A system and method for measuring blood pressure. In some embodiments, a system includes a speckleplethysmography sensor and a processing circuit. The system may be configured: to perform, using the speckleplethysmography sensor, blood flow measurements of a subject, and measurements of cuff pressure of a cuff worn by the subject, while the cuff pressure varies; and to calculate, from the blood flow measurements and the cuff pressure measurements, a first blood pressure.
A system and method for measuring blood pressure. In some embodiments, a system includes a speckleplethysmography sensor and a processing circuit. The system may be configured: to perform, using the speckleplethysmography sensor, blood flow measurements of a subject, and measurements of cuff pressure of a cuff worn by the subject, while the cuff pressure varies; and to calculate, from the blood flow measurements and the cuff pressure measurements, a first blood pressure.
A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/022 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins par application d'une pression pour fermer les vaisseaux sanguins, p. ex. contre la peauOphtalmodynamomètres
A61B 5/0295 - Mesure du débit sanguin utilisant la pléthysmographie, c.-à-d. par mesure des variations du volume d'une partie du corps induites par la circulation du sang qui traverse cette partie, p. ex. pléthysmographie par impédance
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
A wearable device includes a first optical sensor module, the first optical sensor module including: an image sensor configured to receive light from biological tissue; a photodiode configured to receive light from the tissue; a light source comprising a laser and being configured to illuminate, through the tissue, each of the image sensor and the photodiode, a distance between the image sensor and the photodiode being less than 50% of the distance between the image sensor and the light source; at least one processing circuit configured to process first data corresponding to a first light signal received by the image sensor from the light source to generate a speckleplethysmography (SPG) measurement, and to process second data corresponding to a second light signal received by the photodiode from the light source to generate a photoplethysmography (PPG) measurement.
A coupon wafer comprising a device coupon (110) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (124), and the device coupon (110) is attached to the wafer substrate via a tether (122) and the tether (122) is formed from a dielectric material.
A system including a laser. In some embodiments, the system includes a semiconductor laser, configured to generate laser light at an operating wavelength. The semiconductor laser may include: an optical waveguide including a gain medium; a first facet, at a first end of the optical waveguide; a second facet, at a second end of the optical waveguide; and a first reflector, in the optical waveguide, between the first facet and the second facet. The first reflector may be a discrete reflector.
A method of preparing a distributed feedback laser. The distributed feedback laser comprises an active waveguide with a reflective facet. The method comprises: etching a grating into the distributed feedback laser; and etching an output facet into the active waveguide.
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
H01S 5/0234 - Montage à orientation inversée, p. ex. puce retournée [flip-chip], montage à côté épitaxial au-dessous ou montage à jonction au-dessous
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
A system and method for assembly. In some embodiments, the method includes: optically aligning a transfer stamp with a platform wafer, the transfer stamp including a device coupon for bonding to the platform wafer, the device coupon including a device coupon photonic device; applying a lateral force to the transfer stamp, such that a lateral surface of the device coupon engages with a mechanical alignment feature located in the platform wafer and such that the device coupon is aligned relative to the platform wafer; and applying a bonding force to the transfer stamp, such that the device coupon bonds to the platform wafer.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01S 5/02326 - Dispositions pour le positionnement relatif des diodes laser et des composants optiques, p. ex. rainures dans le support pour fixer des fibres optiques ou des lentilles
A multi-module wearable device. According to an embodiment of the present disclosure, there is provided a system, including: a first wearable instrument; a second wearable instrument including a biometric sensor; an electrical connection between the first wearable instrument and the second wearable instrument; and a strap, sized and dimensioned to be disposed about a wrist. The electrical connection may be capable of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a first position on the strap relative to the first wearable instrument, and of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a second position on the strap relative to the first wearable instrument.
A multi-module wearable device. According to an embodiment of the present disclosure, there is provided a system, including: a first wearable instrument; a second wearable instrument including a biometric sensor; an electrical connection between the first wearable instrument and the second wearable instrument; and a strap, sized and dimensioned to be disposed about a wrist. The electrical connection may be capable of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a first position on the strap relative to the first wearable instrument, and of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a second position on the strap relative to the first wearable instrument.
A system for sensing one or more biometrics. In some embodiments, the system includes a first wearable instrument; a second wearable instrument including a biometric sensor; a conductive connection between the first wearable instrument and the second wearable instrument; and a strap, sized and dimensioned to be disposed about a wrist. The system may be capable of securing the first wearable instrument to the strap, of securing the second wearable instrument to the strap at a first position relative to the first wearable instrument, and of securing the second wearable instrument to the strap at a second position relative to the first wearable instrument.
A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
A61B 5/145 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A system and method for optical coupling. In some embodiments, the system includes a first semiconductor chip, including a semiconductor optical amplifier; and a second semiconductor chip, including a fork coupler. The fork coupler may includes a plurality of waveguide fingers, and an output waveguide. The waveguide fingers may be configured to guide, together, a first optical mode of the fork coupler; and the fork coupler may be arranged such that an output mode of the semiconductor optical amplifier couples to the first optical mode of the fork coupler.
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
A system for sensing one or more biometrics. In some embodiments, the system includes a first wearable instrument; a second wearable instrument including a biometric sensor; a conductive connection between the first wearable instrument and the second wearable instrument; and a strap, sized and dimensioned to be disposed about a wrist. The system may be capable of securing the first wearable instrument to the strap, of securing the second wearable instrument to the strap at a first position relative to the first wearable instrument, and of securing the second wearable instrument to the strap at a second position relative to the first wearable instrument.
A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.
An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.
A wearable device. In some embodiments, a system includes a wearable device configured to be worn against the skin of a subject, including: a transmitting window; a light source for generating light for transmission through the transmitting window; a receiving window; a photodetector configured to detect light received through the receiving window; and an opaque barrier, an edge of the transmitting window being separated from an edge of the receiving window by a gap having a width of less than 2 mm, and the opaque barrier being in the gap.
A wearable device. In some embodiments, the wearable device includes: a sensing module; and a strap attached to the sensing module, the wearable device being configured to be worn by a user, with a lower surface of the sensing module in contact with the user, the strap extending over an upper surface of the sensing module.
A wafer with a buried V-groove cavity, and a method for fabricating V-grooves. In some embodiments, the method includes bonding a first layer, to a top surface of a substrate, to form a composite wafer, the first layer being composed of a first semiconductor material, the substrate being composed of a second semiconductor material, the top surface of the substrate having a cavity, the cavity including a V-groove.
A minimally invasive spectrophotometric system. In some embodiments, the system includes a minimally invasive device and a spectrophotometer. The spectrophotometer may include: a transmitting fiber, a receiving fiber, and a head. The head of the spectrophotometer may include: a light source connected to the transmitting fiber and a photodetector connected to the receiving fiber. A portion of the transmitting fiber may be in an insertion tube of the minimally invasive device, and a portion of the receiving fiber may be in the insertion tube of the minimally invasive device. The head of the spectrophotometer may occupy a volume of less than 300 cubic centimeters.
A method of testing one or more optoelectronic devices located on respective device coupons. The device coupon(s) are present on a wafer. The method comprises: testing the or each optoelectronic device using a corresponding testing element, the testing element(s) being located on the same wafer as the device coupon(s), by either: in a first testing protocol, operating the optoelectronic device so as to produce an optical output, and detecting the light incident on the testing element from the optoelectronic device under test, or in a second testing protocol, detecting, by the optoelectronic device under test, the light received from the testing element.
A photonic integrated circuit for use in hyperspectral spectroscopy. The photonic integrated circuit comprising: a multi-spectral laser source, configured to produce a multi-spectral optical signal; a modulator, the modulator configured to split the multi-spectral optical signal into a first component and a second component, and apply an up-chirp modulation profile to the first component and a down-chirp modulation profile to the second component; a first transmitter and receiver module, configured to transmit the modulated first component and receive reflections of the first component; and a second transmitter and receiver module, configured to transmit the modulated second component and receive reflections of the second component.
Echelle gratings with a shared free propagation region. In some embodiments, a system includes: a first echelle grating; and a second echelle grating. The first echelle grating may include: a first input waveguide having an end on a first Rowland circle; a first grating on the first Rowland circle; and a first output waveguide having an end on the first Rowland circle. The second echelle grating may include: a second input waveguide having an end on a second Rowland circle; a second grating on the second Rowland circle; and a second output waveguide having an end on the second Rowland circle. The second input waveguide may be separate from the first input waveguide, the second output waveguide may be separate from the first output waveguide, and the first Rowland circle may overlap the second Rowland circle.
A system and method for calibrating speckle-based sensor. In some embodiments, the system includes a wearable device including: a laser, an array detector; and a processing circuit, the processing circuit being configured to: obtain a calibration of the array detector, using an incoherent light source; obtain a speckle image, using the laser; and calculate a corrected speckle-based measurement, the corrected speckle-based measurement being based on the speckle image and on the calibration.
A system and method for calibrating speckle-based sensor. In some embodiments, the system includes a wearable device including: a laser, an array detector; and a processing circuit, the processing circuit being configured to: obtain a calibration of the array detector, using an incoherent light source; obtain a speckle image, using the laser; and calculate a corrected speckle-based measurement, the corrected speckle-based measurement being based on the speckle image and on the calibration.
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A system including an optical transmitter. In some embodiments, the system includes: a first array of lasers; a first wavelength multiplexer, connected to the first array of lasers; a first coupler, connected to the wavelength multiplexer; and a first wavelength meter, connected to a first output of the first coupler.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G01J 9/02 - Mesure du déphasage des rayons lumineuxRecherche du degré de cohérenceMesure de la longueur d'onde des rayons lumineux par des méthodes interférométriques
Dialysis patients may be affected by renal failure and may be affected by other health conditions, such as hypertension. During and between dialysis sessions, it may be advantageous to monitor various characteristics of the patient and of the dialysis system. As such, a system and method for dialysis biomarker monitoring is provided.
A61M 1/16 - Systèmes de dialyseReins artificielsOxygénateurs du sang avec membranes
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61M 1/36 - Autre traitement du sang dans une dérivation du système circulatoire naturel, p. ex. adaptation de la température, irradiation
Dialysis patients may be affected by renal failure and may be affected by other health conditions, such as hypertension. During and between dialysis sessions, it may be advantageous to monitor various characteristics of the patient and of the dialysis system. As such, a system and method for dialysis biomarker monitoring is provided.
Dialysis patients may be affected by renal failure and may be affected by other health conditions, such as hypertension. During and between dialysis sessions, it may be advantageous to monitor various characteristics of the patient and of the dialysis system. As such, a system and method for dialysis biomarker monitoring is provided.
A semiconductor package. In some embodiments, the package has a top surface and a bottom surface, and includes: a semiconductor die having a front surface, a back surface, and a plurality of edges; a mold compound, on the back surface of the die and the edges of the die; a plurality of first conductive elements extending through the mold compound on the back surface of the die to the top surface of the package; and a plurality of second conductive elements on the bottom surface of the package.
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 27/08 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type
H01L 21/822 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels pour produire des dispositifs, p.ex. des circuits intégrés, consistant chacun en une pluralité de composants le substrat étant un semi-conducteur, en utilisant une technologie au silicium
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
The present invention provides a laser comprising a laser cavity defined by a first reflector and a second reflector. The laser cavity comprising a gain region and an intracavity modulation stage for reducing coherence of the laser output. The intracavity modulation stage comprises a region configured to support a plurality of optical modes. The second reflector is a broadband reflector having a reflectance spectrum configured to support the plurality of optical modes.
A waveguide structure. In some embodiments, the waveguide structure, includes: a first waveguide (105), a second waveguide (120), and a third waveguide (125) on a substrate (115). The first waveguide (105) may be at a different height than the second waveguide (120). The waveguides may be configured to cause light to couple between the first waveguide (105) and the second waveguide (120), and between the second waveguide (120) and the third waveguide (125). The first, second, and third waveguides (105, 120, 125) may be composed of respective materials having a first index of refraction, a second index of refraction, and a third index of refraction respectively. The third material may include silicon and nitrogen. The second index of refraction may be greater than the first index of refraction, and less than the third index of refraction.
An optoelectronic device. The device comprising: an input waveguide, which receives an optical signal; a multistage photodiode detector, comprising a plurality of photodiode elements connected in series, one of the photodiode elements of the plurality of photodiode elements being connected to the input waveguide and configured to receive the optical signal therefrom; and a first electrode and a second electrode, wherein the first electrode is connected to a first contact of each of the plurality of photodiode elements, and the second electrode is connected to a second contact of each of the plurality of photodiode elements.
An optoelectronic device. The device comprises: a silicon-on-insulator platform, including a silicon waveguide, formed in a silicon device layer, a silicon substrate, and a cavity; a III-V semiconductor based device, located within the cavity of the silicon-on-insulator platform and containing a III-V semiconductor based waveguide which is coupled to the silicon waveguide. A region of a bed of the cavity, located between the III-V semiconductor based device and the substrate, includes a patterned surface, which is configured to interact with an optical signal within the III-V semiconductor based waveguide of the III-V semiconductor based device.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
A system with a deformable membrane for speckle mitigation. In some embodiments, the system includes a laser for producing laser light; a photodetector for detecting the laser light after interaction of the laser light with a sample; and a silicon deformable membrane, for modulating the phase of the laser light.
The invention refers to a photonic integrated circuit (PIC), the photonic integrated circuit comprising: at least one laser, the laser having a laser output, a measuring portion including a measuring port and configured to measure an intensity and/or wavelength of light input at the measuring port, and an output portion configured to output light from the photonic integrated circuit to the portion of the tissue, wherein optionally the laser includes a ring resonator laser, a laser generating light having a fixed wavelength, a laser being constructed using hybrid integration, and/or a tunable laser.
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61B 5/0205 - Évaluation simultanée de l'état cardio-vasculaire et de l'état d'autres parties du corps, p. ex. de l'état cardiaque et respiratoire
A61B 5/145 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang
An optical sensor for spectroscopic analysis of a sample, the optical sensor comprising: a photonic integrated chip (PIC) for providing light to the sample, the PIC comprising: one or more laser(s) designed to operate at one or more respective predetermined wavelength(s), each of the one or more laser(s) having an output that is optically coupled to an optical output of the PIC; and a monitor located on the PIC for determining the wavelength of the optical output; the optical sensor further comprising: a detector for collecting a spectrum from the sample; and one or more processors configured to: compare the wavelength of the laser(s) at the optical output with each of their respective predetermined wavelength(s); and if a deviation above a certain threshold is detected between the wavelength of the laser(s) and the predetermined wavelength(s), adapt the collected spectrum to generate a reconstructed spectrum; and use one or more datapoints from the reconstructed spectrum for the spectroscopic analysis.
An optical sensor module for measuring both speckleplethysmography (SPG) and photoplethysmography (PPG) signals at human or animal tissue, the optical sensor module comprising:a first light source, for illuminating the tissue for use with SPG measurements, the first light source comprising a laser; a second light source, for illuminating the tissue for use with PPG measurements; and one or more optical sensor(s) for receiving light from the illuminated tissue.
A61B 5/0295 - Mesure du débit sanguin utilisant la pléthysmographie, c.-à-d. par mesure des variations du volume d'une partie du corps induites par la circulation du sang qui traverse cette partie, p. ex. pléthysmographie par impédance
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A system, comprising: a laser (105) for producing laser light; a photodetector (115) for detecting the laser light after interaction of the laser light with a sample (110); and a silicon deformable membrane (205), for modulating the phase of the laser light.
G01N 21/31 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique
G01N 21/49 - Dispersion, c.-à-d. réflexion diffuse dans un corps ou dans un fluide
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G02B 27/48 - Systèmes optiques utilisant la granulation produite par laser
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
39.
ARCHITECTURE OF A PHOTONIC INTEGRATED CIRCUIT (PIC) AND METHOD FOR OPERATING THE SAME AS WELL AS AN OPTICAL COUPLER
The invention refers to a photonic integrated circuit or PIC, the photonic integrated circuit (28) comprising: at least one laser (30), the laser having a laser output (44), a measuring portion (32) including a measuring port (60) and configured to measure an intensity and/or wavelength of light input at the measuring port, and an output portion (34) configured to output light from the photonic integrated circuit to the portion of the tissue, wherein optionally the laser includes a ring resonator laser, a laser generating light having a fixed wavelength, a laser being constructed using hybrid integration, and/or a tunable laser.
A61B 5/024 - Mesure du pouls ou des pulsations cardiaques
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
A computer-implemented method for deriving a physiological rank indicative of a physiological status of a user, the computer-implemented method comprising acquiring, from a sensor on a wearable device worn by a user, data including bodily parameter data related to the user, and applying a model to the bodily parameter data to obtain physiological information related to the user, and deriving, from the physiological information, a physiological rank indicative of a physiological status of the user wearing the device, wherein the physiological rank is a given value on a physiological rank scale.
G16H 50/30 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le calcul des indices de santéTIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour l’évaluation des risques pour la santé d’une personne
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/0205 - Évaluation simultanée de l'état cardio-vasculaire et de l'état d'autres parties du corps, p. ex. de l'état cardiaque et respiratoire
An optical sensor module for measuring both speckleplethysmography (SPG) and photoplethysmography (PPG) signals at human or animal tissue, the optical sensor module comprising: a first light source, for illuminating the tissue for use with SPG measurements, the first light source comprising a laser; a second light source, for illuminating the tissue for use with PPG measurements; and one or more optical sensor(s) for receiving light from the illuminated tissue.
An optical sensor module for measuring both speckleplethysmography (SPG) and photoplethysmography (PPG) signals at human or animal tissue, the optical sensor module comprising:a first light source, for illuminating the tissue for use with SPG measurements, the first light source comprising a laser; a second light source, for illuminating the tissue for use with PPG measurements; and one or more optical sensor(s) for receiving light from the illuminated tissue.
09 - Appareils et instruments scientifiques et électriques
35 - Publicité; Affaires commerciales
42 - Services scientifiques, technologiques et industriels, recherche et conception
45 - Services juridiques; services de sécurité; services personnels pour individus
Produits et services
Computer software; computer software relating to data
collection, data capture, data mining, data processing, data
systematisation, data analysis, data retrieval, data
management, data input, data storage, dissemination of data,
databases, database management, and compilation of data;
mobile application software; mobile application software
relating to data collection, data capture, data mining, data
processing, data systematisation, data analysis, data
retrieval, data management, data input, data storage,
dissemination of data, databases, database management, and
compilation of data; databases. Data collection; data processing; data processing including
automated data processing, computer data processing, online
data processing, data processing for the collection of data
for business, statistical, and scientific purposes; data
processing verification; systematization of data into
computer databases; systemisation of information into
computer databases; analysis of business and statistical
data; analysis of data including business data analysis and
statistical data analysis relating to business; data
retrieval; data management; database and data processing
management; data input; input of information into computer
databases; dissemination of business and statistical data;
dissemination of business and statistical information
relating to business, statistical and scientific data;
database management; updating and maintenance of data in
databases; compilation of data; compilation of data into
computer databases; compilation of data including
compilation of business data, compilation of statistical
data, and compilation of scientific data; provision of
business data and preparation of business statistical data;
writing of business reports; and information, advisory, and
consultancy services relating to all of the aforesaid. Technological services and research and design relating
thereto; custom design services; custom design, design, and
development of computer hardware and software; custom
design, design, and development of computer hardware and
software relating to research, data collection, data
capture, data mining, data processing, data systematisation,
data analysis, data retrieval, data management, data input,
data storage, dissemination of data, databases, database
management, and compilation of data; providing online,
non-downloadable computer software; providing online,
non-downloadable computer software for research, data
collection, data capture, data mining, data processing, data
systematisation, data analysis, data retrieval, data
management, data input, data storage, dissemination of data,
databases, database management, and compilation of data;
design, development, maintenance and rental of
non-downloadable software; design, development, maintenance
and rental of non-downloadable software for research, data
collection, data capture, data mining, data processing, data
systematisation, data analysis, data retrieval, data
management, data input, data storage, dissemination of data,
databases, database management, and compilation of data;
data storage, other than physical storage; data storage
services including online data storage, electronic data
storage, computerised data storage; design, development,
maintenance and rental of data storage systems; design,
development and rental of data carriers for research, data
collection, data capture, data mining, data processing, data
systematisation, data analysis, data retrieval, data
management, data input, data storage, dissemination of data,
databases, database management, and compilation of data;
software as a service [SaaS]; software as a service [SaaS]
services relating to research, data collection, data
capture, data mining, data processing, data systematisation,
data analysis, data retrieval, data management, data input,
data storage, dissemination of data, databases, database
management, and compilation of data; platform as a service
[PaaS]; platform as a service [PaaS] services relating to
research, data collection, data capture, data mining, data
processing, data systematisation, data analysis, data
retrieval, data management, data input, data storage,
dissemination of data, databases, database management, and
compilation of data; scientific and technological
consultancy, testing, research, advisory, and technical
support services; consultancy, testing, research, advisory,
and technical support services, all relating to research,
data collection, data capture, data mining, data processing,
data systematisation, data analysis, data retrieval, data
management, data input, data storage, dissemination of data,
databases, database management, and compilation of data;
data conversion; writing of scientific and technical
reports; data mining; rental of a database server (to third
parties); scientific data analysis; analysis of statistical
data for scientific research; dissemination of scientific
data; providing data relating to scientific research and
development; provision of scientific data; and information,
advisory, and consultancy services relating to all of the
aforesaid. Licensing services; licensing of software, databases,
technology, information and data; and information, advisory,
and consultancy services relating to all of the aforesaid.
A laser (10)comprising a photonic component (14) comprising a gain medium; and a waveguide platform (12) comprising a Distributed Bragg Reflector, DBR, section (18). The photonic component is optically coupled to the waveguide platform. One or more thermal heaters (28) are positioned at the DBR section (18) of the waveguide platform, and/or at a phase section (16) of the waveguide platform located between the gain medium and the DBR section.
A laser comprising a photonic component comprising a gain medium; and a waveguide platform comprising a Distributed Bragg Reflector, DBR, section. The photonic component is optically coupled to the waveguide platform. One or more thermal heaters are positioned at the DBR section of the waveguide platform, and/or at a phase section of the waveguide platform located between the gain medium and the DBR section.
A photonic module, comprising a first waveguide; a second waveguide, disposed on an opposing side of the first waveguide to a substrate; and, a coupling section. One of the first waveguide and the second waveguide is formed of crystalline silicon. The other of the first waveguide and the second waveguide is formed of amorphous silicon. The coupling section is configured to couple light between the first waveguide and the second waveguide. Such a silicon photonic module has enhanced coupling and transmission properties in contrast to conventional modules.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
A source wafer for use in a micro-transfer printing process. The source wafer comprising: a wafer substrate; a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and one or more etch stop layers, located between the photonic component and the wafer substrate.
A sensor. In some embodiments, the sensor includes a first waveguide, a flexible support element, and a second waveguide. A first portion of the first waveguide may be supported by the flexible support element and separated by a first gap from a second portion of the first waveguide. The flexible support element may be capable of bending so as to cause an effective index of refraction of the first waveguide to change. The first waveguide may be coupled to the second waveguide through a second gap, the second gap being at an end of the first waveguide and an end of the second waveguide.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G01L 11/02 - Mesure de la pression permanente, ou quasi permanente d'un fluide ou d'un matériau solide fluent par des moyens non prévus dans les groupes ou par des moyens optiques
G01L 23/16 - Dispositifs ou appareils pour la mesure ou l'indication ou l'enregistrement des changements, rapides, tels que des oscillations, de la pression des vapeurs, des gaz ou des liquidesIndicateurs pour déterminer le travail ou l'énergie des moteurs à vapeur, à combustion interne ou à autres pressions de fluides à partir de la condition du fluide moteur mis en œuvre électriquement par des moyens photo-électriques
A method for determining a calibration function includes: calculating a first distance, between a distribution of target spectra and a comparison distribution of spectra; calibrating the distribution of target spectra with a first preliminary calibration function to form a first distribution of calibrated target spectra; calculating a second distance, between the first distribution of calibrated target spectra and the comparison distribution of spectra; determining that the second distance is less than the first distance; and setting the calibration function equal to the first preliminary calibration function.
A method of manufacturing a transfer die. The manufactured transfer die comprises a semiconductor device suitable for bonding to a silicon-on-insulator wafer. The method comprises the steps of providing a non-conductive isolation region in a semiconductor stack, the semiconductor stack comprising a sacrificial layer above a substrate; and etching an isolation trench into the semiconductor stack from an upper surface thereof, such that the isolation trench extends only to a region of the semiconductor stack above the sacrificial layer. The isolation trench and the non-conductive isolation region together separate a bond pad from a waveguide region in the optoelectronic device.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/76 - Réalisation de régions isolantes entre les composants
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 33/02 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs
A source wafer for use in a micro-transfer printing process. The source wafer comprising: a wafer substrate; a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and one or more etch stop layers, located between the photonic component and the wafer substrate.
B32B 27/02 - Produits stratifiés composés essentiellement de résine synthétique sous forme de fibres ou de filaments
B41F 16/00 - Appareils pour imprimer des images-transfert
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A computer-implemented method to improve the accuracy of a calculation of a biomarker value from a spectral measurement. The computer-implemented method comprises receiving a primary spectral measurement from a primary detector, receiving, a secondary measurement from a secondary detector, and calculating a value of the biomarker using a biomarker algorithm. The biomarker algorithm takes an input from the primary spectral measurement and a calibration parameter from the secondary measurement.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A61B 5/145 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang
A61B 5/01 - Mesure de la température de parties du corps
An optoelectronic device. The optoelectronic device including: a silicon platform, including a silicon waveguide and a cavity, wherein a bed of the cavity is provided at least in part by a buried oxide layer; a lll-V semiconductor-based optoelectronic component, bonded to a bed of the cavity of the silicon platform; and a bridge-waveguide, located between the silicon waveguide and the lll-V semiconductor-based optoelectronic component.
G02F 1/017 - Structures avec une variation de potentiel périodique ou quasi périodique, p. ex. superréseaux, puits quantiques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
An optical speckle receiver for receiving a speckle signal from a sample, the optical speckle receiver comprising an optical detector and an aperture and/or lens array. The aperture and array respectively comprise a plurality of apertures or lenses and is located between the sample and the optical detector such that the received speckle pattern is obtained from multiple discrete sample locations.
A61B 5/0295 - Mesure du débit sanguin utilisant la pléthysmographie, c.-à-d. par mesure des variations du volume d'une partie du corps induites par la circulation du sang qui traverse cette partie, p. ex. pléthysmographie par impédance
An optoelectronic device. The optoelectronic device including: a silicon platform, including a silicon waveguide and a cavity, wherein a bed of the cavity is provided at least in part by a buried oxide layer; a III-V semiconductor-based optoelectronic component, bonded to a bed of the cavity of the silicon platform; and a bridge-waveguide, located between the silicon waveguide and the III-V semiconductor-based optoelectronic component.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
A waveguide platform and method of fabricating a waveguide platform on a silicon wafer; the method comprising: providing a wafer having a layer of crystalline silicon; lithographically defining a first region of the top layer; electrochemically etching the waveguide platform to create porous silicon at the lithographically defined first region; epitaxially growing crystalline silicon on top of the porous silicon to create a first upper crystalline layer with a first buried porous silicon region underneath; wherein the first buried porous silicon region defines a taper between a first waveguide region of crystalline silicon having a first depth and a second waveguide region of crystalline silicon having a second depth which is smaller than the first depth.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
An optical speckle receiver for receiving a speckle signal from a sample, the optical speckle receiver comprising an optical detector and an aperture and/or lens array. The aperture and array respectively comprise a plurality of apertures or lenses and is located between the sample and the optical detector such that the received speckle pattern is obtained from multiple discrete sample locations.
An optical speckle receiver for receiving a speckle signal from a sample, the optical speckle receiver comprising an optical detector and an aperture and/or lens array. The aperture and array respectively comprise a plurality of apertures or lenses and is located between the sample and the optical detector such that the received speckle pattern is obtained from multiple discrete sample locations.
A61B 5/024 - Mesure du pouls ou des pulsations cardiaques
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
A system and method for health state estimation. In some embodiments, the method includes receiving a first measurement of a subject, the first measurement being a first tissue spectrum of the subject; and generating, using a machine learning inference process based on the first measurement, an estimate of an aspect of the health state of the subject.
G16H 50/20 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le diagnostic assisté par ordinateur, p. ex. basé sur des systèmes experts médicaux
G16H 50/30 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le calcul des indices de santéTIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour l’évaluation des risques pour la santé d’une personne
A demultiplexer for use in a wavelength division multiplexed system. The demultiplexer comprises: an input waveguide, configured to receive a wavelength division multiplexed signal; a demultiplexing element, configured to demultiplex the multiplexed signal received from the input waveguide into a plurality of multi-mode demultiplexed signal components; a multi-mode output waveguide, the multi-mode output waveguide being coupled to the demultiplexing element and configured to receive one of the multi-mode demultiplexed signal components; and a splitter, coupled to the multi-mode output waveguide, and configured to split the received multi-mode demultiplexed signal component into two single-mode outputs.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
The present invention provides a photodiode for a wearable sensor system, the photodiode having a rectangular active area sensitive to wavelengths within the spectral range of 1200 nm to 2400 nm. The present invention also provides a wearable sensor system comprising the photodiode.
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/024 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de température
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A photonic integrated device comprising: a photonic integrated chip (PIC) adapted to investigate blood flow at a portion of tissue of a user, said PIC comprising: a laser having an optical output, or waveguide for guiding an optical output from an external laser, the optical output being split into a first optical component and a second optical component; wherein the first optical component is arranged to be transmitted to and generate speckle at the portion of tissue of the user; the photonic integrated device further comprising: one or more detectors, each detector configured to receive the speckle generated by the first optical component at the portion of tissue; and one or more optical splitters optically coupling the second optical component to one or more respective input(s) of the one or more detectors; wherein the photonic integrated device is further adapted to measure interference at the one or more detectors between a sample arm formed by the first optical component and a reference arm formed by the second optical component.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/02 - Détection, mesure ou enregistrement en vue de l'évaluation du système cardio-vasculaire, p. ex. mesure du pouls, du rythme cardiaque, de la pression sanguine ou du débit sanguin
The present invention provides a photodiode for a wearable sensor system, the photodiode having a rectangular active area sensitive to wavelengths within the spectral range of 1200 nm to 2400 nm. The present invention also provides a wearable sensor system comprising the photodiode.
A61B 5/01 - Mesure de la température de parties du corps
A61B 5/024 - Mesure du pouls ou des pulsations cardiaques
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02F 1/015 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
H01L 31/0304 - Matériaux inorganiques comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
64.
System and method for positioning a sensor on a subject
A system and method for positioning a sensor on a subject. In some embodiments, the system includes an instrument holder, the instrument holder being configured to be secured to a subject, and to hold an instrument temporarily.
A system and method for positioning a sensor on a subject. In some embodiments, the system includes an instrument holder, the instrument holder being configured to be secured to a subject, and to hold an instrument temporarily.
A source wafer for use in a micro-transfer printing process. The source wafer comprises: a substrate; a device coupon (110), including an optoelectronic device; and a breakable tether securing the device coupon to the substrate. The breakable tether includes one or more breaking regions which connect the breakable tether to the substrate.
A photonic integrated device comprising: a photonic integrated chip (PIC) adapted to investigate blood flow at a portion of tissue of a user, said PIC comprising: a laser having an optical output, or waveguide for guiding an optical output from an external laser, the optical output being split into a first optical component and a second optical component; wherein the first optical component is arranged to be transmitted to and generate speckle at the portion of tissue of the user; the photonic integrated device further comprising: one or more detectors, each detector configured to receive the speckle generated by the first optical component at the portion of tissue; and one or more optical splitters optically coupling the second optical component to one or more respective input(s) of the one or more detectors; wherein the photonic integrated device is further adapted to measure interference at the one or more detectors between a sample arm formed by the first optical component and a reference arm formed by the second optical component.
A61B 5/0295 - Mesure du débit sanguin utilisant la pléthysmographie, c.-à-d. par mesure des variations du volume d'une partie du corps induites par la circulation du sang qui traverse cette partie, p. ex. pléthysmographie par impédance
A semiconductor photodiode. The semiconductor photodiode including: an input waveguide, arranged to receive an optical signal at a first port and provide the optical signal from the second port; a photodiode waveguide, arranged to receive the optical signal from the second port of the input waveguide, and at least partially convert the optical signal into an electrical signal; and an electro-static defence component, located adjacent to the photodiode waveguide. The electro-static defence component and the photodiode waveguide are electrically connected in parallel.
H01L 31/105 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type PIN
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
A semiconductor device. In some embodiments, the semiconductor device includes: a first layer having a first region and a second region, the first region being corrugated with a plurality of corrugations, the second region being uncorrugated. A first cycle of the corrugations may have a first duty cycle and a second cycle of the corrugations may have a second duty cycle, the second cycle being between the first cycle and the second region, and the second duty cycle being between the first duty cycle and the duty cycle of the second region.
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
A transmitter photonic integrated circuit (PIC) for generating an optical signal for optical spectroscopy of a surface, the transmitter PIC comprising: One or more coherent light source(s); a homogenizer, the homogenizer comprising a planar waveguide device and/or an optical phased array (OP A) which receives light from the coherent light source(s) and generates interference to produce multiple statistically uncorrelated speckle patterns that are combined to provide the optical output.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/28 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux
G02B 27/48 - Systèmes optiques utilisant la granulation produite par laser
A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm2.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02F 1/015 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Sensors and detectors for medical use; medical apparatus for
measuring biometric data, including blood pressure, oxygen
saturation, hemoglobin, carboxyhemoglobin, methemoglobin,
brain oximetry, muscle oximetry, pulse oximetry, blood
lactate, blood glucose, skin hydration, total body
hydration, photoplethysmography (PPG), speckle
plethysmography (SPG), core body temperature, local body
temperature, blood alcohol level, heart rate and heart rate
variability; sensor apparatus for medical use; medical
devices; medical devices, apparatus and instruments for
monitoring, measuring, recording, storing, processing, and
displaying biometric data; medical devices, apparatus and
instruments for monitoring, measuring, recording, storing,
processing, and displaying biometric data including blood
pressure, oxygen saturation, hemoglobin, carboxyhemoglobin,
methemoglobin, brain oximetry, muscle oximetry, pulse
oximetry, blood lactate, blood glucose, skin hydration,
total body hydration, photoplethysmography (PPG), speckle
plethysmography (SPG), core body temperature, local body
temperature, blood alcohol level, heart rate and heart rate
variability; implantable devices for monitoring, measuring,
recording, storing, processing, and displaying biometric
data; implantable devices for monitoring, measuring,
recording, storing, processing, and displaying biometric
data including blood pressure, oxygen saturation,
hemoglobin, carboxyhemoglobin, methemoglobin, brain
oximetry, muscle oximetry, pulse oximetry, blood lactate,
blood glucose, skin hydration, total body hydration,
photoplethysmography (PPG), speckle plethysmography (SPG),
core body temperature, local body temperature, blood alcohol
level, heart rate and heart rate variability; medical
devices, apparatus and instruments for skin cancer screening
and characterisation; medical devices, apparatus and
instruments for measuring body weight and estimating body
fat percentage; medical devices, apparatus and instruments
for recording or assessing physical performance; sensors,
monitors and displays for medical use; general
health-related instruments and apparatus for monitoring,
measuring, recording, storing, processing, and displaying
biometric data, body movement, sleep, heart rate, and
calories burned; parts and fittings for all of the aforesaid
goods. Technological services and research and design relating
thereto; design for others in the field of communications
and networks; custom design services; custom design, design,
and development of computer hardware and software,
electronic telecommunications apparatus and instruments,
optical apparatus and instruments, optical communication
apparatus and instruments, apparatus for the recording,
transmission or reproduction of sound, images and data,
computer networks, microprocessors, telecommunications
switches, data switches, data centre switches, unified
fabric switches, optical switches, opto-electronic switches,
optical modulators, passive optical components, optical
multiplexers and demultiplexers, optical interconnects,
integrated optical devices, integrated optical modules,
integrated optical/electronic modules, computer chips,
computer chipsets, photonic chips, photonic chipsets,
silicon photonic chips, silicon photonic chipsets, hybrid
optical/electronic chips, hybrid optical/electronic
circuits, integrated circuits computer chipsets, lasers,
photodetectors, avalanche photodetectors; consultancy,
testing, research, advisory, and technical support services,
all relating to computer hardware and software, electronic
telecommunications apparatus and instruments, optical
apparatus and instruments, optical communication apparatus
and instruments, apparatus for the recording, transmission
or reproduction of sound, images and data, computer
networks, microprocessors, telecommunications switches, data
switches, data centre switches, unified fabric switches,
optical switches, opto-electronic switches, optical
modulators, passive optical components, optical multiplexers
and demultiplexers, optical interconnects, integrated
optical devices, integrated optical modules, integrated
optical/electronic modules, computer chips, computer
chipsets, photonic chips, photonic chipsets, silicon
photonic chips, silicon photonic chipsets, hybrid
optical/electronic chips, hybrid optical/electronic
circuits, integrated circuits computer chipsets, lasers,
photodetectors, avalanche photodetectors; providing online
non-downloadable computer software; non-downloadable
computer software for tracking fitness, health and wellness
goals and statistics; non-downloadable computer software for
displaying, aggregating, analysing and organising data and
information in the fields of health, wellness, fitness,
physical activity, weight management, sleep, and nutrition;
custom design, design, and development of optical
transmitters and receivers, imaging apparatus and devices,
3D imaging apparatus and devices, sensors and detectors,
optical sensors and detectors, LiDAR (Light Detection and
Ranging) sensors, controllers for sensors and detectors,
coherent sensors, biometric sensors, sensors for scientific
use to be worn by a human to gather human biometric data,
electronic switches, semiconductor chips, semiconductor
chipsets, spectrophotometers, spectrometers, spectroscopes,
accelerometers, equipment, apparatus and devices for
communications, including wireless communications, data
communications and telecommunications, equipment, apparatus
and devices for recording, organising, reproducing, storing,
processing, manipulating, transmitting, broadcasting,
displaying, monitoring, retrieving and reproducing music,
sounds, images, text, signals, information, data, biometric
data and code, electronic control apparatus, electronic
control apparatus including sensors, electronic control
apparatus for sensors, equipment, apparatus and devices for
controlling, recording, organising, reproducing, storing,
processing, manipulating, transmitting, broadcasting,
displaying, monitoring and retrieving signals, information,
data, biometric data collected from sensors, computer
software for recording, organising, reproducing, storing,
processing, manipulating, transmitting, broadcasting,
displaying, monitoring, retrieving and reproducing music,
sounds, images, text, signals, information, data, biometric
data and code, mobile application software for recording,
organising, reproducing, storing, processing, manipulating,
transmitting, broadcasting, displaying, monitoring,
retrieving and reproducing music, sounds, images, text,
signals, information, data, biometric data and code,
computers, portable computers, wearable computers, smart
phones, wearable smart phones, smart glasses, ear pieces,
body patches, headsets, head-mounted display apparatus,
smart watches, smart wristbands, wearable activity trackers,
smart bracelets, smart rings, jewellery that communicates
data, telecommunication apparatus in the form of jewellery;
custom design, design, and development of sensors and
detectors for medical use, medical apparatus for measuring
biometric data, including blood pressure, oxygen saturation,
hemoglobin, carboxyhemoglobin, methemoglobin, brain
oximetry, muscle oximetry, pulse oximetry, blood lactate,
blood glucose, skin hydration, total body hydration,
photoplethysmography (PPG), speckle plethysmography (SPG),
core body temperature, local body temperature, blood alcohol
level, heart rate and heart rate variability, sensor
apparatus for medical use, medical devices, medical devices,
apparatus and instruments for monitoring, measuring,
recording, storing, processing, and displaying biometric
data, medical devices, apparatus and instruments for
monitoring, measuring, recording, storing, processing, and
displaying biometric data including blood pressure, oxygen
saturation, hemoglobin, carboxyhemoglobin, methemoglobin,
brain oximetry, muscle oximetry, pulse oximetry, blood
lactate, blood glucose, skin hydration, total body
hydration, photoplethysmography (PPG), speckle
plethysmography (SPG), core body temperature, local body
temperature, blood alcohol level, heart rate and heart rate
variability, ketone bodies including acetone in breath,
implantable devices for monitoring, measuring, recording,
storing, processing, and displaying biometric data,
implantable devices for monitoring, measuring, recording,
storing, processing, and displaying biometric data including
blood pressure, oxygen saturation, hemoglobin,
carboxyhemoglobin, methemoglobin, brain oximetry, muscle
oximetry, pulse oximetry, blood lactate, blood glucose, skin
hydration, total body hydration, photoplethysmography (PPG),
speckle plethysmography (SPG), core body temperature, local
body temperature, blood alcohol level, heart rate and heart
rate variability, ketone bodies including acetone in breath,
medical devices, apparatus and instruments for skin cancer
screening and characterisation, medical devices, apparatus
and instruments for measuring body weight and estimating
body fat percentage, medical devices, apparatus and
instruments for recording or assessing physical performance,
sensors, monitors and displays for medical use, general
health-related instruments and apparatus for monitoring,
measuring, recording, storing, processing, and displaying
biometric data, body movement, sleep, heart rate, and
calories burned; custom design, design, and development of
horological and chronometric instruments, watches,
timepieces, chronometers, watch straps, watch bands, cases
for watches and horological and chronometric instruments,
jewellery, bracelets, necklaces, pendants, watches for
outdoor use, sports watches; custom design, design, and
development of wearable clothing, footwear, headgear
incorporated with body sensors; consultancy, testing,
research, advisory, and technical support services, all
relating to of optical transmitters and receivers, imaging
apparatus and devices, 3D imaging apparatus and devices,
sensors and detectors, optical sensors and detectors, LiDAR
(Light Detection and Ranging) sensors, controllers for
sensors and detectors, coherent sensors, biometric sensors,
sensors for scientific use to be worn by a human to gather
human biometric data, electronic switches, semiconductor
chips, semiconductor chipsets, spectrophotometers,
spectrometers, spectroscopes, accelerometers, equipment,
apparatus and devices for communications, including wireless
communications, data communications and telecommunications,
equipment, apparatus and devices for recording, organising,
reproducing, storing, processing, manipulating,
transmitting, broadcasting, displaying, monitoring,
retrieving and reproducing music, sounds, images, text,
signals, information, data, biometric data and code,
electronic control apparatus, electronic control apparatus
including sensors, electronic control apparatus for sensors,
equipment, apparatus and devices for controlling, recording,
organising, reproducing, storing, processing, manipulating,
transmitting, broadcasting, displaying, monitoring and
retrieving signals, information, data, biometric data
collected from sensors, computer software for recording,
organising, reproducing, storing, processing, manipulating,
transmitting, broadcasting, displaying, monitoring,
retrieving and reproducing music, sounds, images, text,
signals, information, data, biometric data and code, mobile
application software for recording, organising, reproducing,
storing, processing, manipulating, transmitting,
broadcasting, displaying, monitoring, retrieving and
reproducing music, sounds, images, text, signals,
information, data, biometric data and code, computers,
portable computers, wearable computers, smart phones,
wearable smart phones, smart glasses, ear pieces, body
patches, headsets, head-mounted display apparatus, smart
watches, smart wristbands, wearable activity trackers, smart
bracelets, smart rings, jewellery that communicates data,
telecommunication apparatus in the form of jewellery;
consultancy, testing, research, advisory, and technical
support services, all relating to sensors and detectors for
medical use, medical apparatus for measuring biometric data,
including blood pressure, oxygen saturation, hemoglobin,
carboxyhemoglobin, methemoglobin, brain oximetry, muscle
oximetry, pulse oximetry, blood lactate, blood glucose, skin
hydration, total body hydration, photoplethysmography (PPG),
speckle plethysmography (SPG), core body temperature, local
body temperature, blood alcohol level, heart rate and heart
rate variability, sensor apparatus for medical use, medical
devices, medical devices, apparatus and instruments for
monitoring, measuring, recording, storing, processing, and
displaying biometric data, medical devices, apparatus and
instruments for monitoring, measuring, recording, storing,
processing, and displaying biometric data including blood
pressure, oxygen saturation, hemoglobin, carboxyhemoglobin,
methemoglobin, brain oximetry, muscle oximetry, pulse
oximetry, blood lactate, blood glucose, skin hydration,
total body hydration, photoplethysmography (PPG), speckle
plethysmography (SPG), core body temperature, local body
temperature, blood alcohol level, heart rate and heart rate
variability, ketone bodies including acetone in breath,
implantable devices for monitoring, measuring, recording,
storing, processing, and displaying biometric data,
implantable devices for monitoring, measuring, recording,
storing, processing, and displaying biometric data including
blood pressure, oxygen saturation, hemoglobin,
carboxyhemoglobin, methemoglobin, brain oximetry, muscle
oximetry, pulse oximetry, blood lactate, blood glucose, skin
hydration, total body hydration, photoplethysmography (PPG),
speckle plethysmography (SPG), core body temperature, local
body temperature, blood alcohol level, heart rate and heart
rate variability, ketone bodies including acetone in breath,
medical devices, apparatus and instruments for skin cancer
screening and characterisation, medical devices, apparatus
and instruments for measuring body weight and estimating
body fat percentage, medical devices, apparatus and
instruments for recording or assessing physical performance,
sensors, monitors and displays for medical use, general
health-related instruments and apparatus for monitoring,
measuring, recording, storing, processing, and displaying
biometric data, body movement, sleep, heart rate, and
calories burned; consultancy, testing, research, advisory,
and technical support services, all relating to horological
and chronometric instruments, watches, timepieces,
chronometers, ear pieces, headsets, watch straps, watch
bands, cases for watches and horological and chronometric
instruments, jewellery, bracelets, necklaces, pendants,
watches for outdoor use, sports watches; consultancy,
testing, research, advisory, and technical support services,
all relating to wearable clothing, footwear, headgear
incorporated with body sensors; information, consultancy and
advisory services relating to all the aforesaid services.
An optical multiplexer. The optical multiplexer comprising: a plurality of input waveguides, each comprising an input slab portion and an input rib portion; an output waveguide, comprising an output slab portion and output rib portion; and a wavelength multiplexer element, coupled to each input waveguide and the output waveguide, the wavelength multiplexer element comprising a slab waveguide which includes a grating configured to multiplex signals of differing wavelengths, received from the input waveguides, into a multiplexed signal, and provide the multiplexed signal to the output waveguide. The input rib portion(s) of one or more of the input waveguides are tapered so as to decrease in width in a direction towards the slab waveguide of the wavelength multiplexer element which is an echelle grating or an arrayed waveguide grating.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
A laser. In some embodiments, the laser includes an optical amplifier, and an output reflector. The output reflector may be configured to receive light from the optical amplifier and to reflect light at a first wavelength back toward the optical amplifier. The output reflector may include a wavelength-selective element, and a coupler configured to receive the light from the optical amplifier and to couple a portion of the light to the wavelength-selective element.
An optical instrument for determining a wavelength of light generated by a light source. The optical instrument may include a signal generator for generating a driving signal, a tunable optical filter device configured to receive the driving signal, the tunable optical filter device configured to diffract the light generated by the light source based on the driving signal, an optical detector device configured to detect a timing of maximum diffraction of light diffracted by the tunable optical filter device, and an analyzer configured to determine the wavelength of the light based the timing of maximum diffraction.
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p. ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
G01J 1/42 - Photométrie, p. ex. posemètres photographiques en utilisant des détecteurs électriques de radiations
A method of preparing a device coupon for a micro-transfer printing process from a multi-layered stack located on a device wafer substrate. The multi-layered stack comprises a plurality of semiconductor layers. The method comprises steps of: (a) etching the multi-layered stack to form a multi-layered device coupon, including an optical component; and (b) etching a semiconductor layer of the multi-layered device coupon to form one or more tethers, said tethers securing the multi-layered device coupon to one or more supports.
An optical out-coupler unit for out-coupling light from a waveguide, comprising a substrate having a planar top surface, a waveguide arranged on the top surface of the substrate and having a facet, a reflective surface, wherein the reflective surface is arranged spaced apart from the facet and opposing the facet, wherein the reflective surface is inclined with respect to a normal to the top surface of the substrate by more than 45°. The optical out-coupler may be part of a photonic integrated chip (PIC).
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
80.
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE
An optoelectronic device comprising an optical waveguide formed in a silicon device layer of a silicon-on-insulator wafer. The optical waveguide including a semiconductor junction comprising a first doped region of semiconductor material and a second doped region of semiconductor material. The second doped region containing dopants of a different species to the first doped region. A first portion of the first doped region extends horizontally on top of the second doped region, a second portion of the first doped region extends vertically along a lateral side of the second doped region and a third portion of the first doped region protrudes as a salient from the first or second portion of the first doped region into the second doped region.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
A siliconized heterogeneous optical engine. In some embodiments, the siliconized heterogeneous optical engine includes a photonic integrated circuit; an electro-optical chip, on a top surface of the photonic integrated circuit; an electronic integrated circuit, on the top surface of the photonic integrated circuit; an interposer, on the top surface of the photonic integrated circuit; a redistribution layer, on a top surface of the interposer, the redistribution layer including a plurality of conductive traces; and a plurality of protruding conductors, on the conductive traces of the redistribution layer. The electronic integrated circuit may be electrically connected to the electro-optical chip and to a conductive trace of the plurality of conductive traces of the redistribution layer.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
A phase shift keying modulator. The modulator comprises: a plurality of silicon waveguides provided in a device layer of a silicon-on-insulator platform, the silicon-on-insulator platform including one or more cavities; one or more III-V semiconductor based devices located within the one or more cavities of the silicon-on-insulator platform, each III-V semiconductor-based device including a III-V semiconductor based waveguide which is coupled at an input end to one of the plurality of silicon waveguides and coupled at an output end to another of the plurality of silicon waveguides, each III-V semiconductor based waveguide comprising an active phase modulating portion; and one or more contacts in electrical contact with each active phase modulating portion, such that the phase shift keying modulator is operable to modulate the phase of an optical wave passing through each active phase modulating portion.
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
An optical waveguide structure. In some embodiments, the optical waveguide structure includes a semiconductor waveguide having a waveguide ridge, and a heater. The waveguide ridge may have a varying dopant concentration across its cross-section. The heater may include a first contact and a second contact, and the waveguide structure may include a conductive path from the first contact to the second contact, the conductive path extending through a doped portion of the waveguide ridge.
G02B 6/124 - Lentilles géodésiques ou réseaux intégrés
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/125 - Lasers à réflecteurs de Bragg répartis [lasers DBR]
H01S 5/06 - Dispositions pour commander les paramètres de sortie du laser, p. ex. en agissant sur le milieu actif
An electro-optical modulator. The electro-optical modulator comprising: an input waveguide, configured to guide light into a modulation region of the electro-optical modulator; a plurality of sub-modulators, within the modulation region, each sub-modulator having a transfer function between an applied voltage and an optical phase shift; and an output waveguide, configured to guide light out of the modulation region. The combination of the transfer functions of each sub-modulator is such that a total transfer function between an applied voltage and an optical phase shift of the modulation region is substantially linear over a range of operating voltages.
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
A method of preparing a distributed feedback laser. The distributed feedback laser comprises an active waveguide with a reflective facet. The method comprises: etching a grating into the distributed feedback laser; and etching an output facet into the active waveguide.
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/02 - Détails ou composants structurels non essentiels au fonctionnement laser
H01S 5/32 - Structure ou forme de la région activeMatériaux pour la région active comprenant des jonctions PN, p. ex. hétérostructures ou doubles hétérostructures
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
An optical waveguide structure. In some embodiments, the optical waveguide structure includes a semiconductor waveguide having a waveguide ridge, and a heater. The waveguide ridge may have a varying dopant concentration across its cross-section. The heater may include a first contact and a second contact, and the waveguide structure may include a conductive path from the first contact to the second contact, the conductive path extending through a doped portion of the waveguide ridge.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
H01S 5/187 - Lasers à émission de surface [lasers SE], p. ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités horizontales, p. ex. lasers à émission de surface à cavité horizontale [HCSEL] à réflexion de Bragg
H01S 5/125 - Lasers à réflecteurs de Bragg répartis [lasers DBR]
G02F 1/335 - Dispositifs de déflexion acousto-optique ayant une structure de guide d'ondes optique
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
A tapered waveguide. In some embodiments, the waveguide has a narrow end and a wide end. A taper angle of the waveguide may be, at each point along the waveguide, less than an adiabatic taper angle by a margin. The margin may be greater at a first point than at a second point, where the adiabatic taper angle is less at the first point than at the second point.
A photonic integrated circuit. In some embodiments, the photonic integrated circuit includes: a waveguide; and a waveguide facet, a first end of the waveguide being at the waveguide facet, a first angle being an angle between: the waveguide at the first end of the waveguide and the normal to the waveguide facet, the first angle being at least 5 degrees, a first section of the waveguide having a first end at the waveguide facet and a second end, the first section having: a curvature of less than 0.01/mm at the first end of the first section, a curvature of less than 0.01/mm at the second end of the first section, and a curvature of at least 0.1/mm at a point between the first end and the second end.
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/32 - Moyens de couplage optique ayant des moyens de focalisation par lentilles
A waveguide mode filter. In some embodiments, the waveguide mode filter includes a first section of waveguide. The first section may have: a first end; a second end; a rate of change of curvature having a magnitude not exceeding 15/mm2 within the first section; a curvature having a magnitude of at most 0.03/mm at the first end; and a curvature having a magnitude of at least 0.1/mm at the second end.
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
A photonic integrated circuit. In some embodiments, the photonic integrated circuit includes: a waveguide; and a waveguide facet, a first end of the waveguide being at the waveguide facet, a first angle being an angle between: the waveguide at the first end of the waveguide and the normal to the waveguide facet, the first angle being at least 5 degrees, a first section of the waveguide having a first end at the waveguide facet and a second end, the first section having: a curvature of less than 0.01/mm at the first end of the first section, a curvature of less than 0.01/mm at the second end of the first section, and a curvature of at least 0.1/mm at a point between the first end and the second end.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
2 within the first section; a curvature having a magnitude of at most 0.03/mm at the first end; and a curvature having a magnitude of at least 0.1/mm at the second end.
G02B 6/125 - Courbures, branchements ou intersections
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
A tapered waveguide. In some embodiments, the waveguide has a narrow end and a wide end. A taper angle of the waveguide may be, at each point along the waveguide, less than an adiabatic taper angle by a margin. The margin may be greater at a first point than at a second point, where the adiabatic taper angle is less at the first point than at the second point.
An imaging component for receiving light, the imaging component comprising a photonic integrated circuit, PIC, receiver, a slab, a wedge, and a lens the wedge having a front surface and an opposing back surface, the imaging component arranged to define a receiving optical path through the front surface of the wedge, the receiving optical path continuing through the wedge and through the slab to the PIC receiver, the lens being configured to focus light of the receiving optical path onto the PIC receiver.
G01S 17/89 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour la cartographie ou l'imagerie
G02F 1/29 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de la position ou de la direction des rayons lumineux, c.-à-d. déflexion
A MOS capacitor-type optical modulator comprising a silicon-on-insulator (SOI) substrate, a first doped region in a silicon device layer of the SOI substrate, and a second doped region laterally separated from the first doped region by a vertically extending insulator layer to form a lateral MOS capacitor region. The first doped region, second doped region and insulator layer are formed from different materials.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.
H01L 31/02 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
A method of transfer printing. The method comprising: providing a precursor photonic device (200), comprising a substrate (210) and a bonding region, wherein the precursor photonic device (200) includes one or more alignment marks (101, 102, 103, 104) located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks (101); aligning the one or more alignment marks (102) of the precursor photonic device (200) with the one or more alignment marks (102) of the transfer die; and bonding at least a part of the transfer die to the bonding region.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
A system comprising: a first module comprising a first sensor, capable of performing biometric sensing at a first location on a patient; and a second module comprising a second sensor, capable of performing biometric sensing at a second location on the patient. The first module comprises a transmitter for transmitting first sensor data, the first sensor data comprising sensing information obtained by the first sensor.
An optical isolator on a silicon photonic integrated circuit. The optical isolator comprising: a polarization splitter; a polarization rotator; and a Faraday rotator. The Faraday rotator comprises: one or more magnets providing a magnetic field; and a silicon spiral delay line. The silicon spiral delay line being formed from a silicon waveguide shaped into a spiral region having no built-in phase shifters and a central region within the spiral region. The central region having no more than a total of 180 degree of phase shifters.
G02F 1/09 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments magnéto-optiques, p. ex. produisant un effet Faraday
G02F 1/095 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments magnéto-optiques, p. ex. produisant un effet Faraday dans une structure de guide d'ondes optique
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
A metal-oxide semiconductor capacitor, MOSCAP, based electro-optic modulator. The modulator comprising: an input waveguide; a modulating region, coupled to the input waveguide; and an output waveguide, coupled to the modulating region. The modulating region includes an n-i-p-n junction, the n-i-p-n junction comprising: a first n doped region, spaced from a p doped region by an intrinsic region, and a second n doped region, separated from the intrinsic region by the p doped region and on an opposing side of the intrinsic region to the first n doped region.
G02F 1/025 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments à semi-conducteurs ayant des barrières de potentiel, p. ex. une jonction PN ou PIN dans une structure de guide d'ondes optique
