The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.
A method of forming an image module includes creating a lens stack wafer including a plurality of lens stacks, determining an individual lens stack compensation for each of the lens stacks, providing an image sensor wafer package including a plurality of image sensors and a transparent wafer overlying the image sensors, forming a plurality of individual adjustment members between the transparent wafer and the lens stack wafer, a size of each individual adjustment member corresponding to individual lens stack compensations, and forming an image module wafer by securing the plurality of lens stacks, the plurality of image sensors, and the plurality of adjustment members to form a plurality of image modules, adjustment members being outside an optical path of the image module, at least one of the plurality of lens stacks and the plurality of image sensors remaining in wafer form during the forming of the image module wafer.
G02B 13/00 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
Embodiments of systems, methods, and computer-readable media for machining materials are disclosed. For example, one embodiment of the present invention includes a method for machining a feature on a work piece (100) along a curving tool path having the steps of controlling a relative translational movement between a tool table and the work piece (100) along the curving tool path and controlling a corresponding angle of rotation of the tool table with respect to the work piece (100) to maintain a substantially constant angle between the tool table and the corresponding relative translational movement between the tool table and the work piece (100) along the curving tool path. In another embodiment, a computer-readable media includes code for a carrying out such a method.
G05B 19/18 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique
B23B 5/36 - Machines ou dispositifs à tourner spécialement conçus pour un travail particulierAccessoires correspondants spécialement conçus à cet effet pour tourner des surfaces de formes spéciales grâce à l'emploi de mécanismes géométriques produisant un mouvement relatif entre l'outil et la pièce, c.-à-d. tours de façonnage
B24B 13/04 - Meulage de lentilles, faisant intervenir des meules commandées par des engrenages
B29D 11/00 - Fabrication d'éléments optiques, p. ex. lentilles ou prismes
B23Q 15/013 - Commande ou régulation du mouvement d'avance
5.
CAMERA SYSTEM INCLUDING RADIATION SHIELD AND METHOD OF SHIELDING RADIATION
A camera system includes an optics stack including first and second substrates secured together in a stacking direction, one of the first and seconds substrates including an optical element, a detector on a sensor substrate, and a feature (680) shielding the camera system, the feature being external to the optics stack and extending from a surface of the optics stack furthest from the sensor substrate
An optical device includes a substrate, a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.
An optical system (302) has a plurality of optical surfaces (304, 305, 306, 307, 308, 309) configured to provide blurred images of objects located within a selected range of object distances. At least two of the plurality of optical surfaces are configured to contribute to the blurring. An imaging system (300) includes a blurring optical system (302), a sensor (310) which receives light directed through the optical system, and an image processor (320) which selects one or more deblurring functions and applies the deblurring functions to provide a processed image. The processor may apply different deblurring functions to different sets of the raw data representing different portions of the field of view.
A micro-optical element includes a support substrate (650), a micro-optical lens (690) in a cured replication material on a first surface of the support substrate and optionally a second micro- optical lens (660) on a second, opposite surface of the support substrate and an opaque material (696, 656) aligned with and overlapping the mirco-optical lens.
A camera system may include an optics stack (140) including two substrates (110,120) secured together in a vertical direction and an optical system (112,124) on the two substrates, the two substrates having exposed sides, a detector on a detector substrate (170), and a stray light blocker (192) directly on at least some sides of the optics stack.
A camera system (100) may include an optics stack (140) including first (110) and second (120) substrates secured together in a stacking direction, one of the first (110) and seconds (120) substrates including an optical element (112), a detector on a sensor substrate (170), and a feature reducing an amount of light entering at an angle greater than a field of view of the camera system from reaching the detector, the feature being on another of the first (110) and second (120) substrates.
A camera system may include an optics stack including two substrates, the optics stack forming an imaging system, each substrate having two surfaces that are parallel to each other and perpendicular to an optical axis of the imaging system, the optics stack including a securing region on opposing surfaces of the two substrates, the two substrates being secured together on a wafer level at their respective securing regions, at least one of the surfaces of the two substrates including a refractive surface of the imaging system, a detector substrate having an active area and a cover structure protecting at least the active area of the detector substrate, the optics stack being secured to an upper surface of the cover structure.
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