[Problem] To provide a photosensitive composition having excellent resolution and heat resistance. [Solution] This photosensitive composition contains a (A) carboxylic acid-containing resin, a (B) photoinitiator, a (C) photosensitive monomer, and a (D) coloring agent. The (A) carboxylic acid-containing resin contains at least one resin selected from (A1) carboxylic acid-containing photosensitive resins in which a phenolic compound is used as a starting material, (A2) carboxylic acid-containing photosensitive resins having a urethane skeleton, (A3) carboxylic acid-containing copolymerized photosensitive resins, and (A4) carboxylic acid-containing photosensitive resins in which an epoxy compound is used as a starting material. The (D) coloring agent contains a quinophthalone compound represented by formula (1).
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemical agents for plugging holes on printed circuit boards; heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics
4.
CURABLE COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT
The present invention provides: a curable composition that is capable of forming a cured product in which deterioration of low dielectric loss tangent characteristics is easily suppressed when curing or heating is performed in an air atmosphere; a cured product which is obtained using the curable composition; and an electronic component which comprises the cured product. An embodiment of the present invention provides a curable composition which contains an antioxidant and a polyphenylene ether that has a functional group having an unsaturated carbon bond, wherein the antioxidant includes one or more selected from among a phosphorus-based antioxidant and a sulfur-based antioxidant.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
5.
METHOD FOR PRODUCING CURED PRODUCT, CURED PRODUCT, AND ELECTRONIC COMPONENT
Provided is a technology pertaining to a method for producing a cured product, the method being capable of obtaining a cured product having sufficient strength when a curable composition is cured in an air atmosphere. A method for producing a cured product according to an aspect comprises a step for heating and curing, in an air atmosphere, a curable composition containing a polyphenylene ether having a structure in which a functional group represented by formula (1) is directly bonded to a benzene ring. (In formula (1), R is a C1-C8 alkyl group.)
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
C08G 65/44 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols par oxydation des phénols
C08G 65/48 - Polymères modifiés par post-traitement chimique
The resin composition contains (A) a branched polyphenylene ether, (B) a curing agent component, (C) a radical polymerization initiator, and (D) a filler, in which the curing agent component (B) has two or more styrene double bonds and has a molecular weight of 2,500 or less.
C08G 65/44 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols par oxydation des phénols
[Problem] To provide a photosensitive resin composition capable of efficiently forming a cured product having both excellent dielectric characteristics and resolution in a short time. [Solution] In this photosensitive resin composition containing a polyphenylene ether resin, a first photopolymerization initiator, a second photopolymerization initiator, and a radical reactive monomer, a weight average molecular weight of the polyphenylene ether resin is adjusted to 250-10,000, the first photopolymerization initiator and the second photopolymerization initiator are made different from each other, and the second photopolymerization initiator is used as a photopolymerization initiator having a 10-hour half-life temperature at 100-200° C.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed. Dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink. Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics.
9.
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Provided are: a curable resin composition comprising an alkali-soluble resin (A), a photopolymerization initiator (B), a heat-curable compound (C), a triazine compound (D), and silica (E), wherein the triazine compound (D) is a compound having a heteroatom-containing group (1) and a photoreactive group (2) on the triazine skeleton and the silica (E) is contained in an amount of 20-70 mass% in terms of solid amount based on the whole curable resin composition; a cured object obtained from the curable resin composition; and an electronic component including the cured object.
Provided is an alkali developable photosensitive resin composition which contains a carboxyl group-containing resin, an epoxy-based thermosetting component, a (meth)acrylic monomer, and a photopolymerization initiator, wherein: the equivalent ratio (carboxyl group equivalent/epoxy group equivalent) of the carboxyl group to the epoxy group is 5.0 to 8.0; and the epoxy-based thermosetting component contains a novolac-type epoxy resin and a bifunctional crystalline epoxy resin that has a softening point of 70°C to 120°C.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
The present invention is a photosensitive resin composition containing a carboxyl group-containing resin, a photopolymerization initiator, titanium oxide, and bentonite, wherein the Y value of the XYZ color system of a cured product of the photosensitive resin composition is 82 or more.
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Provided is a photosensitive resin composition that, while maintaining a low coefficient of thermal expansion (low CTE), has high resolution and excellent embedding properties with respect to a double-sided printed circuit board having fine circuits formed therein. The photosensitive resin composition is characterized by comprising a carboxyl group-containing resin, a photopolymerizable monomer, a photopolymerization initiator, and an inorganic filler, wherein: the melting point or softening point of the photopolymerization initiator is -50°C to 30°C; the inorganic filler is at least one of silica, hydrotalcite, talc, and alumina; and the inorganic filler is a nanofiller.
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
[Problem] To provide a method by which a solder resist having high adhesion to a mold resin can be obtained and an alkali developing-type resin layer having excellent resolution and solder heat resistance can be formed. [Solution] The present invention is characterized by comprising: applying, on at least one surface of a base material, an alkali developing-type resin composition containing a carboxyl group-containing resin, a (meth)acrylate compound, a photoinitiator, an inorganic filler (excluding a sedimentation-preventing agent), and a thermosetting resin to form an alkali developing-type resin composition layer; and drying the alkali developing-type resin composition layer to form an alkali developing-type resin layer on the base material. The present invention is characterized in that: the thermosetting resin contains a polybutadiene rubber; the inorganic filler contains a surface-treated barium sulfate and a surface-treated talc; and, when W (parts by mass) represents the content of the polybutadiene rubber with respect to 100 parts by mass of the carboxyl group-containing resin as expressed in solid content, T (°C) represents the drying temperature for the alkali developing-type resin composition layer, and t (min.) represents the drying time for the alkali developing-type resin composition layer, the alkali developing-type resin layer is formed by drying the alkali developing-type resin composition layer at a drying temperature and a drying time satisfying formulae (1)-(5). (1): 26≤W≤32.5 (2): a=0.3606T-34.721 (in formula (2), -12
Provided is a cured product of a photosensitive resin composition which contains inorganic fillers while maintaining an excellent resolution, and can also reduce warpage of a board when the electronic components are mounted. A cured product of a photosensitive resin composition comprising at least an alkali-soluble resin, a photoinitiator, and an inorganic filler, wherein the inorganic filler is contained in 85% or less by mass based on the total amount of the photosensitive resin composition, the elastic modulus of the cured product is 4 to 12 GPa, and the cured product satisfies the following condition: A≤0.3%, and B−A≤0.3, where A (%) is the water absorption rate of the cured product after leaving it for 60 minutes in an environment with a temperature of 25° C. and a relative humidity of 10%, and where B (%) is the water absorption rate of the cured product after leaving it for 60 minutes in an environment with a temperature of 25° C. and a relative humidity of 60%.
C09D 151/08 - Compositions de revêtement à base de polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères greffés sur des composés macromoléculaires obtenus autrement que par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09D 7/62 - Adjuvants non macromoléculaires inorganiques modifiés par traitement avec d’autres composés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
The resin composition contains (A) a resin and (B) a radical polymerization initiator, the resin (A) has a radically polymerizable functional group, and when a glass transition temperature (Tg) of the resin (A) is X° C. and a temperature of an exothermic peak top when the radical polymerization initiator (B) is heated from a temperature of 25° C. to 300° C. at 5° C./min by differential scanning calorimetry (DSC) is Y° C., (X−18)≤Y≤250 is satisfied.
C08G 65/38 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols
[Problem] To provide a curable resin composition that has improved developability and chemical resistance without causing a decrease in resolution. [Solution] A curable resin composition according to the present invention is characterized by comprising: an alkali-soluble resin that has an imide skeleton and has a weight average molecular weight of 20,000 or less; and an ethylene oxide-modified monomer that is at least pentafunctional.
C08L 101/12 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par des propriétés physiques, p. ex. anisotropie, viscosité ou conductivité électrique
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 101/06 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
18.
CURABLE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
Provided is a curable resin composition which contains a powder having a low volume resistivity, can be inhibited from suffering warpage due to curing shrinkage, and gives cured objects having excellent insulating properties. The curable resin composition comprises (A) a dicyclopentadiene-based epoxy resin, (B) an epoxy resin (which is not the dicyclopentadiene-based epoxy resin (A)), and a powder (C) having a volume resistivity of 1×106 Ω·cm or less, wherein the epoxy resin (B) has an epoxy equivalent in the range of 200-1,000.
Provided are: a new compound usable for a resin composition such as a photosensitive resin composition; and a polyhydroxyamide compound. Also provided are: a photosensitive resin composition containing the polyhydroxyamide compound; a dry film having a resin layer formed from the photosensitive resin composition; a cured product obtained by curing the photosensitive resin composition or curing the resin layer of the dry film; and an electronic component including the cured product. The present invention provides a compound represented by formula (1). (In formula (1), R represents a divalent organic group.)
C07C 233/81 - Amides d'acides carboxyliques ayant des atomes de carbone de groupes carboxamide liés à des atomes de carbone de cycles aromatiques à six chaînons ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un radical hydrocarboné substitué par des groupes carboxyle
C07C 233/63 - Amides d'acides carboxyliques ayant des atomes de carbone de groupes carboxamide liés à des atomes de carbone de cycles autres que des cycles aromatiques à six chaînons ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un radical hydrocarboné substitué par des groupes carboxyle
C07C 235/64 - Amides d'acides carboxyliques, le squelette carboné de la partie acide étant substitué de plus par des atomes d'oxygène ayant des atomes de carbone de groupes carboxamide liés à des atomes de carbone de cycles aromatiques à six chaînons et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné avec des atomes de carbone de groupes carboxamide et des atomes d'oxygène, liés par des liaisons simples, liés à des atomes de carbone du même cycle aromatique à six chaînons non condensé avec des atomes de carbone de groupes carboxamide et des atomes d'oxygène, liés par des liaisons simples, liés en position ortho à des atomes de carbone du même cycle aromatique à six chaînons non condensé ayant l'atome d'azote d'au moins un des groupes carboxamide lié à un atome de carbone d'un cycle aromatique à six chaînons
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
[Problem] To provide a liquid composition excellent in thickener solubility and metal particle dispersion stability, in addition to being excellent in shape retention during wiring formation. [Solution] This liquid composition is characterized by containing metal particles, a dispersion medium, and cellulose having an alkyloxyhydroxypropyl group.
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/107 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des matériaux organiques comportant des solvants, p. ex. pour la coulée en moule poreux ou absorbant
B22F 1/0545 - Dispersions ou suspensions de particules de taille nanométrique
C09C 3/10 - Traitement par des composés organiques macromoléculaires
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
22.
LAMINATE FOR SEMI-ADDITIVE PROCESS, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING LAMINATE FOR SEMI-ADDITIVE PROCESS, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
[Problem] To obtain a laminate for a semi-additive process in which, even with a step for forming an aperture in a substrate for a semi-additive process and forming a conductive seed layer as well as an additional conductive seed layer on the surface of the aperture, interconnects with a satisfactorily smooth and rectangular shape can be formed without retaining a metallic layer of the same type as the conductive layer of a pattern circuit on the conductive seed layer during circuit formation. [Solution] A laminate for a semi-additive process according to the present invention comprises: an insulating substrate; a first conductive seed layer with an aperture formed on at least one side of the insulating substrate; a second conductive seed layer formed on the inner surface of the aperture in the first conductive seed layer and electrically connected to the first conductive seed layer; and a cover layer covering the aperture, wherein the first conductive seed layer and the second conductive seed layer are formed from a metallic material, and the second conductive seed layer is formed from a different type of metallic material than the first conductive seed layer.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
This color tone prediction device comprises an acquisition unit that acquires the formulation of a composition, and a prediction unit that predicts the absorption coefficient and the scattering coefficient of the composition on the basis of a prescription of the composition.
Provided is a new negative photosensitive resin composition having better resolution and insulation reliability. The negative photosensitive resin composition contains: an (A) polyhydroxyamide compound containing a structural unit represented by the following formula (1); a (B) oxime sulfonate compound; and a (C) crosslinking agent, wherein the (A) polyhydroxyamide compound has a weight average molecular weight of 2,000 to 20,000, the (A) polyhydroxyamide compound does not contain a carboxyl group or has a carboxyl group equivalent of 1,500 g/eq or more, and the (C) crosslinking agent contains a plurality of methoxymethyl groups and/or methylol groups.
Provided is a new negative photosensitive resin composition having better resolution and insulation reliability. The negative photosensitive resin composition contains: an (A) polyhydroxyamide compound containing a structural unit represented by the following formula (1); a (B) oxime sulfonate compound; and a (C) crosslinking agent, wherein the (A) polyhydroxyamide compound has a weight average molecular weight of 2,000 to 20,000, the (A) polyhydroxyamide compound does not contain a carboxyl group or has a carboxyl group equivalent of 1,500 g/eq or more, and the (C) crosslinking agent contains a plurality of methoxymethyl groups and/or methylol groups.
Provided is a new negative photosensitive resin composition having better resolution and insulation reliability. The negative photosensitive resin composition contains: an (A) polyhydroxyamide compound containing a structural unit represented by the following formula (1); a (B) oxime sulfonate compound; and a (C) crosslinking agent, wherein the (A) polyhydroxyamide compound has a weight average molecular weight of 2,000 to 20,000, the (A) polyhydroxyamide compound does not contain a carboxyl group or has a carboxyl group equivalent of 1,500 g/eq or more, and the (C) crosslinking agent contains a plurality of methoxymethyl groups and/or methylol groups.
(In the formula, R1 represents a divalent organic group, and R2 represents a tetravalent organic group.)
The present invention provides a resin film in which yellowing caused by a manufacturing process is suppressed. Provided is a resin film comprising a resin composition, said resin film being characterized in that the resin composition contains: one or more resins that are selected from among polyamidimide resin, polyamide resin, polyimide resin, polyarylate resin, polyethersulfone resin, and polycarbonate resin; a phosphorus compound that has a molecular weight of not more than 350; and a filler.
C08L 87/00 - Compositions contenant des composés macromoléculaires non spécifiés, obtenus autrement que par des réactions de polymérisation ne faisant intervenir que des liaisons non saturées carbone-carbone
In order to provide a space-saving structure having a conductive pattern in which a plurality of circuit boards are reliably electrically connected and connected at a sufficient mechanical strength, a structure 2 is provided, comprising two or more circuit boards 4 including: a substrate body 6 having a region formed by a planar member having a predetermined thickness and having a first surface 6A and a second surface 6B that is the back surface thereof; a hollow convex through-hole 10 that is formed by a planar member, has an outer surface 12A and an upper surface 14A having a truncated-cone shape in which the first surface 6A is convex, and an inner surface 12B and a ceiling surface 14B having a truncated-cone shape in which the second surface 6B is concave, the through-hole having an opening 16 passing through the upper surface 14A and the ceiling surface 14B; a connection layer 22 in which a conductive layer (outer surface-side connection layer) 22A formed on the outer surface 12A and the upper surface 14A of the convex through-hole 10, and a conductive layer (inner surface-side connection layer) 22B formed on the inner surface 12B and the ceiling surface 14B are connected by a conductive layer 22C formed in the opening 16; and a conductive pattern 20 that is formed on at least one among the first surface 6A and the second surface 6B, and is connected to the connection layer 22, wherein an insertion-side outer surface 12A (4A), which is the outer surface 12A of the convex through-hole 10 of one circuit board 4A, and an inserted-side inner surface 12B (4B), which is the inner surface 12B of the convex through-hole 10 of the other circuit board 4B, have the same taper angle θ, the insertion-side outer surface 12A (4A) is inserted into an inner space SB surrounded by the inserted-side inner surface 12B (4B), and the insertion-side outer surface 12A (4A) on which the connection layer 22 is formed and the inserted-side inner surface 12B (4B) have a fitting structure of the hollow convex through-holes in surface-contact with each other in a crimped state.
Provided is a resin film in which yellowing caused by a manufacturing process is suppressed. This resin film, which is constituted of a resin composition, is characterized in that: the resin composition contains one or more resins selected from a polyamide-imide resin, a polyamide resin, a polyimide resin, a polyarylate resin, a polyethersulfone resin, and a polycarbonate resin, and a prescribed phosphorus compound; the content of the phosphorus compound is more than 0 parts by mass but not more than 25 parts by mass with respect to 100 parts by mass of the resin; and the content of the solvent is 2.5 parts by mass or less with respect to 100 parts by mass of the resin.
C08L 87/00 - Compositions contenant des composés macromoléculaires non spécifiés, obtenus autrement que par des réactions de polymérisation ne faisant intervenir que des liaisons non saturées carbone-carbone
Provided is a resin composition for films that is capable of providing a film having strong resilience. The resin composition contains a heat-reactive crosslinking agent and one or more resins selected from polyamide-imide resins and polyamide resins.
C08L 77/00 - Compositions contenant des polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions contenant des dérivés de tels polymères
Provided is a resin composition capable of providing a film which has low yellowness while retaining good resilience. The resin composition comprises one or more resins (A) selected from among polyamide-imide resins and polyamide resins, a fibrous alumina filler (B), and a crosslinking agent (C) containing two or more functional groups of one or more kinds selected from among methylol groups and alkoxymethyl groups.
C08L 77/00 - Compositions contenant des polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principaleCompositions contenant des dérivés de tels polymères
Provided is a resin composition which can maintain transparency as a film while exhibiting a good elastic modulus (specifically an average elastic modulus in the machine direction and transverse direction of 6.0 GPa or more). The resin composition contains a resin component and a fibrous alumina filler, and is characterized in that the resin component contains at least a resin having an amide structure, and the fibrous alumina filler includes a fibrous alumina filler which is dispersed in the resin composition at an average diameter of 4 nm to 30 nm and an average fiber length of 200 nm to 4000 nm.
C08L 77/06 - Polyamides dérivés des polyamines et des acides polycarboxyliques
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/34 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyamides
The present invention addresses the problem of providing a polyamide resin that enables the production of a film having good mechanical properties while suppressing production costs. The problem is solved by a polyamide resin comprising structural units represented by formula (1) and structural units represented by formula (2).
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
Provided is a columnar structure that maintains the original shape and size thereof even when stress is produced during a manufacturing process or similar, and can smoothly proceed through manufacturing steps. This columnar structure with a long shape comprises: a side surface section that is long; a plurality of groove sections that are formed at a distance from each other and along at least a portion of the side surface section in the longitudinal direction; and a conductor that is formed on at least a portion of a groove surface of at least one groove section among the plurality of groove sections, and is formed along the longitudinal direction of said groove section.
[Problem] To provide a photosensitive resin composition which is excellent in terms of resolution and is capable of forming a cured product having a high blackness (OD value) as seen by human eyes. [Solution] A photosensitive resin composition according to the present invention comprises (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerization initiator, and (D) a photopolymerizable monomer. The photosensitive resin composition is characterized in that the ratio of the absorbance at 405 nm to the absorbance at 555 nm for a dry coating film of the composition is 0.60 or less.
Provided is a polyhydroxyamide compound with which it is possible to obtain a new negative photosensitive resin composition that does not include a resin component which may be targeted by PFAS regulations. Provided is a polyhydroxyamide compound including a structural unit that is represented by formula (1) and a structural unit that is represented by formula (2). (In formula 1, R1is a divalent organic group.) (In formula 2, R2 is a divalent organic group.)
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
The present invention provides: a method for producing a cured product which has excellent appearance and excellent resolution even if formed into a thick film; or a cured product which is obtained using this method for producing a cured product. This method for producing a cured product includes: a lamination step for obtaining a curable resin laminate by laminating curable resin layers using dry films that each have a first film and a curable resin layer; and a curing step for obtaining a cured product by curing the curable resin laminate. The content of a filler in the curable resin layer is 30% by mass or more based on the total solid content. The curable resin layer has a high filler content surface, which is a surface region that has a relatively high filler content, and a low filler content surface, which is a surface region that has a relatively low filler content. In the lamination step, a pair of curable resin layers adjacent to each other are sequentially laminated so that the high filler content surface of one curable resin layer is superposed on the low filler content surface of the other curable resin layer.
The present invention provides a technology related to a transparent resin composition having excellent transparency, developability, and adhesiveness. One embodiment of the present invention pertains to a transparent resin composition. The transparent resin composition has an alkali-soluble polymer (A), a carboxyl group-containing urethane resin (B), and a polymerizable compound (C). The alkali-soluble polymer (A) includes a cyclohexyl group and a carboxyl group. The carboxyl group-containing urethane resin (B) is obtained by using a compound having an isocyanate group that is not directly bonded to an aromatic ring. The polymerizable compound (C) has an ethylene oxide skeleton. When the total of the alkali-soluble polymer (A) and the carboxyl group-containing urethane resin (B) is defined as 100 parts by mass, the content of the alkali-soluble polymer (A) is 45-75 parts by mass in terms of solid content.
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
B32B 27/40 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyuréthanes
C08J 7/043 - Amélioration de l'adhésivité des revêtements en soi, p. ex. par formation d'apprêts
The present invention provides a resin composition with which it is possible to produce a white solder resist that has a high reflectance and is less likely to produce defective products. One embodiment of the present invention is a resin composition. The resin composition contains an alkali-soluble polymer (A) that contains a cyclohexyl group and a carboxyl group, a urethane polymer (B), a compound (C) that contains a thiol group, and a white pigment (D).
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/40 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyuréthanes
Provided is a novel negative photosensitive resin composition having excellent resolution without using a resin component which can be subjected to PFAS regulation. Provided is a negative photosensitive resin composition containing a polyhydroxy amide compound containing a structural unit represented by formula (1), a crosslinking agent, and a photoacid generator.
[Problem] To provide a photosensitive resin composition which is excellent in terms of resolution and curability in deep portions even if the photosensitive resin composition contains a specific amount of an inorganic filler. [Solution] Disclosed is a photosensitive resin composition which contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a sensitizer, (D) an inorganic filler, and (E) a photopolymerizable monomer, the photosensitive resin composition being characterized in that: the photopolymerization initiator (B) contains an acylphosphine oxide-based photopolymerization initiator and a titanocene-based photopolymerization initiator; the sensitizer (C) contains an anthracene-based sensitizer; the inorganic filler (D) is contained in an amount of 50-90% by mass with respect to the total solid content in the photosensitive resin composition; and the average particle diameter (D50) of the inorganic filler (D) is 0.1-1.0 μm.
An object of the present invention is to provide a resin composition having high electrically insulating properties, high thermally conductive properties, low elasticity, and high solder heat resistance as an electrically insulating layer for a metal-based base material to be used for electronic devices, especially for on-vehicle electronic devices, and having favorable workability during coating a body to be coated as a resin composition for an electrically insulating layer before being cured. The present invention provides a thermosetting resin composition, a cured product, and a resin-attached metal foil, each containing a rubber-like polymer compound (A) having a glass transition temperature (Tg) of −40° C. or lower and a weight average molecular weight (Mw) in a range of 8,000 to 50,000, an epoxy resin (B), a filler (C), and a phenoxy resin (D). The present invention also provides a method for producing a metal-based substrate having any one of the thermosetting resin composition, the cured product, and the resin-attached metal foil, and a method for producing an electronic part using the metal-based substrate.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
05 - Produits pharmaceutiques, vétérinaires et hygièniques
10 - Appareils et instruments médicaux
35 - Publicité; Affaires commerciales
Produits et services
Industrial chemicals. Cosmetics. Pharmaceutical preparations; veterinary preparations;
reagent paper for medical purposes; fumigants only for
agricultural purposes; fungicides only for agricultural
purposes; rat poison; insecticides; herbicides;
insect-repellents only for agricultural purposes;
antiseptics only for agricultural purposes; greases for
medical purposes; adhesive tapes for medical purposes; drug
delivery agents in the form of edible wafers for wrapping
powdered pharmaceuticals; compresses; empty capsules for
pharmaceuticals; eyepatches for medical purposes; ear
bandages; menstruation bandages; sanitary tampons; sanitary
napkins; menstruation knickers; absorbent wadding; adhesive
plasters; bandages for dressings; liquid bandages;
breast-nursing pads; cotton sticks for medical purposes;
dietary supplements for humans; dietetic beverages adapted
for medical purposes; dietetic foods adapted for medical
purposes; dietary supplements for animals. Finger guards for medical purposes; sanitary masks; teething
rings; ice bag pillows for medical purposes; triangular
bandages; supportive bandages; catgut; feeding cups for
medical purposes; dropping pipettes for medical purposes;
teats; ice bags for medical purposes; medical ice bag
holders; nursing appliances; babies' bottles; nursing
bottles; medical apparatus and instruments. Business diagnosis for pharmacy; analysis and consultancy
services relating to the administration and management of
pharmacy; business management analysis and business
consultancy; business management; marketing research and
analysis; providing information concerning commercial sales;
retail or wholesale services for pharmaceutical, veterinary
and sanitary preparations and medical supplies.
[Problem] Provided is a polyphenylene ether having a branch structure, the polyphenylene ether having low dielectric properties and excellent solubility in solvents, an easily controllable molecular weight, and being suitable for mass production. [Solution] An embodiment of the present invention is a polyphenylene ether. The polyphenylene ether is obtained from feedstock phenols that include phenols that satisfy at least condition 1 and phenols (X) represented by formula (1). Condition 1: Having a hydrogen atom at the ortho position and the para position.
C08G 65/44 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols par oxydation des phénols
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
C07C 39/21 - Composés comportant au moins un groupe hydroxyle ou O-métal lié à un atome de carbone d'un cycle aromatique à six chaînons polycycliques ne contenant que des cycles aromatiques à six chaînons dans la partie cyclique, avec une insaturation autre que celle des cycles au moins un groupe hydroxyle étant lié à un cycle non condensé
C07D 309/12 - Atomes d'oxygène uniquement des atomes d'hydrogène et un atome d'oxygène liés directement aux atomes de carbone du cycle, p. ex. éthers du tétrahydropyranne
C08G 65/44 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols par oxydation des phénols
46.
QUINOPHTHALONE COMPOUND, COLORING COMPOSITION, AND CURED PRODUCT
C07D 215/12 - Composés hétérocycliques contenant les systèmes cycliques de la quinoléine ou de la quinoléine hydrogénée ne comportant pas de liaison entre l'atome d'azote du cycle et un chaînon non cyclique ou ne comportant que des atomes d'hydrogène ou de carbone liés directement à l'atome d'azote du cycle avec des radicaux hydrocarbonés substitués liés aux atomes de carbone du cycle
47.
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING PRINTED WIRING BOARD USING THE SAME
Provided is a curable resin composition that can be smoothed by polishing after being filled into a through-hole and inhibits a recess from being generated in the through-hole. The curable resin composition comprises a curable resin, a curing agent, and an inorganic filler. A printed wiring board, in which the through-holes are filled with the cured product of the curable resin composition, has a specific cured product-coating regions.
Provided is a thermosetting resin composition whose semi-cured state and fully cured state can be visually distinguished.
Provided is a thermosetting resin composition whose semi-cured state and fully cured state can be visually distinguished.
The thermosetting resin composition according to the invention is a thermosetting resin composition including a thermosetting resin, a curing agent, and a filler, in which when
an L* value measured using an L*a*b* color system before curing the thermosetting resin composition is defined as L1,
an L* value measured using the L*a*b* color system for a semi-cured product obtained by thermally curing the thermosetting resin composition at 80° C. for 60 minutes is defined as L2, and
an L* value measured using the L*a*b* color system for a fully cured product obtained by further thermally curing the semi-cured product at 150° C. for 60 minutes is defined as L3,
the thermosetting resin composition satisfies the following Formula 1:
Provided is a thermosetting resin composition whose semi-cured state and fully cured state can be visually distinguished.
The thermosetting resin composition according to the invention is a thermosetting resin composition including a thermosetting resin, a curing agent, and a filler, in which when
an L* value measured using an L*a*b* color system before curing the thermosetting resin composition is defined as L1,
an L* value measured using the L*a*b* color system for a semi-cured product obtained by thermally curing the thermosetting resin composition at 80° C. for 60 minutes is defined as L2, and
an L* value measured using the L*a*b* color system for a fully cured product obtained by further thermally curing the semi-cured product at 150° C. for 60 minutes is defined as L3,
the thermosetting resin composition satisfies the following Formula 1:
(
L
2
-
L
3
)
/
(
L
1
-
L
3
)
≥
0.7
.
(
Formula
1
)
Provided is a curable composition that is excellent in low dielectric properties. One embodiment of the present invention is a curable composition containing a polysiloxane having an epoxy group and a compound represented by formula (1). In the formula, G represents an organic group, and X represents a group represented by general formula (1) -11, general formula (1) -12, general formula (1) -13, or general formula (1) -14.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
50.
SUBSTRATE FOR MOUNTING LED AND LED-MOUNTED SUBSTRATE
Provided is a substrate for mounting an LED that can be applied to a thin base material and can result in a sufficient reflectance, particularly a substrate for mounting an LED, adaptable to a mini-LED and a μ-LED. In the substrate for mounting an LED, including a base material and a reflective layer that is layered on an upper region thereof, plural openings are disposed at generally equal spacings in longitudinal and lateral directions in the reflective layer, respectively, the reflective layer is the cured product of a curable resin composition including a curable resin and titanium oxide, the cured product has a storage elastic modulus of 4.0 GPa or less at 25° C., the spacings between the opening and the opening adjacent thereto in the longitudinal direction and the lateral direction are not less than twice the lengths of the opening in the longitudinal direction and the lateral direction, respectively, and the total area rate of the openings with respect to the area of the reflective layer is 0.1% or more and 9.0% or less.
C03C 17/00 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement
C03C 17/32 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement par des matières organiques avec des résines synthétiques ou naturelles
H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
51.
MULTILAYER BODY, CURED PRODUCT, INTERLAYER INSULATING LAYER FORMED OF SAID CURED PRODUCT, AND WIRING BOARD
[Problem] The present invention addresses the problem of providing a multilayer body which comprises a resin composition layer that is capable of forming a cured product having excellent dielectric characteristics, and which exhibits excellent adhesion characteristics between the resin composition layer and a second film. [Solution] The present invention provides a multilayer body which comprises a resin composition layer, a first film that is provided on one surface of the resin composition layer, and a second film that is provided on a surface that is on the reverse side of the one surface of the resin composition layer, wherein: a polyphenylene ether resin, a curing catalyst and an inorganic filler are added to the resin composition layer; and the adhesion strength of the second film at 25°C is adjusted to more than 0 N/25 mm and less than 1 N/25 mm.
Provided is a technology related to a resin layer-equipped copper foil exhibiting excellent adhesion to electrolytic copper plating and excellent reflow resistance. A resin layer-equipped copper foil 10 has copper 20 foil and a resin layer 30 layered on the copper foil. The resin layer 30 contains polyphenylene ether. The polyphenylene ether is preferably a branched polyphenylene ether. The surface roughness Rz of the surface of the copper foil on the resin layer side is preferably 0.5-3.0 μm.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Provided is a curable resin composition that can be applied by an inkjet method, and also has excellent surface curability and low water absorption. The curable resin composition includes: a first (meth)acrylate compound including an aromatic ring group and two or more ethyleneoxy repeating units; a second (meth)acrylate compound including three or more ethyleneoxy repeating units but not including an aromatic ring group; a photoinitiator; and an amine compound. The curable resin composition has a viscosity of 150 mPa·s or less at 25°C.
C08F 220/26 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p. ex. réticulation par UV qui suit l’impression
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
54.
STRUCTURAL BODY AND METHOD FOR PRODUCING STRUCTURAL BODY
This structural body comprises: a substrate; wiring provided on the substrate; an insulating layer provided on the substrate so as to cover all or part of the wiring; a height adjustment part that is provided in a first region on the substrate with the insulating layer interposed therebetween, the height adjustment part being configured from at least one of an organic resin and an organic resin composition; and a first semiconductor chip disposed on the height adjustment part so as to be supported by the height adjustment part.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
Provided is a multi-component curable resin composition that exhibits stable characteristics such as sensitivity after mixing, even after each composition component has been prepared at a high temperature (for example, 60°C). In this multi-component curable resin composition, a carboxyl group-including resin, at least one among a first amine, a second amine, and a third amine, and an epoxy compound that has a weight average molecular weight of 700 or greater are combined in the same composition component.
[Problem] To provide a curable resin composition having high sensitivity, capable of forming a cured article pattern having high resolution in a short time as compared with a conventional curable resin composition. [Solution] In a curable resin composition containing a carboxyl group-containing resin, an inorganic filler, a thermosetting resin, a photopolymerization initiator and a photopolymerizable monomer, the concentration of a (meth) acrylic group relative to the total mass of the solid content of the curable resin composition is adjusted to 0.00070-0.00170 equivalent/g.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 20/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle ou un sel, anhydride, ester, amide, imide ou nitrile
C08F 283/10 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polymères contenant plus d'un radical époxyde par molécule
C08F 292/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des substances inorganiques
C08L 51/08 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des composés macromoléculaires obtenus autrement que par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone
C08L 51/10 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des substances inorganiques
The purpose of the present invention is to provide a negative photosensitive resin composition which can yield a cured product having superior breaking elongation without sacrificing dissolution contrast (γ value), which is an indicator of the resolution of the negative photosensitive resin composition. Provided is a negative photosensitive resin composition which contains: (A) a polyhydroxyamide compound; (B) a photo-acid generator; (C) a crosslinking agent; and (D) a phenol compound having two or more hydroxyl groups. The negative photosensitive resin composition is characterized in that the phenol compound (D) having two or more hydroxyl groups has a molecular weight of 1000 or less, and the content of the phenol compound (D) having two or more hydroxyl groups is 0.01-30 parts by mass relative to 100 parts by mass of solid content in the polyhydroxyamide compound (A).
The purpose of the present invention is to provide a photosensitive resin composition which, while maintaining good resolution, prevents variations in color tones due to the influence of the color of copper in the base even if the photosensitive resin composition is formed into a thin film, and which provides a cured product having concealability. The present invention provides a photosensitive resin composition which contains (A) a coloring agent, (B) an alkali-soluble resin, (C) a photopolymerization initiator and (D) a photopolymerizable monomer, wherein the colorant (A) contains an anthraquinone-based blue pigment and carbon black.
[Problem] To provide a laminated structure comprising a photosensitive resin layer and capable of forming a cured product of a photosensitive resin layer with high resolution, even when the focal depth of an exposure device is shallow. [Solution] In a laminated structure comprising a film, and a photosensitive resin layer provided on one surface of the film, a film thickness tolerance of the photosensitive resin layer is adjusted to 4 µm or less, and the lowest point of a melt viscosity of the photosensitive resin layer at 70-120 °C is adjusted to 800 dPa·s or less.
Provided is a photosensitive thermosetting resin composition from which it is possible to form a solder resist film that has high reflectance and excellent heat resistance and surface curability even with a low exposure amount. The photosensitive thermosetting resin composition contains a carboxy group-containing resin, a photoinitiator, a white pigment, and a thermosetting resin. The photoinitiator contains an oxime ester-based photoinitiator and a titanocene-based photoinitiator. The thermosetting resin contains an epoxy resin. A cured product obtained through thermosetting the photosensitive thermosetting resin composition has a b*value in the L*a*b* color system of 2.0 or less, and has a reflectance of 85% or more at a wavelength of 450 nm.
Provided is a method for producing a structure for light emitting panels, the method making it possible to form a partition wall with excellent resolution. This method for producing a structure for light emitting panels comprises: a step for disposing stacked resin layers, which include a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer, on a base material having a pattern conductor; a step for applying active energy rays to the stacked resin layers so as to expose the stacked resin layers to light and subsequently developing the stacked resin layers so as to form a pattern image on the base material; a step for forming a multilayer partition wall, which comprises a first partition wall and a second partition wall, on the base material by subjecting the pattern image to a heat treatment; and a step for disposing a semiconductor light emitting element, which is connected to the pattern conductor, in a recess that is partitioned by the multilayer partition wall. The first photosensitive thermosetting resin layer is disposed in contact with the base material, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer so as to be separated from the base material. The first partition wall is disposed in contact with the base material, and the second partition wall is disposed on the first partition wall so as to be separated from the base material. The first partition wall has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm (inclusive), and the second partition wall has an average absorbance of 0.5 to 10 (inclusive) in the wavelength range of 430 nm to 750 nm (inclusive).
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p. ex. à construction modulaire
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G09F 9/30 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels
G09F 9/33 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels à semi-conducteurs, p. ex. à diodes
63.
XANTHENE COMPOUND AND METHOD FOR PRODUCING THE SAME
A xanthene compound with excellent heat resistance is provided together with a method for producing the same. The xanthene compound is represented by the formula (1).
A xanthene compound with excellent heat resistance is provided together with a method for producing the same. The xanthene compound is represented by the formula (1).
[Problem] To provide a laminated structure that can be laminated by both a conveyance-type laminator and a vacuum roll laminator. [Solution] A laminated structure according to the present invention comprises a first film and a resin layer formed on the first film, the structure being characterized in that: the resin layer is composed of a dry coating film of a photosensitive resin composition; the melt viscosity of the photosensitive resin composition at 50ºC is 1000-20,000 Pa·s; the melt viscosity of the photosensitive resin composition at 100ºC is 50-2000 Pa·s; and the film thickness of the resin layer is greater than 80 μm and less than or equal to 300 μm.
Provided is a curable composition that is excellent in low dielectric properties. A certain mode of the present invention is a curable composition is characterized by comprising: a compound having a thiol group; an oxime ester photopolymerization initiator; and a polyphenylene ether synthesized from feedstock phenols including a phenol that satisfies at least condition 1 and a phenol that satisfies at least condition 2, wherein the polyphenylene ether contains the phenol that satisfies condition 2 in an amount of 20 mol% or greater with respect to the feedstock phenols as a whole during synthesis. (Condition 1) Having hydrogen atoms at the ortho and para positions (Condition 2) Having a hydrogen atom at the para position and having a functional group containing an unsaturated carbon bond
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08G 65/40 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols à partir des phénols et d'autres composés
[Problem] To provide a curable resin composition that has excellent abradability as well as excellent chemical resistance and bleed resistance during printing. [Solution] Provided is a curable resin composition containing (A) an epoxy resin, (B) an epoxy resin curing agent, and (C) an inorganic filler, wherein the (C) inorganic filler contains at least three of (C1) silica, (C2) calcium carbonate, and (C3) barium sulfate.
Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.
Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.
In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thixotropic index at 25° C. is adjusted to 0.9 or more and less than 1.0.
Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thermal conductivity of a cured product of the thermosetting resin composition is adjusted to 2.5 W/m·K or more.
1/4T2/4T3/4T4/4Ttotaltotal1/4T2/4T3/4T4/4T1/42/4T3/4T4/4Ttotaltotal is taken to be the titanium oxide concentration (mass%) over the entire thickness direction of the cured film.
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/40 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyuréthanes
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
C09D 7/61 - Adjuvants non macromoléculaires inorganiques
[Objective] To provide a curable composition that is useful as, for example, a solder resist for printed wiring boards, is higher in flame retardancy, coatability, resolution, storage stability and low warpage and is also suitable for an inkjet printing method, and a cured product thereof.
[Objective] To provide a curable composition that is useful as, for example, a solder resist for printed wiring boards, is higher in flame retardancy, coatability, resolution, storage stability and low warpage and is also suitable for an inkjet printing method, and a cured product thereof.
[Solution] A curable composition containing (A) a compound having a (meth)acryloyl group, (B) a heat-curable component, (C) a photopolymerization initiator, (D) a crystalline flame retardant and (E) a wetting and dispersing additive, in which the content of the wetting and dispersing additive (E) is 1% by weight to 9% by weight with respect to the content of the crystalline flame retardant (D), a cured product obtained from the curable composition and an electronic component having the cured product.
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
C09D 11/101 - Encres spécialement adaptées aux procédés d’imprimerie mettant en œuvre la réticulation par énergie ondulatoire ou par radiation de particules, p. ex. réticulation par UV qui suit l’impression
C09D 11/107 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone à partir d'acides non saturés ou de leurs dérivés
71.
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Provided are a curable resin composition, a dry film, a cured product, and an electronic component including the same that have excellent resolution, higher insulation reliability, and excellent embeddability in a circuit. A curable resin composition includes: (A) a carboxyl group-containing resin; (B) a photopolymerization initiator; (C) a thermosetting resin; and (D) silica, wherein a blending amount of (D) the silica is 10 to 60% by mass relative to a total solid content of the curable resin composition, (D) the silica includes (D-1) nanosilica, (D-1) the nanosilica has an average secondary particle size of 200 nm or less, and a degree of association of (D-1) the nanosilica is 2.3 or less.
An ink-filled cartridge includes a cartridge, including a cylindrical syringe and a plunger, and an ink therein. The ink has a viscosity at 25° C. of from 50 to 2,000 dPa·s. The ink contains one or more air bubbles having a diameter of 0.1 mm or more. A total volume A of air bubbles in a portion of the syringe corresponding to a distance from a lower end of a discharge nozzle of the cylindrical syringe to a mid-point between the lower end and the plunger, and a total volume B of air bubbles in a portion of the syringe corresponding to a distance from the mid-point to the plunger, satisfy: 0≤A/B<1.0.
B05C 17/005 - Outils à main ou appareils utilisant des outils tenus à la main pour appliquer ou étaler des liquides ou d'autres matériaux fluides sur des surfaces, pour enlever partiellement des liquides ou d'autres matériaux fluides des surfaces pour décharger par pression des matériaux à travers un orifice d'évacuation
B65D 41/00 - Capuchons, p. ex. couvercles à rebords ou capsules à sertissage, c.-à-d. éléments ayant des parties prenant sur la périphérie extérieure d'un col ou d'une paroi limitant une ouverture de versement ou de déchargeCouvercles de protection en forme de capuchons pour les éléments de fermeture, p. ex. couvercles décoratifs en feuille de métal ou en papier
B65D 83/00 - Réceptacles ou paquets comportant des moyens particuliers pour distribuer leur contenu
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
Provided is a laminated structure from which a cured product having a low-roughness surface, excellent plating adhesion, and excellent heat resistance can be formed. The laminated structure according to the present invention comprises a first film, and a resin layer provided on the first film, the laminated structure being characterized in that: the resin layer contains (A) an epoxy resin, (B) a polyarylate compound having a bisphenol structure and an ester group, (C) an inorganic filler, and (D) a solvent; the inorganic filler (C) is contained in the resin layer in an amount of 38-82 mass% in terms of the solid content; and the resin layer has a mass reduction rate of at most 3.0 mass% after the resin layer is heated for 20 minutes at 100 °C under atmospheric pressure.
B32B 27/38 - Produits stratifiés composés essentiellement de résine synthétique comprenant des résines époxy
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
75.
CURABLE RESIN COMPOSITION, MULTILAYER STRUCTURE, CURED PRODUCT AND ELECTRONIC COMPONENT
The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according to the present invention contains (A) an epoxy resin, (B) a polyarylate compound which has a bisphenol structure and an ester group and (C) an inorganic filler. This curable resin composition is characterized in that: the ratio of the equivalent derived from the content of epoxy groups contained in the (A) epoxy resin to the equivalent derived from the content of ester groups and phenolic hydroxyl groups contained in the (B) polyarylate compound which has a bisphenol structure and an ester group is 0.10 to 1.20; and the content of the (C) inorganic filler is 38% by mass to 82% by mass based on the solid content in this curable resin composition.
[Problem] The present invention provides a multilayer body which is capable of efficiently forming an insulating layer that has achieved a good balance between excellent via formability and high dielectric characteristics. [Solution] Disclosed is a multilayer body which comprises a first film and two resin composition layers, wherein: a layer of a photosensitive resin composition, which has solubility or swellability with respect to an alkaline aqueous solution, is formed on one surface of the first film; a layer of a non-photosensitive resin composition, which has solubility or swellability with respect to an organic solvent, is formed on a surface of the layer of a photosensitive resin composition, the surface being on the reverse side of the surface that is in contact with the first film; and the ratio of the dissolution rate A of a cured product layer, which is obtained by photocuring the layer of a photosensitive resin composition, in an organic solvent to the dissolution rate B of the layer of a non-photosensitive resin composition in the organic solvent is regulated to be within a specific range.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
G03F 7/42 - Élimination des réserves ou agents à cet effet
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
A resin composition comprises a polyamideimide resin and a fibrous alumina filler. The polyamideimide resin comprises one or more imide structural units and one or more amide structural units, wherein each imide structural unit is represented by formulas (I-1) to (I-3) and each amide structural unit represented by formula (I-4). The fibrous alumina filler is dispersed in the resin composition in a state that an average fiber diameter is 4 to 30 nm and an average fiber length is 20 to 4,000 nm. A film comprising the resin composition has excellent mechanical properties.
[Problem] To provide a magnetic filler-containing curable resin composition that has high permeability even in a high frequency region and is capable of forming a cured coating film with excellent chemical resistance. [Solution] The curable resin composition according to the present invention contains (A) a curable resin, (B) a curing agent, and (C) a magnetic filler, the curable resin composition being characterized in that the magnetic filler (C) includes at least one of B, Si, Cu, and Nb.
[Problem] To provide a photosensitive resin composition which is capable of forming a cured product that achieves a good balance between high dielectric constant and good resolution (image formability) both after development and before and after thermal curing. [Solution] A photosensitive resin composition which contains a carboxyl group-containing resin, a photocurable compound that does not contain a carboxyl group, a photopolymerization initiator and a thermosetting component, and to which a perovskite compound and silica are added, wherein the content of the perovskite compound is adjusted to be 55% by mass to 90% by mass based on the solid content relative to the total mass of the photosensitive resin composition.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
H05K 3/28 - Application de revêtements de protection non métalliques
80.
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
A thermosetting resin composition includes a hydroxy group-containing fluorocarbon resin, an isocyanate compound having two or more isocyanate groups, and a rutile titanium oxide, in which the mass ratio of the fluorocarbon resin to the isocyanate compound is 1 or more and 20 or less, and the mass ratio of the rutile titanium oxide to the fluorocarbon resin is 1.4 or more and 4 or less. In addition, when elemental analysis by the combustion method is performed on a cured product obtained by curing the thermosetting resin composition, ashes at a content of 45% by mass or more, fluorine atoms at a content of 3% by mass or more, and nitrogen atoms at a content of 0.1% by mass or more are detected when the total is defined as 100% by mass.
[Problem] The present invention addresses the problem of providing a circuit board wherein a small-diameter via hole is formed as designed, and the via hole has excellent adhesion to a copper plating layer without requiring wet desmearing. [Solution] A circuit board according to the present invention comprises an insulating layer that is provided with a via hole, and this circuit board is characterized in that: the insulating layer is formed of a cured product of a thermosetting resin composition that contains a thermosetting resin and an inorganic filler; the opening diameter at the top of the via hole is 30 µm or less; and the manganese content in the insulating layer is less than 50 ppm.
Provided is a method for manufacturing a circuit board (1) provided with an insulation layer (3), this method comprising a step of emitting a pulse laser at output of 0.3 W or more to form a via hole (4), the pulse laser having a wavelength containing 266 nm or 355 nm and having a pulse width of 20 nanoseconds or less. As a result, the via hole (4) having a small diameter can be formed to a design value and a difference in diameter of the via hole (4) between a top portion and a bottom portion can be small.
Provided is a method for manufacturing a circuit board (1) provided with an insulating layer (3), the method comprising a step for forming a via hole (4) by irradiating the circuit board (1) with an excimer laser having a pulse width of 30 microseconds or less and an output of 300 mJ/cm2 or greater.
Provided is a structure comprising a conductor layer and an insulator and having excellent adhesiveness. An embodiment of the present invention is a structure 30 comprising an insulator 10 and a conductor layer 20. The conductor layer 20 is disposed on at least a portion of the surface of the insulator 10. The insulator 10 contains a resin 12 and a filler 14. A conductor layer component that is identical to at least one component forming the conductor layer 20 penetrates, from the interface 16 between the insulator 10 and the conductor layer 20, into the area between the resin 12 and a portion of filler 14, of the filler 14, and the conductor layer component joins with the conductor layer 20.
[Problem] To provide a layered structure that includes a resin layer with which a cured product with a high dielectric constant can be obtained and having both good image formation after development and before heat curing and good image formation after heat curing, and that has both good detachability and good adhesion between the resin layer and a second film. [Solution] This layered structure comprises a first film, a resin layer, and a second film, in that order. The resin layer contains a carboxyl group-containing resin (A), a photo-curable compound (B) containing no carboxyl group, a photoinitiator (C), a perovskite-type compound (D), and an epoxy resin (E). In terms of solid content, the content of the perovskite-type compound (D) accounts for 55-85 mass% of the entire mass of the resin layer. The epoxy resin (E) includes a solid epoxy resin and a liquid epoxy resin. In terms of solid content, the content of the liquid epoxy resin is 150-1000 parts by mass per 100 parts by mass of the solid epoxy resin.
B32B 27/38 - Produits stratifiés composés essentiellement de résine synthétique comprenant des résines époxy
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
86.
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
Provided is a photosensitive resin composition or the like that is capable of achieving both low warpage and high reflectance after a reflow process. The present invention is characterized by containing (A) a carboxyl group-containing urethane resin derived from an aliphatic diisocyanate and a diol having an aromatic ring, (B) a bifunctional (meth)acrylate, (C) a photopolymerization initiator, (D) an epoxy resin, and (E) a coloring agent that exhibits a white color.
G03F 7/035 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyuréthanes
C08G 18/65 - Composés à bas poids moléculaire contenant un hydrogène actif avec des composés à haut poids moléculaire contenant un hydrogène actif
C08G 59/46 - Amides en mélange avec d'autres agents de durcissement
Provided is a resin composition or the like that is capable of achieving both low warpage and high reflectance after a reflow step. A resin composition containing (A) a carboxyl-group-containing urethane resin and (E) a colorant that yields a white color, the resin composition being characterized in that, in dynamic viscoelasticity measurement of a cured film thereof at a frequency of 1 Hz, the temperature (Tg) of the loss tangent peak is 100°C or lower, and the peak of the loss tangent is within the range of 0.5-1.5.
C08G 18/65 - Composés à bas poids moléculaire contenant un hydrogène actif avec des composés à haut poids moléculaire contenant un hydrogène actif
C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
[Problem] To provide a mounting substrate that does not easily have a connection failure due to misalignment even when a minute installation component is mounted. [Solution] A mounting substrate according to the present invention is for mounting an installation component and comprises: a circuit substrate on which a plurality of electrodes are arranged at a prescribed interval; and a resin layer that includes a plurality of openings on a top region of the electrodes on the circuit substrate. The mounting substrate is characterized in that conditional expression (1) is satisfied, where the openings of the resin layer have a size of X μm long and Y μm wide, and the installation component has a size of x μm long and y μm wide.
Provided is a novel negative-type photosensitive resin composition having superior resolution and insulation reliability. The negative-type photosensitive resin composition is characterized by: comprising (A) a polyhydroxyamide compound including a structural unit represented by formula (1), (B) an oxime sulfonate compound, and (C) a crosslinker; the weight‐average molecular weight of the (A) polyhydroxyamide compound being 2,000-20,000; the (A) polyhydroxyamide compound not containing a carboxyl group or having a carboxyl group equivalent of 1,500 g/eq or more; and the (C) crosslinker containing multiple methoxymethyl groups and/or methylol groups. (In the formula, R1is a divalent organic group, and R2 is a tetravalent organic group.)
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
The present invention provides a cured product of a photosensitive resin composition, the cured product containing an inorganic filler and still having excellent resolution, while being capable of suppressing warp of a substrate during mounting of an electronic component. The present invention provides a cured product of a photosensitive resin composition which contains at least an alkali-soluble resin, a photopolymerization initiator and an inorganic filler, wherein: the inorganic filler is contained at a ratio of 85% by mass or less relative to the entirety of the photosensitive resin composition; the cured product has an elastic modulus of 4 to 12 GPa; and A and B satisfy A ≤ 0.3% and (B - A) ≤ 0.3, where A (%) is the water absorption of the cured product after being left to stand for 60 minutes in an environment at 25°C and a relative humidity of 10%, and B (%) is the water absorption of the cured product after being left to stand for 60 minutes in an environment at 25°C and a relative humidity of 60%.
[Problem] To provide a photosensitive resin composition having preferable characteristics required during printed wiring board production, wherein crystallization of a component is suppressed even when exposed to an environment under which an ordinary temperature condition and a low temperature condition are repeated. [Solution] This photosensitive resin composition comprises a carboxy group-containing resin, a photopolymerization initiator, and an organic solvent, wherein an α-aminoacetophenone-based photopolymerization initiator is blended as the photopolymerization initiator, and a petroleum-based solvent, a carbitol acetate, and dipropylene glycol monomethyl ether are blended as the organic solvent.
[Problem] To provide a photosensitive resin composition which makes it possible to sufficiently suppress generation of residue of an unnecessary filler on a substrate after a pattern has been formed on the substrate. [Solution] This photosensitive resin composition contains a carboxyl group-containing resin, a photoinitiator, and an inorganic filler. A surface-treated filler having a hydrophilic group is blended as the inorganic filler.
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols on the surface. The cured product comprises a curable resin composition containing a curable resin and an inorganic filler and is characterized in that the inorganic filler contains an amorphous silica, and the average linear expansion coefficient when a cured product having a thickness of 20 µm is subjected to a temperature change from 0ºC to 180ºC is 70-100 ppm/ºC.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
[Problem] To provide a laminate cured body, a printed wiring board having the same, and a laminate cured body manufacturing method, wherein, even when a cured body having a large film thickness is manufactured using a photocurable resin composition, excellent curing can be performed also in the bottom portion, thereby suppressing undercut formation and achieving improved adhesion to a substrate. [Solution] Provided are: a laminate cured body for use as a resist for a printed wiring board, the laminate cured body being characterized by comprising a lower-layer cured film made of a photocurable resin composition that has been laminated on a substrate upper surface and photocured, and one or a plurality of upper-layer cured films made of a photocurable resin composition that has been laminated on the lower-layer cured film and separately photocured, the laminate cured body being used as a resist for a printed wiring board; a printed wiring board having the same; and a laminate manufacturing method.
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under high-temperature and high-humidity conditions, and yielding a cured coating film having high hardness after curing. [Solution] A curable resin composition containing (A) an epoxy compound, (B) an oxetane compound, (C) a photoacid generator, and (D) a black colorant, wherein the (A) epoxy compound contains (a) an alicyclic epoxy compound having an ester bond in each molecule and (b) an alicyclic epoxy compound not having an ester bond in each molecule in a mass ratio within a numerical range of 5:100-30:100. [Selected drawing] None
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
[Problem] To provide a curable resin composition from which a cured product having excellent insulation reliability can be formed and which has a suppressed amount of emission of halogen-containing substances during combustion. [Solution] This curable resin composition comprises an epoxy resin, an epoxy resin curing agent, and a filler, wherein a filler containing at least one selected from the group consisting of magnesium carbonate, magnesium oxide, hydrotalcite, and aluminum hydroxide is used as the filler.
[Problem] To provide a dry film having a resin layer, said dry film having a support and a resin layer provided on one surface of said support, wherein it is possible to form an interlayer insulation layer that can readily be peeled from the support prior to curing, while having excellent adhesion to a metal layer after curing, particularly excellent adhesion in which interfacial peeling is inhibited even in a high-temperature, high-humidity environment. [Solution] This dry film comprises a first film, and a resin provided to one surface of the first film such that the resin can be peeled therefrom. A thermosetting resin, a curing agent, and an inorganic filler are blended into the resin layer, and the standard deviation of the area percentage of the inorganic filler at two or more different portions of the surface of the cured product resulting from curing of the resin layer is 1% or more.
[Problem] To provide a film laminate comprising a film and a resin composition layer provided on one surface of said film, wherein when a resin composition is applied to the film and dried, the repellency of the resin composition on the film is suppressed. [Solution] A film laminate comprises: a first film; and a resin composition layer provided on one surface of the first film, wherein 15°≤A≤30° and 0.75A≤B≤1.3A are satisfied, where A is a contact angle between the first film and the resin composition at 25 °C, and B is a contact angle between the first film and the resin composition at 75 °C.
Provided is a production method for a resin cured product in which sensitivity and resolution are stable and in which it is possible to obtain a good resin layer state after a lamination step. The present invention is a method for producing a resin cured product on a substrate by using a laminated structure comprising a resin layer and a first film. The production method for the resin cured product on the substrate includes, when laminating the resin layer and the first film of the laminated structure on the substrate in a state in which the resin layer thereof is on the substrate side, performing a first lamination step and a second lamination step under specific conditions, performing exposure after letting the result stand for a prescribed time, and developing the same.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Chemical preparations for use in the process of producing
printed circuit boards, namely, resist ink in the nature of
solder mask; chemical preparations for use in the process of
producing printed circuit boards, namely, resist ink in the
nature of photoresists; chemical preparations for use in the
process of producing printed circuit boards, namely, solder
resists; chemical preparations for solder resists used in
the process of producing printed circuit boards; chemical
preparations for use in the process of producing printed
circuit boards, namely, etching resist; chemical
preparations for use in the process of producing printed
circuit boards, namely, photoresists; chemical preparations
for use in photography; photosensitive resists in the nature
of solder mask in the form of film for use in the process of
producing printed circuit boards; dry films for use in the
process of producing electronic components; photosensitive
resists in the form of film for sealing electronic
components; thermal-curing-type dry films for use in the
process of producing electronic components; dry films
possessing electrical insulation for use in the process of
producing electronic components; chemical preparations for
blocking light; chemical coatings for use in the process of
producing printed circuit boards; chemical preparations for
resisting heat; chemical preparations for industrial
purposes; industrial chemicals; glue and adhesives for
industrial purposes; synthetic resin compositions possessing
thermal conductivity for use in the process of producing
electronic components. Dyestuffs; pigments; marking inks in the nature of printing
inks for use in the process of producing printed circuit
boards; marking inks for use in the process of producing
electronic components; inks for plugging hole, namely,
printing inks for use in the process of producing printed
circuit boards; printing inks for use in the process of
producing printed circuit boards; printing inks for use in
the process of producing electronic components; printing
inks, other than mimeographing inks. Electrical insulating resists, namely, electrical insulating
materials in liquid form for use in the process of producing
printed circuit boards; electrical insulating materials,
namely, electrical insulating synthetic resin materials for
use in the process of producing printed circuit boards;
electrical insulating synthetic resin materials possessing
thermal conductivity for use in the process of producing
electronic components; electrical insulating synthetic resin
materials for use in the process of producing electronic
components; electrical insulating synthetic resin materials
used for liquid-form electrical insulating materials
installed in an interlayer of build-up boards for use in the
process of producing build-up boards; electrical insulating
synthetic resin materials used for liquid-form electrical
insulating materials installed in an interlayer of
electronic components for sealing electronic components;
electrical insulating synthetic resin materials used for
electrical insulating materials installed in an interlayer
of build-up boards for use in the process of producing
build-up boards; electrical insulating synthetic resin
materials used for electrical insulating materials installed
in an interlayer of electronic components for sealing
electronic components; electrical insulating synthetic resin
materials used for electrical insulating materials installed
in an interlayer of a dry film for use in the process of
producing build-up boards; electrical insulating synthetic
resin materials used for electrical insulating materials
installed in an interlayer of a dry film for sealing
electronic components; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing printed circuit boards; electrical insulating
materials, namely, insulating coating materials for use in
the process of producing display panels; electrical
insulating materials, namely, insulating coating materials
for copper foil protection of surface of printed circuit
boards; electrical insulating materials, namely, insulating
coating materials for use in the process of producing
package circuit boards; electrical insulating materials,
namely, insulating coating materials for use in the process
of producing flexible printed circuit boards; insulating
fillers, namely, electrical insulating materials for copper
foil protection of holes of printed circuit boards;
electrical insulating materials for sealing electronic
components in the process of producing printed circuit
boards; electrical insulating materials made of synthetic
resin for sealing electronic components in the process of
producing printed circuit boards; electrical insulating
materials; semi-processed plastics.
