There is provided a method and apparatus for reducing latency for device-to-device communications in a wireless network, for example a cellular mesh (CeMe) network. In accordance with embodiments, there is provided a method for reducing latency for a D2D communication link in the wireless network. The method includes stopping, by a wireless device, data for cellular communications and transitioning, by the wireless device, to a cellular connected mode discontinuous reception (C-DRX) or a cellular idle mode. The method further includes performing, by the wireless device, D2D communication during an off time associated with the cellular C-DRX or the cellular idle mode.
There is provided a method and apparatus for determining frequency offset between a serving base station and a user equipment. The method includes determining a position and velocity vectors of the serving base station based at least in part on broadcast information from the serving base station. The method further includes performing measurements during one or more communication time gaps with a base station, the measurements at least in part based on one or more downlink broadcast signals. The method further includes determining an estimated position of the user equipment based at least in part on the measurements and determining a frequency off-set based on the position and velocity vectors of the serving base station and the estimated position of the user equipment.
This application relates to transimpedance amplifier circuits, which include a frontend amplifier that receives an input current and output a corresponding voltage, and a processing stage configured to process the voltage output from the frontend amplifier. The application relates to amplifier circuit in which the processing stage has a filter with a frequency response with a local minimum. The transimpedance amplifier circuit may be used to process a signal comprising data within a data frequency band and the filter may be configured such that the local minimum is within the data frequency band. The filter response at least partly compensates for a resonant peak in the frequency response from the frontend amplifier due to an expected resonance at the input to the frontend amplifier.
A chirp-based spread spectrum digital radio transmitter configured to suppress or attenuate discontinuities in the chirp frequency profile with an interpolation or smoothing procedure. The interpolation reduces significantly out-of-band emissions and does not affect the demodulation and decoding. In the case of a LoRa communication, the inventive transmitter has low constellation error and can communicate with legacy unmodified receivers. The process does not introduce unwanted phase shifts and can be used to control the signal's phase, also on continuous segments of the chirp to insert an arbitrary phase shift.
09 - Appareils et instruments scientifiques et électriques
38 - Services de télécommunications
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Integrated circuits; sim cards; transceivers; semiconductor; wide area network (wan) hardware; transmitters (telecommunications); electronic signal receivers; computer hardware and computer peripherals; computer hardware, namely, embedded wireless modules for mobile computing and remote connectivity, wireless network adapters, usb adapters, modems, network routers and gateways; computer hardware for wireless content delivery; computer hardware for creating, facilitating and managing remote access to and communication with local area networks (lans), virtual private networks (vpns), wide area networks (wans), software defined networks (sdns) and global computer networks; computer hardware development kit consisting of hardware development tools in the nature of software, antenna, sim card and circuit boards, software development tools and electronic publications, namely, downloadable educational materials related to computers, computer hardware and software, technical documentation and circuit diagrams for the development of wireless or telecommunications hardware; computer software for wireless telecommunications, namely, for setting up, provisioning, configuring, controlling, monitoring, diagnosing and managing wireless network devices; sim and device management software platform that enables, monitors, manages and upgrades devices and connectivity services; computer software for connecting, creating, facilitating and managing remote access to and communication with computers, mobile devices and smartphones, connected objects, systems and information sources, local area networks (lans), virtual private networks (vpns), wide area networks (wans), software-defined networks (sdns) and global computer networks; computer software for managing devices, firmware, embedded applications and airtime subscriptions over global networks; computer software that collects, stores, and processes data and events over a wireless communications network to provide operational visibility to remotely located devices; computer software platform for use in developing machine-to-machine (m2m) software solutions and the internet of things; software for providing machine-to-machine (m2m) and internet of things communication integration services, namely, the integration of disparate computer systems, networks, hardware and software Providing telecommunications connectivity and telecommunications services for machine-to-machine (m2m) and internet of things devices to communicate with each other and with servers over wireless networks; providing telecommunications connections to wireless networks by providing and managing wireless network connectivity Design and development of wireless networks, devices, hardware and software; engineering services in the field of wireless networks, devices, hardware and software, machine-to-machine (m2m) and internet of things; design and development of data intelligence software solutions for the purpose of data management, analysis, interpretation, identification and reporting to enable decision making and action taking for connected devices and internet of things systems; software as a service (saas) services featuring software that enables users to set up, monitor, and configure machine-to-machine (m2m) and internet of things systems and devices, firmware, embedded applications, and airtime manage subscriptions across global networks; software as a service (saas) services featuring computer software platform software that collects and transmits data from connected devices, objects, systems and information sources, and integrates data with enterprise, web and mobile application software
6.
SINGLE-INDUCTOR MULTIPLE-OUTPUT DC-DC CONVERTER AND METHOD OF OPERATING
A SIMO DC-DC converter having a modified buck topology in which multiple output are served from a single inductor. The serving order of the outputs is reversed when the inductor is discharged, such that the inductor current at the end of the serving of an output can be reset to the same value that it had at the beginning of the serving of the same output in the same cycle.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
An electronic component for adapting a pre-set matched impedance for an antenna. The electronic component comprises 1) a capacitance measurement circuit for measuring capacitance of a sensor, wherein the measured capacitance is indicative of a use case of the antenna, 2) a Radio Frequency (RF) switch configured for electrically connecting at least one selected impedance to an RF output, wherein the at least one selected impedance is an impedance in a group of impedances having at least two elements, wherein the RF switch is capable of providing an electrical connection between any impedance in the group of impedances and the RF output, and wherein the at least one selected impedance is configured for adapting the pre-set matched impedance, and 3) a digital processor having access to at least one threshold and the measured capacitance. The digital processor is configured (i) to compare the measured capacitance of the sensor provided by the capacitance measurement circuit to the at least one threshold, (ii) to determine, based on the comparison, which impedance in the group of impedances is the at least one selected impedance, and (iii) to instruct the RF switch to provide an electrical connection between the at least one selected impedance and the RF output. The invention also relates to a method for adapting a pre-set matched impedance for an antenna.
DC/DC converter operated in PFM mode, with an analogue timing circuit that generates the charging time and the discharging time based on the input voltage and the output voltage. The converter does not rely on a zero crossing detector and has a slow feedback loop that corrects either the charge time or the discharge time such that the residual current circulating in the inductor tends to zero at the end of the discharge phase. The inductor's current is sampled at the end of the discharge.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
The present invention relates to a capacitive sensor device comprising a capacitance-measuring circuit, a main sense input and a reference sense input, wherein the capacitive sensor device is configured to measure, using the capacitance-measuring circuit, a current main value of capacitance seen by the main sense input and a current reference value of capacitance seen by the reference sense input, wherein the capacitive sensor device is configured to at least temporarily store at least one previously measured reference value, and wherein the capacitive sensor device is configured to use 1) the current main value, 2) the current reference value and the at least one previously measured reference value, and 3) at least one current correction coefficient, with the capacitive sensor device being configured to adaptively determine the at least one current correction coefficient based on at least the current reference value and the at least one previously measured reference value, for determining a corrected current main value of capacitance. The present invention further relates to a portable electronic device comprising the capacitive sensor device.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
10.
TRANSIENT DIVERTING SUPPRESSOR WITH LOW DV/DT CURRENT
A voltage protection circuit, comprising a dV/dt triggered turn-on circuit configured to receive an input voltage and to turn on a switch when a change in voltage over time exceeds a predetermined level. A voltage limiting circuit coupled to the dv/dt triggered turn-on circuit and configured to limit a maximum voltage seen by the dV/dt triggered turn-on circuit. A current sharing circuit coupled to the dV/dt triggered turn-on circuit and configured to control a level of current through the dV/dt triggered turn-on circuit. A level shifting circuit coupled to the dV/dt triggered turn-on circuit and configured to shift a DC voltage level of the dV/dt triggered turn-on circuit.
H02H 3/44 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles aux taux de variation de quantités électriques
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
11.
SYSTEM AND METHOD OF PROTECTING HIGH VOLTAGE CIRCUITS FROM HIGH ENERGY ELECTRICAL OVERSTRESS EVENTS
A voltage protection circuit (500) is disclosed that includes a programmable reference voltage circuit (1) configured to receive an input voltage and to generate a reference voltage. An error amplifier stage (2) is coupled to the programmable reference voltage circuit (1). A voltage limiting circuit (3) is coupled to the programmable reference voltage circuit (1) and the error amplifier stage (2). A voltage clamping element (4) is coupled to the programmable reference voltage circuit (1), the error amplifier stage (2) and the voltage limiting circuit (3).
A voltage protection circuit, comprising a dV/dt triggered tum-on circuit configured to receive an input voltage and to turn on a switch when a change in voltage over time exceeds a predetermined level. A voltage limiting circuit coupled to the dv/dt triggered tum-on circuit and configured to limit a maximum voltage seen by the dV/dt triggered turn-on circuit. A current sharing circuit coupled to the dV/dt triggered turn-on circuit and configured to control a. level of current through the dV/dt triggered tum-on circuit. A level shifting circuit coupled to the dV/dt triggered tum-on circuit and configured to shift a DC voltage level of the dV/dt triggered tum-on circuit.
A voltage protection circuit is disclosed that includes a programmable reference voltage circuit configured to receive an input voltage and to generate a reference voltage. An error amplifier stage is coupled to the programmable reference voltage circuit. A voltage limiting circuit is coupled to the programmable reference voltage circuit and the error amplifier stage. A voltage clamping element is coupled to the programmable reference voltage circuit, the error amplifier stage and the voltage limiting circuit.
H02H 3/20 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un excès de tension
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
14.
AMBIENT INTERNET-OF-THINGS DEVICES AND METHODS OF OPERATION OF SAME
There are provided ambient internet of things (A-IoT) devices and methods of operation of same. Some embodiments relate to A-IoT device capabilities in relation to energy storage and energy harvesting. Some embodiments, relate to a harmonizing protocol for heterogenous A-IoT device types. Some embodiments, relate to uneven transmission power capabilities of A-IoT devices. Some embodiments relate to the control of carrier wave generation enabling transmission by some A-IoT device configurations. Some embodiments, relate to considering congestion control as it can relate to A-IoT devices.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
A method and system for secure boot key rotations with a secret hardware key is disclosed. To securely update and rotate the secure boot key, a new secure boot key is generated outside of a device. The new secure boot key is signed with the old secure boot key and sent to the device. The device verifies the new secure boot key with the old secure boot key that it already has in read/writable persistent memory. If the verification is successful, the old secure boot key is replaced with the new secure boot key.
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p. ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
A method and system for secure boot key rotations with a secret hardware key is disclosed. To securely update and rotate the secure boot key, a new secure boot key is generated outside of a device. The new secure boot key is signed with the old secure boot key and sent to the device. The device verifies the new secure boot key with the old secure boot key that it already has in read/writable persistent memory. If the verification is successful, the old secure boot key is replaced with the new secure boot key.
H04L 9/32 - Dispositions pour les communications secrètes ou protégéesProtocoles réseaux de sécurité comprenant des moyens pour vérifier l'identité ou l'autorisation d'un utilisateur du système
G06F 21/57 - Certification ou préservation de plates-formes informatiques fiables, p. ex. démarrages ou arrêts sécurisés, suivis de version, contrôles de logiciel système, mises à jour sécurisées ou évaluation de vulnérabilité
H04L 9/30 - Clé publique, c.-à-d. l'algorithme de chiffrement étant impossible à inverser par ordinateur et les clés de chiffrement des utilisateurs n'exigeant pas le secret
An extension of the LoRa™ modulation with an improved ranging mode. A master and a slave device exchange a request and a reply that contain sequences of chirps that are carefully aligned in time, frequency, and preferably also phase, such that the master device can ascertain the propagation delay to the slave by demodulating the reply. Request and reply include chirps having different slopes, preferably slopes of equal absolute value and opposite sign. The slope diversity permits an unbiased estimation of the Doppler shift.
G01S 13/84 - Systèmes utilisant la reradiation d'ondes radio, p. ex. du type radar secondaireSystèmes analogues dans lesquels des signaux de type continu sont transmis pour la détermination de distance par mesure de phase
18.
Protection Circuit with a FET Device Coupled from a Protected Bus to Ground
A semiconductor device includes a voltage input circuit node and a ground voltage node. A first transistor is coupled between the voltage input circuit node and the ground voltage node. A triggering circuit is coupled between the voltage input circuit node and the ground voltage node in parallel with the first transistor. The triggering circuit includes a trigger diode. An output of the triggering circuit is coupled to a control terminal of the first transistor. A load is powered by coupling the load between the voltage input circuit node and the ground voltage node.
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H10D 10/00 - Transistors bipolaires à jonction [BJT]
19.
DRIFT SUPPRESSION METHOD, PROXIMITY SENSOR AND WIRELESS DEVICE
A portable device including a capacitive proximity sensor can suppress a drift superimposed to the capacitive proximity signal and the corresponding method. A processor generates a baseline value by integrating a series of values that are derived from the slope of the proximity signal, when the slope is within stated limits, or a fixed value outside of the stated limits.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
09 - Appareils et instruments scientifiques et électriques
38 - Services de télécommunications
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Integrated circuits; SIM cards; transceivers;
semiconductors; wide area network (WAN) hardware;
transmitters (telecommunications); electronic signal
receivers; computer hardware and computer peripherals;
computer hardware, namely integrated wireless modules for
mobile computing and remote connectivity, wireless network
adapters, USB adapters, modems, network routers and
gateways; computer hardware for the provision of wireless
content; computer hardware for creating, facilitating and
managing remote access and communication with local area
networks (LANs), virtual private networks (VPNs), wide area
networks (WANs), software defined networks (SDNs) and global
computer networks; computer hardware development kit,
comprising hardware development tools in the nature of
software, antennas, SIM cards and printed circuits, software
development tools and electronic publications, namely
downloadable educational material on computers, computer
hardware and software, technical documentation and wiring
diagrams for developing wireless or wired telecommunication
hardware; computer software for wireless telecommunications,
namely for setting up, providing, configuring, controlling,
monitoring, diagnosing and managing wireless network
apparatus; SIM card management software platform and
apparatus for enabling, monitoring, managing and leveling
connectivity apparatus and services; computer software
enabling the connecting, creating, facilitating and managing
of remote access and communication with computers, mobile
apparatus and smartphones, connected objects, information
systems and sources, with local area networks (LANs),
virtual private networks (VPNs), wide area networks (WANs),
software defined networks (SDNs) and global computer
networks; computer software for managing apparatus,
firmware, integrated applications and airtime subscriptions
via global networks; computer software for collecting,
storing and processing data and events via a wireless
communication network in order to create operational
transparency for remote apparatus; software platform for use
in the development of machine-to-machine (M2M) software
solutions and the Internet of Things; software for providing
communication integration services for machine-to-machine
(M2M) and Internet of Things namely the integration of
different computer systems, networks, hardware and software. Providing connectivity and telecommunication services for
machine-to-machine (M2M) communication apparatus and the
Internet of Things, so that they can communicate with each
other and with servers via wireless networks; providing
telecommunication connections to wireless networks through
the provision and management of wireless network
connectivity. Designing and developing wireless networks, apparatus,
hardware and software; engineering services in the field of
wireless networks, apparatus, hardware and software,
machine-to-machine (M2M) communication and the Internet of
Things; designing and developing data intelligence software
solutions for the purpose of data management, analysis,
interpretation, identification and reporting in order to
enable decision-making and adoption of measures for
networked apparatus and Internet of Things systems; software
as a service (SaaS) services with software that enables
users to configure, monitor and configure machine-to-machine
(M2M) systems and the Internet of Things, and to manage
apparatus, firmware, integrated applications and airtime
subscriptions via global networks; software as a service
(SaaS) services with a software platform that collects and
transmits data from apparatus, objects, connected
information systems and sources and integrates the data with
enterprise software, web and mobile applications.
This application relates to data driver circuits, in particular to laser drivers. A driver is configured to receive an input signal and generate a corresponding driver output signal for driving an output device, such as a laser. A bias generator has a first output branch connected to an output node of the bias generator and a first control loop is configured to control a current in the first output branch to have a defined relationship to a bandgap referred current to provide a first bias current for biasing the output device. A driver output node is coupled to the driver and also to the output node of the bias generator, for outputting the driver output signal and the first bias current to the output device.
H03K 17/60 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors bipolaires
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H03K 17/06 - Modifications pour assurer un état complètement conducteur
H03K 19/00 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion
09 - Appareils et instruments scientifiques et électriques
38 - Services de télécommunications
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Circuits intégrés; cartes SIM; émetteurs-récepteurs; semi-conducteurs; matériel pour réseaux longue distance (WAN); émetteurs (télécommunications); récepteurs de signaux électroniques; matériel informatique et périphériques informatiques; matériel informatique, à savoir modules sans fil intégrés pour l'informatique mobile et la connectivité à distance, adaptateurs réseau sans fil, adaptateurs USB, modems, routeurs réseau et passerelles; matériel informatique pour la mise à disposition sans fil de contenus; matériel informatique pour la création, la facilitation et la gestion de l'accès à distance et de la communication avec les réseaux locaux (LAN), les réseaux privés virtuels (VPN), les réseaux étendus (WAN), les réseaux définis par logiciel (SDN) et les réseaux informatiques mondiaux; kit de développement de matériel informatique, comprenant des outils de développement matériel sous forme de logiciels, d'antenne, de carte SIM et de circuits imprimés, des outils de développement logiciel et des publications électroniques, à savoir du matériel pédagogique téléchargeable sur les ordinateurs, le matériel informatique et les logiciels, de la documentation technique et des schémas de câblage pour le développement de matériel de télécommunication sans fil ou filaire; logiciels informatiques pour les télécommunications sans fil, à savoir pour la mise en place, mise à disposition, configuration, contrôle, surveillance, diagnostic et gestion d'appareils de réseau sans fil; plate-forme logicielle de gestion de cartes SIM et d'appareils permettant, surveillant, gérant et mettant à niveau les appareils et les services de connectivité; logiciel informatique permettant de connecter, créer, faciliter et gérer l'accès à distance et la communication avec des ordinateurs, des appareils mobiles et des smartphones, des objets connectés, des systèmes et sources d'information, avec des réseaux locaux (LAN), des réseaux privés virtuels (VPN), des réseaux étendus (WAN), des réseaux définis par logiciel (SDN) et des réseaux informatiques mondiaux; logiciel informatique pour gérer des appareils, des micrologiciels, des applications intégrées et des abonnements à du temps d'antenne via des réseaux mondiaux; logiciel informatique qui collecte, stocke et traite des données et des événements via un réseau de communication sans fil afin de créer une transparence opérationnelle pour les appareils distants; plateforme logicielle à utiliser dans le développement de solutions logicielles machine-to-machine (M2M) et de l'Internet des objets; logiciel pour la fourniture de services d'intégration de communication machine-to-machine (M2M) et Internet des objets, à savoir l'intégration de différents systèmes informatiques, réseaux, matériels et logiciels. (1) Fourniture de connectivité et de services de télécommunication pour les appareils de communication machine-machine (M2M) et Internet des objets, afin qu'ils puissent communiquer entre eux et avec des serveurs via des réseaux sans fil; fourniture de connexions de télécommunication à des réseaux sans fil par la mise à disposition et la gestion de la connectivité des réseaux sans fil.
(2) Conception et développement de réseaux sans fil, d'appareils, de matériel et de logiciels; services d'ingénierie dans le domaine des réseaux sans fil, des appareils, du matériel et des logiciels, de la communication de machine à machine (M2M) et de l'Internet des objets; conception et développement de solutions logicielles d'intelligence des données à des fins de gestion, d'analyse, d'interprétation, d'identification et de reporting des données afin de permettre la prise de décision et l'adoption de mesures pour les appareils en réseau et les systèmes de l'Internet des objets; services de logiciel en tant que service (SaaS) avec des logiciels qui permettent aux utilisateurs de configurer, surveiller et configurer des systèmes de machine à machine (M2M) et de l'Internet des objets, et de gérer des appareils, des micrologiciels, applications intégrées et abonnements de temps d'antenne via des réseaux mondiaux; services software as a service (SaaS) avec logiciel de plateforme logicielle qui collecte et transmet les données des appareils, objets, systèmes et sources d'information connectés et intègre les données avec les logiciels d'entreprise, web et d'applications mobiles.
09 - Appareils et instruments scientifiques et électriques
38 - Services de télécommunications
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Integrated circuits; SIM cards; transceivers; semiconductors; wide area network (WAN) hardware; telecommunications transmitters; electronic signal receivers; computer hardware and computer peripherals; computer hardware, namely, integrated wireless modules for mobile computing and remote connectivity, wireless network adapters, USB adapters, modems, network routers and gateway routers; computer hardware for the provision of wireless content; computer hardware for creating, facilitating and managing remote access and communication with local area networks (LANs), virtual private networks (VPNs), wide area networks (WANs), software defined networks (SDNs) and global computer networks; computer hardware development kit comprising hardware development tools in the nature of recorded software featuring hardware development instructions, antennas, SIM cards and printed circuits; downloadable computer software development tools, recorded computer software development tools and electronic publications, namely, downloadable educational material on computers, computer hardware and software, and technical documentation and wiring diagrams for developing wireless or wired telecommunication hardware; downloadable and recorded computer software for wireless telecommunications, namely, for setting up, providing, configuring, controlling, monitoring, diagnosing and managing wireless networking apparatus; downloadable computer software platforms for managing SIM cards; computer hardware for enabling, monitoring, managing and leveling telecommunications connectivity apparatus and services; downloadable and recorded computer software for connecting, creating, facilitating and managing of remote access and communication with computers, mobile telecommunications apparatus, smartphones and information systems and with local area networks (LANs), virtual private networks (VPNs), wide area networks (WANs), software defined networks (SDNs) and global computer networks; downloadable and recorded computer software for managing telecommunications apparatus, computer firmware, integrated software applications and airtime subscriptions via global networks; downloadable and recorded computer software for collecting, storing and processing data and events data via a wireless communication network in order to create operational transparency for remote apparatus; recorded software platform for use in the development of machine-to-machine (M2M) software solutions and Internet of Things enabled communication devices; downloadable and recorded computer software for providing communication integration services for machine-to-machine (M2M) communication apparatus and Internet of Things enabled devices, namely for the integration of different computer systems, networks, hardware and software Providing telecommunication connectivity services for machine-to-machine (M2M) communication apparatus and Internet of Things enabled communication devices, so that they can communicate with each other and with servers via wireless networks; providing telecommunication connections to wireless networks through the provision and management of wireless network connectivity Designing and developing wireless computer networks, telecommunication apparatus, computer hardware and software; engineering services in the fields of wireless computer networks, telecommunications apparatus, computer hardware and software, machine-to-machine (M2M) communication and Internet of Things enabled communication devices; designing and developing data intelligence software for the purpose of data management, analysis, interpretation, identification and reporting in order to enable decision-making and adoption of measures for networked apparatus and Internet of Things systems; software as a service (SaaS) services featuring software that enables users to monitor and configure machine-to-machine (M2M) communication systems and Internet of Things enabled communication devices , and to manage telecommunication apparatus, computer firmware, integrated software applications and airtime subscriptions all via global networks; software as a service (SaaS) services featuring software that collects and transmits data from telecommunication apparatus, connected information systems and computer databases, and integrates the data with enterprise software, web applications and mobile applications
25.
Semiconductor Device and Method of Forming Substrate with 3-Sided Wettable Flank
A semiconductor device has a substrate and leads formed on two or more sides of the substrate. An electrical component is disposed over the substrate and electrically connected to the lead with bumps or bond wires. The electrical component is encapsulated. A portion of the substrate is removed to form a wettable flank on at least three sides of the lead. The substrate has a molding compound and the lead is disposed within or adjacent to the molding compound. A portion of the molding compound can remain at corners of the substrate. The lead has a first surface or recessed surface on a first side of the lead, a second surface or recessed surface on a second side of the lead, and a third surface or recessed surface on a third side of the lead. A portion of a surface of the lead is plated.
Environmental sensor circuit for a portable connected wireless device. The circuit includes a capacitive proximity sensor that determines when a user is close to the portable device. The device also has a magnetic field probe that provides a signal that indicates the position of a permanent magnet. The sensor circuit integrates both a digitizing unit and digital signal processing for the suppression of noise and drive in signals coming from the proximity sensor and from the magnetic field probe.
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
G01B 7/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
H03K 17/95 - Commutateurs de proximité utilisant un détecteur magnétique
This application relates to a travelling wave electro-optic modulator die comprising a signal carrying structure and a shielding structure. The signal carrying structure is configured to provide an electric field to modulate an optical path length of an optical waveguide. The shielding structure comprises a first shielding electrode and a second shielding electrode located on opposing sides of the signal carrying structure and at least one connecting portion electrically coupled to the first shielding electrode and the second shielding electrode.
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
28.
Systems and methods for fast burst data link acquisition
A system may include a recovery circuit that may: receive a first detect signal for a first burst signal and a second detect signal for a second burst signal in a burst mode data path; receive a reference pattern signal from a continuous mode data path; generate a first lock signal locked to the first burst signal or locked to the reference pattern signal, and a second lock signal locked to the second burst signal; and output the reference pattern signal from the recovery circuit during a guard period. The frequency of the recovery circuit may be locked to the frequency of the reference pattern signal during the guard period. The guard period may start based on when the first detect signal de-asserts or when the first lock signal de-asserts. During the guard period, the recovery circuit does not output the first burst signal or the second burst signal.
This application relates to transimpedance amplifiers (TIAs), in particular to TIAs with wideband feedback. The TIA has an input stage, for receiving an input current and outputting a corresponding output voltage, with a first transistor configured as an input transistor in a first circuit branch. A reference controller is configured to provide a reference voltage with a value equal to a DC value of the output voltage and a voltage regulator is configured to receive a supply voltage and generate a regulated voltage with a voltage offset to the reference voltage, such that the voltage offset does not substantially vary with variation in at least one of the supply voltage, temperature and process variations. The regulated voltage is supplied as a supply voltage to the input stage. The TIA also includes control circuitry for controlling an effective transconductance of the first transistor to a defined value.
There is provided a method and apparatus for managing device-to-device communications in a wireless network, for example a self-organizing network. The method includes collecting, by a wireless network controller, information regarding one or more key performance indicators (KPIs). The information relates to one or more of a 5 ranking of the one or more KPIs and a target value of the one or more KPIs. The method further includes determining, by the wireless network controller, an optimal configuration of the wireless network that best meets the collected information relating to the one or more KPIs. The method additionally includes assigning, by the wireless network controller, a role to each of one or more network devices associated with the 10 wireless network based on the optimal configuration of the wireless network. The role is selected from a gateway (GW), a mesh node, a cellular node and an end node (EN).
DC), wherein the control structure comprises a first control loop operatively coupled to the voltage regulator (7) and configured to control a voltage regulation operation of the voltage regulator (7), and a second control loop operatively coupled to the active rectifier (5) and configured to control a rectifier operation of the active rectifier (5), operates with a faster response time (more than two order of magnitude faster) than the second control loop, and wherein the first control loop is operably engaged with the second control loop.
The invention also relates to a wireless power receiver (10) and a method for operating the wireless power receiver (10).
H02J 50/12 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif du type couplage à résonance
This application describes apparatus and method for transimpedance gain control. A transimpedance amplifier circuit is described with a transimpedance amplifier having an input node for receiving an input current. A variable shunt resistance is connected to the input node and a controller is operable to controllably vary an open-loop transimpedance gain of the transimpedance amplifier and also the resistance of the variable shunt resistance so as to vary a closed-loop transimpedance gain of the transimpedance amplifier.
H03G 3/30 - Commande automatique dans des amplificateurs comportant des dispositifs semi-conducteurs
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
34.
Decision feedback equalizer with high input sensitivity and improved performance for signal processing
A decision feedback equalizer (DFE) may include a summer configured to receive a signal stream, and a plurality of feedback taps including a first feedback tap connected to the summer. The first feedback tap may include a pre-amplifier, a combined latch and a digital to analog converter (DAC). The pre-amplifier may be configured to be clocked by a first clock signal, wherein the pre-amplifier may be configured to receive an output signal of the summer and to receive a first postcursor generated by the DFE of a previous signal in the signal stream. The combined latch may be configured to be clocked by a first clock signal and a second clock signal. The DAC may be coupled to an output node of the combined latch. The first postcursor may be provided to the pre-amplifier without being provided to the summer.
There is provided a method and apparatus for reducing latency for device-to-device communications in a wireless network, for example a cellular mesh (CeMe) network. In accordance with embodiments, there is provided a method for reducing latency for a D2D communication link in the wireless network. The method includes stopping, by a wireless device, data for cellular communications and transitioning, by the wireless device, to a cellular connected mode discontinuous reception (C-DRX) or a cellular idle mode. The method further includes performing, by the wireless device, D2D communication during an off time associated with the cellular C-DRX or the cellular idle mode.
The invention relates to a single-inductor multiple-output (SIMO) DC-DC converter (1), comprising:
an electrical DC voltage source (Vs) switchable connected to an input node (ni) through an input switch (S1, S2);
a plurality of loads (Ro1, Ro2, RoN) each being switchable connected to an output node (no) through one output switch (So1, So2, SoN) of a plurality of output switches (So1, So2, SoN), wherein the electrical DC voltage source (Vs) and the loads (Ro1, Ro2, RoN) are external to the SIMO DC-DC converter (1);
an inductor (L) connected to the input node (ni) and the output node (no) and being configured to buffer energy;
a control structure arranged to operate in consecutive cycles and being configured to generate control signals for the input switch (S1, S2) and the output switches (So1, So2, SoN), wherein the inductor (L) being energized and de-energized in one cycle of operation (Tcycle) for supplying the plurality of loads (Ro1, Ro2, RoN) with a set of currents (Iact) within the said cycle of operation (Tcycle), wherein the control structure being configured to section the cycle of operation (Tcycle) into a plurality of consecutive time segments (tup, tdown) with a duration, wherein in one time segment (tup) the inductor (L) being energized, wherein the duration of the one time segment (tup) being determined by the control structure prior to a start of the cycle of operation (Tcycle), based on a sum of the set of currents (Iact) suppliable to the plurality of loads (Ro1, Ro2, RoN).
The invention relates to a single-inductor multiple-output (SIMO) DC-DC converter (1), comprising:
an electrical DC voltage source (Vs) switchable connected to an input node (ni) through an input switch (S1, S2);
a plurality of loads (Ro1, Ro2, RoN) each being switchable connected to an output node (no) through one output switch (So1, So2, SoN) of a plurality of output switches (So1, So2, SoN), wherein the electrical DC voltage source (Vs) and the loads (Ro1, Ro2, RoN) are external to the SIMO DC-DC converter (1);
an inductor (L) connected to the input node (ni) and the output node (no) and being configured to buffer energy;
a control structure arranged to operate in consecutive cycles and being configured to generate control signals for the input switch (S1, S2) and the output switches (So1, So2, SoN), wherein the inductor (L) being energized and de-energized in one cycle of operation (Tcycle) for supplying the plurality of loads (Ro1, Ro2, RoN) with a set of currents (Iact) within the said cycle of operation (Tcycle), wherein the control structure being configured to section the cycle of operation (Tcycle) into a plurality of consecutive time segments (tup, tdown) with a duration, wherein in one time segment (tup) the inductor (L) being energized, wherein the duration of the one time segment (tup) being determined by the control structure prior to a start of the cycle of operation (Tcycle), based on a sum of the set of currents (Iact) suppliable to the plurality of loads (Ro1, Ro2, RoN).
The invention also relates to a method for operating a SIMO DC-DC converter (1).
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
38.
Variable transimpedance amplifier for low power, high dynamic range, high data rate linear
A variable transimpedance amplifier may include first and second amplifiers. Each of the first and second amplifiers may include a transistor amplifier with a feedback resistor and a capacitor. The output node of the first amplifier may be an output node of the variable transimpedance amplifier. The output node of the second amplifier is not part of the output node of the variable transimpedance amplifier. The open loop gains of the transistor amplifiers may be variable, but the feedback resistor values can be fixed. The transimpedance may be determined by the feedback resistors and a scaling factor proportional to ratio of open loop gains. The transistor amplifiers may share an input transistor. The configuration can provide a high dynamic range of variable transimpedance that is stable over process and operating condition variations, minimize input capacitance loading and noise contribution to small input signals.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/08 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs commandés par la lumière
After transmitting first electrical signals to a receiver, a transmitter receives a burst absent mode signal from the receiver. While in a ready state, the transmitter receives a signal including a data burst, converts the signal to second electrical signals, including a settled DC offset, and transmits the second electrical signals to the receiver. The receiver transmits the burst absent mode signal to the transmitter after receiving the first electrical signals, detects a presence of the second electrical signals. In response to detecting the presence of the second electrical signals, the receiver removes the DC offset from the second electrical signals to generate output signals, and causes transmitting the output signals to a subsequent device. The receiver removes the DC offset by causing an instruction to discharge AC coupling capacitors. The burst absent mode signal is generated using a host reset instruction or an internally generated instruction.
G01S 5/02 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques
G01S 5/08 - Position d'un radiogoniomètre unique obtenue par détermination de la direction de plusieurs sources espacées d'emplacement connu
G01S 5/14 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques déterminant des distances absolues à partir de plusieurs points espacés d'emplacement connu
H04W 4/02 - Services utilisant des informations de localisation
41.
METHOD AND APPARATUS FOR DETERMINING FREQUENCY OFFSET BETWEEN A NON-TERRESTRIAL NETWORK BASE STATION AND A USER EQUIPMENT
There is provided a method and apparatus for determining frequency offset between a serving base station and a user equipment. The method includes determining a position and velocity vectors of the serving base station based at least in part on broadcast information from the serving base station. The method further includes performing measurements during one or more communication time gaps with a base station, the measurements at least in part based on one or more downlink broadcast signals. The method further includes determining an estimated position of the user equipment based at least in part on the measurements and determining a frequency off-set based on the position and velocity vectors of the serving base station and the estimated position of the user equipment.
G01S 5/00 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance
G01S 5/08 - Position d'un radiogoniomètre unique obtenue par détermination de la direction de plusieurs sources espacées d'emplacement connu
H04W 4/02 - Services utilisant des informations de localisation
H04W 64/00 - Localisation d'utilisateurs ou de terminaux pour la gestion du réseau, p. ex. gestion de la mobilité
G01S 5/02 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques
G01S 5/14 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques déterminant des distances absolues à partir de plusieurs points espacés d'emplacement connu
A signal driver may include a variable termination resistor and a signal transmission line. The variable termination resistor may include one or more variable termination resistor units. Each of the one or more variable termination resistor units may include a switch connected to a first end node of the variable termination resistor; a T-coil connected to the switch; a first resistor connected to the first end node of the variable termination resistor and to the T-coil; and a second resistor connected to a second end node of the variable termination resistor and to the T-coil. The signal transmission line may be connected to the second end node of the variable termination resistor.
A signal driver may include a plurality of distributed drivers along a differential transmission line. Each of the plurality of the distributed drivers may include: an output tap configured to receive a portion of an incoming signal of the signal driver; and a T-coil connected to an output node of the output tap. The differential transmission line is connected to and intercepted by a first terminal and a second terminal of the T-coil, and a plurality of T-coils of the plurality of the distributed drivers are distributed along and spaced apart on the differential transmission line.
A differential signal driver may include a driver circuit and a feedback loop. The driver circuit may include a first output node coupled to a first termination node for receiving a first termination bias voltage, a second output node coupled to a second termination node for receiving a second termination bias voltage, and a bias network connected to the second output node and to the second termination node. The feedback loop may include a first feedback resistor connected to the first output node at a first end of the first feedback resistor, a second feedback resistor connected to the second output node at a first end of the second feedback resistor, and a feedback amplifier configured to provide a feedback correction current from a common mode voltage to a node within the line from the first output node to the first termination node.
A packaged optical receiver, comprising: a photodiode configured to receive an optical signal; a transimpedance amplifier (TIA) coupled to the photodiode; and a signal pin; wherein the optical receiver is configured to receive, via the signal pin, a reset signal; and wherein the optical receiver is configured to output in response to the reset signal, via the signal pin, a received signal strength indication (RSSI) for the received optical signal.
A compound semiconductor integrated circuit is disclosed, which includes biasing circuitry for generating a bias voltage at a bias output node. The biasing circuitry comprises a first circuit branch configured to extend between a defined voltage and a supply voltage. The first circuit branch includes a first transistor configured as a current source to generate a defined current in the first circuit branch and a controllably variable resistance. The bias output node is coupled to the first circuit branch at a first node which is between the controllably variable resistance and the first transistor. The biasing circuitry is operable so that the resistance value of the controllably variable resistance varies with a control voltage so as to vary the value of the bias voltage.
G05F 3/24 - Régulation de la tension ou du courant là où la tension ou le courant sont continus utilisant des dispositifs non commandés à caractéristiques non linéaires consistant en des dispositifs à semi-conducteurs en utilisant des combinaisons diode-transistor dans lesquelles les transistors sont uniquement du type à effet de champ
G05F 3/20 - Régulation de la tension ou du courant là où la tension ou le courant sont continus utilisant des dispositifs non commandés à caractéristiques non linéaires consistant en des dispositifs à semi-conducteurs en utilisant des combinaisons diode-transistor
Amplifier circuitry is disclosed for receiving a differential signal and outputting a single-ended output signal. A travelling wave amplifier has a plurality of amplifier elements connected between an input transmission line and an output transmission line, each extending between first and second sides of the travelling wave amplifier. The input transmission line is configured to receive the first differential signal component at the first side and the output transmission line is configured to provide the single-ended output signal at the second side. A matched transmission line, which is configured to match at least some transmission properties of the input transmission line, receive the second differential signal component at the first end. A differential termination network is connected to both the input transmission line and matched and the matched transmission line and is configured to provide differential termination of signals received at the first and second termination inputs.
H03F 3/55 - Amplificateurs utilisant l'effet de temps de transit dans des tubes ou des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs
Amplifier circuitry is disclosed which has a travelling wave amplifier, with a plurality of amplifier elements connected between an input transmission line and an output transmission line, the transmission lines extending between first and second sides of the travelling wave amplifier. The input transmission line is configured to receive an input signal at the first side and the output transmission line is configured to output an output signal at the second side. The circuitry includes biasing circuitry for applying a DC bias to the output transmission line at at least one point upstream of a last amplifier element.
H03F 3/58 - Amplificateurs utilisant l'effet de temps de transit dans des tubes ou des dispositifs à semi-conducteurs utilisant des tubes à ondes progressives
A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
A capacitive proximity sensor with a stacked electrode structure where an inner electrode is partially screened by an upper one. The self-capacitances of selected electrodes is measured while other electrodes are held to ground or to a shield potential. In this manner, the proximity sensor estimates a value of the dielectric permittivity of the approaching body.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
G01B 7/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
52.
Transmitter, receiver, and method for chirp-modulated radio signals
A LoRa transmitter and corresponding receiver where the detection sequence in the preamble is phase-modulated and includes an information that encodes the position in the preamble, such as a countdown index. Nodes that wake up to receive a scheduled download can determine from this information how far the end of the detection sequence is and manage their energy consumption accordingly. The phase modulation is compatible with legacy devices.
A capacitive sensor device with a capacitance-measuring circuit, a main sense input and a reference sense input, wherein the capacitive sensor device is configured to measure, using the capacitance-measuring circuit, a current main value of capacitance seen by the main sense input and a current reference value of capacitance seen by the reference sense input, wherein the capacitive sensor device is configured to store one previously measured reference value, and wherein the capacitive sensor device is configured to use 1) the current main value, 2) the current reference value and the previously measured reference value, and 3) a current correction coefficient, the capacitive sensor device being configured to adaptively determine the current correction coefficient based on the current reference value and the previously measured reference value, for determining a corrected current main value of capacitance; the capacitive sensor device can be used in a portable electronic device.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
54.
Drift suppression method, proximity sensor and wireless device
A portable device including a capacitive proximity sensor can suppress a drift superimposed to the capacitive proximity signal and the corresponding method. A processor generates a baseline value by integrating a series of values that are derived from the slope of the proximity signal, when the slope is within stated limits, or a fixed value outside of the stated limits.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
55.
Method and apparatus for managing device to device communication
A methods and apparatuses for supporting device-to-device (D2D) communication in a wireless network is provided. According to embodiments, during a period where a D2D device 1 (D1) and a D2D device 2 (D2) are available for active D2D communications therebetween and when D2 identifies a need for a second communication with at least one of a base station or a different D2D device, the method includes transmitting, by D2, a D2D communication not available message (DNAM) to D1. The DNAM indicates that one or both of D1 and D2 are unavailable for active D2D communications therebetween. Upon receipt of the DNAM by D1, the method further includes transitioning, by D1, to a listening mode for receiving at least a D2D communication available message (DAM) from D2. The DAM indicates that D1 and D2 are available for active D2D communications therebetween.
A capacitive sensor with a plurality of sense inputs connectable to capacitive sense electrodes and a common reference input, each sense input and the reference input can be put in a measure state, in a ground state, or in a shield state. The sensor can be equipped with external reference capacitors between each of the sense input and the common reference terminal. The reference capacitor can be read individually by selectively pulling one of the input terminals to ground and driving the other to be equipotential with the reference input.
A method of characterizing a LoRa modulated signal or any such signals with a plurality of chirps as symbols. It foresees sampling and storing the signal, determining a phase of at least one chirp in the signal, and determining a timing error and/or a frequency error based on the phase, The timing error is extracted by the height of a discontinuous step in the phase at the position of the cyclical shift, while the frequency error is obtained by the slope of the phase. The method can be applied to a dedicated receiver for the characterization of LoRa transmitters.
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. An insulating material is disposed over the first surface of the semiconductor wafer and into the trench. A conductive layer is formed over the contact pads. The conductive layer can be printed to extend over the insulating material in the trench between adjacent contact pads. A portion of the semiconductor wafer opposite the first surface of the semiconductor wafer is removed to the insulating material in the trench. An insulating layer is formed over a second surface of the semiconductor wafer and side surfaces of the semiconductor wafer. The semiconductor wafer is singulated through the insulating material in the first trench to separate the semiconductor die.
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
This application relates to transimpedance amplifier (TIA) apparatus, in particular to a TIA apparatus suitable for receiving data using burst mode communication. The apparatus has a transimpedance amplifier configured to generate a first voltage based on a current at an input node for an input signal. A controlled voltage source, such as a dummy TIA, generates a second voltage based on a first control current. A controller is configured to collectively control the first control current and a second control current based on an indication of input signal magnitude. The first control current controls the second voltage which may be used as a slicing level. The second control current is subtracted from the current at the input node and can provide a DC restore current.
H03F 3/08 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs commandés par la lumière
H03G 3/30 - Commande automatique dans des amplificateurs comportant des dispositifs semi-conducteurs
A transimpedance amplifier (TIA) for converting an input current at an input node into an output voltage at an output node, the TIA comprising: a first amplifier stage having a first input coupled to the input node and a first output; a feedback path between the first output and the first input; a second amplifier stage in the feedback path having a second input, the second input coupled to the first output of the first amplifier stage; a feedback resistor in the feedback path coupled between an output of the second amplifier stage and first input of the first amplifier stage; and an output stage, comprising: a load resistor coupled between a reference voltage node and a T-coil, the T-coil comprising first and second inductors coupled in series at an inductor node, the T-coil coupled between the first output and the load resistor, the inductor node coupled to the output node of the TIA.
H03F 3/08 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs commandés par la lumière
A proximity sensor for a portable wireless connected device, the sensor being arranged to determine whether a part of a user's body is near the portable connected wireless device. The sensor generates a time-averaged proximity that is alerted when the device is brought near a part of a user's body for a given time and may be periodically reset momentarily during the periods of proximity. An integration time comparable with that used in SAR testing, enables the sensor to reduce the radio power emitted by a portable device when it is near the body. The integration time can be obtained by a sigma/delta modulator configured as rate-compression unit.
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
H04W 4/40 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p. ex. communication véhicule-piétons
62.
Semiconductor device and method of forming substrate with 3-sided wettable flank
A semiconductor device has a substrate and leads formed on two or more sides of the substrate. An electrical component is disposed over the substrate and electrically connected to the lead with bumps or bond wires. The electrical component is encapsulated. A portion of the substrate is removed to form a wettable flank on at least three sides of the lead. The substrate has a molding compound and the lead is disposed within or adjacent to the molding compound. A portion of the molding compound can remain at corners of the substrate. The lead has a first surface or recessed surface on a first side of the lead, a second surface or recessed surface on a second side of the lead, and a third surface or recessed surface on a third side of the lead. A portion of a surface of the lead is plated.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
The invention relates to a Global Navigation Satellite System (GNSS) receiver, comprising 1) a radiofrequency (RF) front-end configured to acquire GNSS signals emitted by a plurality of GNSS satellites in at least two snapshot time windows, wherein each emitted GNSS signal comprises a respective known spreading code identifying the emitting GNSS satellite, and wherein the RF front-end is configured to transform the acquired GNSS signals in each of the at least two snapshot time windows into a digital sequence, respectively, and 2) a receiver unit configured to determine for each snapshot time window pseudo-ranges from the GNSS receiver to at least a subset of the emitting GNSS satellites, respectively, wherein said at least two subsets corresponding to the at least two snapshot time windows may differ from one another, and wherein said pseudo-ranges are determined using (i) the known spreading codes and (ii) the at least two digital sequences. The GNSS receiver is configured to determine composite pseudo-ranges between the GNSS receiver and a composite subset of the emitting GNSS satellites at composite receive times, using at least the determined pseudo-ranges corresponding to the at least two snapshot time windows. The invention also relates to an assembly comprising a GNSS receiver, a gateway and a computing unit. The invention also relates to a method for determining a position of a GNSS receiver.
Environmental sensor circuit for a portable connected wireless device. The circuit includes a capacitive proximity sensor that determines when a user is close to the portable device. The device also has a magnetic field probe that provides a signal that indicates the position of a permanent magnet. The sensor circuit integrates both a digitizing unit and digital signal processing for the suppression of noise and drive in signals coming from the proximity sensor and from the magnetic field probe.
G01B 7/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
H03K 17/95 - Commutateurs de proximité utilisant un détecteur magnétique
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
The invention relates to an electronic component for adapting a pre-set matched impedance for an antenna. The electronic component comprises 1) a capacitance measurement circuit for measuring capacitance of a sensor, wherein the measured capacitance is indicative of a use case of the antenna, 2) a Radio Frequency (RF) switch configured for electrically connecting at least one selected impedance to an RF output, wherein the at least one selected impedance is an impedance in a group of impedances having at least two elements, wherein the RF switch is capable of providing an electrical connection between any impedance in the group of impedances and the RF output, and wherein the at least one selected impedance is configured for adapting the pre-set matched impedance, and 3) a digital processor having access to at least one threshold and the measured capacitance. The digital processor is configured (i) to compare the measured capacitance of the sensor provided by the capacitance measurement circuit to the at least one threshold, (ii) to determine, based on the comparison, which impedance in the group of impedances is the at least one selected impedance, and (iii) to instruct the RF switch to provide an electrical connection between the at least one selected impedance and the RF output. The invention also relates to a method for adapting a pre-set matched impedance for an antenna.
A radio transmitting device configured to transmit a spread-spectrum radio signal wherein a carrier frequency changes in a predetermined set of radio channels according to a hopping sequence, the radio signal being organized in packets having each a header transmitted at a first channel in the hopping sequence comprising a detection sequence, and payload data encoding a message transmitted at following channels in the hopping sequence.
H04B 1/7143 - Dispositions pour la production de séquences de sauts
H04B 1/7136 - Dispositions pour la production de sauts de fréquences, p. ex. utilisant une batterie de sources de fréquence, un accord continu ou une transformée
67.
METHOD AND APPARATUS FOR DEVICE TO DEVICE COMMUNICATION FOR CELLULAR DEVICES
There is provided a method and user equipment for a user equipment (UE) to perform device to device communication, for example sidelink communication. The method includes identifying, by a user equipment (UE), a time opportunity for the sidelink communication. The method further includes upon determination of a need for the sidelink communication, activating, by the UE, the sidelink communication during the time opportunity. In some embodiments, the method further includes the UE transmitting a sidelink availability message. In some embodiments, the time opportunity is at least in part dependent on the mode of operation of the UE.
A capacitive sensor with a plurality of sense inputs connectable to capacitive sense electrodes and a common reference input, each sense input and the reference input can be put in a measure state, in a ground state, or in a shield state. The sensor can be equipped with external reference capacitors between each of the sense input and the common reference terminal. The reference capacitor can be read individually by selectively pulling one of the input terminals to ground and driving the other to be equipotential with the reference input.
Methods and apparatuses related to a two-step RACH procedure are provided. Channel conditions can be estimated based on a UE PRACH transmission rather than the subsequent PUSCH transmission in the first part of the two-step RACH. A variable length gap can be provided between the PRACH preamble transmission and the PUSCH transmission. Other solutions are also provided.
There are provided methods for predicting timing advance (TA) with respect to a base station. According to some embodiments, the method includes determining, by a user equipment (UE), a set of TAs, each TA corresponding to a particular distance from the base station and measuring, by the UE, a set of instances of a power metric, each instance of the power metric associated with a respective distance from the base station. The method further includes determining, by the UE, a set of differences between each of the instances of the power metric and determining, by the UE, a new TA at least in part using the set of TAs and the set of differences.
A semiconductor device has a first semiconductor die including a first protection circuit. A second semiconductor die including a second protection circuit is disposed over the first semiconductor die. A portion of the first semiconductor die and second semiconductor die is removed to reduce die thickness. An interconnect structure is formed to commonly connect the first protection circuit and second protection circuit. A transient condition incident to the interconnect structure is collectively discharged through the first protection circuit and second protection circuit. Any number of semiconductor die with protection circuits can be stacked and interconnected via the interconnect structure to increase the ESD current discharge capability. The die stacking can be achieved by disposing a first semiconductor wafer over a second semiconductor wafer and then singulating the wafers. Alternatively, die-to-wafer or die-to-die assembly is used.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
72.
TVS diode circuit with high energy dissipation and linear capacitance
A TVS circuit having a first diode with a cathode coupled to a first terminal and an anode coupled to a first node. A second diode has an anode coupled to a second node and a cathode coupled to a third node. A third diode is coupled between the first node and second node. A fourth diode is coupled between the first node and third node. A fifth diode is coupled between the second node and a second terminal. A sixth diode is coupled between the second terminal and the third node. A seventh diode can be coupled between the second terminal and an intermediate node between the fifth diode and sixth diode. The first diode is disposed on a first semiconductor die, while the second diode is disposed on a second semiconductor die. Alternatively, the first diode and second diode are disposed on a single semiconductor die.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
G05F 3/18 - Régulation de la tension ou du courant là où la tension ou le courant sont continus utilisant des dispositifs non commandés à caractéristiques non linéaires consistant en des dispositifs à semi-conducteurs en utilisant des diodes Zener
H01L 27/08 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type
H02H 3/20 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un excès de tension
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H01L 23/62 - Protection contre l'excès de courant ou la surcharge, p. ex. fusibles, shunts
73.
METHOD AND APPARATUS FOR SUPPORTING DEVICE TO DEVICE COMMUNICATION
There is provided a method and apparatus for supporting device to device communication between a source device and a destination device. The method includes transmitting, by the SRC device, one or more of reference signals, data information and control information (CI) in sub-frames (SFs) between two consecutive special SFs in a time division duplex (TDD) pattern. The method further includes receiving, by the SRC device, one or more of other reference signals, other data information and other CI in other SFs between other two consecutive special SFs in the TDD pattern. The method further includes switching, by the SRC device, operations between downlink (DL) and uplink (UL) in the one of the two consecutive special SFs or one of the other two consecutive special SFs. In the method, each frame of the TDD pattern includes at least two special SFs.
A semiconductor device comprises a semiconductor die and an integrated capacitor formed over the semiconductor die. The integrated capacitor is configured to receive a high voltage signal. A transimpedance amplifier is formed in the semiconductor die. An avalanche photodiode is disposed over or adjacent to the semiconductor die. The integrated capacitor is coupled between the avalanche photodiode and a ground node. A resistor is coupled between a high voltage input and the avalanche photodiode. The resistor is an integrated passive device (IPD) formed over the semiconductor die. A first terminal of the integrated capacitor is coupled to a ground voltage node. A second terminal of the integrated capacitor is coupled to a voltage greater than 20 volts. The integrated capacitor comprises a plurality of interdigitated fingers in one embodiment. In another embodiment, the integrated capacitor comprises a plurality of vertically aligned plates.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 31/02 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails
H01L 31/107 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel fonctionnant en régime d'avalanche, p.ex. photodiode à avalanche
H01L 49/02 - Dispositifs à film mince ou à film épais
H03F 3/08 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs commandés par la lumière
75.
METHOD AND APPARATUS FOR INITIAL ACCESS FOR REDUCED CAPABILITY DEVICES
There is provided a method and apparatus for a method for initial access of a reduced capability (RedCap) device to a wireless network. The method includes receiving broadcast access permission information and determining an access permission status based on one or more characteristics of the RedCap device and the broadcast access permission information. The method further includes receiving, by the RedCap device, broadcast capability indication configuration information and determining a capability indication configuration based on the broadcast capability indication configuration information. The capability indication configuration is indicative of one or more messages to use for transmission of one or more capabilities of the RedCap device. The method further includes upon determination the access permission status indicates that the RedCap device is permitted to access to the wireless network, transmitting the one or more capabilities of the RedCap device via the one or more messages.
H04W 48/16 - ExplorationTraitement d'informations sur les restrictions d'accès ou les accès
H04W 48/10 - Distribution d'informations relatives aux restrictions d'accès ou aux accès, p. ex. distribution de données d'exploration utilisant des informations radiodiffusées
H04W 36/00 - Dispositions pour le transfert ou la resélection
H04W 48/18 - Sélection d'un réseau ou d'un service de télécommunications
76.
METHOD AND APPARATUS FOR WIRELESS COMMUNICATION WITH PHASE CONTINUITY
There is provided methods and apparatuses for wireless communication with phase continuity. According to embodiments, a receiving device (e.g. a base transceiver station (BTS), next generation NodeB (gNodeB or gNB)) sends, to a transmitting device (e.g. user equipment (UE)), a request for transmitting data across multiple slots with phase continuity. The transmitting device transmits to the receiving device the data across multiple slots, wherein the transmitting device maintains phase continuity while the data is transmitted. In some embodiments, the receiving device is provided with capability information indicative of whether the transmitting device supports phase continuity during data transmission. In some embodiments, the receiving device determines if the transmitting device has the capability for supporting phase continuity during data transmission. In some embodiments, the receiving device notifies the transmitting device of time duration that the receiving device expects the phase to be continuous.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic integrated circuits; electronic integrated
circuits (ICs) used to prevent system failures caused by
electrostatic discharge, electrical fast transient, cable
discharge, lightning, inductive switching, and high inrush
currents for load and power distribution.
An extension of the LoRa modulation with an improved ranging mode. A master and a slave device exchange a request and a reply that contain sequences of chirps that are carefully aligned in time, frequency, and preferably also phase, such that the master device can ascertain the propagation delay to the slave by demodulating the reply. Request and reply include chirps having different slopes, preferably slopes of equal absolute value and opposite sign. The slope diversity permits an unbiased estimation of the Doppler shift.
G01S 13/84 - Systèmes utilisant la reradiation d'ondes radio, p. ex. du type radar secondaireSystèmes analogues dans lesquels des signaux de type continu sont transmis pour la détermination de distance par mesure de phase
79.
Method and device for improved accuracy of proximity and touch detection in mobile devices
A mobile device has a proximity sensor. A compensation value of the proximity sensor is determined. The compensation value is compared to a reference compensation value to determine validity of the compensation value. A capacitance of the proximity sensor is measured. A value of the capacitance of the proximity sensor is adjusted based on the compensation value. A coefficient defining a relationship between a capacitance of the proximity sensor and a temperature of the mobile device is calculated. A temperature sensor is coupled to the proximity sensor. The temperature of the mobile device is measured. A value of the capacitance of the proximity sensor is adjusted based on the coefficient and the temperature of the mobile device. The adjusted capacitance value is compared to a threshold capacitance value to determine proximity of an object to the mobile device. A radio frequency signal is adjusted by detecting proximity.
G09G 5/00 - Dispositions ou circuits de commande de l'affichage communs à l'affichage utilisant des tubes à rayons cathodiques et à l'affichage utilisant d'autres moyens de visualisation
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
H03K 17/955 - Commutateurs de proximité utilisant un détecteur capacitif
H04M 1/02 - Caractéristiques de structure des appareils téléphoniques
80.
Method and apparatus for supporting device to device communication for wireless devices
There is provided a method and user equipment (UE) for supporting device to device (D2D) communication, for example side link communication, of wireless devices. At least one of the source UE or the destination UE is out of synchronization. Side link (SL) communication information (e.g. SL sync signal, SL timing request message, SL-data, special sync signal) may be blindly and repeatedly transmitted until the source UE receives a response from the destination UE.
This application relates to determining transmission quality of a communication channel, in particular for determining a measure of errors in data transmitted as multi-bit symbols. Described is an error checker with an input for receiving an input signal comprising a series of modulated symbols, wherein each symbol encodes multiple bits of a pseudo-random bit sequence. A demodulator is configured to receive the input signal and only partially demodulate at least some of the symbols to generate a partially demodulated bit sequence. A PRBS module is configured to receive the partially demodulated bit sequence and determine the pseudo-random bit sequence and a comparator compares the output of the demodulator to an expected output based on the pseudo-random bit sequence determined by the PRBS module.
H04L 43/0823 - Erreurs, p. ex. erreurs de transmission
H04L 27/26 - Systèmes utilisant des codes à fréquences multiples
H04L 1/20 - Dispositions pour détecter ou empêcher les erreurs dans l'information reçue en utilisant un détecteur de la qualité du signal
H04L 1/24 - Tests pour s'assurer du fonctionnement correct
H03M 13/37 - Méthodes ou techniques de décodage non spécifiques à un type particulier de codage prévu dans les groupes
H03M 13/00 - Codage, décodage ou conversion de code pour détecter ou corriger des erreursHypothèses de base sur la théorie du codageLimites de codageMéthodes d'évaluation de la probabilité d'erreurModèles de canauxSimulation ou test des codes
Circuitry for testing an integrated capacitor that includes a first capacitor, a supply node for connecting to a voltage supply, a test node for connecting to the integrated capacitor, and a charge monitoring circuit. The circuitry is operable in a sequence of states including a first state in which the first capacitor is connected to the supply node and is disconnected from the test node so as to charge the first capacitor to a test voltage and a second state in which the first capacitor is disconnected from the supply node and is connected to the test node to apply the test voltage to the integrated capacitor. The charge monitoring circuit is configured to monitor a charge transfer from the first capacitor to the integrated capacitor in said second state and to generate a measurement value based on an amount of the charge transfer.
G01R 31/12 - Test de la rigidité diélectrique ou de la tension disruptive
G01R 31/27 - Test de dispositifs sans les extraire physiquement du circuit dont ils font partie, p. ex. compensation des effets dus aux éléments environnants
There is provided a method and apparatus for management of internet protocol (IP) flow records in a wireless communication network. The method and apparatus can provide for the compression and aggregation of the IP flow records for subsequent transmission, thereby reducing bandwidth necessary for transmission thereof.
H04L 61/4511 - Répertoires de réseauCorrespondance nom-adresse en utilisant des répertoires normalisésRépertoires de réseauCorrespondance nom-adresse en utilisant des protocoles normalisés d'accès aux répertoires en utilisant le système de noms de domaine [DNS]
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
a) when the first digital gate signal has a second value; characterized in that the first digital gate signal (ϕ1) comprises a periodic series of pulses, wherein the pulses have widths proportional to the filter coefficients.
There is provided methods and associated base station and user equipment, for facilitating transmissions in a wireless communication system. The mapping between an index and its corresponding HARQ ID or HARQ ID & NDI pair can be done using one or more equations relating the two entities. The equations can be defined in two configurations, one for encoding HARQ ID or HARQ ID & NDI pair and a second for decoding the encoded HARQ ID or HARQ ID & NDI pair to determine the HARQ ID or HARQ ID and NDI.
H04L 1/18 - Systèmes de répétition automatique, p. ex. systèmes Van Duuren
H04L 1/16 - Dispositions pour détecter ou empêcher les erreurs dans l'information reçue en utilisant un canal de retour dans lesquelles le canal de retour transporte des signaux de contrôle, p. ex. répétition de signaux de demande
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronic integrated circuits; Electronic integrated circuits (ICs) used to prevent system failures caused by electrostatic discharge, electrical fast transient, cable discharge, lightning, inductive switching, and high inrush currents for load and power distribution
09 - Appareils et instruments scientifiques et électriques
Produits et services
Integrated circuits; electronic circuits; semiconductor
chips; integrated circuit chips; integrated circuit platform
for low power data center applications.
Transmitter for chirp-modulated radio signals comprising a chirp generator configured to generate a series of chirp signals, wherein each chirp carries an element of information encoded as a cyclic shift, and has a phase encoding an error correction code dependent form the cyclic shift of the chirp, the transmitter further comprising a modulator configured to modulate the series of chirp onto a radio signal and a radio transmitter, transmitting the radio signal. receiver for chirp-modulated radio signals, comprising a clock unit and a demodulator configured for demodulating a series of received chirps signal, the demodulator having a dechirp unit, configured for determining a cyclic shift of each received chirp relative to a base chirp and an error correction code based on a phase of the received chirp, the receiver having a synchronism correction unit configured to detect and/or correct an error in the clock unit based on the error correction code.
The application describes a transimpedance amplifier circuit having a first circuit branch extending between first and second supply nodes. An input NMOS transistor is located in the first circuit branch, with its drain terminal coupled to the first supply node via a load resistor, its source terminal coupled to the second supply node and its gate terminal coupled to an input node for receiving an input signal. The circuit includes a PMOS transistor having its source terminal coupled to a third supply node, its drain terminal coupled to the first circuit branch, at a node in a part of the first circuit branch extending from the drain terminal of the input transistor to the load resistor, and its gate terminal coupled to the input node. A drain current of the PMOS transistor contributes a proportion but not all of a drain current for input NMOS transistor.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
A semiconductor device includes a voltage input circuit node and a ground voltage node. A first transistor is coupled between the voltage input circuit node and the ground voltage node. A triggering circuit is coupled between the voltage input circuit node and the ground voltage node in parallel with the first transistor. The triggering circuit includes a trigger diode. An output of the triggering circuit is coupled to a control terminal of the first transistor. A load is powered by coupling the load between the voltage input circuit node and the ground voltage node.
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H10D 10/00 - Transistors bipolaires à jonction [BJT]
A method and apparatus for supporting multi transport block grant (MTBG) data transmission in a wireless communication system, such as an LTE system. The method includes increasing the number of hybrid automatic repeat request (HARQ) processes in a HARQ cycle to greater than 8, where the HARQ processes are divided into two or more HARQ process groups. The method further includes specifying a delay indicative of time between the MTBG and commence of the data transmission and another delay indicative of time between the data transmission and acknowledgement (ACK).
A proximity sensor for a portable connected wireless device generating an immediate proximity status signal (PROXSTAT, 310) that becomes active when a part of a user's body is close to the proximity sensor, an averaging unit (259) that may include a FIFO buffer, averaging the immediate proximity status flag in a predetermined time window, and a decision unit generating a time-averaged proximity status flag (350) based on an averaged value of the immediate proximity status flag in the time window, for example when the averaged value exceeds a predetermined threshold. In embodiments, the sensor is configured to switch temporarily and repeatedly the time-averaged proximity status flag to an inactive state when the value of the averaged or accumulated value yields an active state of the time-averaged proximity status flag. This feature improves the connectivity when the sensor is used to limit the RF emission of mobile devices.
H04M 1/72454 - Interfaces utilisateur spécialement adaptées aux téléphones sans fil ou mobiles avec des moyens permettant d’adapter la fonctionnalité du dispositif dans des circonstances spécifiques en tenant compte des contraintes imposées par le contexte ou par l’environnement
G06F 3/04883 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] utilisant des caractéristiques spécifiques fournies par le périphérique d’entrée, p. ex. des fonctions commandées par la rotation d’une souris à deux capteurs, ou par la nature du périphérique d’entrée, p. ex. des gestes en fonction de la pression exercée enregistrée par une tablette numérique utilisant un écran tactile ou une tablette numérique, p. ex. entrée de commandes par des tracés gestuels pour l’entrée de données par calligraphie, p. ex. sous forme de gestes ou de texte
97.
TVS diode circuit with high energy dissipation and linear capacitance
A TVS circuit having a first diode with a cathode coupled to a first terminal and an anode coupled to a first node. A second diode has an anode coupled to a second node and a cathode coupled to a third node. A third diode is coupled between the first node and second node. A fourth diode is coupled between the first node and third node. A fifth diode is coupled between the second node and a second terminal. A sixth diode is coupled between the second terminal and the third node. A seventh diode can be coupled between the second terminal and an intermediate node between the fifth diode and sixth diode. The first diode is disposed on a first semiconductor die, while the second diode is disposed on a second semiconductor die. Alternatively, the first diode and second diode are disposed on a single semiconductor die.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
G05F 3/18 - Régulation de la tension ou du courant là où la tension ou le courant sont continus utilisant des dispositifs non commandés à caractéristiques non linéaires consistant en des dispositifs à semi-conducteurs en utilisant des diodes Zener
H01L 27/08 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type
H02H 3/20 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un excès de tension
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H01L 23/62 - Protection contre l'excès de courant ou la surcharge, p. ex. fusibles, shunts
Advanced modulation and demodulation schemes for LoRa or equivalent chirp spread spectrum transmissions, with differential modulation and symbol repetition improve the sensitivity in combination with soft demodulation methods.
A LoRa receiver for processing digital chirp spread-spectrum modulated signals with an advanced module for the determination of the timing error and/or of the frequency error arranged to estimate a position of a frequency discontinuity in each symbol, extract one or more frequency-continuous fragments out of each symbol, dechirp the coherent fragments, determine a timing error, and/or a frequency error, and/or a modulation value, and/or a SNR.
a has electrical interconnect for the semiconductor die. A molding compound is disposed over the semiconductor die and first substrate area using a transfer mold process, which leaves mold culls and mold gates disposed over the second substrate area. A substrate edge is formed in the second substrate area under the mold gates. The substrate edge extends into the first substrate area under the molding compound to reinforce the mold gates and reduce cracking during mold degating. The substrate edge can have a variety of forms such as parallel bars, diagonal bars, orthogonal bars, and combinations thereof.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
