Described are various embodiments of computer-implemented methods for compressing a digital connectivity representation of an integrated circuit, as well as related non-transitory computer readable mediums which comprise instructions to carry out such methods, which methods and mediums may be useful in the reverse engineering of integrated circuits.
Described are various embodiments of a system and method for automatic extraction of integrated circuit component data. In one embodiment, a method is provided for automatically extracting transistor data from a digital representation of an integrated circuit that comprises digitally defining at least one diffusion space corresponding to a respective spatial region of the IC that comprises at least one diffusion feature. For each discrete diffusion space, diffusion space circuit features that intersect with each diffusion feature are incrementally assessed by assigning a current state value to each diffusion space circuit feature based on an identified feature characteristic associated therewith and an identified feature characteristic of an electrically adjacent feature in the diffusion space.
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
Described are various embodiments of image registration methods and systems, as well as associated non-transitory computer readable mediums comprising instructions directed to image registration.
G06T 7/32 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur la corrélation
4.
REGISTERING DIGITAL REPRESENTATIONS OF INTERCONNECTED LAYERS OF MULTILAYER DATASETS
Described are various embodiments of methods, systems and computer-readable mediums comprising instructions for registering respective digital representations of at least two interconnected layers of a multilayer dataset. In some embodiments, the digital representations are preprocessed before key features in one layer are used to register that layer with another layer. In some embodiments, one layer is reduced to key features or coordinates of key features to register that layer with another layer. One application disclosed is the assembly of a three-dimensional representation of an integrated circuitfrom two-dimensional representations of respective integrated circuit layers and specifically, from high-definition images of respective integrated circuit layers.
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
G06V 10/26 - Segmentation de formes dans le champ d’imageDécoupage ou fusion d’éléments d’image visant à établir la région de motif, p. ex. techniques de regroupementDétection d’occlusion
G06V 10/774 - Génération d'ensembles de motifs de formationTraitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source méthodes de Bootstrap, p. ex. "bagging” ou “boosting”
G06V 20/69 - Objets microscopiques, p. ex. cellules biologiques ou pièces cellulaires
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
35 - Publicité; Affaires commerciales
38 - Services de télécommunications
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Downloadable online publications, namely, custom and standard technical reports, newsletters, and magazines in the fields of electronics, consumer electronics, mobile devices, medical devices, storage devices and storage technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, batteries, cameras, lidar, radar, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering, computers, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, information technology, engineering design, and environmental sustainability and carbon modeling of the foregoing.
(2) Printed publications, namely, custom and standard technical reports, newsletters, and magazines in the fields of electronics, consumer electronics, mobile devices, medical devices, storage devices and storage technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, batteries, cameras, lidar, radar, infotainment, embedded memory, semiconductors, and environmental sustainability and carbon modeling of the foregoing. (1) Providing multiple-user access to a global computer information network in the field of technical information regarding hardware and software used in the fields of computing devices, telecommunications, consumer devices, medical devices, data storage, automotive electronics, semiconductors, battery technology, and environmental sustainability and carbon modeling of the foregoing; providing multiple-user access via a global computer information network to preexisting and commissioned technical reports in the fields of electronics, consumer electronics, mobile devices, medical devices, data storage and memory devices and technology, dram memory, NAND flash memory, automotive electronics, internet of things and sensor technology, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, logic analysis, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, data security, firmware, hardware and software integrating systems design and design methodologies, information technology, and environmental sustainability and carbon modeling of the foregoing; providing view-only access, namely, providing view-only access to databases and online report viewing platforms featuring technical reports for the purposes of offering for sale additional licensing rights for the use of such technical reports; offering subscription-based access to technical, market, and environmental impact reports, and specific categories thereof; provision of multiple-user access via a global computer network to deconstruction and component analysis reports and bills of materials of electronic devices, consumer devices, technology equipment, componentry thereof, and environmental sustainability and carbon modeling of the foregoing.
(2) Educational services, namely, conducting seminars, presentations and online webinars in the field of integrated circuits, electronic designs and process technology, and environmental sustainability and carbon modeling thereof; educational services, namely, conducting seminars, presentations, and online webinars in the field of intellectual property.
(3) Consulting services in the field of audio engineering, automotive engineering, biomedical and medical device engineering, computer engineering, electrical engineering, electronic engineering, forensic engineering, industrial engineering, manufacturing engineering, mechanical engineering, software engineering, and sound engineering, as well environmental sustainability and carbon modeling consulting services in respect thereof; semiconductor integrated circuitry and electronic design analysis services; reverse engineering services; environmental sustainability assessment and carbon modeling services for integrated circuits, electronics designs, and process technology relating to integrated circuits and electronics designs; functional and structural analysis of integrated circuits, electronics designs, and process technology relating to integrated circuits and electronics designs; provision of semiconductor circuit extraction, transistor characterization, and waveform analysis to assure compliance with industry standards, environmental sustainability standards, and carbon-based standards; provision of integrated circuit design services and microelectronics engineering consulting services regarding the functionality and structure of semiconductor integrated circuitry and other electrical devices for subsequent disclosure to the engineering, marketing, intellectual property, corporate responsibility, environmental sustainability, and carbon-based impact tracking groups of semiconductor, electronics, and information technology companies and law firms; technical analysis, namely, scientific and technological research and analysis of functionality and structure of competing products; process/structural analysis services, namely analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level, as well as environmental, carbon-impact, and sustainability assessments thereof; microprocessor-based security card analysis services, namely, scientific and technological research and analysis of functionality and structure of microprocessors therein; custom report preparation services, namely technical reports on function, layout, structure, and design, environmental sustainability, and carbon-based impact assessments of integrated circuit devices, semiconductor devices and processes, and electronic and technical equipment components, as determined through reverse engineering; product research and measurement evaluations in the field of consumer electronics products; preparation of custom and standard technical reports, namely, reports comprising results of scientific and technological research and analysis of electronic device and component functionality and structure and reverse engineering reports in the fields of electronics, consumer electronics, mobile devices, medical devices, data storage and memory devices and technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, battery technology, cameras, lidar, radar, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, and information technology; analysis, namely, scientific and technological research and analysis of functionality, and structure , environmental sustainability, and carbon-based impact of semiconductor device logic systems, semiconductor materials and packaging analysis, semiconductor process flows, transistor characterization, semiconductor design and architecture, and semiconductor comparison of architecture, interconnection, and patterning; scientific and technological services, namely, deconstruction analysis and component analysis of electronic devices, consumer devices, technology equipment, and componentry thereof; technological analysis services, namely, scientific and technological research and analysis of functionality and structure of electronic devices and components for identification, interconnection, materials, construction, environmental sustainability, carbon-based impact, and costing of deconstructed electronic devices, consumer devices, technology equipment, and componentry thereof; analysis of integrated circuit and electronic designs and process technology; provision of integrated circuit design services; microelectronics engineering consulting services; design analysis services, namely, scientific and technological research and analysis of the functional and structural design of electronic devices and components to the engineering, marketing, intellectual property, environmental sustainability, and carbon-based impact tracking groups of semiconductor, electronics, and information technology companies; process/structural analysis services, namely, scientific and technological research and analysis of the structures and manufacturing processes of electronic devices and components, and the environmental sustainability, and carbon-based impact thereof; microprocessor-based security card consulting services, namely, scientific and technological research and analysis of functionality and structure of electronic devices and components; technological custom report services, namely, preparing reports showing custom scientific and technological research and analysis of functionality, and structure, environmental sustainability, and carbon-based impact of technological devices and components; technical analysis of semiconductor and electronics patents, namely, scientific and technological research and analysis of patents in the field of semiconductors and electronics and the function, layout, structure, and design thereof.
7.
REGISTERING DIGITAL REPRESENTATIONS OF INTERCONNECTED LAYERS OF MULTILAYER DATASETS
Described are various embodiments of methods, systems and computer-readable mediums comprising instructions for registering respective digital representations of at least two interconnected layers of a multilayer dataset. In some embodiments, the digital representations are preprocessed before key features in one layer are used to register that layer with another layer. In some embodiments, one layer is reduced to key features or coordinates of key features to register that layer with another layer. One application disclosed is the assembly of a three-dimensional representation of an integrated circuit from two-dimensional representations of respective integrated circuit layers and specifically, from high-definition images of respective integrated circuit layers.
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur les caractéristiques
Described are various embodiments of a method for detecting potential errors in digitally segmented images, and a system employing the same. In one embodiment, a method comprises receiving as input a segmented image comprising an array of segmented pixel values; for each of at least one respective dimension of the array, calculating a respective extension array comprising, for each given pixel of the array corresponding with a designated segmentation value, a corresponding extension value; based at least in part on the array of segmented pixel values and each respective extension array, identifying, via a digital image classifier and a trained error detection model accessible thereto, a potential error in the segmented image; and upon positively identifying the potential error, providing a corresponding error signal in association with the segmented image.
G06V 10/98 - Détection ou correction d’erreurs, p. ex. en effectuant une deuxième exploration du motif ou par intervention humaineÉvaluation de la qualité des motifs acquis
G06V 10/26 - Segmentation de formes dans le champ d’imageDécoupage ou fusion d’éléments d’image visant à établir la région de motif, p. ex. techniques de regroupementDétection d’occlusion
G06V 10/764 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant la classification, p. ex. des objets vidéo
G06F 30/39 - Conception de circuits au niveau physique
9.
CONTRAST-ENHANCING STAINING SYSTEM AND METHOD AND IMAGING METHODS AND SYSTEMS RELATED THERETO
Described are various embodiments of a contrast-enhancing staining system and method. In one embodiment, a method is described for enhancing contrast in an image of a substrate surface between regions of said substrate having different charge carrier characteristics. The method comprises exposing said substrate to a staining precursor comprising an oxidant; directing microwave electromagnetic radiation at the substrate, said microwave electromagnetic radiation enhancing a reaction rate of said oxidant reacting into a deposition material, said reaction rate being related to the charge carrier characteristics of a proximal region; and acquiring an image of said substrate surface indicating a visual contrast between each of said regions based on differential deposition of the deposition material therebetween.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
10.
SYSTEM AND METHOD FOR AUTOMATIC EXTRACTION OF INTEGRATED CIRCUIT COMPONENT DATA
Described are various embodiments of a system and method for automatic extraction of integrated circuit component data. In one embodiment, a method is provided for automatically extracting transistor data from a digital representation of an integrated circuit that comprises digitally defining at least one diffusion space corresponding to a respective spatial region of the IC that comprises at least one diffusion feature. For each discrete diffusion space, diffusion space circuit features that intersect with each diffusion feature are incrementally assessed by assigning a current state value to each diffusion space circuit feature based on an identified feature characteristic associated therewith and an identified feature characteristic of an electrically adjacent feature in the diffusion space.
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
G06V 10/40 - Extraction de caractéristiques d’images ou de vidéos
11.
SYSTEM AND METHOD FOR AUTOMATIC EXTRACTION OF INTEGRATED CIRCUIT COMPONENT DATA
Described are various embodiments of a system and method for automatic extraction of integrated circuit component data. In one embodiment, a method is provided for automatically extracting transistor data from a digital representation of an integrated circuit that comprises digitally defining at least one diffusion space corresponding to a respective spatial region of the IC that comprises at least one diffusion feature. For each discrete diffusion space, diffusion space circuit features that intersect with each diffusion feature are incrementally assessed by assigning a current state value to each diffusion space circuit feature based on an identified feature characteristic associated therewith and an identified feature characteristic of an electrically adjacent feature in the diffusion space.
Described are various embodiments of image registration methods and systems, as well as associated non-transitory computer readable mediums comprising instructions directed to image registration.
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur les caractéristiques
13.
SYSTEM AND METHOD FOR IMAGE SEGMENTATION FROM SPARSE PARTICLE IMPINGEMENT DATA
Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.
G06V 10/24 - Alignement, centrage, détection de l’orientation ou correction de l’image
G06V 10/74 - Appariement de motifs d’image ou de vidéoMesures de proximité dans les espaces de caractéristiques
G01N 23/04 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en transmettant la radiation à travers le matériau et formant des images des matériaux
14.
MACHINE LEARNING SYSTEM AND METHOD FOR OBJECT-SPECIFIC RECOGNITION
G06V 10/26 - Segmentation de formes dans le champ d’imageDécoupage ou fusion d’éléments d’image visant à établir la région de motif, p. ex. techniques de regroupementDétection d’occlusion
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
G06V 10/26 - Segmentation de formes dans le champ d’imageDécoupage ou fusion d’éléments d’image visant à établir la région de motif, p. ex. techniques de regroupementDétection d’occlusion
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
35 - Publicité; Affaires commerciales
38 - Services de télécommunications
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
Online publications, namely, custom and standard technical
reports, newsletters, and magazines in the fields of
electronics, consumer electronics, mobile devices, medical
devices, storage devices and storage technology, dram
memory, nand flash memory, automotive electronics, internet
of things, sensor technology, image sensor technology,
batteries, cameras, lidar, radar, infotainment, embedded
memory, semiconductors, wired and wireless network
communications technology, antennas, power management
technology, clean technology, optoelectronics, display
technology, engineering, computers, high technology, office
systems management, microprocessor and microcontroller-based
systems, firmware, hardware and software integrating systems
design and design methodologies, information technology, and
engineering design. Printed publications, namely, custom and standard technical
reports, newsletters, and magazines in the fields of
electronics, consumer electronics, mobile devices, medical
devices, storage devices and storage technology, dram
memory, nand flash memory, automotive electronics, internet
of things, sensor technology, image sensor technology,
batteries, cameras, lidar, radar, infotainment, embedded
memory, semiconductors, wired and wireless network
communications technology, antennas, power management
technology, clean technology, optoelectronics, display
technology, engineering, computers, high technology, office
systems management, microprocessor and microcontroller-based
systems, firmware, hardware and software integrating systems
design and design methodologies, information technology, and
engineering design. Market analysis and assessment. Providing multiple-user access to a global computer
information network in the field of technical information
regarding hardware and software used in the fields of
computing devices, telecommunications, consumer devices,
medical devices, data storage, automotive electronics,
semiconductors, and battery technology; providing
multiple-user access via a global computer information
network to pre-existing and commissioned technical reports
in the fields of electronics, consumer electronics, mobile
devices, medical devices, data storage and memory devices
and technology, dram memory, nand flash memory, automotive
electronics, internet of things and sensor technology,
semiconductors, wired and wireless network communications
technology, antennas, power management technology, clean
technology, optoelectronics, logic analysis, display
technology, engineering and engineering design, computing
devices, high technology, office systems management,
microprocessor and microcontroller-based systems, data
security, firmware, hardware and software integrating
systems design and design methodologies, and information
technology; providing view-only access to technical reports
for the purposes of offering for sale additional licensing
rights for the use of such technical reports; offering
subscription-based access to technical and market reports,
and specific categories thereof; provision of multiple-user
access via a global computer network to deconstruction and
component analysis reports and bills of materials of
electronic devices, consumer devices, technology equipment,
and componentry thereof. Education regarding integrated circuits, and electronic
designs and process technology; education regarding
intellectual property. Consulting services in the field of audio engineering,
automotive engineering, biomedical and medical device
engineering, computer engineering, electrical engineering,
electronic engineering, forensic engineering, industrial
engineering, manufacturing engineering, mechanical
engineering, software engineering, and sound engineering;
semiconductor integrated circuitry and electronic design
analysis services; reverse engineering services; analysis of
integrated circuits, electronics designs, and process
technology relating to integrated circuits and electronics
designs; provision of semiconductor circuit extraction,
transistor characterization, and waveform analysis;
provision of technical analysis of patents; provision of
integrated circuit design services, microelectronics
engineering consulting services, patent infringement and
validity advisory services respecting semiconductor
integrated circuitry and other electrical devices, and
design analysis services to the engineering, marketing,
intellectual property groups of semiconductor, electronics,
and information technology companies and law firms;
technical analysis of competing products and intellectual
property, technical evaluation and rating of patents;
process/structural analysis services, namely analysis of the
physical structure of integrated circuits, analysis of
processes used to manufacture integrated circuits, and
analysis of electronic assemblies at the printed circuit
board level; microprocessor-based security card analysis
services; custom report preparation services, namely
technical reports on integrated circuit devices,
semiconductor devices and processes, electronic and
technical equipment deconstruction and componentry, and
intellectual property evaluations and analysis; product
research and measurement and performance evaluations in the
field of consumer electronics products; preparation of
custom and standard technical reports and reverse
engineering reports in the fields of electronics, consumer
electronics, mobile devices, medical devices, data storage
and memory devices and technology, dram memory, nand flash
memory, automotive electronics, internet of things, sensor
technology, image sensor technology, battery technology,
cameras, lidar, radar, infotainment, embedded memory,
semiconductors, wired and wireless network communications
technology, antennas, power management technology, clean
technology, optoelectronics, display technology, engineering
and engineering design, computing devices, high technology,
office systems management, microprocessor and
microcontroller-based systems, firmware, hardware and
software integrating systems design and design
methodologies, and information technology; analysis of
semiconductor device logic systems, semiconductor materials
and packaging analysis, semiconductor process flows,
transistor characterization, semiconductor design and
architecture, and semiconductor comparison of architecture,
interconnection, and patterning; deconstruction and
component analysis of electronic devices, consumer devices,
technology equipment, and componentry thereof; technological
analysis services for identification, interconnection,
materials, construction, and costing of deconstructed
electronic devices, consumer devices, technology equipment,
and componentry thereof; analysis of integrated circuit and
electronic designs and process technology; provision of
integrated circuit design services; microelectronics
engineering consulting services; design analysis services to
the engineering, marketing, intellectual property groups of
semiconductor, electronics, and information technology
companies; process/structural analysis services;
microprocessor-based security card consulting services;
technological custom report services; technical analysis of
semiconductor and electronics patents; patent infringement
and validity advisory services respecting semiconductor
integrated circuitry and other electrical devices. Intellectual property services, namely, intellectual
property consulting services, liaison services, intellectual
property identification, intellectual property auditing,
intellectual property portfolio development, intellectual
property management, intellectual property protection,
strategy development for intellectual property exploitation;
competitive intellectual property analytics; licensing of
intellectual property, patent application preparation and
preparation advisory services; patent validity assessment,
infringement identification and analysis, technical patent
infringement and claims analysis argument preparation, and
expert and factual witness services in the field of
intellectual property.
17.
Ion beam chamber fluid delivery apparatus and method and ion beam etcher using same
Described are various embodiments of an ion beam chamber fluid delivery system and method for delivering a fluid onto a substrate in an ion beam system during operation. In one embodiment, the system comprises: a chamber comprising an ion beam gun oriented so as to cause ions to impinge the substrate, said chamber having a fluid delivery conduit therein for delivering the fluid into the chamber; a transferable substrate stage for holding the substrate, the transferable stage further configured to move between an operating position and a payload position during non-operation, said payload position for receiving and removing said substrate; and a fluid delivery nozzle being in a fixed location relative to the transferable stage, at least during operation, with an outlet position that is configured to deliver a fluid to a predetermined location on said transferable stage.
Described are various embodiments of an ion beam chamber fluid delivery system and method for delivering a fluid onto a substrate in an ion beam system during operation. In one embodiment, the system comprises: a chamber comprising an ion beam gun oriented so as to cause ions to impinge the substrate, said chamber having a fluid delivery conduit therein for delivering the fluid into the chamber; a transferable substrate stage for holding the substrate, the transferable stage further configured to move between an operating position and a payload position during non-operation, said payload position for receiving and removing said substrate; and a fluid delivery nozzle being in a fixed location relative to the transferable stage, at least during operation, with an outlet position that is configured to deliver a fluid to a predetermined location on said transferable stage.
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
35 - Publicité; Affaires commerciales
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
Providing multiple-user access to a global computer information network in the field of technical information regarding hardware and software used in the fields of computing devices, telecommunications, consumer devices, medical devices, data storage, automotive electronics, semiconductors, and battery technology; providing multiple-user access via a global computer information network to pre-existing and commissioned technical reports in the fields of electronics, consumer electronics, mobile devices, medical devices, data storage and memory devices and technology, dram memory, NAND flash memory, automotive electronics, internet of things and sensor technology, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, logic analysis, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, data security, firmware, hardware and software integrating systems design and design methodologies, and information technology; providing view-only access, namely, providing view-only access to databases and online report viewing platforms featuring technical reports for the purposes of offering for sale additional licensing rights for the use of such technical reports; offering subscription-based access to technical and market reports, and specific categories thereof; provision of multiple-user access via a global computer network to deconstruction and component analysis reports and bills of materials of electronic devices, consumer devices, technology equipment, and componentry thereof Downloadable online publications, namely, custom and standard technical reports, newsletters, and magazines in the fields of electronics, consumer electronics, mobile devices, medical devices, storage devices and storage technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, batteries, cameras, lidar, radar, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering, computers, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, information technology, and engineering design Printed publications, namely, custom and standard technical reports, newsletters, and magazines in the fields of electronics, consumer electronics, mobile devices, medical devices, storage devices and storage technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, batteries, cameras, lidar, radar, infotainment, embedded memory, semiconductors Market analysis and assessment Educational services, namely, conducting seminars, presentations and online webinars in the field of integrated circuits, and electronic designs and process technology; educational services, namely, conducting seminars, presentations, and online webinars in the field of intellectual property Consulting services in the field of audio engineering, automotive, engineering, biomedical and medical device engineering, computer engineering, electrical engineering, electronic engineering, forensic engineering, industrial engineering, manufacturing engineering, mechanical engineering, software engineering, and sound engineering; semiconductor integrated circuitry and electronic design analysis services; reverse engineering services; functional and structural analysis of integrated circuits, electronics designs, and process technology relating to integrated circuits and electronics designs; provision of semiconductor circuit extraction, transistor characterization, and waveform analysis to assure compliance with industry standards; provision of integrated circuit design services and microelectronics engineering consulting services regarding the functionality and structure of semiconductor integrated circuitry and other electrical devices for subsequent disclosure to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies and law firms; technical analysis, namely, scientific and technological research and analysis of functionality and structure of competing products; process/structural analysis services, namely analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level; microprocessor-based security card analysis services, namely, scientific and technological research and analysis of functionality and structure of microprocessors therein; custom report preparation services, namely technical reports on function, layout, structure, and design of integrated circuit devices, semiconductor devices and processes, and electronic and technical equipment components, as determined through reverse engineering; product research and measurement evaluations in the field of consumer electronics products; preparation of custom and standard technical reports, namely, reports comprising results of scientific and technological research and analysis of electronic device and component functionality and structure and reverse engineering reports in the fields of electronics, consumer electronics, mobile devices, medical devices, data storage and memory devices and technology, dram memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, battery technology, cameras, lidar, radar, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, and information technology; analysis, namely, scientific and technological research and analysis of functionality and structure of semiconductor device logic systems, semiconductor materials and packaging analysis, semiconductor process flows, transistor characterization, semiconductor design and architecture, and semiconductor comparison of architecture, interconnection, and patterning; scientific and technological services, namely, deconstruction analysis and component analysis of electronic devices, consumer devices, technology equipment, and componentry thereof; technological analysis services, namely, scientific and technological research and analysis of functionality and structure of electronic devices and components for identification, interconnection, materials, construction, and costing of deconstructed electronic devices, consumer devices, technology equipment, and componentry thereof; analysis of integrated circuit and electronic designs and process technology; provision of integrated circuit design services; microelectronics engineering consulting services; design analysis services, namely, scientific and technological research and analysis of the functional and structural design of electronic devices and components to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies; process/structural analysis services, namely, scientific and technological research and analysis of the structures and manufacturing processes of electronic devices and components; microprocessor-based security card consulting services, namely, scientific and technological research and analysis of functionality and structure of electronic devices and components; technological custom report services, namely, preparing reports showing custom scientific and technological research and analysis of functionality and structure of technological devices and components; technical analysis of semiconductor and electronics patents, namely, scientific and technological research and analysis of in the field of reverse engineering of semiconductors and electronics and the function, layout, structure, and design thereof Intellectual property services, namely, intellectual property consulting services, intellectual property management; licensing of intellectual property, patent application preparation and preparation advisory services; patent validity assessment, infringement identification and analysis, technical patent infringement and claims analysis argument preparation, and expert and factual witness services in the field of intellectual property
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
38 - Services de télécommunications
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Printed and online publications, namely, custom and standard technical reports, newsletters, and magazines in the fields of electronics, consumer electronics, mobile devices, medical devices, storage devices and storage technology, DRAM memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, batteries, cameras, LiDAR, RADAR, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering, computers, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, information technology, and engineering design. (1) Providing multiple-user access to a global computer information network in the field of technical information regarding hardware and software used in the fields of computing devices, telecommunications, consumer devices, medical devices, data storage, automotive electronics, semiconductors, and battery technology; providing multiple-user access via a global computer information network to pre-existing and commissioned technical reports in the fields of electronics, consumer electronics, mobile devices, medical devices, data storage and memory devices and technology, DRAM memory, NAND flash memory, automotive electronics, internet of things and sensor technology, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, logic analysis, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, data security, firmware, hardware and software integrating systems design and design methodologies, and information technology; providing view-only access to technical reports for the purposes of offering for sale additional licensing rights for the use of such technical reports; offering subscription-based access to technical and market reports, and specific categories thereof; consulting services in the field of audio engineering, automotive engineering, biomedical and medical device engineering, computer engineering, electrical engineering, electronic engineering, forensic engineering, industrial engineering, manufacturing engineering, mechanical engineering, software engineering, and sound engineering; semiconductor integrated circuitry and electronic design analysis services; reverse engineering services; analysis of integrated circuits, electronics designs, and process technology relating to integrated circuits and electronics designs; provision of semiconductor circuit extraction, transistor characterization, and waveform analysis; provision of technical analysis of patents; provision of integrated circuit design services, microelectronics engineering consulting services, patent infringement and validity advisory services respecting semiconductor integrated circuitry and other electrical devices, and design analysis services to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies and law firms; intellectual property services, namely, intellectual property consulting services, liaison services, intellectual property identification, intellectual property auditing, intellectual property portfolio development, intellectual property management, intellectual property protection, strategy development for intellectual property exploitation, market analysis and assessment, competitive intellectual property analytics, technical analysis of competing products and intellectual property, licensing of intellectual property, patent application preparation and preparation advisory services, technical evaluation and rating of patents, patent validity assessment, infringement identification and analysis, technical patent infringement and claims analysis argument preparation, and expert and factual witness services in the field of intellectual property; education regarding integrated circuits, and electronic designs and process technology; education regarding intellectual property; process/structural analysis services, namely analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level; microprocessor-based security card analysis services; custom report preparation services, namely technical reports on integrated circuit devices, semiconductor devices and processes, electronic and technical equipment deconstruction and componentry, and intellectual property evaluations and analysis; product research and measurement and performance evaluations in the field of consumer electronics products; preparation of custom and standard technical reports and reverse engineering reports in the fields of electronics, consumer electronics, mobile devices, medical devices, , data storage and memory devices and technology, DRAM memory, NAND flash memory, automotive electronics, internet of things, sensor technology, image sensor technology, battery technology, cameras, LiDAR, RADAR, infotainment, embedded memory, semiconductors, wired and wireless network communications technology, antennas, power management technology, clean technology, optoelectronics, display technology, engineering and engineering design, computing devices, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, and information technology; analysis of semiconductor device logic systems, semiconductor materials and packaging analysis, semiconductor process flows, transistor characterization, semiconductor design and architecture, and semiconductor comparison of architecture, interconnection, and patterning; deconstruction and component analysis of electronic devices, consumer devices, technology equipment, and componentry thereof; analysis services for identification, interconnection, materials, construction, and costing of deconstructed electronic devices, consumer devices, technology equipment, and componentry thereof; provision of multiple-user access via a global computer network to deconstruction and component analysis reports and bills of materials of electronic devices, consumer devices, technology equipment, and componentry thereof; semiconductor integrated circuitry and electronic design analysis services; analysis of integrated circuit and electronic designs and process technology; provision of integrated circuit design services; microelectronics engineering consulting services; design analysis services to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies; process/structural analysis services; microprocessor-based security card consulting services; custom report services; technical analysis of semiconductor and electronics patents; patent infringement and validity advisory services respecting semiconductor integrated circuitry and other electrical devices.
21.
Ion beam delayering system and method, topographically enhanced delayered sample produced thereby, and imaging methods and systems related thereto
Described are various embodiments of an ion beam delayering system and method, topographically enhanced sample produced thereby, and imaging methods and systems related thereto. In one embodiment, a method comprises: identifying at least two materials in an exposed surface of the sample and predetermined operational characteristics of an ion beam mill that correspond with a substantially different ion beam mill removal rate for at least one of the materials; operating the ion beam mill in accordance with the predetermined operational characteristics to simultaneously remove the materials and introduce or enhance a topography associated with the materials and surface features defined thereby; acquiring surface data; and repeating the operating and acquiring steps for at least one more layer.
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01J 37/31 - Tubes à faisceau électronique ou ionique destinés aux traitements localisés d'objets pour couper ou perforer
22.
CONTRAST-ENHANCING STAINING SYSTEM AND METHOD AND IMAGING METHODS AND SYSTEMS RELATED THERETO
Described are various embodiments of a contrast-enhancing staining system and method. In one embodiment, a method is described for enhancing contrast in an image of a substrate surface between regions of said substrate having different charge carrier characteristics. The method comprises exposing said substrate to a staining precursor comprising an oxidant; directing microwave electromagnetic radiation at the substrate, said microwave electromagnetic radiation enhancing a reaction rate of said oxidant reacting into a deposition material, said reaction rate being related to the charge carrier characteristics of a proximal region; and acquiring an image of said substrate surface indicating a visual contrast between each of said regions based on differential deposition of the deposition material therebetween.
G01N 21/78 - Systèmes dans lesquels le matériau est soumis à une réaction chimique, le progrès ou le résultat de la réaction étant analysé en observant l'effet sur un réactif chimique produisant un changement de couleur
G01N 23/2202 - Préparation d’échantillons à cet effet
Described are various embodiments of a contrast-enhancing staining system and method. In one embodiment, a method is described for enhancing contrast in an image of a substrate surface between regions of said substrate having different charge carrier characteristics. The method comprises exposing said substrate to a staining precursor comprising an oxidant; directing microwave electromagnetic radiation at the substrate, said microwave electromagnetic radiation enhancing a reaction rate of said oxidant reacting into a deposition material, said reaction rate being related to the charge carrier characteristics of a proximal region; and acquiring an image of said substrate surface indicating a visual contrast between each of said regions based on differential deposition of the deposition material therebetween.
G01N 21/00 - Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c.-à-d. en utilisant des ondes submillimétriques, de la lumière infrarouge, visible ou ultraviolette
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
24.
Integrated circuit imaging, rendering and layout editing system and method
Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.
G06F 9/455 - ÉmulationInterprétationSimulation de logiciel, p. ex. virtualisation ou émulation des moteurs d’exécution d’applications ou de systèmes d’exploitation
G06F 30/39 - Conception de circuits au niveau physique
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
25.
SYSTEM AND METHOD FOR IMAGE SEGMENTATION FROM SPARSE PARTICLE IMPINGEMENT DATA
Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
G01N 23/04 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en transmettant la radiation à travers le matériau et formant des images des matériaux
G01N 23/203 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant la rétrodiffusion
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
G01Q 30/04 - Dispositifs d'affichage ou de traitement de données
26.
SYSTEM AND METHOD FOR IMAGE SEGMENTATION FROM SPARSE PARTICLE IMPINGEMENT DATA
Described are various embodiments of a system and method for segmenting images. Various aspects further relate to generating segmented images from sparsely sampled particle impingement data.
G01N 23/00 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou
G01N 23/04 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en transmettant la radiation à travers le matériau et formant des images des matériaux
G01N 23/203 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant la rétrodiffusion
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
27.
Reverse engineering data analysis system, and integrated circuit component data processing tool and method thereof
Described are reverse engineering data analysis systems, and integrated circuit component data processing tools and methods thereof. A system can comprise: a data storage device operable to store a data structure comprising extracted IC component data nodes representative of corresponding IC components of target IC and a connectivity therebetween; a graphical user interface (GUI); and a digital data processor operable on said data structure to: render, via said GUI, a dynamic graph of said data nodes; graphically migrate at least some of said data nodes on said dynamic graph as a function of a connectivity thereof with other nodes, wherein connected nodes are attractively displaced relative to one another such that said migrating nodes progressively cluster with related nodes to define distinct IC component clusters representative of distinct groups of related IC components of the target IC, whereas unconnected notes are repulsively displaced so to progressively distance said unconnected nodes.
G06F 30/327 - Synthèse logiqueSynthèse de comportement, p. ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
Described are various embodiments of an ion beam delayering system and method, and endpoint monitoring system and method therefor. In one embodiment, a method is described for monitoring an ion beam de-layering process for an unknown heterogeneously layered sample, the method comprising: grounding the sample to allow an electrical current to flow from the sample, at least in part, as a result of the ion beam de-layering process; milling a currently exposed layer of the sample using the ion beam, resulting in a given measurable electrical current to flow from the sample as said currently exposed layer is milled, wherein said given measurable electrical current is indicative of an exposed surface material composition of said currently exposed layer; detecting a measurable change in said measureable electrical current during said milling as representative of a corresponding exposed surface material composition change; and associating said measurable change with a newly exposed layer of the sample.
Described are various embodiments of an ion beam delayering system and method, and endpoint monitoring system and method therefor. In one embodiment, a method is described for monitoring an ion beam de-layering process for an unknown heterogeneously layered sample, the method comprising: grounding the sample to allow an electrical current to flow from the sample, at least in part, as a result of the ion beam de-layering process; milling a currently exposed layer of the sample using the ion beam, resulting in a given measurable electrical current to flow from the sample as said currently exposed layer is milled, wherein said given measurable electrical current is indicative of an exposed surface material composition of said currently exposed layer; detecting a measurable change in said measureable electrical current during said milling as representative of a corresponding exposed surface material composition change; and associating said measurable change with a newly exposed layer of the sample.
Described are various embodiments of an ion beam delayering system and method, topographically enhanced sample produced thereby, and imaging methods and systems related thereto. In one embodiment, a method comprises: identifying at least two materials in an exposed surface of the sample and predetermined operational characteristics of an ion beam mill that correspond with a substantially different ion beam mill removal rate for at least one of the materials; operating the ion beam mill in accordance with the predetermined operational characteristics to simultaneously remove the materials and introduce or enhance a topography associated with the materials and surface features defined thereby; acquiring surface data; and repeating the operating and acquiring steps for at least one more layer.
G01N 19/06 - Recherche par enlèvement de matière, p. ex. test à l'étincelle
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
33.
ION BEAM DELAYERING SYSTEM AND METHOD, TOPOGRAPHICALLY ENHANCED DELAYERED SAMPLE PRODUCED THEREBY, AND IMAGING METHODS AND SYSTEMS RELATED THERETO
Described are various embodiments of an ion beam delayering system and method, topographically enhanced sample produced thereby, and imaging methods and systems related thereto. In one embodiment, a method comprises: identifying at least two materials in an exposed surface of the sample and predetermined operational characteristics of an ion beam mill that correspond with a substantially different ion beam mill removal rate for at least one of the materials; operating the ion beam mill in accordance with the predetermined operational characteristics to simultaneously remove the materials and introduce or enhance a topography associated with the materials and surface features defined thereby; acquiring surface data; and repeating the operating and acquiring steps for at least one more layer.
G01N 19/06 - Recherche par enlèvement de matière, p. ex. test à l'étincelle
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
Described are reverse engineering data analysis systems, and integrated circuit component data processing tools and methods thereof. A system can comprise: a data storage device operable to store a data structure comprising extracted IC component data nodes representative of corresponding IC components of target IC and a connectivity therebetween; a graphical user interface (GUI); and a digital data processor operable on said data structure to: render, via said GUI, a dynamic graph of said data nodes; graphically migrate at least some of said data nodes on said dynamic graph as a function of a connectivity thereof with other nodes, wherein connected nodes are attractively displaced relative to one another such that said migrating nodes progressively cluster with related nodes to define distinct IC component clusters representative of distinct groups of related IC components of the target IC, whereas unconnected notes are repulsively displaced so to progressively distance said unconnected nodes.
G06F 30/327 - Synthèse logiqueSynthèse de comportement, p. ex. logique de correspondance, langage de description de matériel [HDL] à liste d’interconnections [Netlist], langage de haut niveau à langage de transfert entre registres [RTL] ou liste d’interconnections [Netlist]
G06F 30/398 - Vérification ou optimisation de la conception, p. ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
G06F 21/14 - Protection des logiciels exécutables contre l’analyse de logiciel ou l'ingénierie inverse, p. ex. par masquage
Described are various embodiments of a reverse engineering data analysis system, and integrated circuit component data processing tool and method thereof. In one such embodiment, an integrated circuit (IC) reverse engineering data management system for processing IC component data extracted from a target IC is described that comprises: a data storage device operable to store a data structure comprising a plurality of extracted IC component data nodes representative of a corresponding plurality of IC components of the target IC and a connectivity therebetween; a graphical user interface (GUI); and a digital data processor operable on said data structure to: render, via said GUI, a dynamic graph of said data nodes; graphically migrate at least some of said data nodes on said dynamic graph as a function of a connectivity thereof with other nodes, wherein connected nodes are attractively displaced relative to one another such that said migrating nodes progressively cluster with related nodes to define distinct IC component clusters representative of distinct groups of related IC components of the target IC, whereas unconnected notes are repulsively displaced so to progressively distance said unconnected nodes. Various related methods, processes, systems and computer-readable media are also described.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01R 31/303 - Test sans contact de circuits intégrés
G06F 3/14 - Sortie numérique vers un dispositif de visualisation
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
36.
Integrated circuit imaging, rendering and layout editing system and method
Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.
G06F 9/455 - ÉmulationInterprétationSimulation de logiciel, p. ex. virtualisation ou émulation des moteurs d’exécution d’applications ou de systèmes d’exploitation
Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.
Devices, systems and methods relating to a distortion-correcting imaging for collecting image-related data of a substrate are disclosed, comprising: a beam emitter for directing an emission at an intended location on the substrate, and a signal detector for determining a signal intensity value associated with the emission; wherein the signal intensity value is associated with a corrected substrate location, said corrected substrate location determined from the intended substrate location and a correction factor, said correction factor being a function of said intended substrate location.
H01J 37/304 - Commande des tubes par une information en provenance des objets, p. ex. signaux de correction
H01J 37/26 - Microscopes électroniques ou ioniquesTubes à diffraction d'électrons ou d'ions
H01J 37/22 - Dispositifs optiques ou photographiques associés au tube
H04N 5/357 - Traitement du bruit, p.ex. détection, correction, réduction ou élimination du bruit
G01N 23/2251 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM]
H01J 37/28 - Microscopes électroniques ou ioniquesTubes à diffraction d'électrons ou d'ions avec faisceaux de balayage
39.
Method and system for ion beam delayering of a sample and control thereof
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.
Methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. A first component or node on an integrated circuit is coupled to a second component or node on the same integrated circuit. After an external bias is applied to the first component or node, a focused ion beam is applied to the integrated circuit and an image is taken using an electron detector. The features or components on the integrated circuit which are coupled to the second component or node will show up in high contrast on the resulting image. The method may also involve applying a bias to a node or component and then using focused ion beam imaging techniques (through an electron detector) to arrive at an image of the integrated circuit. Components coupled to the node will appear in high contrast in the resulting image.
G21G 5/00 - Conversion supposée des éléments chimiques par réaction chimique
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
H01J 37/22 - Dispositifs optiques ou photographiques associés au tube
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
G01R 31/303 - Test sans contact de circuits intégrés
43.
METHODS, SYSTEMS AND DEVICES RELATING TO DISTORTION CORRECTION IN IMAGING DEVICES
Devices, systems and methods relating to a distortion-correcting imaging for collecting image-related data of a substrate are disclosed, comprising: a beam emitter for directing an emission at an intended location on the substrate, and a signal detector for determining 5 a signal intensity value associated with the emission; wherein the signal intensity value is associated with a corrected substrate location, said corrected substrate location determined from the intended substrate location and a correction factor, said correction factor being a function of said intended substrate location.
G01N 23/00 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou
G01N 21/84 - Systèmes spécialement adaptés à des applications particulières
G01R 33/565 - Correction de distorsions d'image, p. ex. dues à des inhomogénéités de champ magnétique
44.
METHODS, SYSTEMS AND DEVICES RELATING TO DISTORTION CORRECTION IN IMAGING DEVICES
Devices, systems and methods relating to a distortion-correcting imaging for collecting image-related data of a substrate are disclosed, comprising: a beam emitter for directing an emission at an intended location on the substrate, and a signal detector for determining 5 a signal intensity value associated with the emission; wherein the signal intensity value is associated with a corrected substrate location, said corrected substrate location determined from the intended substrate location and a correction factor, said correction factor being a function of said intended substrate location.
G01N 21/84 - Systèmes spécialement adaptés à des applications particulières
G01N 23/00 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou
G01R 33/565 - Correction de distorsions d'image, p. ex. dues à des inhomogénéités de champ magnétique
Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.
G21G 5/00 - Conversion supposée des éléments chimiques par réaction chimique
G01R 31/303 - Test sans contact de circuits intégrés
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
36 - Services financiers, assurances et affaires immobilières
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
Market research Brokerage in the field of patents acquisitions and licensing Product research and development, namely, product teardowns; technology research, namely, product research and development related to patent infringement; engineering, namely, reverse engineering; preparation of technical analysis reports in support of patent activities Patent consultation, namely, providing prior art analysis, patent claims analysis, evidence of use, patent infringement analysis, licensing and litigation support, advice regarding patent improvement, patent prosecution support, patent and portfolio assessment, patent landscaping, patent portfolio analysis; providing expert witnesses in the field of intellectual property and patents; patent portfolio auditing; patent portfolio management consulting; patent strategy consulting
37 - Services de construction; extraction minière; installation et réparation
42 - Services scientifiques, technologiques et industriels, recherche et conception
44 - Services médicaux, services vétérinaires, soins d'hygiène et de beauté; services d'agriculture, d'horticulture et de sylviculture.
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Product teardowns; Technology research in the field of consumer electronics teardowns, costing and bill of materials analysis, circuit analysis, systems and software analysis, semiconductor package design and process fabrication analysis, technology trends analysis, namely patent landscaping, technology roadmaps, technology commentary - multiple technology areas electronics, automotive, clean energy, medical devices, internet of things, and market research; Consulting in the field of reverse engineering; Preparation of technical analysis reports for others in the field of patents and inventions; Prior art analysis; Patent claims analysis; Litigation support, namely providing evidence of use for others, namely identification and preparation of evidence of use; Infringement analysis, namely analysis of infringement of intellectual property and other legal rights; Patent licensing and litigation support, namely, licensing campaign strategy development and planning, patent portfolio mining for patent licensing campaigns, product and market evaluations for patent licensing campaigns, due diligence and risk assessment for patent licensing campaigns; Advising regarding patent improvement; Patent prosecution support; Patent and portfolio assessment; Patent landscaping; Patent portfolio mining; Patent portfolio auditing; Patent portfolio management consulting; Patent strategy consulting; Patent brokerage.
36 - Services financiers, assurances et affaires immobilières
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
Produits et services
[ Market and technical intelligence acquisition services, namely, providing market analysis and market assessment information relating to the use, cost, sourcing, functionality, and technical significance of electronic devices, as well as components and subcomponents thereof ] [ Market and technical intelligence acquisition services, namely, providing financial analysis information relating to the use, cost, sourcing, functionality, and technical significance of electronic devices, as well as components and subcomponents thereof; intellectual property benchmarking consulting services, namely, financial valuation relating to the identification of, and comparison of components of electronic devices and systems to, relevant patents, patent applications, technical reports and analyses, and other reverse engineering and technical analysis reports ] Reverse engineering services for assessing the layouts, connectivity, and functionality of circuitry and subcomponents of components of electronic devices and systems; Market and technical intelligence acquisition services, namely, providing technological information relating to the use, cost, sourcing, functionality, and technical significance of electronic devices, as well as components and subcomponents thereof; Semiconductor integrated circuitry and electronic design analysis services; technological analysis of integrated circuit and electronic designs and process technology; technological analysis of semiconductor and electronics patents; provision of integrated circuit design services; microelectronics engineering consulting services; providing technology design analysis services to the engineering, marketing and intellectual property groups of companies operating in the fields of semiconductors, electronics and information technology companies, namely, analyzing the designs of semiconductors, integrated circuitry and electronics for others; custom report services, namely, preparation of technology reports in the fields of semiconductors, integrated circuitry, and electronics for others; preparation of technology reports consisting of visual and textual representations of components of electronic devices and systems, including the layouts, structure, materials, connectivity, interrelationships, and functionality of circuitry and other functional and structural elements within such components; preparation of technology reports consisting of visual and textual representations of components of electronic devices and systems at various stages of reverse engineering, computer and hand generated representations of circuitry generated at various stages of reverse engineering; preparation of technology reports consisting of visual and textual representations of associations between reports of visual and textual representations of components of electronic devices and systems and other documents, said other documents including patents, patent applications, and third party technical reports and assessments; preparation of technology reports of visual and textual representations of electronic devices and systems that include characteristics and data relating to the electronic components within said electronic devices and systems; providing an online searchable database featuring collections of technology reports of visual and textual representations of components of electronic devices and systems, for review, comparison, sale and licensing Intellectual property consultation services relating to the identification of, and comparison of components of electronic devices and systems to, relevant patents, patent applications, technical reports and analyses, and other reverse engineering and technical analysis reports; intellectual property consultation, namely, patent infringement and validity advisory services respecting semiconductor integrated circuitry and other electrical devices; intellectual property consultation services, namely, intellectual property liaison services, intellectual property identification, intellectual property auditing, intellectual property portfolio development, intellectual property management, intellectual property protection, strategy development for intellectual property exploitation, market analysis and assessment, technical analysis of competing products, technology licensing, patent application preparation, technical evaluation and rating of patents, patent validity assessment, infringement identification and analysis Downloadable technical reports consisting of visual and textual representations of components of electronic devices and systems, including the layouts, structure, materials, connectivity, interrelationships, and functionality of circuitry and other functional and structural elements within such components; downloadable technical reports consisting of visual and textual representations of components of electronic devices and systems at various stages of reverse engineering, computer and hand generated representations of circuitry generated at various stages of reverse engineering; downloadable technical reports consisting of visual and textual representations of associations between technical reports of visual and textual representations of components of electronic devices and systems and other documents, said other documents including patents, patent applications, and third party technical reports and assessments; downloadable technical reports and collections of downloadable technical reports of visual and textual representations of electronic devices and systems that include characteristics and data relating to the electronic components within said electronic devices and systems; providing a searchable electronic database featuring collections of technology reports of visual and textual representations of components of electronic devices and systems, for review, comparison, sale and licensing [ Technical reports in printed form consisting of visual and textual representations of components of electronic devices and systems, including the layouts, structure, materials, connectivity, interrelationships, and functionality of circuitry and other functional and structural elements within such components; technical reports in printed form consisting of visual and textual representations of components of electronic devices and systems at various stages of reverse engineering, computer and hand generated representations of circuitry generated at various stages of reverse engineering; technical reports in printed form consisting of visual and textual representations of associations between technical reports in printed form of visual and textual representations of components of electronic devices and systems and other documents, said other documents including patents, patent applications, and third party technical reports and assessments; technical reports in printed form and collections of technical reports in printed form of visual and textual representations of electronic devices and systems that include characteristics and data relating to the electronic components within said electronic devices and systems ]
Methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. A first component or node on an integrated circuit is coupled to a second component or node on the same integrated circuit. After an external bias is applied to the first component or node, a focused ion beam is applied to the integrated circuit and an image is taken using an electron detector. The features or components on the integrated circuit which are coupled to the second component or node will show up in high contrast on the resulting image. The method may also involve applying a bias to a node or component and then using focused ion beam imaging techniques (through an electron detector) to arrive at an image of the integrated circuit. Components coupled to the node will appear in high contrast in the resulting image.
G21G 5/00 - Conversion supposée des éléments chimiques par réaction chimique
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
H01J 37/22 - Dispositifs optiques ou photographiques associés au tube
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
G01R 31/303 - Test sans contact de circuits intégrés
Methods and systems for tracing circuitry on integratedcircuits using focused ion beam based imaging techniques. Afirst component or node on an integrated circuit is coupled toa second component or node on the same integrated circuit.After an external bias is applied to the first component ornode, a focused ion beam is applied to the integrated circuitand an image is taken using an electron detector. The featuresor components on the integrated circuit which are coupled tothe second component or node will show up in high contrast onthe resulting image. The method may also involve applying abias to a node or component and then using focused ion beamimaging techniques (through an electron detector) to arrive atan image of the integrated circuit. Components coupled to thenode will appear in high contrast in the resulting image.
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
35 - Publicité; Affaires commerciales
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Printed and electronic publications, namely technical reports in the field of semiconductors, integrated circuitry and electronics consisting of visual and textual representations of components of said electronic devices and systems, including the layouts, structure, materials, connectivity, interrelationships, and functionality of circuitry and other functional and structural elements within such components; Printed and electronic publications, namely technical reports in the field of semiconductors, integrated circuitry, and electronics consisting of visual and textual representations of components of said electronic devices and systems at various stages of reverse engineering, computer and hand generated representations of circuitry generated at various stages of reverse engineering; Printed and electronic publications, namely technical reports in the field of semiconductors, integrated circuitry and electronics consisting of visual and textual representations of associations between reports of visual and textual representations of components of said electronic devices and systems and other documents, said other documents including, namely patents, patent applications, and third party technical reports and assessments; Printed and electronic publications, namely technical reports and collections of technical reports in the field of semiconductors, integrated circuitry, and electronics of visual and textual representations of said electronic devices and systems that include characteristics and data relating to the electronic components within said electronic devices and systems (1) Reverse engineering services for assessing the layouts, connectivity, and functionality of circuitry and subcomponents of components of electronic devices and systems, namely semiconductors, integrated circuitry, and printed and other circuit boards; Market and technical intelligence acquisition services for providing technological, market analysis, market assessment and financial analysis information relating to the use, cost, sourcing, functionality, and technical significance of electronic devices, as well as components and subcomponents thereof
(2) Intellectual property and benchmarking consulting services relating to the identification of, and comparison of components of electronic devices and systems to, relevant patents, patent applications, technical reports and analyses, and other reverse engineering and technical analysis reports
(3) Semiconductor integrated circuitry and electronic design analysis services; analysis of integrated circuit and electronic designs and process technology in the field of integrated circuitry; technical analysis of semiconductor and electronics patents; provision of integrated circuit design services; microelectronics engineering consulting services; patent infringement and validity advisory services respecting semiconductor integrated circuitry and other electrical devices; providing technology design analysis services to the engineering, marketing and intellectual property groups of companies operating in the fields of semiconductor, electronics, and information technology namely, analyzing the designs of semiconductors, integrated circuitry, and electronic for others; intellectual property consultation services, namely, intellectual property liaison services, intellectual property identification, intellectual property auditing, intellectual property portfolio development, intellectual property management, intellectual property protection, strategy development for intellectual property exploitation, market analysis and assessment, technical analysis of competing products, technology licensing, patent application preparation, technical evaluation and rating of patents, patent validity assessment, infringement identification and analysis; custom report services, namely, preparation of technology reports in the fields of semiconductors, integrated circuitry, and electronics for others
(4) Preparation of reports consisting of visual and textual representations of components of electronic devices and systems, including the layouts, structure, materials, connectivity, interrelationships, and functionality of circuitry and other functional and structural elements within such components; preparation of reports consisting of visual and textual representations of components of electronic devices and systems at various stages of reverse engineering, computer and hand generated representations of circuitry generated at various stages of reverse engineering; preparation of reports consisting of visual and textual representations of associations between reports of visual and textual representations of components of electronic devices and systems and other documents, said other documents including patents, patent applications, and third party technical reports and assessments; preparation of reports of visual and textual representations of electronic devices and systems that include characteristics and data relating to the electronic components within said electronic devices and systems; collections of reports of visual and textual representations of components of electronic devices and systems for review, comparison, sale and licensing
Methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. A first component or node on an integrated circuit is coupled to a second component or node on the same integrated circuit. After an external bias is applied to the first component or node, a focused ion beam is applied to the integrated circuit and an image is taken using an electron detector. The features or components on the integrated circuit which are coupled to the second component or node will show up in high contrast on the resulting image. The method may also involve applying a bias to a node or component and then using focused ion beam imaging techniques (through an electron detector) to arrive at an image of the integrated circuit. Components coupled to the node will appear in high contrast in the resulting image.
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
A method for determining if a device on a pre-existing CMOS integrated circuit is a p-channel device or an n-channel device. The method comprises etching the contact etch stop layer (CESL) which occurs at different rates on the two different CESL types thus allowing the device type to be determined by examining how much non-etched material is left.
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
G01R 31/303 - Test sans contact de circuits intégrés
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
H01J 37/31 - Tubes à faisceau électronique ou ionique destinés aux traitements localisés d'objets pour couper ou perforer
56.
A DIGITAL NETLIST PARTITIONING SYSTEM FOR FASTER CIRCUIT REVERSE-ENGINEERING
Methods and systems are provided to reduce the complexity of sequential digital circuitry including cells of unknown function by grouping and defining like instance of combinational circuitry cells. The system groups together cells that feed into the same combination of one or more state cells. The groups of cells are then replaced by clouds which are defined in the netlist for the sequential digital circuitry to produce a simpler representation of the circuitry for analysis purposes and to aid in determining the function of those cells for which the function is unknown.
Methods and systems are provided to reduce the complexity of sequential digital circuitry including cells of unknown function by grouping and defining like instance of combinational circuitry cells. The system groups together cells that feed into the same combination of one or more state cells. The groups of cells are then replaced by clouds which are defined in the netlist for the sequential digital circuitry to produce a simpler representation of the circuitry for analysis purposes and to aid in determining the function of those cells for which the function is unknown.
Methods and systems are provided to reduce the complexity of sequential digital circuitry including cells of unknown function by grouping and defining like instance of combinational circuitry cells. The system groups together cells that feed into the same combination of one or more state cells. The groups of cells are then replaced by clouds which are defined in the netlist for the sequential digital circuitry to produce a simpler representation of the circuitry for analysis purposes and to aid in determining the function of those cells for which the function is unknown.
A system is disclosed for displaying circuitry interconnections as flightlines between a component specified as the local component and the foreign components connecting to the local component. Upon obtaining data of the circuit components and interconnections, a user can designate the local component from among all of the circuit components. The system determines the foreign components connected to that local component, retrieves the flightline appearance display settings for the computer display, and renders a view of the specified local component and its foreign components with flightlines representing each interconnection connection. The flightlines can be color coded to indicate inputs, outputs or other characteristics of interest to the user.
A system is disclosed for displaying circuitry interconnections as flightlines between a component specified as the local component and the foreign components connecting to the local component. Upon obtaining data of the circuit components and interconnections, a user can designate the local component from among all of the circuit components. The system determines the foreign components connected to that local component, retrieves the flightline appearance display settings for the computer display, and renders a view of the specified local component and its foreign components with flightlines representing each interconnection connection. The flightlines can be color coded to indicate inputs, outputs or other characteristics of interest to the user.
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
G06F 3/14 - Sortie numérique vers un dispositif de visualisation
A system is disclosed for displaying circuitry interconnections as flightlines between a component specified as the local component and the foreign components connecting to the local component. Upon obtaining data of the circuit components and interconnections, a user can designate the local component from among all of the circuit components. The system determines the foreign components connected to that local component, retrieves the flightline appearance display settings for the computer display, and renders a view of the specified local component and its foreign components with flightlines representing each interconnection connection. The flightlines can be color coded to indicate inputs, outputs or other characteristics of interest to the user.
A method, computer-readable medium and system are described for deriving a schematic diagram representative of an integrated circuit (1C) comprising a plurality of circuit elements. In general, the method, computer-readable medium and system are configured to receive as input a working schematic diagram identifying at least some of the circuit elements, and at least one existing schematic diagram from one or more libraries thereof. Based on this input, at least a portion of the working schematic diagram that matches at least a portion of the at least one existing schematic diagram is identified and replaced, thereby forming a revised schematic diagram.
The current invention uses structural data mining methods and systems, combined with partitioning hints and heuristics, to locate high level library functional blocks in a gate level netlist of an integrated circuit (IC). In one embodiment of the invention, the library is created by synthesizing various design blocks and constraints. The method supports characterization matching between a netlist and a library, between libraries and between netlists. The data mining method described herein uses a subgraph growing method to progressively characterize the graph representation of the netlist of the IC. In one embodiment of the invention, alternative hashing is used to perform subgraph characterization. Further, the located high level functional blocks may be used to substitute the corresponding portions of the target netlist having the matched characterizations, and may be annotated accordingly in the resulting netlist.
The current invention uses structural data mining methods and systems, combined with partitioning hints and heuristics, to locate high level library functional blocks in a gate level netlist of an integrated circuit (IC). In one embodiment of the invention, the library is created by synthesizing various design blocks and constraints. The method supports characterization matching between a netlist and a library, between libraries and between netlists. The data mining method described herein uses a subgraph growing method to progressively characterize the graph representation of the netlist of the IC. In one embodiment of the invention, alternative hashing is used to perform subgraph characterization. Further, the located high level functional blocks may be used to substitute the corresponding portions of the target netlist having the matched characterizations, and may be annotated accordingly in the resulting netlist.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
[ Design analysis software for use in the analysis and reverse engineering of semiconductor devices, integrated circuits, microelectromechanical (MEMS) devices, photonics systems, electronic systems and software ] Analysis and reverse engineering of semiconductor devices, integrated circuits, microelectromechanical (MEMS) devices, photonics systems, electronic systems and software; Engineering consultation services in the field of semiconductor devices, integrated circuits, microelectromechanical (MEMS) devices, photonics systems, electronic systems, software and patents; Providing information about semiconductor devices, integrated circuits, microelectromechanical (MEMS) devices, photonics systems, electronic systems, software and patents
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Engineering services and consultation in the area of semi-conductor integrated circuits; engineering services and consultation in the areas of electronic systems and software, communications and photonics and patent portfolio analysis.
67.
METHOD OF DERIVING AN INTEGRATED CIRCUIT SCHEMATIC DIAGRAM
A method, computer-readable medium and system are described for deriving a schematic diagram representative of an integrated circuit (1C) comprising a plurality of circuit elements. In general, the method, computer-readable medium and system are configured to receive as input a working schematic diagram identifying at least some of the circuit elements, and at least one existing schematic diagram from one or more libraries thereof. Based on this input, at least a portion of the working schematic diagram that matches at least a portion of the at least one existing schematic diagram is identified and replaced, thereby forming a revised schematic diagram.
The present invention seeks to provide a simple, but novel regime, for re-labelling swappable pins that permits swappability information to be maintained without significantly increasing computational complexity and is conducive to inexact pattern matching for the purposes of developing more complex logical processing blocks from elementary components in design analysis. The method comprises a recursive application of a simple labelling procedure. This method is repeated recursively until all gate instances in the circuit fragment have been assigned a swappability number.
The present invention seeks to provide a simple, but novel regime, for re-labelling swappable pins that permits swappability information to be maintained without significantly increasing computational complexity and is conducive to inexact pattern matching for the purposes of developing more complex logical processing blocks from elementary components in design analysis. The method comprises a recursive application of a simple labelling procedure. This method is repeated recursively until all gate instances in the circuit fragment have been assigned a swappability number.
A schematic diagram detailing a circuit that was reverse engineered from a plurality of images taken of the circuit is provided. The schematic diagram includes at least one circuit element that was represented as an object in at least one of the plurality of images, such that signal continuity information was determined through local tracing of connectivity between a first image and a second image of the plurality of images. A method of tracing the connectivity within the plurality of images to produce the schematic diagram is also disclosed.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
G06K 9/36 - Prétraitement de l'image, c. à d. traitement de l'information image sans se préoccuper de l'identité de l'image
71.
A METHOD OF LOCAL TRACING OF CONNECTIVITY AND SCHEMATIC REPRESENTATIONS PRODUCED THEREFROM
A schematic diagram detailing a circuit that was reverse engineered from a plurality of images taken of the circuit is provided. The schematic diagram comprises at least one circuit element that was represented as an object in at least one of the plurality of images, such that signal continuity information was determined through local tracing of connectivity between a first image and a second image of the plurality of images. A method of tracing the connectivity within the plurality of images to produce the schematic diagram is also disclosed.
41 - Éducation, divertissements, activités sportives et culturelles
Produits et services
Providing online non-downloadable publications, namely, magazines and electronic newsletters in the fields of microprocessor and micro controller based systems for firmware, hardware and software for design professionals, including integration of hardware, software and firmware, practical designs and how-to technical features, product updates, engineering and high technologies and free demonstrations, new products related to integrated circuits, computers, electronic components and high technology provided via e-mail; arranging and conducting educational and instructional services, namely, providing seminars and providing instruction in the field of information technology, electronic designs and applications for technology professionals; providing instruction in the field of [ automotives and automotive diagnostic services featuring computer software and information technology for the development of technologies for the fabrication of automotive electronics for automotive professionals; providing instruction in the fields of becoming engineers and engineering managers, ] consumer audio electronics, portable audio, TV and home entertainment audio, satellite radio, automotive, and audio signal processing; providing instruction in the fields of engineering, digital television systems and equipment, networking systems and equipment, voice and data networking, digital rights management, advanced display architectures and video codec techniques via a website on the Internet; design resource, namely, online and non-downloadable resource guides for [ engineers, engineer managers and military ] in the fields of developing signal processing systems, communications, audio, video and imaging technologies, motion control technology [ and aerospace technology ] via the Internet; providing instruction in the fields of development, design and implementation of electronic technology, high technology, mobile communications technology and mobile communications systems architecture, electronic designs and applications for technology professionals, wireless networking technology, video technology and imaging technology via a website on the Internet; [ providing educational workshops, namely, providing web casts in the field of mechatronic design for micro controllers, mechanics and electrical engineers; providing interactive training courses for engineers in the field of engineering technology provided by means of a global computer network and distributing course materials in connection therewith; ] educational services in the nature of classes, courses and seminars regarding intellectual property, integrated circuits, and electronic designs and process technology; providing news and information, namely, providing blogs featuring postings in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology [ and aerospace technology ]
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
Providing multiple-user access to a global computer information network featuring technical information regarding computer hardware and software; Online services, namely, providing an online database featuring information in the field of mobile communications Online services, namely, providing an online database featuring information in the following fields, namely, electronic circuit designs and computer software applications for technology professionals, computer software and information technology for the development of technologies for the fabrication of automotive electronics for automotive professionals, consumer audio electronics design, portable audio products design, TV and home entertainment audio products design, satellite radio design, design of integrated circuits for automotive and audio signal processing, engineering, information technology, digital television systems and equipment design, networking systems and equipment design, voice and data networking design, digital rights management, advanced display architectures and video codec techniques design, industrial control design, high information technology, mobile communications technology and mobile communications systems architecture, wireless networking technology design, video technology and imaging technology design, all via the Internet; Consulting services in the field of engineering; Semiconductor integrated circuitry and electronic design analysis services, analysis of integrated circuit and electronic designs and process technology, provision of integrated circuit design services, microelectronics engineering consulting services; design analysis of semiconductors for engineering, marketing companies, intellectual property consulting companies, electronics companies, and information technology companies, Design of integrated circuits; process/structural analysis services, namely, analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level, and preparing related technical reports; microprocessor-based security card consulting services, namely, technical consulting services in the field of security access cards featuring embedded microprocessors; Online services, namely, providing a database featuring news and information in the fields of engineering, computers, and electronics design; providing news and information for engineers in the fields of development, design and implementation of electronic technology, high technology, mobile communications technology, mobile communications systems architecture and wireless networking technology; providing a website featuring news and information in the field of mechatronic design for microcontrollers, mechanics and electrical engineers, via the Internet; Product on-line evaluation services of mechatronic design for microcontrollers mechanics and electrical engineers, via the Internet; providing news and information in the field of engineering design, communications technology related to military developing signal processing systems, motion control technology and aerospace technology via the Internet; Providing news and information for engineers in the following fields, namely, design for engineers, design and implementation of electronic technology, engineering design patent infringement and validity advisory services; licensing of intellectual property, patent application preparation, patent validity assessment, infringement identification and analysis, technical patent infringement and claims analysis argument preparation; expert and factual witness services in legal matters in the field of intellectual property
Arranging, promoting and conducting trade shows, expositions and business conferences in the field of microprocessor and microcontroller based systems development, Radio Frequency Identifier (RFID) industry; [ promoting the goods and services of computer technology companies by preparing and placing advertisements accessed through a global computer network; ] business market analysis services; providing an online database featuring industry information relating to the analog and mixed signals marketplace; intellectual property management
75.
Method and apparatus for removing dummy features from a data structure
A method and apparatus to reduce occurrences of electrically non-functional elements, known as dummy features, from a source data structure is described. The source data structure may be image data, a vector based data structure or some other data format. Dummy features in the source data structure are detected and then deleted. Dummy features may be detected by selecting a representative dummy feature, using it as a reference pattern or polygon and comparing it to features in the source data structure. The step of comparing the selected reference to the comprises selecting a cut-off correlation threshold value, and computing the correlation coefficients between the reference and the feature. Features are selectively removed based on a comparison between their correlation coefficients and the selected cut-off correlation threshold value. This threshold value may require updating to remove all dummy features in the source data structure. When different shaped dummy features in the same data structure are encountered, a further reference feature may be selected and the process repeated.
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Printed publications, namely, newsletters and magazines in the fields of electronics, engineering; computers, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, information technology and engineering design. (1) Providing multiple-user access to a global computer information network in the field of technical information regarding computer hardware and software; Consulting Services in the field of audio engineering, automotive engineering, biomedical engineering, computer engineering, electrical engineering, electronic engineering, forensic engineering, industrial engineering, manufacturing engineering, mechanical engineering, software engineering, sound engineering; Semiconductor integrated circuitry and electronic design analysis services; Analysis of integrated circuit and electronic designs and process technology; Technical analysis of semiconductor and electronics patents; Provision of integrated circuit design services, microelectronics engineering consulting services, patent infringement and validity advisory services respecting semiconductor integrated circuitry and other electrical devices, design analysis services to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies, intellectual property services, namely, consulting services, liaison services, intellectual property identification, intellectual property auditing, intellectual property portfolio development, intellectual property management, intellectual property protection, strategy development for intellectual property exploitation, technical analysis of competing products, licensing of intellectual property, patent application preparation, technical evaluation and rating of patents, patent validity assessment, infringement identification and analysis, technical patent infringement and claims analysis argument preparation, expert and factual witness services in the field of intellectual property, integrated circuits, and electronic designs and process technology, process/structural analysis services, namely analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level, microprocessor-based security card consulting services, custom report services, namely technical reports on integrated circuit devices, semiconductor devices and processes, and intellectual property evaluations and analysis; Product research, measurement evaluations in the field of consumer electronics products.
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
35 - Publicité; Affaires commerciales
38 - Services de télécommunications
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
On-line publications namely downloadable electronic magazines in the fields of electronics, computers, office systems management, microprocessor, microcontroller based systems for firmware, hardware and software design professionals, including integration of hardware, software and firmware, practical designs and how-to-technical features, product updates, engineering and high technologies and free demonstrations, downloadable computer hardware evaluation programs; C-ROMs or DVDs featuring computer hardware and software evaluation programs; downloadable electronic newsletters in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audiom video and imaging technologies, motion control technology and acrospace technology. Printed publications, namely, newsletters and magazines in the fields of electronics, engineering, computers, high technology, office systems management, microprocessor and microcontroller-based systems, firmware, hardware and software integrating systems design and design methodologies, information technology and engineering design. Arranging, promoting and conducting trade shows, expositions and conferences in the field of microprocessor and microcontroller based systems development, radio Frequency Identifier (RFID) industry; promoting the goods and services of computer technology companies by preparing and placing advertisements accessed through a global computer network; business market analysis services. Providing multiple-user access to a global computer information network featuring technical information regarding computer hardware and software. Providing on-line publications, namely magazines and electronic newsletters in the field of microprocessor and microcontroller based systems for firmware, hardware and software design professionals, including integration of hardware, software and firmware, practical designs and how-to technical features, product updates, engineering and high technologies and free demonstrations of new products related to integrated circuits, computers, electronic components and high technology provided via e-mail; arranging, promoting and conducting educational and instructional services, namely providing seminars and providing instruction in the field of information technology, electronic designs and applications for technology professionals, providing instruction in the field of automotives and automotive diagnostic services featuring computer software and information technology for the development of technologies for the fabrication of automotive electronics for automotive professionals, providing instruction in the fields of engineers and engineering managers, consumer audio electronics, portable audio,TV and home entertainment audio, satellite radio, automotive, and audio signal processing, providing instruction in the fields of engineering, digital television systems and equipment, networking systems and equipment, voice and data networking, digital rights management, advanced display architectures and video codec techniques via a website on the internet, providing educational workshops, web casts in the field of mechatronic design, for microcontrollers, mechanics and electrical engineers, providing interactive training courses for engineers in the field of engineering technology provided by means of a global computer network and distributing course materials in connection therewith; educational services in the nature of classes, courses and seminars regarding intellectual property, integrated circuits, and electronic designs and process technology; providing educational news and information namely blog postings in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology, aerospace technology, development, design and implementation of electronic technology, via the internet; providing educational news and information in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology and aerospace technology, via the internet; publication of electronic newsletters in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology and aerospace technology, via the internet. On-line services, namely, providing on-line information in the fields of electronic designs and applications for technology professionals, automotives and automotive diagnostic services featuring computer software and information technology for the development of technologies for the fabrication of automotive electronics for automotive professionals, engineers and engineering managers, consumer audio electronics, portable audio, TV and home entertainment, audio, satellite radio, automotive and audio signal processing, engineering, technology, digital television systems and equipment, networking systems and equipment, voice and data networking, digital rights management, advanced display architectures and video codec techniques, industrial control engineers and design, high technology, mobile communications and mobile communications systems architecture; providing industry information relating to the analog and mixed signals marketplace, wireless networking technology, video technology and imaging technology, via the internet; consulting services in the field of engineering; semiconductor integrated circuitry and electronic design analysis services; technical analysis of integrated circuit technology and electronic designs and process technology; technical analysis of semiconductor and electronics patents; provision of integrated circuit design services; microelectronics engineering consulting services; design analysis services to the engineering, marketing, and intellectual property groups of semiconductor, electronics, and information technology companies; technical analysis of competing products; product research, measurement evaluations in the field of consumer electronics products; providing computer hardware and software evaluation services that may be downloaded from a global computer network or via CD-ROM or DVD; providing technical news and information in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology and aerospace technology, via the internet; on-line services, namely, providing news and information in the fields of electronics, engineering, computers, high technology and office systems management, new products related to ingegrated circuits, electronic components; providing news and information for engineers and electrical engineering in the fields of development, industrial control engineers and designers, design and implementation of electronic technology, engineering design; providing news and information for engineers and electrical engineering in the fields of development, design and implementation of electronic technology, high technology, mobile communications technology and mobile communications systems architecture, wireless networking technology; providing a micro site featuring news and information in the field of mechatronic design, for microcontrollers, mechanics and electrical engineers, via the Internet; product demonstration services, namely, online evaluation services of mechatronic design, for microcontrollers mechanisms and electrical engineer via the Internet; providing a website in the fields of design resources for engineers, engineer managers and military developing signal processing systems, and in the fields of communications, audio, video and imaging technologies, motion control technology and aerospace technology via the Internet; providing a website in the fields of development, design and implementation of electronic technology, high technology, mobile communications technology, mobile communications systems architecture, engineering, electronic designs and applications for technology professionals, wireless networking technology, video technology and imaging technology via the internet; providing technical news and information namely blog postings in the fields of design resource for engineers, engineer managers and military developing signal processing systems, communications, audio, video and imaging technologies, motion control technology and aerospace technology, development, design and implementation of electronic technology via the Internet. Advisory services relating to intellectual property rights and intellectual property protection; services for the exploitation of intellectual property rights; investigations in relation to intellectual property; advisory services relating to intellectual property licensing; advisory services relating to patents; advisory services relating to infringement of patents; management of patents; licensing of integrated circuit hardware and software.
78.
METHOD OF PREPARING AN INTEGRATED CIRCUIT DIE FOR IMAGING
Integrated circuit dies are prepared for imaging by completely etching away all metal from the metal lines without removing barrier layers that underlie the metal lines. The metal vias may also be removed, especially if they are formed from the same metal as the metal lines, as in copper damascene circuits. This provides high contrast images that permits circuit layout extraction software to readily distinguish between metal lines and vias.
A system and method for aligning tile images of an area of interest of an integrated circuit having N metal layers M, where N>1, includes a parametric representation algorithm for extracting parametric representations of edges from an image showing metal layer (MN) and at least a proportion of metal layer (MN-1) of the integrated circuit to produce a parametric representation of the edges visible on the respective metal layers. The parametric representations include an indication of the metal layer with which each extracted edge is associated and at least one of x and y coordinates associated with each of the extracted edges.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p. ex. automatique
G03F 1/00 - Originaux pour la production par voie photomécanique de surfaces texturées, p. ex. masques, photomasques ou réticulesMasques vierges ou pellicules à cet effetRéceptacles spécialement adaptés à ces originauxLeur préparation
A method and apparatus to reduce occurrences of electrically non-functional elements, known as dummy features, from a source data structure is described. The source data structure may be image data, a vector based data structure or some other data format. Dummy features in the source data structure are detected and then deleted. Dummy features may be detected by selecting a representative dummy feature, using it as a reference pattern or polygon and comparing it to features in the source data structure. The step of comparing the selected reference to the comprises selecting a cut-off correlation threshold value, and computing the correlation coefficients between the reference and the feature. Features are selectively removed based on a comparison between their correlation coefficients and the selected cut-off correlation threshold value. This threshold value may require updating to remove all dummy features in the source data structure. When different shaped dummy features in the same data structure are encountered, a further reference feature may be selected and the process repeated.
A method of registering and vertically aligning multiply-layered images into a mosaic is described. The method comprises performing an iterative process of vertical alignment of layers into a mosaic using a series of defined alignment correspondence pairs and global registration of images in a layer using a series of defined registration correspondence points and then redefining the identified alignment correspondence pairs and/or registration correspondence points until a satisfactory result is obtained. Optionally, an initial global registration of each layer could be performed initially before commencing the alignment process. The quality of the result could be determined using a least squares error minimization or other technique.
A method of registering and vertically aligning multiply- layered images into a mosaic is described. The method comprises performing an iterative process of vertical alignment of layers into a mosaic using a series of defined alignment correspondence pairs and global registration of images in a layer using a series of defined registration correspondence points and then redefining the identified alignment correspondence pairs and/or registration correspondence points until a satisfactory result is obtained. Optionally, an initial global registration of each layer could be performed initially before commencing the alignment process. The quality of the result could be determined using a least squares error minimization or other technique.
The present invention involves a computationally efficient method of determining the locations of standard cells in an image of an IC layout. The initial step extracts and characterizes points of interest of the image. A coarse localization of possible standard cell locations is performed and is based on a comparison of the points of interest of an instance of an extracted standard cell and the remaining points of interest in the image. A more rigid comparison is made on the list of possible locations comprising a coarse match and a fine match. The coarse match results in a shortlist of possible locations. The fine match performs comparisons between the template and the shortlist. Further filtering is done to remove the effects of noise and texture variations and statistics on the results are generated to achieve the locations of the standard cells on the IC layout.
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
84.
METHOD OF DESIGN ANALYSIS OF EXISTING INTEGRATED CIRCUITS
The present invention involves a computationally efficient method of determining the locations of standard cells in an image of an IC layout. The initial step extracts and characterizes points of interest of the image. A coarse localization of possible standard cell locations is performed and is based on a comparison of the points of interest of an instance of an extracted standard cell and the remaining points of interest in the image. A more rigid comparison is trade on the list of possible locations comprising a coarse match and a fine match. The coarse match results in a shortlist of possible locations. The fine match performs comparisons between the template and the shortlist. Further filtering is done to remove the effects of noise and texture variations and statistics on the results are generated to achieve the locations of the standard cells on the IC layout.
85.
METHOD AND APPARATUS FOR REDUCING REDUNDANT DATA IN A LAYOUT DATA STRUCTURE
The method and apparatus in accordance with the present invention reduces the data size of a layout data structure by reducing the amount of electrically redundant interconnects within a bank of interconnects. Electrically redundant interconnects are the repetitive interconnects within a bank of interconnects which do not contribute to the understanding of the IC. Therefore, a number of these interconnects may be deleted from the banks in the layout data structure, provided that enough interconnects remain to maintain the electrical connectivity and the visual representation of the bank.
86.
Method and apparatus for removing uneven brightness in an image
The present invention provides a method and apparatus for reducing uneven brightness in an image from a particle based image system. This uneven brightness is most often seen as regions of shadow, but may also be seen as regions of over brightness. In cases where the uneven brightness is in the form of shadowing, the method corrects for the shadowy regions by first identifying the area of shadow, obtaining brightness information from a region near the shadow, where the brightness is optimal, applying statistical methods to determine the measured brightness as a regression function of the optimal brightness, and number and proximity of shadowy objects, then correcting the shadow area brightness by calculating the inverse of the function of the shadow brightness. With this method, the brightness within the shadowy or over brightness regions are corrected to appear at a substantially similar level of brightness as the region of optimal brightness in the image.
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Engineering services and consultation in the area of semi-conductor integrated circuits; engineering services and consultation in the areas of electronic systems and software, communications and photonics and patent portfolio analysis.
88.
METHOD AND APPARATUS FOR REMOVING UNEVEN BRIGHTNESS IN AN IMAGE
The present invention provides a method and apparatus for reducing uneven brightness in an image from a particle based image system. This uneven brightness is most often seen as regions of shadow, but may also be seen as regions of over brightness. In cases where the uneven brightness is in the form of shadowing, the method corrects for the shadowy regions by first identifying the area of shadow, obtaining brightness information from a region near the shadow, where the brightness is optimal, applying statistical methods to determine the measured brightness as a regression function of the optimal brightness, and number and proximity of shadowy objects, then correcting the shadow area brightness by calculating the inverse of the function of the shadow brightness. With this method, the brightness within the shadowy or over brightness regions are corrected to appear at a substantially similar level of brightness as the region of optimal brightness in the image.
The method and apparatus in accordance with the present invention determines the locations of incorrectly connected polygons in a polygon representation of an integrated circuit layout. These incorrectly connected polygons result in short circuits, which often occur for major signal busses such as power and ground. It can be time-consuming to determine the exact location of the short. The invention includes the step of tessellating the polygon representation, including each conductive layer, into predetermined shapes such as triangles or trapezoids. Each of the triangles or trapezoids is then translated into a node for the development of a nodal network where nodes are connected directly to one another to represent shapes having edges adjacent to other shape edges. The current capacity of each connection between adjacent nodes is then specified. Two nodes that are electrically connected to the incorrectly connected polygons are selected and used as parameters for a network flow analysis algorithm. This algorithm determines the areas of high density where high flow is dictated by the triangle or trapezoid having the lowest current capacity. The areas of high density are flagged as points where short circuits may exist. These flagged points may then be investigated to confirm whether they are short circuits.
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Engineering services and consultation in the area of semi-conductor integrated circuits.
(2) Engineering services and consultation in the areas of electronic systems and software, communications, and photonics.
(3) Engineering services and consultation in the area of patent portfolio analysis.
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
(1) Engineering services and consultation in the area of semi-conductor integrated circuits.
(2) Engineering services and consultation in the areas of electronic systems and software, communications and photonics.
(3) Engineering services and consultation in the area of patent portfolio analysis.
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Business market analysis services; licensing of integrated circuit hardware and software [ Education services in the nature of classes, courses and seminars regarding intellectual property, integrated circuits, and electronic designs and process technology ] Semiconductor integrated circuitry and electronic design analysis services; analysis of integrated circuit and electronic designs and process technology; technical analysis of semiconductor and electronics patents; provision of integrated circuit design services; microelectronics engineering consulting services; patent infringement and validity advisory services with respect to semiconductor integrated circuitry and other electrical devices; design analysis services to the engineering, marketing, intellectual property groups of semiconductor, electronics, and information technology companies; intellectual property services, namely, consulting services, liaison services, intellectual property identification, intellectual property auditing, intellectual property portfolio development, intellectual property management, intellectual property protection, strategy development for intellectual property exploitation, technical analysis of competing products; licensing of intellectual property; patent application preparation, technical evaluation and rating of patents, patent validity assessment, intellectual property infringement identification and analysis, technical patent infringement and claims analysis argument preparation; expert and factual witness services in the field of intellectual property, integrated circuits, and electronic designs and process technology; process/structural analysis services, namely analysis of the physical structure of integrated circuits, analysis of processes used to manufacture integrated circuits, and analysis of electronic assemblies at the printed circuit board level; microprocessor-based security card consulting services; custom report services, namely, technical reports on integrated circuit devices, semiconductor devices and processes, and intellectual property evaluations and analysis
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
[ Printed publications, namely, daily newsletter providing data concerning the worldwide semiconductor industry ] COMPUTER SERVICES, NAMELY, PROVIDING AN ON-LINE DAILY NEWSLETTER CONCERNING THE WORLDWIDE SEMICONDUCTOR INDUSTRY
