A solder processing apparatus having a storage tank 110 storing molten solder S; and an extension part 210 being at least partially immersed in the molten solder S in the storage tank 110 and extending in the molten solder S. The extension part 210 reciprocates in a horizontal direction in the molten solder S.
Provided are: a flux capable of increasing the joining strength of a solder joint part without using an underfill; and a method for manufacturing a joined body using said flux. According to the present invention, a flux containing an epoxy resin, a curing agent for curing the epoxy resin, and an activator is adopted. The mass ratio represented by the epoxy resin/curing agent is at least 5. The flux contains a coupling agent, and the coupling agent contains a compound represented by general formula (C-1). The content of the epoxy resin is 50-95 mass% with respect to the total mass of the flux. In the formula, Rc1represents a C1-C6 alkyl group or a hydrogen atom. Rc2represents a C1-C10 alkylene group or a single bond. A methylene group constituting the alkylene group may be substituted with an oxygen atom. Rc3ccccc=3.
Provided is a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, an on-vehicle electronic circuit, an ECU electronic circuit, an on-vehicle electronic circuit device, and an ECU electronic circuit device having excellent reliability as a result of suppressing surface tension low and having high tensile strength and shear strength. The solder alloy has an alloy composition comprising, by mass %, 3.0-4.0% Ag, 0.1-1.0% Cu, 0.1-1.5% Bi, 3.0-6.0% Sb, 0.2-6.0% In, 0.020-0.040% Fe, 0.001-0.020% Co, and the balance Sn. Preferably, the alloy composition further contains, in terms of mass%, at least one of Ge, Ga, As, Pd, Mn, Zn, Zr, and Mg at an amount of 0.1% or less in total.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
Nonferrous metals and their alloys; copper and its alloys;
lead and its alloys; tin and its alloys; solders; solder
alloys; silver solder; gold solder; lead-free solder; solder
in the form of ball; solder in the form of rod; solder in
the form of wire; resin core wire of nonferrous metals and
their alloys; soldering wire of metal; solder in the form of
paste; solder in the form of powder.
Provided are a solder alloy, a solder paste, and a solder joint that exhibit a suitable melting temperature, are excellent in wettability, are high in tensile strength and shear strength, and are further excellent in drop impact resistance. The solder alloy has the following alloy composition. The alloy composition has an alloy composition consisting of, by mass %, Ag: 0.1 to 3.9%, Cu: 0.1 to 1.0%, Bi: 0.6 to 1.4%, Sb: 5.1 to 7.9%, Ni: 0.01 to 0.30%, Co: 0.001 to 0.100% or less, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
6.
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint
Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition that includes, by mass %, Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, Ge: 0.001 to 0.015%, optionally one or more of Mn, Pd, Au, Pt, Cr, V, Mo, and Nb each with an upper limit of 0.01% by mass %, and the balance being Sn. The alloy composition satisfies the following relation (1):
Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition that includes, by mass %, Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, Ge: 0.001 to 0.015%, optionally one or more of Mn, Pd, Au, Pt, Cr, V, Mo, and Nb each with an upper limit of 0.01% by mass %, and the balance being Sn. The alloy composition satisfies the following relation (1):
0.0003
<
(
Ni
/
Co
)
×
(
1
/
Ag
)
×
Ge
<
0.05
(
1
)
Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition that includes, by mass %, Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, Ge: 0.001 to 0.015%, optionally one or more of Mn, Pd, Au, Pt, Cr, V, Mo, and Nb each with an upper limit of 0.01% by mass %, and the balance being Sn. The alloy composition satisfies the following relation (1):
0.0003
<
(
Ni
/
Co
)
×
(
1
/
Ag
)
×
Ge
<
0.05
(
1
)
Ni, Co, Ag, and Ge in the relation (1) each represent the contents (mass %) in the alloy composition.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
A flux containing rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, in which the thiol compound includes a compound (Tp) having a benzenethiol skeleton in which one or more hydrogen atoms on a benzene ring are substituted with a mercapto group (—SH), is provided in the present invention. As the compound (Tp), at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol, and benzenethiol is preferable. According to such flux, a change in viscosity of the solder paste with time can be further suppressed.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A flux containing rosin, a solvent, a thixotropic agent, an amine hydroiodide, and an activator (provided that the amine hydroiodide is excluded), in which the amine hydroiodide includes a heteroalicyclic amine hydroiodide, is provided in the present invention. As the heteroalicyclic amine hydroiodide, at least one selected from the group consisting of piperidine hydroiodide and pipecholine hydroiodide is preferable. According to such flux, the generation of voids during soldering can be further suppressed.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A jet soldering apparatus includes a first housing; a first supply port provided on the first housing and configured to provide first molten solder; a second housing; and a second supply port provided on the second housing and configured to provide second molten solder. The jet soldering apparatus is configured to mix the first molten solder and the second molten solder so as to obtain mixed molten solder. The jet soldering apparatus is configured to provide the mixed molten solder such that the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.
Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an organic acid (A), and a solvent (S). The organic acid (A) includes a dimer acid (A1) that demonstrates a weight reduction rate of not more than 1 mass % in a thermogravimetric analysis in which the dimer acid is heated up to 260° C. at a temperature rising rate of 10° C./min. The solvent (S) includes a solvent (S1) that demonstrates the weight reduction rate of at least 99 mass % in a thermogravimetric analysis in which the solvent (S1) is heated up to 150° C. at a temperature rising rate of 6° C./min.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
11.
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
A flux according to the present invention is characterized by containing: a compound having an oxyalkylene group and an epoxy group; at least one acid anhydride selected from the group consisting of succinic anhydride and derivatives thereof; a rosin; a solvent; a thixotropic agent; and an activator. A method for producing a bonded body according to the present invention is characterized by including a step for obtaining a bonded body by soldering a component and a substrate, wherein when soldering, reflow is carried out in an atmospheric environment using a solder paste that contains a solder alloy powder and the flux according to the present invention. The adoption of such a flux and a solder paste containing the flux can suppress the occurrence of flux residue cracking due to temperature changes, even in the case of atmospheric reflow soldering.
The present invention provides a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, an on-vehicle electronic circuit, an ECU electronic circuit, an on-vehicle electronic circuit device, and an ECU electronic circuit device that have a low melting point, have high shear strength, exhibit an appropriate fracture mode, and have excellent heat cycle resistance. The solder alloy has an alloy composition comprising, in mass%, 2.0-3.6% Ag, 0.6-0.9% Cu, 1.0-5.0% In, 3.0-5.0% Sb, 0.0010-0.0300% Fe, and 0.0010-0.0500% Co, with the remainder being Sn. Preferably, the alloy composition further contains, in mass%, at least one of Zr, Ge, Ga, P, As, Pb, Zn, Mg, Cr, Ti, Mo, Pt, Pd, Au, Al, and Si in a total amount of 0.100% or less.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
Provided are: a solder alloy having a low melting point, a high shear strength, and a suitable fracture mode; a solder paste; a solder ball; a solder preform; a solder joint; an on-vehicle electronic circuit; an ECU electronic circuit; an on-vehicle electronic circuit device; and an ECU electronic circuit device. This solder alloy has an alloy composition comprising, in terms of mass%, 2.0-3.6% Ag, 1.0-5.0% In, 3.0-5.0% Sb, 0.001-0.030% Fe, and 0.0000-0.0500% Co, inclusive, with the remainder being Sn. Preferably, this alloy composition also contains at least one element from among Zr, Ge, Ga, P, As, Pb, Zn, Mg, Cr, Ti, Mo, Pt, Pd, Au, Al, and Si at a total amount of 0.100% or less in terms of mass%.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
Provided are: a joining material capable of suppressing generation of voids in a solder joint part; a method for manufacturing the same; a solder joint; and a method for manufacturing the same. A joining material 1A has a base metal layer 2A and a coating layer 3A covering at least one surface (Sa1 or Sa2) of the base metal layer 2A. The base metal layer 2A contains a first metal containing Sn and a second metal comprising an alloy containing Ni and Fe, and the coating layer contains a metal having a melting point lower than that of the second metal. The ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 or more as the ratio represented by the base metal layer/coating layer.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
B22F 3/18 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet en utilisant des rouleaux presseurs
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
Nonferrous metals and their alloys; copper and its alloys; lead and its alloys; tin and its alloys; solders; solder alloys; silver solder; gold solder; lead-free solder; solder in the form of ball; solder in the form of rod; solder in the form of wire; resin core wire of nonferrous metals and their alloys; soldering wire of metal; solder in the form of paste; solder in the form of powder.
16.
SOLDER ALLOY, SOLDER BALL, SOLDER PASTE, AND SOLDERED JOINT
Provided are a solder alloy, a solder paste, a solder ball, and a soldered joint having excellent heat cycle resistance and drop impact resistance, and excelling in mounting properties by suppressing non-fusion, tombstoning, and discoloration. The solder alloy has an alloy composition comprising 0.8-2.5% Ag, 0.10-1.00% Cu, 0.03-0.07% Ni, 0.006-0.014% Ge, and 0.001-0.030% Co, with the remainder being Sn. Preferably, the alloy composition further contains, in terms of mass%, at least one of Ga, As, Pd, Mn, In, Zn, Zr, and Mg at an amount of 0.1% or less in total.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
A jet solder device includes a storage tank 110 for storing molten solder S, supply parts 120, 130 for supplying molten solder S, and a guide member 150 for guiding the molten solder S supplied from the supply parts 120, 130 to the molten solder S in the storage tank 110. The guide member 150 is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder S.
This jet soldering apparatus includes a storage tank 110 for storing molten solder S, and a supply section 125 having a plurality of nozzles 127 for supplying the molten solder S. The height of the nozzles 127 is between 3 mm and 10 mm, inclusive.
A conveying claw 600 is used to convey a substrate to which solder is supplied. The conveying claw 600 comprises: a claw body 620 made of resin material and having a claw portion 610 for holding the substrate; and a coating film 630 coating at least the claw portion 610.
To provide a sliding member and a bearing whose seizure resistance and abrasion resistance are increased without using zinc compounds, and to provide a method for preventing a sliding member made of a resin composition from being seized by friction. A sliding member made of a resin composition, wherein the resin composition consists of, relative to 100 vol % of the resin composition: 1 vol % to 10 vol % of ferric oxide; 2.5 vol % to 15 vol % of barium sulfate; 1 vol % to 20 vol % of at least one optional constituent selected from the group consisting of aramid, polyimide, ultra-high-molecular-weight polyethylene, molybdenum disulfide, graphite, carbon fiber, and polyether ether ketone (PEEK) resin; and the balance being fluororesin, and wherein the total amount of constituents other than the fluororesin is 45 vol % or less; and a bearing including a metallic substrate, and a sliding layer made of the resin composition on the metallic substrate; and a method for preventing a sliding member made of a resin composition from being seized by friction including forming the sliding member with a resin composition containing 1 vol % to 10 vol % of ferric oxide, 2.5 vol % to 15 vol % of barium sulfate, and 55 vol % or more of fluororesin.
Provided is a preform solder capable of enhancing thermal conductivity of a solder connection part, a method for manufacturing the same, and a method for manufacturing a solder joint. The present invention uses a preform solder that contains: a first metal including Sn; a second metal comprising an alloy including Ni and Fe; and a third metal having an entire surface formed from a metal including Ni. Alternatively, the present invention uses a preform solder 1 that has a metal structure comprising a first phase (10) which is a continuous phase, a second phase (20) which is dispersed in the first phase (10), and a third phase (30) which is dispersed in the first phase. The first phase (10) includes Sn; the second phase (20) comprises an alloy including Ni and Fe; and the entire surface of the third phase (30) is configured from a metal formed from a metal including Ni.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa·s or more at 30° C. or is a solid at 30° C., has a boiling point of 200° C. or more, and has a weight loss rate of less than 96 mass % when heated to 230° C. The thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. The content of the first solvent is 30 mass % or more with respect to the total mass of flux. The content of the polyamide exceeds 2 mass % with respect to the total mass of flux.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.
A solder paste containing a first metal powder, a second metal powder, and a flux is employed. The first metal powder contains Sn. A second metal powder 20A has a core portion 201 formed of an alloy containing Ni and Fe, and a surface layer 202 that covers the core portion 201 and is formed of a metal containing Ni. An Ni content in the metal forming the surface layer 202 of the second metal powder 20A is 50% by mass or more relative to a total mass of the metal forming the surface layer 202 of the second metal powder 20A. The surface layer 202 of the second metal powder 20A has a thickness of 0.05 μm or more and 0.30 μm or less.
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
A method for soldering includes applying a first solder alloy having a melting point in a temperature range higher than 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range higher than 210° C., and applying a second solder alloy having the melting point in a temperature range from than 160° C. to 210° C. to a joint portion of a second electronic component and the substrate to which the first electronic component is joined, and heating them in the temperature range from 160° C. to 210° C., wherein the second solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.
Provided are a solder alloy and a solder joint formed from the soldier alloy. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.7%, Cu: 0.4 to 0.8%, Sb: 0.50 to 2.90%, In: 5.00 to 10.00%, and Ni: 0.01 to 0.06%, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
The present invention uses a flux containing a rosin component, an activator, and water. The activator includes an imidazole compound, and the water content is at least 40 mass% with respect to the total mass of the flux. The molar ratio of the imidazole compound to the rosin component is at least 1.3, as represented by the ratio of imidazole compound/rosin component.
Provided are a solder, a solder alloy, a solder ball, a solder paste, and a solder joint, which have a low melting point, high hardness in a high-temperature environment, heat cycle resistance, and electromigration resistance. The solder alloy has an alloy composition that includes, by mass %, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: more than 0% and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
29.
SLIDING MEMBER AND METHOD FOR PRODUCING SLIDING MEMBER
This sliding member comprises: a cylindrical metal base material; a porous layer formed on the inner circumferential surface of the metal base material; and a sliding layer covering the porous layer. The porous layer is formed of a metal element or an alloy composition. The sliding layer is formed of a resin composition. The sliding member has, on a portion of the inner circumferential surface thereof, a region in which the resin composition is not present and a non-porous layer formed of a metal element or an alloy composition is exposed.
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/362 - Emploi de compositions spécifiées de flux
Provided are a solder alloy, a solder ball, a solder preform, a solder paste, and a solder joint which have excellent wettability and high reliability by prevention of rupture of solder joints. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.8%, Cu: 0.4 to 0.8%, Sb: 0.03 to 2.90%, In: 1.1 to 4.2%, Ni: 0.01 to 0.14%, Bi: 0.1 to 5.0%, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
A flux according to the present invention is characterized by containing rosin, a polymer having a repeating unit represented by general formula (p1), a solvent, a thixotropic agent comprising a polyamide, a specific dicarboxylic acid, and a compound having a specific benzotriazole skeleton. In general formula (p1), R1is a methyl group or a hydrogen atom. R2 is a hydrocarbon group having 1-2 carbon atoms or a hydrogen atom. According to the flux, a solder alloy powder has high cohesiveness during reflow, the blackening of flux residue is suppressed, and precipitation over time is less likely to occur, thereby achieving good stability over time.
A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, at least one of Fe and Co in a total amount of 0.003-0.1 mass %, and a remainder of Sn.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
Provided are a solder alloy, a solder ball, a solder preform, a solder joint, and a circuit that are excellent in wettability and shear strength, exhibit a suitable fracture mode, suppress the growth of an intermetallic compound at a joint interface even after a plurality of times of reflow while having excellent drop impact resistance, and furthermore, have a suitable bump shape. The solder alloy has an alloy composition comprising, in terms of mass%, 0.10-3.00% of Ag, 0.80-6.00% of Cu, 0.08-0.60% of Ni, and 0.0010-0.0150% of Ge, with the remainder being Sn. The alloy composition preferably further contains at least one type of element selected from Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and a rare earth element at a total amount of 0.1% or less.
A flux contains: a triol solvent (S1); a monoamide-based thixotropic agent; and at least one solvent (S2) selected from the group consisting of a monohydric solvent and a dihydric solvent, wherein the content of the monoamide-based thixotropic agent is 0.5% by mass or more and less than 15% by mass with respect to the total mass of the flux, and the content of the solvent (S2) is 50% by mass or more with respect to the total mass of the flux.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 1/20 - Traitement préalable des pièces ou des surfaces destinées à être brasées, p. ex. en vue d'un revêtement galvanique
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/362 - Emploi de compositions spécifiées de flux
A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 101/36 - Dispositifs électriques ou électroniques
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
A sliding member comprises a metal substrate, a porous layer formed on one surface of the metal substrate, and a sliding layer covering the porous layer. The sliding layer is formed of a resin composition, and the porous layer has a matrix phase comprising Cu and Sn, and hard particles dispersed in the matrix phase and comprising a Laves phase constituted of a composition of Co, Mo and Si.
A flux containing a rosin (P), a compound (SA), an activator (provided that a compound corresponding to the compound (SA) is excluded), and a solvent (provided that a compound corresponding to the compound (SA) is excluded) is adopted. The compound (SA) is a compound represented by General Formula (sa). In Formula (sa), R11 represents a hydrocarbon group which may have a hydroxy group; R12 and R13 each independently represent a hydrocarbon group having 5 or less carbon atoms, which may have a substituent, a hydroxy group, or a hydrogen atom; and m represents a positive integer.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.
F16C 33/12 - Composition structuraleEmploi de matériaux spécifiés ou de traitement particulier des surfaces, p. ex. contre la rouille
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 7/04 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de couches successives avec une ou plusieurs couches non réalisées à partir de poudre, p. ex. à partir de tôles
A source liquid for a foam fire-extinguishing agent containing 14 mass% or more of an anionic surfactant, 0.2-10 mass% of an amphoteric surfactant, 1.0 mass% or more of a non-ionic surfactant having an HLB of 15 or higher, and a solvent, the source liquid for a foam fire-extinguishing agent not containing any fluorine-based surfactants.
A62D 1/02 - Compositions pour éteindre les incendiesEmploi de produits chimiques pour éteindre les incendies contenant ou produisant une phase gazeuse, p. ex. de la mousse
A foam extinguishing agent raw liquid comprises 14 mass % or more of an anionic surfactant, 0.2 mass % or more and 10 mass % or less of an amphoteric surfactant, 1.0 mass % or more of a nonionic surfactant having HLB of 15 or more, and a solvent. The foam extinguishing agent does not contain a fluorine-based surfactant.
A62D 1/00 - Compositions pour éteindre les incendiesEmploi de produits chimiques pour éteindre les incendies
A62D 1/02 - Compositions pour éteindre les incendiesEmploi de produits chimiques pour éteindre les incendies contenant ou produisant une phase gazeuse, p. ex. de la mousse
43.
SOLDER ALLOY, SOLDER BALL, SOLDER PASTE, AND SOLDER JOINT
Provided are a solder alloy, a solder ball, a solder paste, and a solder joint, which have excellent thermal conductivity, fall impact resistance, and heat cycle resistance. This solder alloy has an alloy composition containing, in mass%, 1.0-4.0% of Ag, 0.10-1.00% of Cu, 1.0-7.0% of Sb, 0.001-0.030% of Co, and 0.005-0.050% of Fe, the remaining portion being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
This sliding member comprises a tubular metal base material, a seamless porous layer which is formed on the inner circumferential surface of the metal base material, and a sliding layer which covers the porous layer, wherein the porous layer is formed of a metal alone or an alloy composition, and the sliding layer is formed of a resin composition.
C08K 3/30 - Composés contenant du soufre, du sélénium ou du tellure
C08L 27/12 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un halogèneCompositions contenant des dérivés de tels polymères non modifiées par un post-traitement chimique contenant du fluor
C08L 77/10 - Polyamides dérivés de groupes amino et carboxyle liés aromatiquement soit d'acides aminocarboxyliques, soit de polyamines et d'acides polycarboxyliques
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C22C 1/08 - Alliages poreux avec pores ouverts ou fermés
Nonferrous metals and their alloys; copper and its alloys;
lead and its alloys; tin and its alloys; solders; solder
alloys; silver solder; gold solder; lead-free solder; solder
in the form of ball; solder in the form of rod; solder in
the form of bar; solder with grease; soldering wire of
metal; solder in the form of paste; solder in the form of
powder.
Nonferrous metals and their alloys; copper and its alloys;
lead and its alloys; tin and its alloys; solders; solder
alloys; silver solder; gold solder; lead-free solder; solder
in the form of ball; solder in the form of rod; solder in
the form of bar; solder with grease; soldering wire of
metal; solder in the form of paste; solder in the form of
powder.
A flux and a solder paste capable of minimizing the time-dependent changes in viscosity when stored at 30° C. and minimizing the coloration of flux residues while having favorable reflow properties and favorable cleanability of flux residues are provided. As such a flux, a flux containing a rosin, a thixotropic agent, an activator, and a solvent is adopted. The rosin includes one or more selected from the group consisting of an acid-modified rosin, a hydrogenated rosin, and an acid-modified hydrogenated rosin, and the thixotropic agent includes a compound represented by General Formula (1). In General Formula (1), R11 and R12 each independently represent a hydrocarbon group which has 1 to 3 carbon atoms and may have a substituent, or a single bond. R21 and R22 each independently represent a hydrocarbon group which has 7 to 29 carbon atoms and may have a substituent. R13 represents a substituent. n represents an integer of 0 to 4.
A flux and a solder paste capable of minimizing the time-dependent changes in viscosity when stored at 30° C. and minimizing the coloration of flux residues while having favorable reflow properties and favorable cleanability of flux residues are provided. As such a flux, a flux containing a rosin, a thixotropic agent, an activator, and a solvent is adopted. The rosin includes one or more selected from the group consisting of an acid-modified rosin, a hydrogenated rosin, and an acid-modified hydrogenated rosin, and the thixotropic agent includes a compound represented by General Formula (1). In General Formula (1), R11 and R12 each independently represent a hydrocarbon group which has 1 to 3 carbon atoms and may have a substituent, or a single bond. R21 and R22 each independently represent a hydrocarbon group which has 7 to 29 carbon atoms and may have a substituent. R13 represents a substituent. n represents an integer of 0 to 4.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
This flux contains a chelating agent and an organic acid. The chelating agent contains a compound (C) having a five-member ring structure comprising nitrogen atoms, sulfur atoms, and carbon atoms. The organic acid includes an organic sulfonic acid.
Provided herein is a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
The present invention provides a sliding member and a bearing where seizing resistance and wear resistance are improved without using a zinc compound. The present invention also provides a method for preventing seizing due to friction of a sliding member formed using a resin composition. The sliding member is formed using a resin composition, wherein: 100 vol% of the resin composition includes 1-10 vol% of ferric oxide, 2.5-15 vol% of barium sulfate, and 1-20 vol% of at least one type of optional component selected from the group consisting of aramid, polyimide, ultrahigh molecular weight polyethylene, molybdenum disulfide, graphite, carbon fiber, and polyether ether ketone (PEEK) resin, the remainder being a fluororesin; and the total addition amount other than the fluororesin is 45 vol% or less. The bearing comprises a metal base material and a sliding layer, which is formed using the abovementioned resin composition, on the metal base material. The method prevents seizing due to friction of the sliding member formed using the resin composition and includes forming the sliding member by using a resin composition comprising 1-10 vol% of ferric oxide, 2.5-15 vol% of barium sulfate, and 55 vol% or more of fluororesin.
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
This solder process apparatus comprises a storage tank 110 that contains molten solder, and an extension unit 210 of which at least a part extends in the molten solder in the storage tank 110, and that reciprocally moves in the horizontal direction in the molten solder S while moving up and down each at least once when moving from one side to the other in the horizontal direction.
A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
Nonferrous metals and their alloys; copper and its alloys;
lead and its alloys; tin and its alloys; solders; solder
alloys; silver solder; gold solder; lead-free solder; solder
in the form of ball; solder in the form of rod; solder in
the form of bar; solder with grease; soldering wire of
metal; solder in the form of paste; solder in the form of
powder.
Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder.
Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder.
59.
Layered bonding material, semiconductor package, and power module
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
Produits et services
Shafts for machines; bearings for machines; shaft couplings
or connectors for machines; valves for machines. Shafts for land vehicles; bearings for land vehicles; shaft
couplings or connectors for land vehicles; brake valves for
land vehicles; shafts for automobiles or motorcycles;
bearings for automobiles or motorcycles; shaft couplings or
connectors for automobiles or motorcycles; brake valves for
automobiles or motorcycles.
Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder.
62.
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELECTRODE
A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.
Provided is a flux which is suitable for use in mounting indium sheets, has high wetting properties even in relatively low-temperature bonding, and is more inhibited from forming voids. The flux comprises a rosin, one or more organic acids, and a solvent (S). The organic acids include a monocarboxylic acid (A1) having a melting point of 35-90°C, and the solvent (S) comprises a solvent (S1) having a boiling point of 100°C or lower.
Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an organic acid (A), and a solvent (S). The organic acid (A) includes a dimer acid (A1) that demonstrates a weight reduction rate of not more than 1 mass% in a thermogravimetric analysis in which the dimer acid is heated up to 260°C at a temperature rising rate of 10°C/min. The solvent (S) includes a solvent (S1) that demonstrates the weight reduction rate of at least 99 mass% in a thermogravimetric analysis in which the solvent (S1) is heated up to 150°C at a temperature rising rate of 6°C/min.
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
Produits et services
Shafts for machines; bearings for machines; shaft couplings for machines; shaft connectors for machines; valves for machines. Shafts for land vehicles; bearings for land vehicles; shaft couplings for land vehicles; shaft connectors for land vehicles; brake valves for land vehicles; shafts for automobiles and motorcycles; bearings for automobiles; bearings for motorcycles; shaft couplings for automobiles and motorcycles; shaft connectors for automobiles and motorcycles; brake valves for automobiles and motorcycles
Provided are a solder alloy, a solder paste, and a solder joint, which exhibit a suitable melting temperature, are excellent in terms of wettability, have high tensile strength and shear strength, and have excellent drop impact resistance. The solder alloy has the following alloy composition. The alloy composition comprises 0.1-3.9 mass% of Ag, 0.1-1.0 mass% of Cu, 0.6-1.4 mass% of Bi, 5.1-7.9 mass% of Sb, 0.01-0.30 mass% of Ni, and 0.001-0.100 mass% of Co, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
67.
Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing method
A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.
F16C 33/12 - Composition structuraleEmploi de matériaux spécifiés ou de traitement particulier des surfaces, p. ex. contre la rouille
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 7/04 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de couches successives avec une ou plusieurs couches non réalisées à partir de poudre, p. ex. à partir de tôles
68.
Soldering Apparatus And Method Of Detecting Failures Of Gasket
Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
G01M 3/30 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par mesure du taux de perte ou de gain d'un fluide, p. ex. avec des dispositifs réagissant à la pression, avec des indicateurs de débit pour tuyaux, câbles ou tubesExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par mesure du taux de perte ou de gain d'un fluide, p. ex. avec des dispositifs réagissant à la pression, avec des indicateurs de débit pour raccords ou joints d'étanchéité de tuyauxExamen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par mesure du taux de perte ou de gain d'un fluide, p. ex. avec des dispositifs réagissant à la pression, avec des indicateurs de débit pour soupapes en utilisant le déplacement progressif d'un fluide chassé par un autre
A metal according to the present invention comprises gallium and bismuth, and may be a liquid metal or comprise a liquid metal and a solid metal at 35°C. The metal may comprise 0.01-30 mass% bismuth. The metal may also comprise one or more elements among indium, tin, zinc, and silver.
C22C 28/00 - Alliages à base d'un métal non mentionné dans les groupes
C22C 30/00 - Alliages contenant moins de 50% en poids de chaque constituant
C22C 30/02 - Alliages contenant moins de 50% en poids de chaque constituant contenant du cuivre
C22C 30/04 - Alliages contenant moins de 50% en poids de chaque constituant contenant de l'étain ou du plomb
C22C 30/06 - Alliages contenant moins de 50% en poids de chaque constituant contenant du zinc
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
C22F 1/16 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des autres métaux ou de leurs alliages
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
70.
Flux for resin-cored solder, resin-cored solder, and soldering method
Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 1/20 - Traitement préalable des pièces ou des surfaces destinées à être brasées, p. ex. en vue d'un revêtement galvanique
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
71.
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
This flux contains a first solvent and a thixotropic agent. The first solvent either has a viscosity of 10 Pa•s or more at 30°C or is a solid at 30°C, has a boiling point of 200°C or more, and has a weight loss rate of less than 96 mass% when heated to 230°C. The thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. The content of the first solvent is 30 mass% or more with respect to the total mass of flux. The content of the polyamide exceeds 2 mass% with respect to the total mass of flux.
Provided are a solder, a solder alloy, a solder ball, a solder paste, and a solder joint, which have a low melting point, high hardness in a high-temperature environment, heat cycle resistance, and electromigration resistance. The solder alloy has an alloy composition that includes by mass %, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: more than 0% and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, with the balance being Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
A flux according to the present invention contains a rosin, a solvent, a thixo agent, a thiol compound, and an activator, and is characterized in that the thiol compound includes a compound (Tp) having a benzenethiol backbone in which at least one hydrogen atom on a benzene ring is substituted with a mercapto group (-SH). As the compound (Tp), at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol, and benzenethiol is preferable. By using the flux, it is possible to further suppress temporal viscosity change in a solder paste.
Flux according to the present invention is characterized by containing rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), the amine hydriodide including a complex alicyclic amine hydriodide. The complex alicyclic amine hydriodide is preferably at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide. Employing such flux makes it possible to further suppress the generation of voids during soldering.
A laminated bonding material 10 comprises a substrate 11, a first solder part 12a that is laminated on a first surface of the substrate 11, and a second solder part 12b that is laminated on a second surface of the substrate 11, wherein: the substrate 11 has a linear expansion coefficient of 7.0-9.9 ppm/K; the first solder part 12a and the second solder part 12b are each made of lead-free solder; the lead-free solder has a Young's modulus of not less than 45 GPa and a tensile strength of not more than 100 MPa; and the thickness of the first solder part 12a differs from the thickness of the second solder part 12b.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
C22C 27/04 - Alliages à base de tungstène ou de molybdène
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
A jet flow soldering device 100 comprises: a retention tank 110 that retains molten solder; supply ports 125, 135 for supplying the molten solder to a substrate 200; and cooling units 310, 330 that are located on the downstream side of the supply ports 125, 135 in the conveying direction of the substrate 200, that are provided at positions above the storage tank 110, and that supply a gas.
A solder removal mechanism 520 is provided to remove solder from a transport claw 510 for transporting a substrate 200 to which solder is supplied. The solder removal mechanism includes an abutment body 530 that can be passed relatively in a recess portion 511 of the transport claw 510 or under the transport claw 510.
The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
A jet soldering apparatus has a first housing; a first supply port provided on the first housing and configured to provide molten solder; a second housing; and a second supply port provided on the second housing and configured to provide the molten solder. The molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed. The mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.
A brazing paste contain a brazing material in an amount of 80% by mass or more and 95% by mass or less; and a binder in an amount of 5% by mass or more and 20% by mass or less. The brazing material contains a flux in an amount of 2% by mass or more and 5% by mass or less. The binder contains a solid solvent containing two or more hydroxyl groups and having 8 to 10 carbon atoms, and a liquid solvent. When the binder does not contain a thixotropic agent, the liquid solvent is contained in an amount of 68% by mass or more with respect to a total of the binder, and when the binder contains a thixotropic agent, the thixotropic agent is contained in an amount of 11% by mass or less with respect to a total of the binder.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A brazing paste contain 80% by mass or more and 95% by mass or less of a brazing material; and 5% by mass or more and 20% by mass or less of a binder. The binder contains a solid solvent containing two or more hydroxyl groups and having 5 to 7 carbon atoms, and a liquid solvent.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.
Provided is a soldering device in which gas is drawn through suction ports in a first plate more uniformly than in a conventional device. A soldering device according to the present disclosure is a soldering device for performing soldering and includes a blower unit for supplying gas to an object. The blower unit includes: a first plate in which a plurality of suction ports for drawing of the gas outside the blower unit are formed; a second plate that has a plate surface facing the plurality of suction ports; a plurality of nozzles; and a fan for supplying the gas drawn through the plurality of suction ports to the plurality of nozzles. A flow path through which the gas flows and which extends from the plurality of suction ports to go through a heater and the fan and to reach the plurality of nozzles is formed in the blower unit. A part of the flow path surrounds at least a part of the second plate in directions in which the plate surface extends.
The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50° C. to 190° C. to the total endothermic amount within the range of from 50° C. to 200° C. is 90% or more.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
0c represents a single bond or an alkylene group having 2-6 carbon atoms. n represents 1 or 2. When n represents 1, m represents an integer of 1-3. When n represents 2, m represents 1.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portion from the through hole; a heating step that heats the thread solder piece with the cylindrical soldering iron and causes to melt the thread solder piece at the solder object portion; and a curing step that cures a melting object of the thread solder piece to solder the solder object portion. The thread solder piece is composed of a core containing a flux and a coating member containing a solder alloy that covers the core. The flux has a rosin having an acid value which is substantially as a main component thereof.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/362 - Emploi de compositions spécifiées de flux
A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of 1200 or less, in which the content of the low-molecular-weight nonionic surfactant is equal to or larger than the content of the organic sulfonic acid activator. This flux contains no cationic surfactant or contains more than 0 wt % and 5 wt % or less of the cationic surfactant. A solder paste containing this flux and a Sn-based solder metal.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
The present invention employs a flux containing a resin component, an activator, and a solvent. The resin component contains a copolymer (A) having an alkene-derived repeating unit (al), and an acrylic acid-derived repeating unit (a2) in which a hydrogen atom bonded to a carbon atom at an a-position may be substituted with a substituent, and contains a rosin (B). A mixing ratio of the copolymer (A) and the rosin (B) is 1 or more as a mass ratio represented by copolymer (A)/rosin (B).
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
The present invention provides a flux and a solder paste, which are capable of reducing cracking of a flux residue due to temperature change, while being capable of suppressing separation of a solder paste into a solder powder and a flux with time during storage, and which are also capable of suppressing a decrease in the soldering strength in cases where an underfill is used. The present invention employs a flux which contains a resin component, an activator and a solvent. The resin component contains: a copolymer (A) which has a repeating unit (a1) that is derived from an alkene and a repeating unit (a2) that is derived from an acrylic acid, wherein a hydrogen atom bonded to a carbon atom in the α-position may be substituted by a substituent; and a rosin (B). The mixing ratio of the copolymer (A) to the rosin (B) is 1 or more in terms of the mass ratio expressed by (copolymer (A))/(rosin (B)).
A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
91.
FLUX-COATED BALL AND METHOD FOR MANUFACTURING SAME
The present invention employs a flux-coated ball 100 having a core part 110 and a shell part 120 with which the core part 110 is coated. The flux-coated ball 100 is characterized in that the core part 110 is made of a solder ball or a copper core ball, that the shell part 120 is made of a flux layer containing at least one selected from the group consisting of an activator and a resin component, and that an oxide film thickness in the flux-coated ball 100 is 3 nm or less.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.
A sliding member according to the present invention is provided with a metal base material, a porous layer that is formed on one surface of the metal base material, and a sliding layer that covers the porous layer. The sliding layer is formed of a resin composition; and the porous layer has a matrix phase that contains Cu and Sn, and hard particles that are dispersed in the matrix phase and contain a Laves phase which is configured from a composition comprising Co, Mo and Si.
Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
The present invention employs flux containing rosin (P), a compound (SA), an activator (other than the compound (SA)), and a solvent (other than the compound (SA)). The compound (SA) is a compound represented by general formula (sa). In formula (sa), R11represents a hydrocarbon group that may have a hydroxy group. Each of R12and R13 is a hydroxy group, a hydrogen atom, or a hydrocarbon atom with a carbon number no greater than five and that may have a substituent. m represents a positive integer.
Provided are a lead-free and antimony-free solder alloy which has a medium-low melting point and ensures solderability even after being held at a high temperature for a long time, a solder ball, a ball grid array, and a solder joint. The lead-free and antimony-free solder alloy has an alloy composition consisting of 12 to 23% by mass of In, and 0.001 to 0.08% by mass of Ge, with the balance being Sn and unavoidable impurities. Preferably, the alloy composition has 16 to 21% by mass of In; the alloy composition has 0.005 to 0.01% by mass of Ge; the alloy composition has 0.005 to 0.009% by mass of Ge; U and Th as the unavoidable impurities are each included in an amount of 5 mass ppb or less; and As and Pb as the unavoidable impurities are each included in an amount of 5 mass ppm or less.
B23K 35/00 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
An objective of the present invention is to provide a flux that suppresses occurrence of flux drying up during soldering and occurrence of precipitation during storing.
An objective of the present invention is to provide a flux that suppresses occurrence of flux drying up during soldering and occurrence of precipitation during storing.
The flux comprising, based on the whole flux,
3.5 to 11% by mass of a rosin ester,
more than 0% by mass and 18% by mass or less of a rosin resin other than a rosin ester, and
70% by mass or more and less than 96.5% by mass of a solvent.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40°C or lower and a solvent having a boiling point of 240°C or lower.
The present invention employs a flux that contains rosin, a terpene phenol resin, and an activator. The terpene phenol resin has a hydroxyl value greater than 70 mgKOH/g. The activator contains an organic acid having a solubility parameter (SP value) equal to or greater than 11.00, or an organic acid expressed by general formula (1). In formula (1), R1represents an acyclic hydrocarbon group having 2-15 carbon atoms, an alicyclic hydrocarbon group having 3-15 carbon atoms, an aromatic group, or a carboxyl group, with the caveat that the acyclic hydrocarbon group and the alicyclic hydrocarbon group each contain a hydroxyl group or a carboxyl group. Formula (1): R1-COOH
The present invention employs a flux that contains rosin, a terpene phenol resin, and an activator. The terpene phenol resin has a hydroxyl value greater than 130 mgKOH/g. The activator contains a halogen salt of a primary amine.
