to drive the reflective prism to rotate around a rotating shaft parallel to the second axis, the axis of the rotating shaft being parallel to the light incident surface.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
An ultrasonic fingerprint module (100), a fabrication method therefor and an electronic device. The ultrasonic fingerprint module (100) comprises an ultrasonic detection layer (10) and an ink layer (20); the ultrasonic detection layer (10) has an ultrasonic receiving surface (11); the ink layer (20) is provided on the side of the ultrasonic detection layer (10) far from the ultrasonic receiving surface (11); the ink layer (20) is used to reflect ultrasonic waves emitted by the ultrasonic detection layer (10); the ink layer (20) contains a resin material and carbon powder particles; the average particle size of the carbon powder particles is 0.5 microns to 5 microns; and the mass ratio of the carbon powder particles is 2.5% to 15%. The ink layer (20) may reflect the ultrasonic waves emitted from the ultrasonic detection layer (10) toward a fingerprint to be detected, so that an ultrasonic signal received by the fingerprint is strengthened, thereby improving the strength of the ultrasonic signal emitted by the ultrasonic fingerprint module (100) toward the fingerprint, and improving the efficiency of fingerprint recognition.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
16.
OPTICAL DIFFUSER, LIGHT EMITTING MODULE, MOBILE TERMINAL, AND METHOD FOR MANUFACTURING OPTICAL DIFFUSER
An optical diffuser (30), a light emitting module (1), a mobile terminal, and a method for manufacturing the optical diffuser. The optical diffuser (30) comprises: a diffusion sheet (100); and an ITO layer (200), disposed inside the diffusion sheet (100).
Disclosed are a projection module, a structured light three-dimensional imaging device, and an electronic apparatus. The projection module includes a laser emitter and a reflective grating. The laser emitter includes a light emitting surface from which laser light is emitted. The reflective grating includes a reflecting surface arranged obliquely relative to the light emitting surface and opposite to the light emitting surface. The reflective face is provided with a grating microstructure thereon. The projection module can adjust a reflection angle of the laser light when expanding beams to generate a laser pattern.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
Provided are a display screen (100), a display assembly (200), and an electronic device (300). The display screen (100) comprises a first display layer (10) and a second display region (40); the first display layer (10) and the second display region (40) are arranged spaced apart; the first display layer (10) is provided with a plurality of spaced light transmission points (11), and after light is projected onto the first display layer (10), it can pass through the light transmission points (11); the second display region (40) comprises a plurality of display compensation points (41); the display compensation points (41) are disposed at positions corresponding to the light transmission points (11), and each display compensation point (41) at least covers the corresponding light transmission point (11); the display content of the display region of the first display layer (10) and the display content of the display compensation point (41) of the second display region (40) fit with each other, and are used for causing the display screen (100) display completely; the region of the second display region (40) other than that which displays the compensation points (41) can transmit light. The display screen (100) can implement full-screen display.
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
Provided are an ultrasonic detection module and an electronic device. The ultrasonic detection module comprises an ultrasonic sensor, a first thin film assembly, a second thin film assembly and a cover plate which are sequentially arranged in a stacked manner, wherein the ultrasonic sensor is used for transmitting an ultrasonic signal to the cover plate, and is used for receiving an ultrasonic signal reflected back by a target object; the first thin film assembly is used for weakening or eliminating at least one of contour marks and wrinkle marks generated on the second thin film assembly when the ultrasonic sensor is attached; and the second thin film assembly is used for displaying a preset color. According to the ultrasonic detection module in the present application, attachment marks caused by the presence of attachment stress and different shrinkage rates of film layers in the second thin film assembly can be eliminated or weakened, and wrinkles generated by the film layers in the second thin film assembly due to the cure shrinkage of glue are also avoided.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques Détails
A lens (100), which comprises a mounting surface (6), a light incident surface (5), a first light-emitting surface (1), a second light-emitting surface (2) and a reflecting surface (3), wherein the mounting surface (6) is used for mounting the lens (100), a light source cavity (50) is provided in the center of the mounting surface (6), the light source cavity (50) is used for accommodating a light source (200), the inner surface of the light source cavity (50) is a light incident surface (5), one end of the first light-emitting surface (1) is connected with the mounting surface (6), the other end of the first light-emitting surface (1) is connected with the second light-emitting surface (2); and the reflecting surface (3) is used for reflecting the light emitted from the light incident surface (5) to the reflecting surface (3) to the first light-emitting surface (1) or the second light-emitting surface (2) to emit out. The lens (100) enables the light to be projected at a large angle and can meet the optical performance requirement of a large field of view.
The present invention relates to an anisotropic conductive film and a method for manufacturing same, and a bonding structure and an ultrasonic biometric identification apparatus. The anisotropic conductive film comprises first conductive particles and second conductive particles, wherein the particle size of the first conductive particles is less than the particle size of the second conductive particles, and the ratio of the number of the first conductive particles to the number of the second conductive particles is (3-8) : 1. The anisotropic conductive film is applicable to pins made of different materials, and is particularly applicable to a bonding structure where a pin made of a relatively hard material and a pin made of a relatively loose material exist at the same time, thereby ensuring that the anisotropic conductive film has a relatively low conduction impedance and excellent conduction stability on both of the two materials.
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 33/04 - Homopolymères ou copolymères des esters
A touch feedback module (100) comprises a suspension wing plate (110), transfer structures (120), a touch panel (130), at least one piezoelectric motor (140), and at least one limiting structure (150). The transfer structures (120) and the piezoelectric motor (140) are respectively provided on the suspension wing plate (110); the limiting structure (150) is an elastic structure, and is provided on one side of the suspension wing plate (110) close to the touch panel (130), and is located in an area enclosed by the transfer structures (120); the touch panel (130) is erected on one side of the transfer structures (120) distant from the suspension wing plate (110).
A touch control feedback module (10) comprises: a suspended wing plate (110) having a support surface (111) and a first center line perpendicular to the support surface (111), the suspended wing plate (110) being symmetrically structured with respect to the first center line; at least one piezoelectric motor (140) disposed on the support surface (111) and symmetrically structured with respect to the first center line; a transfer structure (120) disposed on the suspended wing plate (110) and symmetrically structured with respect to the first center line; and a touch panel (130) disposed on a side of the transfer structure (120) located away from the suspended wing plate (110).
Disclosed is a touch-control feedback module (100), comprising: a suspension wing plate (110), wherein the suspension wing plate (110) comprises a bearing portion (112) and a suspension wing portion (111), and the suspension wing portion (111) is arranged around the bearing portion (112) and is connected to the bearing portion (112); a transmission structure (120), wherein the transmission structure (120) is arranged at the suspension wing portion (111); at least one piezoelectric motor (140), wherein each piezoelectric motor (140) is arranged at the bearing portion (112); and a touch panel (130), wherein the touch panel (130) is erected on the side, away from the suspension wing plate (110), of the transmission structure (120).
A touch feedback module (100) comprising suspended flap (110), a transfer structure (120), a touch panel (130), and at least one piezo motor (140), where: the transfer structure (120) and the piezo motor (140) respectively are provided on the suspended flap (110); the touch panel (130) is provided at the side of the transfer structure (120) away from the suspended flap (110); and, the transfer structure (120) and the suspended flap (110) are an integrated structure, or, the transfer structure (120) and the touch panel (130) are an integrated structure.
A method for calibrating a bracket of a 3D structured light module, an apparatus, and a device. Said method comprises: controlling a transmitter (220) to project infrared light to a calibration plate (120), and receiving an infrared image, the infrared image being obtained by photographing by means of an infrared receiving module (210), the calibration plate (120) onto which infrared light has been projected; acquiring the position of a preset mark point in the infrared image; calculating an offset between the position of the preset mark point and a set position of the preset mark point; and performing position adjustment of the infrared receiving module (210) and the transmitter (220) according to the offset.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
A bracket-type camera device (10) comprises: a bracket (12) extending along the vertical direction (10a); a first camera module (14) arranged on the bracket (12); a second camera module (16) arranged on the bracket (12), and spaced from the first camera module (14) in the vertical direction (10a); the first camera module (14) and the second camera module (16) respectively have at least two rotation modes of left and right rotation and up and down rotation relative to the bracket (12), the axis of the left and right rotation of the first camera module (14) is parallel to the vertical direction (10a), the axis of the up and down rotation of the first camera module (14) is perpendicular to the vertical direction (10a); the axis of the left and right rotation of the second camera module (16) is parallel to the vertical direction (10a), the axis of the up and down rotation of the second camera module (16) is perpendicular to the vertical direction (10a).
The present application discloses a flexible circuit board, an ultrasonic fingerprint module, and an electronic apparatus. The flexible circuit board comprises a substrate, a first pin, and multiple second pins. The substrate comprises a first connection region and a second connection region connected to the first connection region. The first pin is provided at the first connection region, and the multiple second pins are provided at the second connection region. The first pin has a first connection surface located away from the substrate, and is provided with an accommodation space therein. An opening of the accommodation space is located at the first connection surface. When an ultrasonic fingerprint module having the flexible circuit board is applied to an electronic apparatus, electrical connections of the electronic apparatus have improved stability.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
29.
LENS ACCURACY CALIBRATION METHOD, APPARATUS AND DEVICE FOR 3D PHOTOGRAPHIC MODULE
The present application relates to a lens accuracy calibration method, apparatus and device for a 3D photographic module. The method comprises: controlling a 3D photographic module to collect a target sample so as to obtain a sample image, wherein the sample image comprises a bright image and a dark image; extracting a central light area and an edge light area of the bright image, and acquiring a brightness value of the central light area and a brightness value of the edge light area; comparing the brightness value of the central light area and the brightness value of the edge light area of the bright image with brightness values of corresponding areas of the dark image, in order to obtain a brightness difference of central light areas and a brightness difference of edge light areas; acquiring a ratio of the brightness difference of the edge light areas to the brightness difference of the edge light areas, and using same as a calibration coefficient; and performing subsequent calibration processing on the 3D photographic module according to the calibration coefficient, wherein the subsequent calibration processing comprises at least one of lens compensation coefficient calibration, temperature compensation coefficient calibration, internal parameter calibration, external parameter calibration, and distortion compensation parameter calibration.
The present application discloses a display device and an electronic device. The display device comprises a display unit, a transmitter, a beam expander, an ultra-wide-angle lens, and an image sensor; wherein the transmitter and the beam expander are arranged on one side, away from the display side, of the display unit, and the beam expander is arranged between the transmitter and the display unit; wherein, the transmitter is used to emit sensing light toward the display unit, and the beam expander is used to diffuse the sensing light through the beam expander and project it to the outside of the display side of the display unit; the ultra-wide-angle lens and the image sensor are arranged on the peripheral side of the display unit and the ultra-wide-angle lens and the image sensor are correspondingly arranged; wherein, the ultra-wide-angle lens is used to acquire the sensing light reflected by user fingers and transmit the sensing light to the image sensor, and the image sensor is used to generate a fingerprint pattern according to the sensing light. The cooperation of the transmitter, the beam expander, the ultra-wide angle lens and the image sensor can provide more convenient fingerprint recognition experience.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
31.
ULTRASONIC FINGERPRINT RECOGNITION ASSEMBLY AND ELECTRONIC DEVICE
Provided in the present invention is an ultrasonic fingerprint recognition assembly, comprising a cover plate, an ultrasonic sensor and a display panel, wherein the ultrasonic sensor is placed between the cover plate and the display panel, and the ultrasonic sensor comprises a TFT substrate arranged on a side close to the display panel, and a piezoelectric layer and a conductive layer arranged on the TFT substrate in sequence; the piezoelectric layer is coated on the substrate by mixing piezoelectric material and an organic solvent, and is obtained by means of crystallization and polarization treatment, and the organic solvent comprises at least one of methyl ethyl ketone, propylene glycol methyl ether acetate, and dimethylacetamide. The ultrasonic sensor in the ultrasonic fingerprint recognition assembly provided in the present invention is arranged between the cover plate and the display panel. Due to the limited thickness of the cover plate, the ultrasonic signal is not affected by the cover plate, the penetration is strong, and the fingerprint recognition process is no longer restricted by the display panel; moreover, the light transmittance of the piezoelectric layer is uniform and the light transmittance thereof is excellent, thereby improving the speed and accuracy of fingerprint recognition.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
32.
FINGERPRINT IDENTIFICATION ASSEMBLY AND ELECTRONIC DEVICE
A fingerprint identification assembly and an electronic device. The fingerprint identification assembly comprises a fingerprint sensor (10) and a protective layer (20); the protective layer (20) is provided at the bottom part of the fingerprint sensor (10) that faces away from the top part, the surface of the top part being a fingerprint identification sensing surface; the fingerprint sensor (10) is used to transmit and identify ultrasonic waves, and the protective layer (20) shields from electromagnetic interference. By means of providing a protective layer, electromagnetic interference may be blocked; in addition, the protective layer can be made thin without needing to provide an air layer, which may significantly reduce the overall thickness of the fingerprint identification assembly such that the thickness of the electronic device can be made thinner.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
33.
PHOTOSENSITIVE MODULE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE
The present application relates to a photosensitive module, provided on one side of a light-transmissive display panel distant from a light-emitting surface. The light-emitting surface of the display panel comprises a first polarizer; the photosensitive module comprises a first light sensor, a second light sensor, and a second polarizer; optical axes of the first polarizer and the second polarizer are perpendicular to each other, and the second polarizer is provided between the second light sensor and the display panel. Therefore, the first light sensor may receive ambient light and light generated by the display panel, and the second light sensor may only receive light generated by the display panel. The intensity of the current ambient light can be obtained by calculating the difference of light received by the first light sensor and the second light sensor. The present application further relates to a display apparatus provided with the photosensitive module, and an electronic device. There is no need to provide an aperture on the display panel to monitor ambient light, thereby facilitating realizing full screen display and improving the user experience.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
34.
BASE, LIGHT EMISSION MODULE, 3D RECOGNITION DEVICE, AND INTELLIGENT TERMINAL
A base (300), comprising: a plastic body (310) provided with a through-hole (3142) passing through two ends of the plastic body (310), wherein the through-hole (3142) provides a light passage for a light source (200), and the plastic body (310) comprises a light entrance end and a light exit end; and a heat sink (320) disposed on a sidewall (312) of the plastic body (310) and comprising a heat dissipation surface (322), wherein the heat dissipation surface (322) is exposed by the plastic body (310), such that when a heat transfer path is established between the heat sink (320) and the light source (200), the heat dissipation surface (322) directly exchanges heat with the outside environment so as to perform heat dissipation for the light source (200). Further disclosed are a light emission module, a 3D recognition device, and an intelligent terminal.
H01S 5/024 - Dispositions pour la gestion thermique
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21V 29/00 - Protection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
35.
METHOD FOR MANUFACTURING COLLIMATOR, COLLIMATOR, OPTICAL FINGERPRINT MODULE, AND ELECTRONIC DEVICE
A method for manufacturing a collimator (100), comprising alternating and stacking light shielding layers (1) and transparent layers (2), the number of the light shielding layers (1) being greater than the number of the transparent layers (2) by one so that both sides of any transparent layer (2) are provided with the light shielding layers (1). The step of providing the light shielding layer (1) comprises: patterning the light shielding layer (1) so as to form light transmitting holes (3) on the light shielding layer (1), the light transmitting holes (3) on each light shielding layer (1) being correspondingly configured to form light selection channels. The step of providing the transparent layer (2) comprises: providing a first transparent medium on the patterned light shielding layer (1) so as to form the transparent layer (2) on the light shielding layer (1), and filling the light transmitting hole (3) with the first transparent medium. Two adjacent light shielding layers (1) cover the outer sides of the transparent layer (2) located between the two adjacent light shielding layers (1), so as to block light from entering the transparent layer (2) from an area outside the optical selection channels.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
36.
ELECTRONIC DEVICE, FINGERPRINT RECOGNITION METHOD THEREFOR, AND APPARATUS THEREOF
An electronic device, a fingerprint recognition method therefor, and an apparatus thereof. The method comprises: receiving the environmental temperature at the position at which an electronic device is located, which is detected by a temperature sensor (S120); when fingerprint information entered by a user at the environmental temperature is pre-stored, extracting from stored data a fingerprint recognition calibration parameter corresponding to the environmental temperature (S130), wherein fingerprint recognition calibration parameters and temperature data are pre-stored in the stored data, and the fingerprint recognition calibration parameters and the temperature data have a preset binding relationship; calibrating an initial parameter value of a fingerprint recognition apparatus according to the extracted fingerprint recognition calibration parameter, and using the calibrated fingerprint recognition apparatus to acquire a user fingerprint to obtain a user fingerprint image (S140); and performing a fingerprint authentication operation according to the user fingerprint image and the fingerprint information entered at the environmental temperature (S150).
G06F 21/32 - Authentification de l’utilisateur par données biométriques, p. ex. empreintes digitales, balayages de l’iris ou empreintes vocales
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
37.
TOUCH FEEDBACK DEVICE, INTELLIGENT TERMINAL AND VEHICLE
Disclosed is a touch feedback device comprising a touch element, a piezoelectric vibrator (300), a presser detector (700) and a processor. The touch element comprises a frame (100) and a touch screen (200) connected with the frame (100). The piezoelectric vibrator (300) is connected with the touch element, and is used for driving the touch screen (200) to move. The presser detector (700) is connected with the touch element, and is used for detecting the touch pressure applied on the touch screen (200). The processor is connected with the piezoelectric vibrator (300) and the presser detector (700) respectively, and is used for obtaining the touch pressure detected by the presser detector (700) and driving the piezoelectric vibrator (300) to drive, according to the detected touch pressure, the touch screen (200) to generate vibration of a corresponding degree.
A flexible collimator (2), comprising: a substrate (21), wherein the substrate (21) is a flexible substrate; collimation columns (22), wherein a plurality of collimation columns (22) are provided and are disposed, spaced apart from each other, on the substrate (21), and the collimation columns (22) are used for adjusting light that passes through the flexible collimator (2) to be light that forms a predetermined included angle with collimated light; and a light-shielding layer (23) filled between the collimation columns (22), wherein the light-shielding layer (23) is used for preventing the light from passing through same.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
39.
PROJECTION MODULE, IDENTIFICATION APPARATUS, ELECTRONIC DEVICE, AND MOBILE TERMINAL
A projection module (10), comprising a reflection cavity (110), wherein the reflection cavity (110) comprises a light entrance region (112) and a light exit region (111) provided opposite to each other, the light exit region (111) is provided with multiple light exit holes (1110), light enters the reflection cavity (110) from the light entrance region (112) and is reflected at least once, and the light in the reflection cavity (110) exits by means of the multiple light exit holes (1110) to form multiple light spots; and a baffle (120) provided in the reflection cavity (110), wherein the baffle (120) is used for preventing the light from directly reaching the light exit region (111) from the light entrance region (112).
A detection system (100) for detecting light power of a light emitting module (200), comprising a light transmission film (20), an image capturing device (30), and a light detection module (40). The light transmission film (20) and the image capturing device (30) are sequentially disposed at a light emission path of the light emitting module (200). When the light emitting module (200) emits light toward the light transmission film (20), the image capturing device (30) is used to capture the light transmission film (20) so as to form a captured image. The brightest region in the captured image has a correspondence with a region to undergo detection (210) of the light emitting module (200). The light detection module (40) can be aimed at said region (210) to perform detection with respect to the same, so as to obtain the maximum optical power of the light emitting module (200).
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
G01J 1/14 - Photométrie, p. ex. posemètres photographiques par comparaison avec une lumière de référence ou avec une valeur électrique de référence en utilisant des moyens entièrement visuels en utilisant une comparaison avec une surface de brillance étalonnée
41.
PROJECTION MODULE, IMAGING DEVICE, AND ELECTRONIC APPARATUS
A projection module (10), an imaging device (100), and an electronic apparatus (1000). The projection module (10) comprises a light source (12) and a microlens array element (14) disposed on an optical path. The microlens array element (14) comprises a substrate (142). The substrate (142) comprises a first surface (1422) and a second surface (1424) facing away from each other. The first surface (1422) is provided with a first strip-shaped microlens array (144), and the second surface (1424) is provided with a second strip-shaped microlens array (146). The first strip-shaped microlens array (144) comprises a plurality of first strip-shaped microlenses (1442), and the second strip-shaped microlens array (146) comprises a plurality of second strip-shaped microlenses (1462). The arrangement direction of the plurality of first strip-shaped microlenses (1442) and the arrangement direction of the plurality of second strip-shaped microlenses (1462) intersect with each other to form an included angle.
A projection module (10), an imaging device (100), and an electronic device (1000). The projection module (10) comprises a light source (12), a mask (14) provided above the light source (12), and a projection lens (16) provided above the mask (14). The light source (12) comprises a first center (X). The mask (14) comprises a second center (Y). The second center (Y) and the first center (X) are aligned with the axial direction of the projection module (10). The optical axis (A1) of the projection lens (16) is provided at an offset to the first center (X) and the second center (Y).
A depth acquisition method, a depth acquisition apparatus (100) and an electronic device (1000). The depth acquisition method comprises: a first projector (10) emitting a first laser pattern; a camera module (30) receiving the first laser pattern to generate a first infrared image; a second projector (20) emitting a second laser pattern; the camera module (30) receiving the second laser pattern to generate a second infrared image; acquiring an overlapped region of the two infrared images; and acquiring depth information concerning a target object according to the overlapped region.
Disclosed are an infrared lens (10), a camera module (100) and an electronic device (1000). The infrared lens (10) comprises a first lens (L1), a second lens (L2), a third lens (L3) and a fourth lens (L4). The infrared lens (10) satisfies the following formula: a bbe(vd) < 35, wherein abbe(vd) is the maximum abbe number from the first lens (L1) to the fourth lens (L4).
An optical component, a photoelectric module, a depth acquisition apparatus, and an electronic device. The optical component (14) comprises an optical element (141) and a conductive loop (142), wherein the optical element (141) is used for expanding beams or diffusing a laser; and the conductive loop (142) is arranged on the optical element (141). The conductive loop (142) comprises multiple conductive lines (1421) and connection lines (1422, wherein the connection lines (1422) are used for connecting the multiple conductive lines (1421).
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
H01S 3/00 - Lasers, c.-à-d. dispositifs utilisant l'émission stimulée de rayonnement électromagnétique dans la gamme de l’infrarouge, du visible ou de l’ultraviolet
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
46.
WIDE-ANGLE LENS, CAMERA MODULE, AND ELECTRONIC APPARATUS
Disclosed are a wide-angle lens (10), a camera module (100), and an electronic apparatus (1000). The wide-angle lens (10) successively comprises, from an object side to an image side, a first lens piece (L1), a second lens piece (L2), and a third lens piece (L3). The first lens piece (L1) has a negative refractive power, and an object-side face (S1) of the first lens piece (L1) is concave at the optical axis and convex at the circumference. The second lens piece (L2) has a positive refractive power, and the third lens piece (L3) has a negative refractive power. The wide-angle lens (10) satisfies the relationship: 2 < |f1|/f ≤ 4.
G02B 13/18 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous avec des lentilles ayant une ou plusieurs surfaces non sphériques, p. ex. pour réduire l'aberration géométrique
G02B 13/00 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous
Disclosed are an imaging module (10) and an electronic device (100). The imaging module (10) comprises a receiving module (11), a transmission module (12), and a support (13). The support (13) comprises a first supporting portion (132) and a second supporting portion (134) which are in an integral structure; the first supporting portion (132) is provided with a first accommodating space (1321); the receiving module (11) is at least partially provided in the first accommodating space (1321), and the second supporting portion (134) is provided with a second accommodating space (1342); the transmission module (12) is at least partially provided in the second accommodating space (1342).
A projection module (10), an imaging device (100) and an electronic device (1000). The projection module (10) comprises a light source (12), a diffuser (14), and a photomask (16), the light source (12) being used to emit light rays. The diffuser (14) is used to diffuse the light rays emitted by the light source (12) into uniform light rays. The photomask (16) is used to project the uniform light rays emitted by the diffuser (14) as structured light rays, the diffuser (14) being positioned between the light source (12) and the photomask (16).
Disclosed is a 3D recognition module (10). The 3D recognition module (10) comprises a projection unit (120) used for emitting projection light; a first beam splitter (130) provided on an optical path of the projection light; and a receiving unit (140) used for receiving surface information of a detected object, wherein the projection light is projected to the detected object after passing through the first beam splitter (130), and can be reflected to form information light carrying the surface information of the detected object; and the information light is received by the receiving unit (140) after passing through the first beam splitter (130).
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
50.
PROJECTION MODULE, STRUCTURED LIGHT THREE-DIMENSIONAL IMAGING DEVICE AND ELECTRONIC DEVICE
Disclosed are a projection module (10), a structured light three-dimensional imaging device (100) and an electronic device (1000). The projection module (10) comprises a laser emitter (11) and a reflection type optical grating (12). The laser emitter (11) includes a light-out plane (112) for emitting laser. The reflection type optical grating (12) includes a reflecting plane (122); the reflecting plane (122) is arranged obliquely opposite to the light-out plane (112), and an optical grating microstructure (124) is arranged on the reflecting plane (122). The projection module (10) can realize adjustment of laser reflection angles while expanding beams to generate a laser pattern.
A photovoltaic module (10) comprises a substrate (11), a heat conductor (12), a light source (13) and an optical element (14). The substrate (11) comprises an integrally formed body portion (111) and an extension portion (112). The main body portion (111) includes a first face (1111) and a second face (1112) which are opposite to each other, and a through hole (1113) penetrating through the first face (1111) and the second face (1112). The extension portion (112) is combined with the first face (1111), the heat conductor (12) is filled in the through hole (1113), the light source (13) is carried on the heat conductor (12), and the optical element (14) is provided on the extension portion (112). Further provided are a depth extraction device (100) and an electronic device (1000).
A filtering assembly (12), a camera module (10), an image capturing device (100) and an electronic device (1000). The filtering assembly (12) comprises a filter (122), a bandpass coating (124) and a bandstop coating (126). The bandpass coating (126) is provided on one surface of the filter (122), and the bandpass coating (126) is used for allowing only visible light and infrared light to pass therethrough. The bandstop coating (126) is provided on the other surface of the filter (122), and the bandstop coating (126) is used for cutting off infrared light in a predetermined cutoff band.
A circuit board assembly (11), a photoelectric module (10), a depth camera (100) and an electronic device (1000). The circuit board assembly (11) comprises a heat-radiating substrate (111), a circuit board (112) and a heat-generating element (113), wherein the heat-radiating substrate (111) comprises a bearing surface (1111) and a first conductive element (1113) is formed on the bearing surface (1111); the circuit board (112) is provided on the heat-radiating substrate (111) and is electrically connected to the first conductive element (1113); and the heat-generating element (113) is provided on the bearing surface (1111) and is electrically connected to the circuit board (112) by means of the first conductive element (1113).
An organic light-emitting diode display panel for fingerprint recognition includes a plurality of pixel areas arranged in arrays, the pixel area includes a pixel unit and a fingerprint recognition unit, which are adjacent to each other, the pixel unit is configured to emit colorful image light, the fingerprint recognition unit comprises a sensing light emitting module and a sensing light receiving module, the sensing light emitting module is configured to emit sensing light to a finger, and the sensing light receiving module is configured to receive the sensing light reflected by the finger and convert a light signal of the sensing light into an electric signal. An electronic device is also provided.
H01L 51/50 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED)
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
55.
Organic light-enitting diode display panel for fingerprint recognition and electronic device
An organic light-emitting diode display panel for fingerprint recognition includes a glass substrate, a pixel layer, and a transparent substrate, which are laminated; the pixel layer includes a plurality of pixel units arranged on the glass substrate in arrays, wherein the plurality of pixel units are configured to emit light of multiple colors which are combined to form a colorful image; the transparent substrate includes a first side and a second side, which are disposed opposite to each other, the first side is fitted on the pixel layer, a plurality of light receiving units are arranged on a surface of the second side, and an orthographic projection of each light receiving unit on the transparent substrate is located in a gap between the adjacent pixel units. An electronic device is also provided.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 27/32 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux avec des composants spécialement adaptés pour l'émission de lumière, p.ex. panneaux d'affichage plats utilisant des diodes émettrices de lumière organiques
The present disclosure relates to the field of biological recognition and provides a face recognition method and device and apparatus. The face recognition method includes: recording a face video image and dynamically tracking an eye in the face video image; detecting a blink frequency of the eye during dynamic tracking of the eye; judging whether the blinking frequency is within a preset frequency range; if the blink frequency is within the preset frequency range, determining that the face is a living face; if the blink frequency is not within the preset frequency range, determining that the face is a fake face. In the embodiment of the present disclosure, the real face and the fake face can be accurately distinguished by the blink frequency of the eye. Therefore, the safety of face recognition is improved.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, bonding wires, an ultrasonic probe, and packaging material. The control chip is arranged on the substrate. The control chip is connected to the substrate by the bonding wires using a wire bonding technology. The ultrasonic probe is arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 41/113 - Eléments piézo-électriques ou électrostrictifs à entrée mécanique et sortie électrique
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H01L 41/293 - Formation d’électrodes, de connexions électriques ou de dispositions de bornes Électrodes de connexion de parties piézo-électriques ou électrostrictives multicouches
The present disclosure discloses a package for an ultrasonic fingerprint sensor comprising: a substrate comprising a top surface and a plurality of first connecting electrodes formed on the top surface; a control chip arranged on the substrate and comprising a periphery-stepped upper surface facing away from the substrate, the periphery-stepped upper surface comprising a central upper surface and a peripheral lower surface surrounding and being lower than the central upper surface, the control chip comprising a plurality of second connecting electrodes formed on the central upper surface, and a plurality of third connecting electrodes formed on the peripheral lower surface connected to the second connecting electrodes; bonding wires configured to bond the first connecting electrodes to the third connecting electrodes; an ultrasonic transducer arranged on the control chip; and packing material configured to package the substrate, the bonding wires and the ultrasonic transducer as one module.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H01L 41/053 - Montures, supports, enveloppes ou boîtiers
H01L 41/113 - Eléments piézo-électriques ou électrostrictifs à entrée mécanique et sortie électrique
The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes a piezoelectric layer. The piezoelectric layer includes an array of piezoelectric posts, a plurality of emitting electrodes, and a plurality of receiving electrodes. The piezoelectric posts are configured for emitting and receiving ultrasonic wave. The material of each of the piezoelectric posts includes lead zirconate titanate piezoelectric ceramics. The emitting electrodes are formed on a lower surface of the piezoelectric layer by a sputtering process. The receiving electrodes are formed on an upper surface of the piezoelectric layer by the sputtering process. Each of the emitting electrodes and each of the receiving electrodes include lead, zirconium, titanium, and/or alloys thereof. The present disclosure also discloses a method for manufacturing the ultrasonic transducer, an ultrasonic fingerprint recognition sensor having the ultrasonic transducer, and an electronic device having the ultrasonic fingerprint recognition sensor.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
brevets
