Provided is a multi-surface body structure that has a simple structure and can be easily assembled. The present invention comprises: a base part which extends along an axis and which has a first patterned conductor formed along a surface of the base part; and a multi-surface part which is connected to an end of the base part along the axis, which includes a plurality of flat surfaces each having a multi-angle shape, and which has a second patterned conductor that is formed along the surface of each of the flat surfaces and that is electrically connected to the first patterned conductor.
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p. ex. à construction modulaire
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
H04R 1/02 - BoîtiersMeublesMontages à l'intérieur de ceux-ci
F21Y 107/40 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur les côtés de polyèdres, p. ex. de cubes ou de pyramides
F21Y 107/80 - Sources lumineuses comprenant des éléments générateurs de lumière disposés en trois dimensions sur des supports ou des substrats articulés
The purpose of the present invention is to provide: a cured product which is obtained by optically and thermally curing a curable resin composition and exhibits optical characteristics such as a high total light transmittance, a low haze value and excellent transparency that leads to insusceptibleness to yellowing, while having excellently low warping properties, excellent chemical resistance and excellent wet heat resistance; and a curable resin composition which enables the achievement of this cured product. The present invention provides a cured product which is obtained by curing a curable resin composition that contains (A) an alkali-soluble resin, (B) a specific photopolymerization initiator and (C) an amine-based curing agent.
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
[Problem] To provide a curable composition with good discharge performance, crack resistance after being cured, solder heat resistance, and tensile resistance. [Solution] This curable composition is characterized by comprising three or more compounds having an isocyanurate skeleton.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C09D 11/30 - Encres pour l'impression à jet d'encre
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
4.
CURABLE RESIN COMPOSITION, CURED OBJECT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
[Problem] To provide a curable resin composition capable of forming solder resists which combine long-lasting low glossiness and resultant long-term freedom from solder adhesion with withstand voltage on a high level. [Solution] A curable resin composition comprising a curable resin, barium sulfate, and a heat-curing catalyst, the barium sulfate having an oil absorption of 40-70 mL/100 g.
C08F 299/00 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires
[Problem] To provide: a curable resin composition that has excellent uniform dispersibility and dryness to the touch in a resin layer, and that yields a final cured product having excellent environmental reliability; and a laminate structure, a cured product, and an electronic component having a resin layer formed using the curable resin composition. [Solution] A curable resin composition containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a photocurable compound containing no carboxyl groups, (D) an inorganic filler, and (E) a polymerization inhibitor, wherein the (C) photocurable compound containing no carboxyl groups includes (C-1) a photocurable compound having a weight average molecular weight of 2,000-10,000 and (C-2) a photocurable compound having a weight average molecular weight of 500 or more and less than 2,000, and the (C-1) photopolymerizable compound is included at a ratio of 25-500 parts by mass with respect to 1 part by mass of the (E) polymerization inhibitor.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
[Problem] The present invention addresses the problem of providing a photosensitive resin composition that enables the achievement of a cured coating film which is not susceptible to the generation of a roller mark, and which is capable of suppressing re-adhesion of a development residue, while maintaining adequate insulation reliability. [Solution] The present invention provides a photosensitive resin composition which contains a carboxyl group-containing resin, a photopolymerizable monomer and a thermosetting component, and which is characterized in that: the photopolymerizable monomer contains a (meth)acrylate having an isocyanuric ring; and the thermosetting component contains a biphenyl-type epoxy resin.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
7.
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
[Problem] The present invention addresses the problem of providing a thermosetting resin composition, the provisionally cured state and the fully cured state of which are able to be distinguished from each other by visual observation. [Solution] The present invention provides a thermosetting resin composition which contains a thermosetting resin, a curing agent and a filler, and which is characterized in that formula 1 is satisfied if L1 is the L* value of the thermosetting resin composition before curing as determined by the L*a*b* color system, L2 is the L* value of a provisionally cured product, which is obtained by thermally curing the thermosetting resin composition at 80°C for 60 minutes, as determined by the L*a*b* color system, and L3 is the L* value of a fully cured product, which is obtained by further thermally curing the provisionally cured product at 150°C for 60 minutes, as determined by the L*a*b* color system. (Formula 1): (L2 – L3)/(L1 – L3) ≥ 0.70
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H05K 3/28 - Application de revêtements de protection non métalliques
[Problem] To provide a method for, in the manufacturing of a laminate that includes a substrate and a cured coating covering at least part of the surface of the substrate, satisfactorily curing each of a plurality of regions having different thicknesses in a photosensitive resin composition layer formed on the surface of the substrate without causing undercut or halation. [Solution] In the manufacturing of a laminate including a substrate and a cured coating covering at least part of the surface of the substrate, when the sensitive resin composition layer formed on the surface of the substrate has a plurality of regions with different thicknesses, the integrated amount of light for exposing each of the plurality of regions is made to have a specific relationship.
[Problem] To provide a photosensitive film laminate with which it is possible to form a solder resist layer that has a low-gloss surface with recesses and protrusions and is less susceptible to visible flaws although having high blackness with excellent visibility of marking ink. [Solution] This photosensitive film laminate comprises a photosensitive film, and a first film provided on one surface of the photosensitive film, and is characterized in that the photosensitive film is provided with a surface with recesses and protrusions that is in contact with the first film, and the surface with recesses and protrusions of the photosensitive film after cured satisfies parameters: (A) 1.025 < surface area / area <1.400 and (B) 0.1 μm < arithmetic average surface roughness Ra < 0.5 μm.
[Problem] To provide a photosensitive resin composition that, in comparison to conventional photosensitive resin compositions, achieves good adhesion and separation properties with respect to a substrate before and after curing, and makes it possible form a resist layer in which modification due to contact with a plating solution and elution into the plating solution are suppressed. [Solution] A photosensitive resin composition wherein blended in combination are: a non-photosensitive alkali-soluble resin as an alkali-soluble resin; and an alkylene oxide-modified bifunctional (meth)acrylate and alkylene oxide-modified trifunctional (meth)acrylate as photosensitive monomers.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
11.
SUBSTRATE FOR MOUNTING LED, AND LED-MOUNTED SUBSTRATE
[Problem] To provide a substrate which is for mounting an LED, the substrate being applicable to a thin substrate, being able to obtain sufficient reflectance, and being specifically suited for a mini-LED or μ-LED. [Solution] This substrate for mounting an LED comprises a substrate and a reflective layer laminated on an upper region of the substrate, wherein: a plurality of openings are provided in the reflective layer at substantially equal intervals in the longitudinal and lateral directions; the reflective layer is a cured product of a curable resin composition containing a curable resin and a titanium oxide; the storage modulus of the cured product at 25 °C is 4.0 GPa or less; the longitudinal or lateral interval between an opening and an adjacent opening is at least two times the longitudinal or lateral length of the opening; and the ratio of the total area of the openings to the area of the reflective layer is 0.1-9.0%.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H05K 3/28 - Application de revêtements de protection non métalliques
12.
LAMINATE AND ELECTRONIC DEVICE PROVIDED WITH LAMINATE
Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even after a long heat resistance test. A laminate comprising a support and a primer layer, a metal particle layer, and a metal plating layer provided in the stated order on the support, wherein the primer layer includes a phenoxy resin having a weight-average molecular weight of 10,000 to 100,000.
B32B 15/092 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines époxy
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
13.
MULTILAYER BODY AND ELECTRONIC DEVICE THAT IS PROVIDED WITH MULTILAYER BODY
The present invention provides a multilayer body which is capable of maintaining adhesion of a plating layer not only in a normal state but also after a long-term heat resistance test. This multilayer body is provided with: a supporting body; and a primer layer, a metal particle layer and a metal plating layer, which are sequentially arranged on the supporting body. With respect to this multilayer body, the metal particle layer contains metal particles, a compound that has a basic nitrogen atom-containing group, and an epoxy resin.
B32B 15/092 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines époxy
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
14.
CURABLE RESIN COMPOSITION, LAMINATED STRUCTURE, CURED PRODUCT, AND ELECTRONIC COMPONENT
[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Solution] A curable resin composition that enables alkaline development and forms a cured film when subjected to exposure and heat treatment. If a dried coating film having a thickness of 2–100 μm is formed from this curable resin composition, the arithmetic mean roughness Ra of the dried coating film is less than 0.1 μm, and the arithmetic mean roughness Ra of a cured film obtained by heat curing the dried coating film is 0.1–1 μm. This curable resin composition has characteristics such that the obtained dried coating film has good resolution, and there is minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Selected drawing] None
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
This photosensitive film laminated body, provided with a composition layer formed from a composition, and a first film provided on one surface of the composition layer, is characterized in that, upon irradiation with 200 mJ/cm2 ultraviolet light for 5 seconds, when the time at the completion of the radiation was defined as 0 seconds and electron spin resonance was measured at 4.3 seconds intervals until 81.7 seconds had elapsed, the number of times that an amount of increase in signal strength compared with the signal strength before irradiation, in the same magnetic field, was at least equal to 50 [a.u.] was at least three.
Provided is a laminated curable resin structure from which a cured product having high resolution, excellent crack resistance, and excellent adhesion to metal plating can be obtained. Provided is a laminated curable resin structure comprising a two-layered resin layer in which an X layer composed of an alkali-soluble resin composition X and a Y layer composed of an alkali-soluble resin composition Y are laminated, wherein: the X layer is laminated on the Y layer, and occupies 5-30% of the total thickness of the two-layered resin layer, which is a combination of the X layer and the Y layer; and in a cured product having a thickness of 20-30 μm and subjected to light irradiation at 1,000 mJ/cm2 and heat treatment at 160 °C for 1 hour, the thermal expansion coefficient at 200-250 °C by thermomechanical analysis is 110 ppm/°C or less.
Provide a laminated structure which has excellent crack resistance, has good patterning properties, and can be removed without residue in a development step. The laminated structure has a dual-layered resin layer obtained by laminating a resin layer (A) formed from a resin composition (a) and a resin layer (B) formed from a resin composition (b). The resin composition (b) of the resin layer (B) comprises an alkali-soluble resin, a photo-base generator that also functions as a photopolymerization initiator or a photopolymerization initiator and a photo-base generator, and a thermosetting resin. The resin composition (a) of the resin layer (A) contains a carboxyl group-containing resin and a thermosetting resin, and does not substantially contain a photopolymerization initiator. The 150°C gelling time of a mixture of the thermosetting resin and the alkali-soluble resin contained in the resin composition (b) of the resin layer (B) is 120-600 seconds. The 150°C gelling time of a mixture of the thermosetting resin and the carboxyl group-containing resin contained in the resin composition (a) of the resin layer (A) is 300-1200 seconds, and is longer than the gelling time of the mixture of the resin layer (B).
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
H05K 3/28 - Application de revêtements de protection non métalliques
18.
CURABLE RESIN COMPOSITION, DRY FILM, AND CURED PRODUCT
A curable resin composition comprising a curable resin and a blocked isocyanate is characterized in that the amount of fluorine in the entire curable resin composition is 10-30% by mass, and the cured product of the curable resin composition has a b* value of 1 or less.
[Problem] To provide a dry film multilayer body which has an appearance with matte texture after curing, while having good mechanical characteristics and resolution. [Solution] A multilayer body which comprises a resin layer (A) and a resin layer (B) that is provided on the resin layer (A), wherein the resin layer (A) has a first gloss value of 50 or more and a second gloss value of 30 or less, while the resin layer (B) has a third gloss value of 50 or more; or this multilayer body which is characterized in that the resin layer (A) contains (A1) a block copolymerized resin and (A2) a photopolymerizable compound, while the resin layer (B) contains (B1) an alkali-soluble (meth)acrylate resin. [Selected drawing] FIG. 1
B32B 7/06 - Liaison entre couches permettant une séparation sans difficultés
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
H05K 3/28 - Application de revêtements de protection non métalliques
Provided is an ink-filled cartridge with which there is little incorporation of air bubbles and it is possible to inhibit intermittent discharge. This ink has a viscosity at 25°C of 50-2,000 dPa∙s, said viscosity being measured at the values 25°C, 5 rpm, and 30 seconds using a cone and plate type viscometer in compliance with methods for viscosity measurement according to 10 Cone and Plate Rotational Viscometers in JIS K8803: 2011. At least one air bubble having a diameter of at least 0.1 mm is included in the ink in a syringe and, when the distance from the bottom end of a dispensing nozzle to a plunger in the cylindrical axis direction of the syringe is L, and using the bottom end of the dispensing nozzle as a starting point (S), the point at a distance of L/2 as a point (M), and the plunger as an end point (F), the total air-bubble volume A (cm3) in the syringe between the starting point (S) and the point (M) and the total air-bubble volume B (cm3) in the syringe between the point (M) and the end point (F) satisfy the relational expression: 0≤A/B<1.0.
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
21.
LAMINATED STRUCTURE, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Provided is a laminated structure which is not only capable of achieving both contradictory characteristics such as B-HAST resistance and crack resistance at a high level, but also has excellent photopatterning properties. A laminated structure having a dual-layered resin layer obtained by laminating a resin layer (A) formed from a resin composition (a) and a resin layer (B) formed from a resin composition (b), the laminated structure characterized in that: the resin composition (b) of the resin layer (B) comprises an alkali-soluble resin, a photo-base generator that also functions as a photopolymerization initiator or a photopolymerization initiator and a photo-base generator, and a thermosetting resin; the resin composition (a) of the resin layer (A) contains a carboxyl group-containing resin and a thermosetting resin, and does not substantially contain a photopolymerization initiator; and the difference between the gloss sensitivity and the residual sensitivity is at most 20 steps as obtained by measuring the coating film thickness of a formed pattern obtained by using a step tablet and exposing the dual-layered resin from the resin layer (B)-side and a performing a PEB step, and the coating film thickness of a formed pattern obtained by performing the PEB step after said exposure and then performing a developing step.
G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
[Problem] To provide a curable resin composition that can be suitably used as a paste for coating or filling a printed wiring board having a high degree of wiring formation freedom, the curable resin composition making it possible to obtain a cured product with which it is possible to form a coating film with no variation and which has a high relative magnetic permeability that is stable over time. [Solution] This curable resin composition contains a thermosetting resin, a curing agent, magnetic powder, and a dilution component, the curable resin composition being characterized in that the thermosetting resin has a 5% weight loss temperature of more than 180 °C as determined by thermal gravimetric analysis and the dilution component has a 5% weight loss temperature of 50-180 °C as determined by thermal gravimetric analysis.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
[Problem] To provide a thermosetting resin composition capable of easily individualizing chips by a step for individualizing chips one-by-one after batch sealing a plurality of chips using a thermosetting resin composition in production of a SAW filter. [Means] The thermosetting resin composition according to the present invention includes a thermosetting resin and is characterized in that a cured product obtained by heating and curing the thermosetting resin composition for 60 minutes at 180°C after heating for 30 minutes at 100°C satisfies the following conditions: (i) the breaking point strength is 100 MPa or less, (ii) the linear expansion coefficient is 35 ppm/°C or less, and (iii) the storage modulus at 30°C is 2 GPa or more.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
C08K 3/013 - Charges, pigments ou agents de renforcement
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/28 - Application de revêtements de protection non métalliques
H03H 9/25 - Détails de réalisation de résonateurs utilisant des ondes acoustiques de surface
24.
LAMINATE STRUCTURE, CURED PRODUCT OF RESIN LAYER IN SAID LAMINATE STRUCTURE, ELECTRONIC COMPONENT, AND CURED PRODUCT FORMATION METHOD
[Problem] To provide: a laminate structure that provides excellent detachability and affixing ability between a resin layer and a second film even in a condition where the environmental temperature around the laminate structure increases to a certain temperature (particularly, to about 40°C); a cured product of a resin layer in said laminate structure; an electronic component having said cured product; and a method for forming said cured product. [Solution] The laminate structure sequentially includes a first film, a resin layer, and a second film. The resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photoinitiator, and (D) a thermosetting resin. The detachment strength between the second film and the resin layer at an environmental temperature of 40°C is 0.4-1.5 N/cm.
The present invention provides: a curable resin composition which exhibits excellent resolution and higher insulation reliability, while having excellent embeddability into a circuit; a dry film; a cured product; and an electronic component which comprises the curable resin composition, the dry film or the cured product. A curable resin composition which contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a thermosetting resin and (D) silica, and which is characterized in that: the blending amount of the silica (D) is 0 to 60% by mass relative to the total solid content of the curable resin composition; the silica (D) contains (D-1) nanosilica; the nanosilica (D-1) has an average secondary particle diameter of 200 nm or less; and the degree of association of the nanosilica (D-1) is 2.3 or less.
[Problem] The present invention addresses the problem of providing: a curable composition that is useful as, for example, a solder resist for a printed circuit board, that has higher flame retardance, coating properties, resolution, and storage stability and low warpage, and that is suitable for inkjet printing methods; and a cured product of the curable composition. [Solution] Provided are: a curable composition that is characterized by containing (A) a compound having a (meth)acryloyl group, (B) a thermosetting component, (C) a photopolymerization initiator, (D) a crystalline flame retardant, and (E) a wetting disperant, and by the content of the (E) wetting dispersant being 1-9 mass% with respect to the content of the (D) crystalline flame retardant; a cured product obtained from the curable composition; and an electronic component including the cured product.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
27.
MULTILAYER STRUCTURE AND FLEXIBLE PRINTED WIRING BOARD
[Problem] The present invention addresses the problem of providing: a multilayer structure which is capable of forming a photosensitive structure that exhibits excellent warping resistance, excellent folding resistance and excellent metal adhesion to a permanent dielectric film; and a dry film of this multilayer structure. [Solution] A multilayer structure which comprises a resin layer (A) that is formed of an alkali developable resin composition and a resin layer (B) that is superposed on the resin layer (A), and which is characterized in that: the resin layer (B) is formed of a photosensitive thermosetting resin composition that contains one or more components selected from the group consisting of a polyimide, a polyamide imide and a polyamide; the elastic modulus of a cured product of the resin layer (A) is 0.3 to 1.5 GPa as measured at 23°C; the elastic modulus of a cured product of the resin layer (B) is more than 1.5 GPa but not more than 3.5 GPa as measured at 23°C; and the thickness of the resin layer (A) is larger than the thickness of the resin layer (B). [Selected drawing] None
G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
B32B 15/088 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des polyamides
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
[Problem] To maintain excellent resolution exhibited by a formed resin layer and stabilize the light sensitivity of the resin layer during exposure to light, specifically during a period between exposure to light and a first film being detached. [Solution] A photosensitive film laminate which comprises a composition layer formed from a composition and a first film provided on one surface of the composition layer, and which is characterized in that the composition contains: (A) a carboxyl group-containing photosensitive resin; (B) a coloring agent able to impart a black color; (C) a photopolymerization initiator; and (D) a photopolymerization inhibitor. The photosensitive film laminate is also characterized in that: x/y<2.0. when x denotes the absorbance of i rays and y denotes the absorbance of h rays, by the photopolymerization initiator (C); and the photopolymerization inhibitor (D) includes at least one type of compound selected from the group consisting of an alkoxynaphthol compound and phenothiazine, and the photopolymerization inhibitor is contained at a quantity of 0.015-0.2 mass% relative to the composition.
[Problem] The present invention addresses the problem of finding: an electrical insulating layer for a metal base substrate used for electronic devices, in particular on-board electronic devices, the electrical insulating layer having a high electrical insulating capacity, high heat conductivity, low elasticity, and high resistance to soldering heat; and a resin composition which is the pre-curing form of the electrical insulating layer, the resin composition exhibiting good workability when applied to a body to be coated. [Solution] The problem is solved by providing: a heat-curable resin composition, a cured product, and a metal foil with a resin, which are characterized by containing (A) a rubber-like polymeric compound having a glass transition temperature (Tg) of -40֯C or less, and a weight average molecular weight (Mw) of 8,000-50,000, (B) an epoxy resin, (C) a filler, and (D) a phenoxy resin; a method for producing a metal base substrate having the foregoing; and a method for producing electronic parts using said metal base substrate. [Selected drawing] FIG. 1
B32B 25/14 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique comprenant des copolymères dans lesquels les composants en caoutchouc prédominent
C08L 9/00 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures à diènes conjugués
C08L 21/00 - Compositions contenant des caoutchoucs non spécifiés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 71/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
[Problem] To provide a curable composition having suitable flexibility, suitably low warpage after light exposure, as well as suitable heat resistance for a thin film substrate such as a flexible wiring board. [Solution] A curable composition containing: (A) a radical polymerizable monomer represented by formula 1 (R1 in formula (1) represents a C1-4 hydrocarbon group which may be linear, branched, or cyclic and may include an ether bond (the hydrocarbon group may have a substituent)); (B) a photocurable urethane compound having two (meth)acryloyl groups; (C) a compound other than (A) and (B) having a (meth)acryloyl group; (D) a photopolymerization initiator; and (E) a thermosetting component. The curable composition has low viscosity, and after being coated on a thin film substrate and exposed to light, is capable of keeping warpage of the thin film substrate low. Furthermore, the cured coated film has excellent heat resistance and has both flexibility and low warpage.
[Problem] To provide a curable resin composition which has excellent cleaning removability even when adhered to a mixing tub or tool used in a production process of solder resist ink, and dried. [Solution] A curable resin composition according to the present invention comprises (A) a curable resin, (B) a filler, and (C) an organic solvent, and is characterized in that the dissolution start time of a completely dried coating film, which has a size of 20 mm (length) × 20 mm (width) × 7 μm (film thickness) and is formed using the curable resin composition, in propylene glycol monomethyl ether acetate serving as a cleaning solvent is within 20 seconds from the start of immersion in the cleaning solvent.
C08G 59/17 - Polycondensats modifiés par post-traitement chimique par des acides monocarboxyliques ou par leurs anhydrides, halogénures ou esters à bas poids moléculaire par l'acide acrylique ou méthacrylique
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
[Problem] To provide a thermosetting resin composition from which it is possible to form a resin layer having excellent balance in flexibility, reflectivity, heat resistance, and warpage. [Solution] The thermosetting resin composition according to the present invention is characterized by containing a hydroxy group-containing fluorine resin, an isocyanate compound having two or more isocyanate groups, and a rutile-type titanium oxide, and is characterized in that the mass ratio of the fluorine resin with respect to the isocyanate compound is 1-20, and the mass ratio of the rutile-type titanium oxide with respect to the fluorine resin is 1.4-4. Further, the thermosetting resin composition according to the present invention contains a hydroxy group-containing fluorine resin, an isocyanate compound having two or more isocyanate groups, and a rutile-type titanium oxide, and is characterized in that, when an elemental analysis is performed though a combustion method with respect to a cured product obtained by curing said thermosetting resin composition and when the total is defined as 100 mass%, the detected ash content is 45 mass% or more, the detected amount of fluorine atoms is 3 mass% or more, and the detected amount of nitrogen atoms is 0.1 mass% or more.
The present invention provides: a photosensitive multilayer resin structure which has excellent resolution, while maintaining characteristic functions of a filler at higher levels, said filler being filled thereinto in a large amount; and the like. A photosensitive multilayer resin structure which comprises a filler-filled layer (A) and a protective layer (B), and which is characterized in that: the filler-filled layer (A) does not substantially contain a photopolymerization initiator, and the filler content thereof is from 10% by mass to 80% by mass relative to all components excluding organic solvents; and the filler content of the protective layer (B) is from 0% by mass to 25% by mass relative to the filler content of the filler-filled layer (A).
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
[Problem] To provide: a photocurable thermosetting resin composition that stores exceptionally well, that leads to minimal adverse events such as pinholes and cissing in a resulting dry film, and that has exceptional electrical characteristics; a cured product of said resin composition; and an electronic component comprising said cured product. [Solution] A photocurable thermosetting resin composition composed of a resin composition of at least a two-liquid system and containing an epoxy resin (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a photosensitive monomer (D), silica (E), barium sulfate (F), and an organic solvent, the photocurable thermosetting resin composition characterized in that a resin composition of at least a two-liquid system is used to obtain the photocurable thermosetting resin composition, the carboxyl group-containing resin (B), the photosensitive monomer (D), and the silica (E) are contained in a separate resin composition from the epoxy resin (A), the barium sulfate (F), and the photopolymerization initiator (C), and the resin composition containing the photopolymerization initiator (C) has an organic solvent capable of dissolving the photopolymerization initiator (C); a cured product obtained from said curable composition; and an electronic component comprising said cured product.
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
A curable resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a heat-curable resin and (D) a coloring agent, and is intended to be formed on copper having a CZ-treated surface, the transmittance of a dried coating film (film thickness: 20 μm) formed from the curable resin composition on a glass substrate having a thickness of 2 mm being 30 to 50% at a wavelength of 430 nm and 28 to 45% at a wavelength of 530 nm.
Polishing of a cured product is facilitated, and the surface of the cured product is planarized. A curable resin composition, the curable resin composition being characterized in that the 30-second viscosity obtained by measuring the curable resin composition at a temperature of 25°C and a rotor rotational speed of 5.0 rpm by a cone and plate viscometer in accordance with JIS Z8803:2011 is 200-3000 dPa・s (inclusive), and a cured product of the curable resin composition has the following characteristics (1) and (2): (1) the stress is at least 0.5 N and less than 1.3 N; (2) the storage modulus at 30°C is less than 8.8 GPa.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
[Problem] Provided is a curable composition having excellent flexibility and resolution and excellent adhesion to copper. [Solution] A curable composition according to the present invention is characterized by including: (A) an ion scavenger containing at least one component selected from the group consisting of zirconium, aluminum, zinc, magnesium, calcium, antimony, and bismuth; (B) a photosensitive monomer; and (C) a photopolymerization initiator.
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p. ex. réticulation par UV qui suit l’impression
C09D 11/102 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09D 11/30 - Encres pour l'impression à jet d'encre
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
H05K 3/28 - Application de revêtements de protection non métalliques
39.
CURABLE COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT
[Problem] To provide: a curable composition that includes an AMA ester and produces cured products that are flexible, have low warpage, and adhere to conductor circuits; a cured product of the curable composition; and an electronic component that includes the cured product. [Solution] A curable composition that contains (A) a polymerizable monomer that is represented by formula (1) (in which R1 is a straight-chain, branched, or cyclic C1–4 hydrocarbon group that may include an ether linkage (and may also include a substituent)), (B) a compound selected from the group that consists of melamine and derivatives thereof, (C) a photopolymerization initiator, and (D) a thermosetting component. Cured products of the curable composition are flexible, have low warpage, and have high adhesion to conductor circuits.
[Problem] To provide: a curable composition that has application properties suitable for inkjet printing methods; and a cured product thereof that has low warpage, solder heat resistance, resolution, and fire resistance suitable as a solder resist of a flexible printed wiring board. [Solution] A curable composition at least comprising components (A)-(D): (A) three types of compounds having one, two, or three (meth)acryloyl groups in a single molecule; (B) a flame retardant having a phosphazene structure and a phenoxy group substituted by a cyano group (-CN), a hydroxyl group (-OH), or a methyl group; (C) a photoinitiator; and (D) a thermosetting component, wherein the viscosity of the composition is 50 mPa·s or less at 50℃. A cured product obtained from said curable composition. An electronic component having said cured product.
[Problem] To provide a structure of a multilayer structure that facilitates recognition of front and rear sides thereof and prevents a film track from being left on a resin layer when a second film is separated. [Solution] A structure according to the present invention is provided with a first film, a resin layer, and a second film in this order, the structure being characterized in that a difference between a Trouser tear force of the first film and a Trouser tear force of the second film is -0.05 N or less or +0.05 N or more, a difference in haze between the first film and the second film is -5% or less or +5% or more, or a difference between an L* value, an a* value, and a b* value in a Lab color space measured on the side of the first film of the structure and an L* value, an a* value, and a b* value in the Lab color space measured on the side of the second film of the structure satisfies a specific condition.
[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms. [Selected drawing] None
C08F 299/00 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires
C08G 59/02 - Polycondensats contenant plusieurs groupes époxyde par molécule
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
H05K 3/28 - Application de revêtements de protection non métalliques
[Problem] To provide a matte-finish cured film provided on a substrate such as a wiring substrate, wherein scratches are unlikely to be conspicuous. [Solution] A cured film according to the present invention formed from a curable resin composition provided on a substrate, wherein the cured film is characterized in that Gs(20°) ≤ 5, Gs(85°) ≤ 35, and a ratio R, represented by the formula R = {Gs(85°)/Gs(60°)}/{Gs(60°)/Gs(20°)}, is 0.35-4.0, where Gs(20°) is the 20 degree glossiness, Gs(60°) is the 60 degree glossiness, and Gs(85°) is the 85 degree glossiness, each measured according to JIS Z 8741-1997 on a cured film surface.
[Problem] To provide a method which is capable of removing only a cured coating film in a defect part from a base material in cases where a defect is found in a part of the cured coating film during the production of a wiring board wherein the cured coating film is provided on the base material, and which is capable of removing the cured coating film from the base material regardless of the composition of a photosensitive resin composition. [Solution] A method for reusing a base material by removing a part or the entirety of a cured coating film from a wiring board that is provided with the cured coating film on the surface of the base material, said method being characterized in that the cured coating film is formed of a cured product of a photosensitive resin composition, and being also characterized by comprising: a step for irradiating a part or the entirety of the cured coating film with at least one of an active energy ray that is capable of generating active oxygen in an oxygen atmosphere and an active energy ray that is capable of cleaving a C-C carbon bond; and a step for removing the cured coating film in the portion irradiated with the active energy ray by cleaning the wiring board with a solvent.
[Problem] To provide a photocurable black composition for forming a black shielding material that reduces the reflection of light irradiating a display from the user side. [Solution] A photocurable black composition comprising: (A) an alkali-soluble resin; (B) a photopolymerization initiator; (C) a photopolymerizable polyfunctional monomer; and (D) carbon black having a nitrogen adsorption specific surface area of 300 m2/g or more based on JIS K6217-2:2017.. When irradiated with light through a transparent base material, a cured film of a black coated base material obtained from the photocurable black composition suppresses the reflection of the light so as to suppress the occurrence of a white blur on the cured film.
[Problem] To provide a curable resin composition such that it is possible to form a cured product that serves as an insulating material with a low dielectric constant and a low loss tangent. [Solution] This curable resin composition contains a curable resin, an inorganic filler, and an organic solvent, and contains a single gas or gas mixture of any of oxygen, nitrogen, carbon dioxide, and argon in an amount of 20% by volume or more, said curable resin composition being characterized in that the maximum diameter of air bubbles of the single gas or gas mixture is 5.0 μm or less and the thixotropic index value is less than 2.0.
C08J 9/30 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement par mélange de gaz dans des compositions liquides ou des plastisols, p. ex. par fabrication de mousse à l'aide d'air
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
[Problem] To provide a curable composition suited to application by an inkjet method, the curable composition being capable of curing by a practical light exposure level, having not only high cured film hardness after curing but also suppressed gloss as a black matrix to be used in LED products, and furthermore having a matte effect. [Solution] A curable composition characterized by: containing (A) a polyfunctional alicyclic epoxy compound, (B) an oxetane compound, (C) a cyclic siloxane compound having four or more epoxy groups, and (D) a photocationic polymerization initiatorl and having an OD value of 4 or higher at a film thickness of 10-20 μm after curing. [Selected drawing] None
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08K 3/013 - Charges, pigments ou agents de renforcement
48.
CURABLE RESIN COMPOSITION, DRY FILM AND CURED ARTICLE COMPRISING SAME, AND ELECTRONIC COMPONENT EQUIPPED WITH SAID CURED ARTICLE
[Problem] To provide: a curable resin composition which is improved in developability/resolution without being deteriorated in heat resistance and chemical resistance, more specifically a curable resin composition which is useful as a PID material for optical use or a material for an optical sensor protection film and can be formed into a cured article having both of higher transparency and excellent heat resistance; a dry film produced from the curable resin composition; a cured article produced from the curable resin composition; and a printed wiring board equipped with the cured article. [Solution] A curable resin composition comprising (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, the composition being characterized in that the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure with a tricarboxylic acid anhydride and has a number average molecular weight of 500 to 1000. [Representative drawing] None
C08F 283/04 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polycarbonamides, des polyesteramides ou des polyimides
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
C08G 18/34 - Acides carboxyliquesLeurs esters avec des composés monohydroxylés
C08G 18/79 - Polyisocyanates ou polyisothiocyanates contenant des hétéro-atomes autres que l'azote, l'oxygène ou le soufre de l'isocyanate ou de l'isothiocyanate de l'azote caractérisés par le polyisocyanate utilisé, celui-ci contenant des groupes formés par oligomérisation d'isocyanates ou d'isothiocyanates
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
[Problem] To provide: a curable resin composition which has excellent heat resistance and low warping properties, while enabling the achievement of a cured product having improved light transmittance; a dry film and a cured product of the curable resin composition; and an electronic component which contains the cured product. [Solution] A curable resin composition which is characterized by containing (A) an amide imide resin, (B) a thermosetting resin, (C) a thermal curing accelerator and (D) inorganic particles, and which is also characterized in that the amide imide resin (A) is a reaction product of a tricarboxylic acid anhydride having an aliphatic structure and an isocyanurate-type polyisocyanate that is synthesized from an isocyanate having an aliphatic structure, while having a number average molecular weight of from 500 to 1,000; a dry film and a cured product of the curable resin composition; and an electronic component which contains the cured product. [Selected drawing] None
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 79/04 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principalePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
C08G 18/34 - Acides carboxyliquesLeurs esters avec des composés monohydroxylés
C08G 18/79 - Polyisocyanates ou polyisothiocyanates contenant des hétéro-atomes autres que l'azote, l'oxygène ou le soufre de l'isocyanate ou de l'isothiocyanate de l'azote caractérisés par le polyisocyanate utilisé, celui-ci contenant des groupes formés par oligomérisation d'isocyanates ou d'isothiocyanates
C08K 3/00 - Emploi de substances inorganiques en tant qu'adjuvants
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/28 - Application de revêtements de protection non métalliques
Provided are a laminate, etc., having excellent laser beam perforating workability and reflow resistance, and having an ultrathin copper foil and a resin layer of which a cured product has low dielectric loss tangent. The laminate is characterized by having at least a carrier foil, an ultrathin copper foil having a thickness of 0.1-6 μm, and a resin layer in this order, wherein the resin layer includes (A) an epoxy resin, (B) a compound having an active ester group, and (C) an inorganic filler.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/092 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines époxy
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
51.
STRUCTURE COMPRISING SUBSTRATE COMPOSED OF LIQUID CRYSTAL POLYMER, AND CURED COATING COMPRISING THERMOSETTING COMPOSITION FORMED ON SURFACE OF SAID SUBSTRATE
[Problem] To provide a structure comprising a substrate composed of a liquid crystal polymer, and a cured coating comprising a thermosetting composition formed on the surface of the substrate, wherein the cured coating is prevented from peeling from the substrate and has superior solder heat resistance. [Solution] A structure comprising a substrate composed of a liquid crystal polymer, and a cured coating comprising a thermosetting composition formed on the surface of the substrate, said thermosetting composition being characterized by including (A) a thermosetting component and (B) aluminum oxide particles. [Selected drawing] None
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08K 3/105 - Composés contenant des métaux des groupes 1 à 3 ou des groupes 11 à 13 du tableau périodique
C08G 63/06 - Polyesters dérivés soit d'acides hydroxycarboxyliques, soit d'acides polycarboxyliques et de composés polyhydroxylés dérivés des acides hydroxycarboxyliques
52.
THERMOSETTING COMPOSITION AND COATED SUBSTRATE HAVING CURED FILM COMPRISING SAME
[Problem] To provide: a thermosetting composition for a surface coating of a high-melting-point substrate, said composition being capable of solving the problem of peeling of a coating film that has been applied to the high-melting-point substrate; and a coated substrate obtained by applying a surface coating layer comprising the thermosetting composition to the high-melting-point substrate. [Solution] A thermosetting composition to be applied to a high-melting-point substrate having a melting point of not less than 270°C, said thermosetting composition comprising, (A) a thermosetting component, (B) aluminum oxide particles, and (C) acrylic block copolymers represented by formula (I) or formula (II) below. (I) X–Y–X or (II) X–Y–X' (In the formulas, X and X' are polymer blocks primarily comprising methacrylic acid ester units having a glass transition point Tg of at least 0°C, and Y is a polymer block primarily comprising acrylic acrylic acid ester units having a glass transition point of less than 0°C.) The mass percentage of the sum of X and X' with respect to the total mass of the acrylic block copolymers is in the range of 12 mass% to 35 mass%, inclusive. Furthermore, a coated substrate obtained by applying a cured film comprising the thermosetting composition to the high-melting-point substrate.
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C09D 201/00 - Compositions de revêtement à base de composés macromoléculaires non spécifiés
Provided are: a curable resin composition from which a cured product having excellent resolution and embedding properties of high-density wiring patterns is obtained; a dry film having a resin layer obtained from the composition; a cured product of the composition or the resin layer of the dry film; and an electronic component having the cured product. The curable resin composition is characterized by including (A) a photocurable resin, (B) a photopolymerization initiator, and (C) silica, wherein (A) the photocurable resin has a refractive index of 1.50-1.65 on a D line as measured at 25 ˚C, and (C) the silica is covered with an organic alkoxysilane having a refractive index of 1.50-1.65 on a D line as measured at 25 ˚C.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
54.
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
C08L 33/08 - Homopolymères ou copolymères des esters de l'acide acrylique
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
This layered structure body, wherein the occurrence of static electricity is suppressed and, moreover, parting is prevented, has excellent long-term reliability and comprises an electroconductive layer, a support film, a photosensitive resin layer, and a protective film, in this order. The surface resistance value of the electroconductive layer is 1.0 × 1010Ω or lower, and the surface resistance value of the support film is 1.0 × 1012Ω or higher. The photosensitive resin layer includes a carboxyl group-containing resin, a photopolymerization initiator, a heat-curable component, and an inorganic filler, and the proportion of the solvent residual content is less than 5 % by mass based on the total amount of the resin layer containing the solvent.
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
B32B 7/025 - Propriétés électriques ou magnétiques
H05K 3/28 - Application de revêtements de protection non métalliques
56.
DRY FILM FOR HOLLOW DEVICE, CURED PRODUCT, AND ELECTRONIC COMPONENT
A dry film for a hollow device according to the present invention enables good sealing by suppressing the flow of a sealing material into a hollow part of a hollow device. This dry film for a hollow device is provided with a resin layer 3 that comprises a curable resin composition containing a solvent and that is disposed on a carrier film 2. The resin layer 3 is provided with at least one of each of regions 3a and 3b in which the remaining amounts of the solvent contained in the curable resin composition are respectively relatively large and small in the thickness direction. A difference in the remaining amount of the solvent between the region having a relatively large amount thereof and the region having a relatively small amount thereof is not less than 0.2 mass%.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
57.
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
Provided are a photosensitive resin composition, or the like, having excellent optical properties (resolution) and with which can be obtained a cured object having excellent reliability with respect to heat resistance, crack resistance, etc. This photosensitive resin composition comprises (A) a curable copolymer resin having at least a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2), (B1) an epoxy resin, (B2) a maleimide compound having two or more maleimide structures within one molecule, (C) a photopolymerization initiator, and (D) silica, and is characterized in that the amount of the (D) silica blended, converted to solid contents, is 25 to 75 % by mass, and when the photosensitive resin composition is irradiated with a 1,000 mJ/cm2 light and heated at 160°C for one hour to obtain a cured object, the difference (H-L), between the mean coefficient of linear thermal expansion (L) calculated in the 0°C to 50°C range and the mean coefficient of linear thermal expansion (H) calculated in the 200°C to 250°C range, for this cured object, is over 20 ppm/°C but lower than or equal to 60 ppm/°C.
[Problem] To provide a photoresist composition which enables development with use of a weak alkaline developer liquid and achievement of fine patterning with high resolution, while having excellent releasability. [Solution] A photoresist composition which contains (A) a carboxyl group-containing resin, (B) a photopolymerizable monomer and (C) a thermosetting component, and which is characterized in that if the photoresist composition is applied onto a flat substrate so that the film thickness of the photoresist composition after curing is 2 μm ± 0.5 μm, and is subsequently cured, after 30-minute prebaking at 75°C, by being exposed to ultraviolet light 1 including the wavelength of 375 nm in the ambient atmosphere with the amount of exposure light of 1,000 mJ/cm2233 solution, while Ra2 is the arithmetic mean roughness Ra of the surface of a cured coating film 2 that is formed by exposing the cured coating film 1 to ultraviolet light 2 including the wavelength of 185 nm and the wavelength of 254 nm in an oxygen atmosphere with the amount of exposure light of 25.2 mJ/cm2, Ra1 and Ra2 satisfy the formula Ra2/Ra1 ≤ 4.5 × 10-1.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
[Problem] To provide a photosensitive black resin composition which enables the production of a cured article having excellent hardness and adhesiveness while keeping the shielding performance and insulation performance thereof. [Solution] A photosensitive black resin composition comprising at least (A) a photosensitive resin, (B) a photopolymerization initiator, (C) a black pigment and (D) a filler, the photosensitive black resin composition being characterized in that the photosensitive resin (A) contains an acrylate compound which has a bonding moiety and at least two (meth)acryloyl groups bonded to the bonding moiety through a linking moiety in which the linking moiety comprises at least one group selected from the group consisting of a caprolactone group, an ethylene oxide group and a propylene oxide group and the total number of carbon atoms and oxygen atoms per a single linking moiety is 3 to 15, and the filler (D) comprises calcium carbonate.
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C09D 11/037 - Encres d’imprimerie caractérisées par des particularités autres que la nature chimique du liant caractérisées par le pigment
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p. ex. réticulation par UV qui suit l’impression
60.
CURABLE COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Provided are a curable composition, a dry film, a cured product, and an electronic component, said curable composition including an alkali-soluble resin (A), a photopolymerization initiator (B), an epoxy resin (C), a silicon compound (D), a hydrophilic silica (E), and an organic thixotropic agent (F). The curable composition contains hydrophilic silica and a silicon-based surface conditioner but also has good soldering properties and resolves the issues of silica flocculation and precipitation. As a result, the issues of flocculation and precipitation of hydrophilic silica inside a curable composition are resolved and, when the curable composition is coated upon a base material, the silicon compound (D) maintains base material wettability and, at the same time, improves flux wettability for the obtained cured product, thereby providing improved soldering properties when the cured product is used as a solder resist.
[Problem] To provide: a curable composition capable of forming cured objects which have excellent adhesion to the substrates and have high total light transmittance and a satisfactorily reduced haze; and a cured object obtained from the curable composition. [Solution] A curable composition which comprises (A) a urethane (meth)acrylate, (B) a thiocarboxylic acid derivative, (C) triallyl isocyanurate, and (D) a photopolymerization initiator, wherein the thiocarboxylic acid derivative (B) is contained in an amount of 50 parts by mass or more per 100 parts by mass of the urethane (meth)acrylate (A) and the triallyl isocyanurate (C) is contained in an amount of 40 parts by mass or more per 100 parts by mass of the urethane (meth)acrylate (A); and a cured object formed from the curable composition.
A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; a coloring agent; and an inorganic filler. When the thickness of the curable resin layer 12 is X (μm), the largest particle diameter of aggregate particles of the inorganic filler is X/2 (μm) or less. The dry film 11 has excellent light-shielding performance, and is configured such that warping is suppressed and burrs and chipping during dicing can also be suppressed.
[Problem] To provide an alkali developable curable resin composition which is able to be suppressed in decrease of performance even under relatively severe storage conditions. [Means] An alkali developable curable resin composition which contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator having an oxime bond, (C) a reactive diluent and (D) a thermosetting resin, and which is composed of at least two liquid compositions, so that the photopolymerization initiator (B) having an oxime bond and the alkali-soluble resin (A) are blended in different compositions. This alkali developable curable resin composition is characterized in that at least one (E) orthoester compound is blended together with the photopolymerization initiator (B) having an oxime bond.
Provided is a curable resin composition with which the occurrence of blistering is suppressed under high temperature conditions such as reflow, and which can produce a dry film that exhibits excellent finger-touch dryness, suppression of warping and slit processability. Also provided is a curable resin composition with which the occurrence of blistering is suppressed under high temperature conditions such as reflow and which can give a cured product having a low Dk value. One curable resin composition is characterized by containing (A) a polyimide having a number average molecular weight of more than 10,000 and having a maleimide ring or a benzoxazine ring at a terminal, and (B-1) a thermosetting resin component. Another curable resin composition is characterized by containing (A) a polyimide having a number average molecular weight of more than 10,000 and having a maleimide ring or a benzoxazine ring at a terminal, and (B-2) a compound having a maleimide group.
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08G 73/00 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant de l'azote, avec ou sans oxygène ou carbone, non prévus dans les groupes
[Problem] To provide a curable resin composition having such a property that air bubbles generated in a film of the curable resin composition applied onto a substate can escape from the film easily and also having excellent heat resistance, dryability, electroless gold plating properties, heat resistance, flexibility and bending properties. [Solution] A curable resin composition comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a compound having two ethylenically unsaturated groups and having a molecular weight of 300 to 1000, and (D) a heat-curable component, wherein, when 0.2 ml of the curable resin composition is intercalated between two stainless steel sheet sensors each having a diameter of 35 mm, then the resultant product is allowed to leave at 25°C for 60 seconds, and then a share stress of 0.0001 Pa is changed to a stress of 1.0 E + 4 Pa, the amount of change in viscosity is 20 Pa or less.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
[Problem] To provide: a resist composition having excellent close adhesiveness, hydrofluoric acid resistance and detachability; and a processed substrate product produced using the resist composition. [Solution] Produced are: a hydrofluoric acid-resistant resist composition characterized by comprising (A) a carboxyl group-containing resin, (B) a polyfunctional (meth)acrylate monomer, (C) a polyfunctional thiol compound, (D) a photopolymerization initiator and (E) talc in an amount of 20 to 100 parts by mass relative to 100 parts by mass of the carboxyl group-containing resin (A); and a processed substrate product produced by an etching processing using the hydrofluoric acid-resistant resist composition.
[Problem] To provide: a curable resin composition from which a cured product having high heat resistance, a low dielectric loss tangent and high adhesion to a conductor can be produced; and a dry film, a resin-clad copper foil, a cured product and an electronic component that contain the curable resin composition. [Solution] Provided are: a resin composition which contains an epoxy resin (A) and a compound (B) having an active ester group, and which is characterized in that the ratio of the total amount of epoxy groups in the epoxy resin (A)/the total amount of active ester groups in the compound (B) having an active ester group in the composition is 0.2-0.6; and a dry film, a resin-clad copper foil, a cured product and an electronic component that contain the curable resin composition.
122 represents a residue of an aromatic diamine (b) having a carboxyl group, and each occurrence of Y independently represents a cyclohexane ring or an aromatic ring).
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
H05K 3/28 - Application de revêtements de protection non métalliques
69.
HIGH-WITHSTAND-VOLTAGE, HEAT-DISSIPATING, INSULATING RESIN COMPOSITION AND ELECTRONIC COMPONENT IN WHICH SAME IS USED
Provided is a high-withstand-voltage, heat-dissipating, insulating resin composition that has high thermal conductivity and excellent heat dissipation, and that can prevent deterioration of withstand voltage characteristics and does not require machining such as press molding or vacuum pressing. A high-withstand-voltage, heat-dissipating, insulating resin composition containing (A) high-thermal-conductivity particles and (B) a curable resin, wherein the high-withstand-voltage, heat-dissipating, insulating resin composition is characterized in that: the volume occupied by the (A) high-thermal-conductivity particles is 60 vol% or higher relative to the total solids fraction volume of the high-withstand-voltage, heat-dissipating, insulating resin composition; the (A) high-thermal-conductivity particles contain (A-1) high-thermal-conductivity particles having a specific surface area of 0.2-0.6 m2/g as measured by the BET method and (A-2) high-thermal-conductivity particles having a specific surface area of 6.0-12.5 m2/g as measured by the BET method; and the (A-2) high-thermal-conductivity particles having a specific surface area of 6.0-12.5 m2/g as measured by the BET method constitute 5-16 wt.% relative to the total weight of the (A) high-thermal-conductivity particles.
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
Provided is a curable resin composition or the like from which it is possible to obtain a cured product that can improve dispersibility of a perovskite-type compound, that has excellent adhesion to a substrate, and that can achieve a high dielectric constant and a low dielectric loss tangent simultaneously. This curable resin composition or the like is characterized by including a curable resin and a perovskite-type compound that is coated with at least one of a hydrous oxide of silicon, a hydrous oxide of aluminum, a hydrous oxide of zirconium, a hydrous oxide of zinc, and a hydrous oxide of titanium.
Provided is a curable resin composition or the like having excellent high temperature exposure resistance and hardly generating any outgas when having a heat history of high temperature for an extended period of time on a package substrate, that is, being able to suppress decrease of weight, while satisfying performances necessary for solder resist, such as high adhesion, high resolution, high insulation reliability (HAST resistance), and high crack resistance (TCT resistance). This curable resin composition or the like contains a carboxyl group-containing resin (A), an epoxy resin (B), a photopolymerization initiator (C), and an inorganic filler (D), and is characterized in that the epoxy resin (B) has a Gardner color scale of less than or equal to 3, and that the epoxy resin (B) contains an epoxy resin (B-1) having the structure in formula (I), and a liquid trifunctional epoxy resin (B-2) having an isocyanuric ring.
C08K 3/00 - Emploi de substances inorganiques en tant qu'adjuvants
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
G03F 7/031 - Composés organiques non couverts par le groupe
H05K 3/28 - Application de revêtements de protection non métalliques
[Problem] To provide an alkali developing-type photosensitive resin composition having excellent solvent solubility, resolution, sensitivity, and adhesiveness while maintaining high heat resistance. [Solution] This alkali developing-type photosensitive resin composition is characterized: in containing a carboxyl group-containing resin, a photobase generator, a thermosetting resin, and a filler; and in that the thermosetting resin contains a maleimide compound having a biphenyl skeleton, and the filler has a photoreacting or a thermoreacting functional group at the surface.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
Provided are the following: a curable resin composition which exhibits excellent developing performance and gives a cured product having excellent flexibility, adhesive properties and heat resistance; a dry film having a resin layer obtained from the composition; a cured product of the composition or of the resin layer of the dry film; and an electronic component having the cured product. This curable resin composition contains (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a compound having an ethylenically unsaturated group and (D) a thermosetting resin, and is characterized by containing, as the thermosetting resin (D): (D-1) a thermosetting resin, which has one or more structures represented by formulae (d-1-1) to (d-1-4) and which has a number average molecular weight of 1000 or less; and (D-2) a difunctional thermosetting resin having a number average molecular weight of 1000-3000. (In formula (d-1-4), R moieties are each independently a hydrogen atom or a methyl group. However, it is not possible for all the R moieties to be hydrogen atoms.)
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
74.
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD
[Problem] To provide a curable resin composition having excellent properties such as noise suppression, and suitably usable as a hole-plugging filler in a printed circuit board having a high degree of freedom for forming wirings. [Solution] The curable resin composition comprising at least a curable resin and a magnetic filler is characterized in that when measured with a cone-plate type rotating viscometer (cone-plate type) in accordance with JIS-Z8803:2011, the viscosity at 5.0 rpm is 100 to 3000 (dPa·s), and the cured product formed by curing the curable resin composition at 150°C for 30 minutes has an insulation resistance value of 1.0 × 105 Ω or greater.
Provided are a photosensitive resin laminate that can be photolithographically patterned notwithstanding the incorporation of magnetic particles; a dry film in which the laminate is supported or protected by a film; a cured product of the laminate or the dry film laminate; an electronic component comprising the cured product; and a method for producing an electronic component using the laminate. The photosensitive resin laminate and so forth are characterized in that a resin layer (A) containing an alkali-soluble resin and magnetic particles and a photosensitive resin layer (B) containing an alkali-soluble resin and a photopolymerization initiator are laminated.
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
76.
CURABLE COMPOSITION FOR INKJET, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT COMPRISING SAID CURED PRODUCT
[Problem] To provide a curable composition for inkjet printing, which has excellent surface curability and excellent curability in deep portions. [Solution] A curable composition for inkjet, which is characterized by containing (A) an oxime ester photopolymerization initiator and (B) an amino group-containing (meth)acrylate compound.
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
H05K 3/28 - Application de revêtements de protection non métalliques
Provided are the following: a curable resin composition which exhibits excellent B-HAST resistance and PCT resistance while ensuring excellent reliability as a rigid cured product having excellent TCT resistance; and a dry film, a cured product and a printed wiring board obtained using the curable resin composition. The present invention is: a curable resin composition which contains (A) a carboxyl group-containing resin, (B) an epoxy resin having a dicyclopentadiene skeleton, (C) a photopolymerization initiator, and (D) spherical silica, with the content of the spherical silica (D) being 50 mass% or more relative to non-volatile components in the composition; and a dry film, a cured product and a printed wiring board obtained using the curable resin composition.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/16 - Polycondensats modifiés par post-traitement chimique par des acides monocarboxyliques ou par leurs anhydrides, halogénures ou esters à bas poids moléculaire
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
H05K 3/28 - Application de revêtements de protection non métalliques
Provided are: a curable resin composition capable of giving a cured object which has excellent adhesion to roughening-free substrates or low-profile substrates, while retaining physical properties including low CTE; a dry film including a resin layer obtained from the composition; a cured object obtained by curing a resin layer which is either the composition or the dry film; a layered structure including a cured resin layer comprising the cured object; and an electronic component including the cured object. The curable resin composition is characterized by comprising a curable resin and surface-treated silica particles having a positive zeta potential.
Provided are: a curable resin composition which is excellent in terms of conductor layer/solder resist adhesion after an HAST treatment and which can give cured objects having a low dielectric dissipation factor; a dry film including a resin layer obtained from the composition; a cured object obtained by curing a resin layer which is either the composition or the dry film; and an electronic component including the cured object. The curable resin composition is characterized by comprising: silica particles coated with at least any one of hydrated aluminum oxide, hydrated zirconium oxide, hydrated zinc oxide, and hydrated titanium oxide; an epoxy compound; and a hardener which is any one of active-ester-group-containing compounds, cyanate-ester-group-containing compounds, and maleimide-group-containing compounds.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 9/02 - Ingrédients traités par des substances inorganiques
H05K 3/28 - Application de revêtements de protection non métalliques
[Problem] To provide a resin composition which exhibits excellent adhesion, resolution, sensitivity and the like even after long-term storage. [Solution] An alkali developable photocurable thermosetting resin composition which contains at least an alkali soluble resin, a photopolymerization initiator having an oxime bond, a reactive diluent, a thermosetting resin and a solvent, and which is composed of at least two packs of compositions that are configured such that: the alkali soluble resin and the photopolymerization initiator having an oxime bond are blended in different compositions; and a solvent that is blended together with the photopolymerization initiator having an oxime bond contains 50% by mass or more of a ketone solvent.
G03F 7/031 - Composés organiques non couverts par le groupe
C08G 59/17 - Polycondensats modifiés par post-traitement chimique par des acides monocarboxyliques ou par leurs anhydrides, halogénures ou esters à bas poids moléculaire par l'acide acrylique ou méthacrylique
[Problem] To provide a curable composition for inkjet printing, by which the heat resistance of an obtained film is improved beyond the prior art. [Solution] This curable composition for inkjet printing contains: (A) a (meth)acrylate monomer which has a cyclic skeleton and in which the number of alkylene oxide modifications is 1-6; (B1) a difunctional (meth)acrylate monomer which does not have a cyclic skeleton but which has two or more alkylene glycol structures; (B2) a difunctional (meth)acrylate monomer which does not have a cyclic skeleton but which has a monoalkylene glycol structure; and (C) a photopolymerization initiator. Due to this configuration, an obtained film does not crack, exhibits excellent adhesion to a conductor and maintains sufficient hardness even after a thermal history that assumes a plurality of soldering applications. In addition, the problem can also be solved by a curable composition for inkjet printing, which contains: (A') a (meth)acrylate monomer which has a cyclic skeleton and in which the number of alkylene oxide modifications is 1-6; (B1') a difunctional (meth)acrylate monomer which does not have a cyclic skeleton but which has two or more alkylene glycol structures; (B2') a difunctional (meth)acrylate monomer which does not have a cyclic skeleton but which has a monoalkylene glycol structure; and (C') a photopolymerization initiator.
Provided is a heat-dissipating insulating resin composition that enables high packing and close packing of heat-dissipating microparticles without causing sedimentation or aggregation, exhibits excellent storage stability and printing properties, and produces excellent heat conductivity (heat-dissipation properties) in a cured product. A heat-dissipating insulating resin composition containing heat-dissipating inorganic particles (A) and a curable resin composition (B), wherein the heat-dissipating insulating resin composition is characterized in that the heat-dissipating inorganic particles (A) contain at least β-silicon carbide (A-1), and the volume occupancy rate of the heat-dissipating inorganic particles (A) is at least 60 capacity% of the total capacity of a cured product of the heat-dissipating heat insulating resin composition.
H01B 3/00 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques
H05K 3/28 - Application de revêtements de protection non métalliques
83.
CURABLE COMPOSITION FOR INKJET PRINTING, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT HAVING SAID CURED PRODUCT
[Problem] To provide a curable composition for inkjet printing, which is used for the purpose of achieving a cured product that has excellent heat resistance, hardness and adhesion to a substrate. [Solution] A curable composition for inkjet printing, which contains (A) a hyperbranched oligomer or polymer that has an ethylenically unsaturated group, (B) a photopolymerization initiator and (C) a thermosetting compound.
C09D 11/30 - Encres pour l'impression à jet d'encre
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
H05K 3/28 - Application de revêtements de protection non métalliques
84.
CURABLE COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT COMPRISING SAID CURED PRODUCT
[Problem] To provide: a curable composition which is free from defects of prior art, while having excellent reflectance, yellowing resistance, solder heat resistance and crack resistance; a cured product of this curable composition; and an electronic component which comprises this cured product. [Solution] A curable composition which is characterized by containing (A) a white coloring agent, (B) a photopolymerization initiator, (C) a bi- or higher functional (meth)acrylate monomer that has a heterocyclic ring and (D) a thermosetting compound, a cured product of this curable composition, and an electronic component which comprises this cured product are achieved.
Provided are a dry film, a cured product and a printed wiring board which exhibit excellent reliability as cured products while exhibiting excellent slit processability and handleability and excellent lamination properties. This dry film has a support film, a protective film and a resin layer held between the support film and the protective film. The resin layer contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) spherical silica and (D) an epoxy resin. The content of the spherical silica (C) is 50 mass% or more relative to solid content in a curable resin composition used in the resin layer. The total amount of one or more epoxy resins blended as liquids among the epoxy resin (D) is 20 mass% or more of the overall amount of the epoxy resin (D).
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
H05K 3/28 - Application de revêtements de protection non métalliques
This curable resin composition contains a carboxyl group-containing photosensitive resin, a photopolymerization initiator and a thermosetting compound. The carboxyl group-containing photosensitive resin contains a radical-polymerizable polymer. The radical-polymerizable polymer contains constituent units derived from a maleimide-based monomer, constituent units derived from an unsaturated carboxylic acid monomer having no ester bond and constituent units derived from a hydroxyl group-containing monomer as essential units in a polymer that is a base polymer. The radical-polymerizable polymer has a structure obtained by reacting a carboxyl group in the polymer that is a base polymer with a monomer having a functional group capable of reacting with the carboxyl group.
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
Provided are: a resin composition for multilayer electronic components, which is suitable for the production of a small multilayer electronic component that exhibits excellent distinguishability in appearance inspection; a dry film which has a resin layer that is obtained from the composition; a cured product of the composition or the resin layer of the dry film; a multilayer electronic component which is provided with a protective layer that contains the cured product; and a printed wiring board which comprises the multilayer electronic component. A resin composition for multilayer electronic components, which is used for protective layers of a multilayer electronic component that is obtained by alternately stacking electrode layers and insulating layers and by providing protective layers on both end faces in the stacking direction, and which is characterized by containing a curable resin, an inorganic filler and a coloring agent.
211 is 5.0 × 10-2to 1.0 × 102122 (dPa•s) represents a smallest value of a melt viscosity at 60 to 100°C as measured in accordance with JIS-K7244-10:2005, and is also characterized in that the pencil hardness as measured by the pencil hardness test in accordance with JIS-K5600-5-4:1999 is HB or harder when the heat-curable resin composition is heated at 100°C for 160 minutes.
Provided is a curable resin composition that, even if a cured film having sites where a painted membrane of the curable resin composition overlaps is formed upon a circuit board, the adhesion between the substrate (insulated section) and the circuit (conductive section) is maintained and cracks and peeling are unlikely to occur in the cured film. This curable resin composition includes a curable resin and is characterized by A, B, and C all being 1–15 MPa and A and B being 0.5–5 times C, when A (MPa) is the sheer strength between the insulated section and a cured film α when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the substrate, B (MPa) is the sheer strength between the conductive section and the cured film α when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the conductive section of the substrate, and C (MPa) is the sheer strength between the cured film α and a cured film β, when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the cured film β comprising a cured product of the curable resin composition.
H05K 3/28 - Application de revêtements de protection non métalliques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
C09D 201/00 - Compositions de revêtement à base de composés macromoléculaires non spécifiés
Provided are: a multilayer structure which has higher bendability than ever before, in particular, excellent crack resistance to excessive seam folding; a dry film; and a flexible printed wiring board which comprises a cured product of the dry film as a protective film. A multilayer structure which comprises a resin layer (A) and a resin layer (B) that is laminated on a flexible printed wiring board, with the resin layer (A) being interposed therebetween. The resin layer (B) is formed from a photosensitive thermosetting resin composition that contains an alkali-soluble resin, a photopolymerization initiator, a thermally reactive compound and a block copolymer; and the resin layer (A) is formed from an alkali developable resin composition that contains an alkali-soluble resin and a thermally reactive compound.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
H05K 3/28 - Application de revêtements de protection non métalliques
92.
ELECTROCONDUCTIVE COMPOSITION, CONDUCTOR USING SAME, AND LAYERED STRUCTURE
[Problem] To provide an electroconductive composition capable of producing a conductor exhibiting highly stable electrical resistance even after being subjected to repeated expansion/contraction or increased expansion. [Solution] This electroconductive composition contains an elastomer and silver powder, and is characterized in that: the silver powder has been surface-treated; the silver powder has an average primary particle diameter of 1.0 µm or smaller and an apparent porosity of 50 to 95%; and the cumulative 95% particle diameter (D95 particle diameter) in the particle size distribution of secondary particles of the silver powder in the electroconductive composition is 3.0 to 25.0 µm.
[Problem] To provide a two-pack type curable composition set for ink-jet printing which can accommodate highly fine patterns, is tack-free, and is suitable for straightening the warpage of pseudo-wafers and which has excellent heat resistance and, despite this, is excellent in terms of suitability for delivery and storage stability. [Solution] The two-pack type curable composition set for ink-jet printing is a two-pack type curable composition for ink-jet printing which comprises a main ingredient and a hardener, and is characterized in that the main ingredient contains a thermally crosslinking ingredient and the hardener contains a heat-curing catalyst ingredient and that the main ingredient and the hardener each contain an ingredient which cures with actinic rays.
C09D 11/30 - Encres pour l'impression à jet d'encre
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
C09D 11/54 - Encres à base de deux liquides, l’un des liquides étant l’encre, l’autre liquide étant une solution de réaction, un fixateur ou une solution de traitement pour l’encre
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H05K 3/28 - Application de revêtements de protection non métalliques
94.
WARPAGE CORRECTION MATERIAL AND METHOD FOR MANUFACTURING FAN OUT-TYPE WAFER LEVEL PACKAGE
[Problem] To provide a warpage correction material which can adjust the amount of warpage even at the temperature at which a fan out-type wafer level package (FO-WLP) is mounted, and at room temperature at which, for example, wafer transportation is performed, and thereby reduce the warpage of the WLP. [Solution] This warpage correction material for a fan out-type wafer level package is characterized by comprising a curable resin composition including a component that is curable by means of an active energy ray and heat, wherein when the warpage correction material is formed into a flat film-shaped cured product by curing the warpage correction material by means of the active energy ray and heat, and the linear expansion coefficient α (ppm/°C) at 25°C, the elastic modulus β (GPa) at 25°C, and the thickness γ (μm) of the cured product satisfy the following relational expression: 2000≤α×β×γ≤10000.
Provided is an alkali developable photocurable resin composition or the like that has excellent sensitivity and resolution and that is capable of forming a cured product having excellent appearance and surface smoothness. The alkali developable photocurable resin composition or the like includes: (A) an alkali-soluble resin; (B) a photopolymerization initiator; (C) a blue colorant; and (D) an inorganic filler, and is characterized in that the average particle diameter of the blue colorant (C) is 300 nm or less, and the average particle diameter of the inorganic filler (D) is 1.0 µm or less.
The purpose of the present invention is to provide a dry film with which it is possible to form a cured product in which there is less unevenness on the surface even when heat curing is performed without peeling the film, a cured product of a resin layer of the dry film, a printed wiring board provided with the cured product, and a method for manufacturing a cured product. A dry film in which a resin layer is laminated on a film, wherein the dry film is characterized in that: the resin layer is a heat-curable resin layer containing a heat-curable resin and a curing agent; the difference in the thermal change rate (%) between the longitudinal direction and the lateral direction of the film is 2.7% or less; and the curing agent includes two or more resins selected from phenol resins, cyanate ester resins, and active ester resins.
H05K 3/28 - Application de revêtements de protection non métalliques
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
B32B 27/42 - Produits stratifiés composés essentiellement de résine synthétique comprenant des résines de condensation d'aldéhydes, p. ex. avec des phénols, des urées ou des mélamines
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
97.
CURABLE COMPOSITION, BASE RESIN, CURING AGENT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
Provided are a curable composition with which it is possible to obtain a cured product having exceptional strength, a base resin, a curing agent, a dry film, a cured product, and a printed wiring board. A curable composition containing (A) a curable component and (B) a surface-treated filler, wherein the curable composition, etc., is characterized by containing (B-1) a surface-treated filler having photocurable reactive groups and thermosetting reactive groups as the (B) surface-treated filler.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08G 59/17 - Polycondensats modifiés par post-traitement chimique par des acides monocarboxyliques ou par leurs anhydrides, halogénures ou esters à bas poids moléculaire par l'acide acrylique ou méthacrylique
The present invention is able to provide: a negative photocurable resin composition which is capable of forming a cured product that has excellent resolution, high heat resistance and high elongation; a dry film which has a resin layer that is obtained from this composition; a cured product of this dry film; and a printed wiring board which comprises this cured product. A negative photocurable resin composition which is characterized by containing (A) an alkali-soluble resin, (B) an organosiloxane compound having a cyclic siloxane skeleton with 6 or more ring members and (C) a photopolymerization initiator, and which is also characterized in that the organosiloxane compound (B) having a cyclic siloxane skeleton with 6 or more ring members has a skeleton represented by general formula (1). (In the formula, n represents an integer of 1 or more.)
Provided are: a photocurable resin composition capable of forming a cured product that has superior printing properties, i.e., free of oozing, streaks, etc., and superior crack resistance; a dry film having a resin layer obtained using the composition; a cured product obtained by curing the composition or the resin layer of the dry film; and a printed circuit board comprising the cured product. The photocurable resin composition contains (A) an epoxy (meth)acrylate having a urethane bond and a bisphenol AD skeleton, (B) a photopolymerization initiator, and (C) a filler.
C08F 299/06 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés à partir de polyuréthanes
The purpose of the present invention is to provide a semiconductor sealing material capable of reducing warping of a wafer or a package in a semiconductor wafer or a semiconductor package, and particularly in a fan-out type wafer level package (FO-WLP). The present invention provides a semiconductor sealing material containing at least a thermosetting component (A) and an actinic radiation curable component (B), characterized in that, when the semiconductor sealing material is heat-treated at 150ºC for 10 minutes under an environment with no exposure to actinic radiation and then irradiated with 1 J/cm2 of ultraviolet light containing the 351 nm wavelength at 25ºC, the amount of heat generated, α (J/g), is such that 1 ≤ α (J/g).
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
brevets
